US20080225533A1 - Light modules - Google Patents

Light modules Download PDF

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Publication number
US20080225533A1
US20080225533A1 US11/747,767 US74776707A US2008225533A1 US 20080225533 A1 US20080225533 A1 US 20080225533A1 US 74776707 A US74776707 A US 74776707A US 2008225533 A1 US2008225533 A1 US 2008225533A1
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United States
Prior art keywords
circuit board
thermal plate
light module
thermal
hole
Prior art date
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Granted
Application number
US11/747,767
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US7427148B1 (en
Inventor
Tien-Fu Huang
Chin-Yin Yu
Kuo-Chang Hu
Shyh-Rong Tzan
Shih-Hao Hua
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Industrial Technology Research Institute ITRI
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Industrial Technology Research Institute ITRI
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Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE reassignment INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HU, KUO-CHANG, HUA, SHIH-HAO, HUANG, TIEN-FU, TZAN, SHYH-RONG, YU, CHIN-YIN
Publication of US20080225533A1 publication Critical patent/US20080225533A1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention relates in general to light modules and in particular to light modules with high heat dissipation efficiency.
  • CTR Cathode Ray Tube
  • flat panel displays having small size and low radiation.
  • conventional flat panel displays use Cold Cathode Fluorescent Lamps (CCFL) as backlight.
  • CCFLs provide only a short lifetime and present difficulties when facilitating miniaturization.
  • LEDs have been increasingly applied rather than the conventional CCFL as a light source for the flat panel display. Specifically, since excessive high temperature can adversely reduce illumination and lifetime of LEDs, heat dissipation becomes critical.
  • a light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate.
  • the circuit board has a through hole communicating a first side and a second side thereof.
  • the lighting element is disposed on the first side of the circuit board and located corresponding to the through hole.
  • the first thermal plate is disposed on the second side of the circuit board, opposite to the first side, and comprises a first protrusion extending through the through hole and connecting the lighting element.
  • FIG. 1 is a sectional view of a light module
  • FIG. 2 is a perspective diagram of the circuit board shown in FIG. 1 ;
  • FIG. 3 is a sectional view of another embodiment of a light module.
  • an embodiment of a light module for an electronic device primarily comprises a circuit board 10 , a plurality of lighting elements 20 electrically connected to the circuit board 10 , and a first thermal plate 30 .
  • the circuit board 10 is a FR-4 printed circuit board, and the lighting elements 20 are LEDs.
  • the first thermal plate 30 has higher thermal conductivity than the circuit board 10 , such as an aluminum plate.
  • the lighting elements 20 are disposed on a first side 11 of the circuit board 10
  • the first thermal plate 30 is disposed on a second side 12 of the circuit board 10 , opposite to the first side 11 , to dissipate heat from the lighting elements 20 .
  • the circuit board 10 and the first thermal plate 30 can be directly secured by screws or mechanically interlocked with each other.
  • the circuit board 10 and the first thermal plate 30 can also be connected to each other by an adhesive thermal pad (not shown) disposed therebetween.
  • the circuit board 10 has a plurality of through holes 13 communicating with the first and second sides 11 and 12
  • the first thermal plate 30 has a plurality of first protrusions 31 projecting toward the lighting elements 20 via the through holes 13 .
  • the first protrusions 31 extend through the through holes 13 and physically contact the lighting elements 20 , such that heat from the lighting elements 20 is rapidly transferred downward and dissipated via the first thermal plate 30 .
  • the first protrusion 31 and the lighting element 20 can also be thermally connected via an electrically insulating thermal pad (not shown) disposed therebetween.
  • an embodiment of the lighting elements 20 and the through holes 13 of the first thermal plate 30 are arranged in matrix to provide uniform illumination. However, they can also be arranged in other specific formations to meet illumination distribution requirements.
  • a light module comprises a circuit board 10 , a plurality of lighting elements 20 disposed on a first side 11 of the circuit board 10 , a first thermal plate 30 disposed on a second side 12 of the circuit board 10 , and at least a second thermal plate 40 below the first thermal plate 30 .
  • the first thermal plate 30 has a plurality of first protrusions 31 extending through the through holes 13 of the circuit board 10 and contacting the lighting elements 20 .
  • the second thermal plate 40 has a plurality of second protrusions 41 projecting toward the circuit board 10 and connecting the first thermal plate 30 .
  • the light module may comprise more thermal plates below the first and second thermal plates 30 and 40 , such as the thermal plates 50 and 60 shown in FIG. 3 , to enhance cooling efficiency thereof.
  • a light module comprises a circuit board, a lighting element disposed on a first side of the circuit board, and a thermal plate disposed on a second side of the circuit board, opposite to the first side.
  • the circuit board has at least one through hole with a protrusion of a thermal plate extending therethrough, wherein the protrusion connects the lighting element to dissipate heat via the thermal plate, preventing failure of the lighting element or circuit board due to high temperature.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole communicating a first side and a second side thereof. The lighting element is disposed on the first side of the circuit board and located corresponding to the through hole. The first thermal plate is disposed on the second side of the circuit board, opposite to the first side, and comprises a first protrusion extending through the through hole and connecting the lighting element.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The invention relates in general to light modules and in particular to light modules with high heat dissipation efficiency.
  • 2. Description of the Related Art
  • With the progress of semiconductor and electronic technologies, traditional Cathode Ray Tube (CRT) displays have increasingly been replaced by flat panel displays having small size and low radiation. Generally, conventional flat panel displays use Cold Cathode Fluorescent Lamps (CCFL) as backlight. However, CCFLs provide only a short lifetime and present difficulties when facilitating miniaturization.
  • As a result of the aforementioned disadvantages, LEDs have been increasingly applied rather than the conventional CCFL as a light source for the flat panel display. Specifically, since excessive high temperature can adversely reduce illumination and lifetime of LEDs, heat dissipation becomes critical.
    • BRIEF SUMMARY OF THE INVENTION
  • Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole communicating a first side and a second side thereof. The lighting element is disposed on the first side of the circuit board and located corresponding to the through hole. The first thermal plate is disposed on the second side of the circuit board, opposite to the first side, and comprises a first protrusion extending through the through hole and connecting the lighting element.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
  • FIG. 1 is a sectional view of a light module;
  • FIG. 2 is a perspective diagram of the circuit board shown in FIG. 1; and
  • FIG. 3 is a sectional view of another embodiment of a light module.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 1, an embodiment of a light module for an electronic device, such as a backlight of a flat panel display, primarily comprises a circuit board 10, a plurality of lighting elements 20 electrically connected to the circuit board 10, and a first thermal plate 30. In this embodiment, the circuit board 10 is a FR-4 printed circuit board, and the lighting elements 20 are LEDs. The first thermal plate 30 has higher thermal conductivity than the circuit board 10, such as an aluminum plate.
  • As shown in FIG. 1, the lighting elements 20 are disposed on a first side 11 of the circuit board 10, and the first thermal plate 30 is disposed on a second side 12 of the circuit board 10, opposite to the first side 11, to dissipate heat from the lighting elements 20. The circuit board 10 and the first thermal plate 30 can be directly secured by screws or mechanically interlocked with each other. However, the circuit board 10 and the first thermal plate 30 can also be connected to each other by an adhesive thermal pad (not shown) disposed therebetween.
  • In this embodiment, the circuit board 10 has a plurality of through holes 13 communicating with the first and second sides 11 and 12, and correspondingly, the first thermal plate 30 has a plurality of first protrusions 31 projecting toward the lighting elements 20 via the through holes 13. As shown in FIG. 1, the first protrusions 31 extend through the through holes 13 and physically contact the lighting elements 20, such that heat from the lighting elements 20 is rapidly transferred downward and dissipated via the first thermal plate 30. In some embodiments, the first protrusion 31 and the lighting element 20 can also be thermally connected via an electrically insulating thermal pad (not shown) disposed therebetween.
  • Referring to FIG. 2, an embodiment of the lighting elements 20 and the through holes 13 of the first thermal plate 30 are arranged in matrix to provide uniform illumination. However, they can also be arranged in other specific formations to meet illumination distribution requirements.
  • As shown in FIG. 3, another embodiment of a light module comprises a circuit board 10, a plurality of lighting elements 20 disposed on a first side 11 of the circuit board 10, a first thermal plate 30 disposed on a second side 12 of the circuit board 10, and at least a second thermal plate 40 below the first thermal plate 30. In this embodiment, the first thermal plate 30 has a plurality of first protrusions 31 extending through the through holes 13 of the circuit board 10 and contacting the lighting elements 20. The second thermal plate 40 has a plurality of second protrusions 41 projecting toward the circuit board 10 and connecting the first thermal plate 30. Specifically, locations of the second protrusions 41 are offset with respect to the first protrusions 31, such that the first and second thermal plates 30 and 40 form a space therebetween, increasing heat dissipation area and cooling efficiency thereof. Furthermore, the light module may comprise more thermal plates below the first and second thermal plates 30 and 40, such as the thermal plates 50 and 60 shown in FIG. 3, to enhance cooling efficiency thereof.
  • Light modules are provided according to the embodiments. A light module comprises a circuit board, a lighting element disposed on a first side of the circuit board, and a thermal plate disposed on a second side of the circuit board, opposite to the first side. The circuit board has at least one through hole with a protrusion of a thermal plate extending therethrough, wherein the protrusion connects the lighting element to dissipate heat via the thermal plate, preventing failure of the lighting element or circuit board due to high temperature.
  • While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation to encompass all such modifications and similar arrangements.

Claims (9)

1. A light module, comprising:
a circuit board, comprising a first side, a second side opposite to first side, and a through hole communicating with the first and second sides;
a lighting element, electrically connected to the circuit board and disposed on the first side, corresponding to the through hole;-and
a first thermal plate, disposed on the second side of the circuit board, comprising a first protrusion extending through the through hole and connecting the lighting and
a second thermal plate connected to the first thermal plate, wherein the second thermal plate comprises a second protrusion projecting toward the circuit board and connecting the first thermal plate.
2. The light module as claimed in claim 1, wherein the first thermal plate has higher thermal conductivity than the circuit board.
3. The light module as claimed in claim 1, wherein the lighting element comprises an LED.
4. The light module as claimed in claim 1, wherein the circuit board is a FR-4 printed circuit board.
5. The light module as claimed in claim 1, further comprising a plurality of lighting elements, the circuit board further comprising a plurality of through holes corresponding to the lighting elements, the first thermal plate further comprising a plurality of first protrusions respectively extending through the through hole and connecting the lighting elements.
6. The light module as claimed in claim 5, wherein the lighting elements and the through holes are arranged in matrix.
7-8. (canceled)
9. The light module as claimed in claim 1, wherein location of the second protrusion is offset with respect to the first protrusion.
10. The light module as claimed in claim 9, wherein the first and second thermal plates form a space therebetween.
US11/747,767 2007-03-15 2007-05-11 Light modules Active US7427148B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW096108882A TWI324669B (en) 2007-03-15 2007-03-15 Light modules
TWTW96108882 2007-03-15

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US20080225533A1 true US20080225533A1 (en) 2008-09-18
US7427148B1 US7427148B1 (en) 2008-09-23

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2312918A1 (en) * 2009-10-16 2011-04-20 Foxsemicon Integrated Technology, Inc. Illumination Device
JP2020038830A (en) * 2018-09-04 2020-03-12 ヒュンダイ・モービス・カンパニー・リミテッド Led lamp apparatus for vehicle

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100188860A1 (en) * 2009-01-28 2010-07-29 Been-Yu Liaw Lotus blossom heat dissipating device
DE102011051047B4 (en) * 2011-06-14 2015-06-18 Hella Kgaa Hueck & Co. lighting device
CN104913236B (en) * 2014-03-12 2019-07-09 欧司朗有限公司 Lighting module and illumination group including the lighting module
US20150265027A1 (en) * 2014-03-21 2015-09-24 Lumitech Int'l Inc. Nail lamp device
CN104791626B (en) * 2015-04-15 2018-02-09 东莞市闻誉实业有限公司 Advertising lamp

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US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
US6874810B2 (en) * 2002-04-03 2005-04-05 Autoliv Asp. Inc. Airbag cover deployment flaps

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DE102004016847A1 (en) * 2004-04-07 2005-12-22 P.M.C. Projekt Management Consult Gmbh Light emitting diode arrangement and method for producing a light emitting diode array
US7289328B2 (en) * 2004-12-21 2007-10-30 Hewlett-Packard Development Company, L.P. Multi-chip module with power system and pass-thru holes
DE202005012652U1 (en) * 2005-08-11 2005-11-10 Kotzolt, Michael Power light diode module has light diode on carrier plate having a hole through which a cooling body is inserted to contact the rear face of the diode and cool it

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Publication number Priority date Publication date Assignee Title
US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US6874810B2 (en) * 2002-04-03 2005-04-05 Autoliv Asp. Inc. Airbag cover deployment flaps
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2312918A1 (en) * 2009-10-16 2011-04-20 Foxsemicon Integrated Technology, Inc. Illumination Device
CN102042518A (en) * 2009-10-16 2011-05-04 富士迈半导体精密工业（上海）有限公司 Lighting device
JP2020038830A (en) * 2018-09-04 2020-03-12 ヒュンダイ・モービス・カンパニー・リミテッド Led lamp apparatus for vehicle
US10948169B2 (en) 2018-09-04 2021-03-16 Hyundai Mobis Co., Ltd. LED lamp apparatus for vehicle

Also Published As

Publication number Publication date
DE102007022425A1 (en) 2008-09-18
US7427148B1 (en) 2008-09-23
DE102007022425B4 (en) 2009-12-24
TWI324669B (en) 2010-05-11
TW200837309A (en) 2008-09-16

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