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Publication numberUS20080220702 A1
Publication typeApplication
Application numberUS 12/124,594
Publication date11 Sep 2008
Filing date21 May 2008
Priority date3 Jul 2006
Publication number12124594, 124594, US 2008/0220702 A1, US 2008/220702 A1, US 20080220702 A1, US 20080220702A1, US 2008220702 A1, US 2008220702A1, US-A1-20080220702, US-A1-2008220702, US2008/0220702A1, US2008/220702A1, US20080220702 A1, US20080220702A1, US2008220702 A1, US2008220702A1
InventorsChung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Kun-Cheng Sung
Original AssigneeSang Fang Chemical Industry Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Polishing pad having surface texture
US 20080220702 A1
Abstract
The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
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Claims(11)
1. A polishing pad having a surface texture, comprising:
a surface texture, comprising:
at least one first groove;
at least one second groove extending from a central portion of the polishing pad to an edge of the polishing pad, wherein the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points; and
a plurality of holes disposed at the intersection points, wherein the holes are blind holes, the depth of the holes is larger than that of the first groove, the diameter of the hole is larger than the width of the first groove and the second groove, and the first groove, the second groove and the holes are on the same surface.
2. The polishing pad as claimed in claim 1, wherein the first groove comprises a plurality of circular grooves with different radii from the top view and the circular grooves are concentric grooves.
3. The polishing pad as claimed in claim 1, wherein the first groove comprises a plurality of rectangular grooves with different side lengths and the rectangular grooves are concentric grooves.
4. The polishing pad as claimed in claim 1, wherein the first groove is a spiral groove from the top view.
5. The polishing pad as claimed in claim 1, wherein the second groove comprises a plurality of radial grooves from the top view.
6. The polishing pad as claimed in claim 5, wherein each of the second grooves is a linear groove.
7. The polishing pad as claimed in claim 5, wherein each of the second grooves is an arced groove.
8. A polishing pad having a surface texture, comprising:
a surface texture, comprising:
a plurality of circular grooves with different radii, the circular grooves being concentric grooves;
a plurality of radial grooves, extending from a central portion of the polishing pad to an edge of the polishing pad, wherein the circular grooves are intersected with the radial grooves to form a plurality of intersection points; and
a plurality of the first holes, disposed at the intersection points, wherein the first holes are blind holes, the depth of the first holes is larger than that of the circular grooves, the diameter of the first hole is larger than the width of the circular grooves and the radial grooves, and the circular grooves, the radial grooves and the first holes are on the same surface.
9. The polishing pad as claimed in claim 8, wherein each of the radial grooves is a linear groove.
10. The polishing pad as claimed in claim 8, wherein each of the radial grooves is an arced groove.
11. The polishing pad as claimed in claim 8, further comprising a plurality of the second holes disposed on the circular grooves.
Description
    BACKGROUND OF THE INVENTION
  • [0001]
    1. Field of the Invention
  • [0002]
    The present invention relates to a polishing pad having a surface texture, and more particularly, to a polishing pad with holes to store polishing slurry.
  • [0003]
    2. Description of the Related Art
  • [0004]
    Polishing generally refers to a wear control for a preliminary coarse surface in the process of chemical mechanical polishing (CMP), which makes the slurry containing fine particles evenly dispersed on the upper surface of a polishing pad, and at the same time places a polishing workpiece against the polishing pad and then rubs the workpiece repeatedly with a regular motion. The polishing workpiece may be objects such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel. In order to maintain the distribution and flow of the polishing slurry and the planarization and polishing efficiency after the chemical mechanical polishing, the upper surface of the polishing pad is usually cut with a plurality of grooves or formed with a surface texture. Therefore, the polishing effect of the polishing pad on the workpiece to be polished is easily affected by the grooves and the surface texture.
  • [0005]
    Referring to FIG. 1, a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 504,429 is shown. The surface texture of the polishing pad 1 comprises a plurality of concentric circular grooves 11, wherein the depth and the width of the circular grooves 11 are designed in accordance with the requirement. However, the polishing pad 1 has the disadvantage that the impurities produced during the polishing process cannot be quickly removed from the polishing pad 1, thus negatively affecting the polishing precision and the service life of the polishing pad 1.
  • [0006]
    Referring to FIG. 2, a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 562,716 is shown. The surface texture of the polishing pad 2 comprises a plurality of radial grooves 21, wherein the radial grooves 21 are connected to the center 22 of the polishing pad 2 and the edge 23 of the polishing pad 2. The advantage of the polishing pad 2 is that the impurities produced during the polishing process can be quickly removed from the polishing pad 2. However, the polishing pad 2 has the disadvantage that the polishing particles in the polishing slurry are also quickly removed from the polishing pad 2, thus negatively affecting the polishing precision and the service life of the polishing pad 2.
  • [0007]
    Consequently, there is an existing need for a polishing pad having a surface texture to solve the above-mentioned problems.
  • SUMMARY OF THE INVENTION
  • [0008]
    The objective of the present invention is to provide a polishing pad having a surface texture. The polishing pad comprises a surface texture disposed on a polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove is connected to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove.
  • [0009]
    Thus, the second groove(s) enables the impurities suspended in the polishing slurry to be quickly removed, and the holes then store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0010]
    FIG. 1 is a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 504,429;
  • [0011]
    FIG. 2 is a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 562,716;
  • [0012]
    FIG. 3 is a top view of the polishing pad according to the first embodiment of the present invention;
  • [0013]
    FIG. 4 is a top view of the polishing pad according to the second embodiment of the present invention;
  • [0014]
    FIG. 5 is a top view of the polishing pad according to the third embodiment of the present invention;
  • [0015]
    FIG. 6 is a top view of the polishing pad according to the fourth embodiment of the present invention;
  • [0016]
    FIG. 7 is a top view of the polishing pad according to the fifth embodiment of the present invention; and
  • [0017]
    FIG. 8 is a top view of the polishing pad according to the sixth embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • [0018]
    The present invention provides a polishing pad having a surface texture. The polishing pad is suitable for polishing an object to be polished in the chemical mechanical polishing (CMP) process. The object to be polished comprises, but is not limited to, objects such as semiconductors, storage medium substrates, integrated circuits, LCD flat glass, optical glass, and photoelectric panels.
  • [0019]
    According to the present invention, the polishing pad comprises a surface texture disposed on a polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. That is, the first groove, the second groove and the holes are on the same surface (polishing surface). In a preferred embodiment, the first grooves are a plurality of circular grooves with different radii from the top view and the circular grooves are concentric grooves. However, the first grooves can also be a plurality of rectangular grooves with different side lengths and the rectangular grooves are concentric grooves. Alternatively, the first groove(s) may be a spiral groove, or grooves of other shapes.
  • [0020]
    The second groove(s) extends from a central portion of the polishing pad to an edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. Preferably, the second groove(s) is a plurality of radial grooves from the top view, each of which is a linear or arced groove. The holes are disposed at the intersection points. The holes are blind holes. The diameter of the hole is larger than the width of the first groove(s) and the second groove(s). The depth of the holes is larger than that of the first groove(s) and the second groove(s). Thus, the second groove enables the impurities suspended in the polishing slurry to be quickly removed, and the holes then store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
  • [0021]
    The present invention will be described in detail with the following examples, but it does not mean that the present invention is limited to the content disclosed by the examples.
  • EXAMPLE 1
  • [0022]
    Referring to FIG. 3, a top view of the polishing pad according to the first embodiment of the present invention is shown. The surface texture of the polishing pad 3 of the present embodiment comprises a plurality of the first grooves 31, a plurality of the second grooves 32, and a plurality of holes 33. The first grooves 31 are a plurality of concentric circular grooves, the first grooves are a plurality of circular grooves with different radii from the top view. The second grooves 32 are a plurality of radial grooves, and each of the second grooves 32 is a linear groove extending from a central portion of the polishing pad 3 to the edge 34 of the polishing pad 3. The first grooves 31 are intersected with the second grooves 32 to form a plurality of intersection points. The holes 33 are disposed at the intersection points, and the depth of the holes 33 is larger than that of the first grooves 31 and the second grooves 32. The diameter of the hole 33 is larger than the width of the first grooves 31 and the second grooves 32.
  • EXAMPLE 2
  • [0023]
    Referring to FIG. 4, a top view of the polishing pad according to the second embodiment of the present invention is shown. The surface texture of the polishing pad 4 of the present embodiment comprises a plurality of the first grooves 41, a plurality of the second grooves 42, and a plurality of holes 43. The first grooves 41 are a plurality of concentric circular grooves. The second grooves 42 are a plurality of radial grooves, and each of the second grooves 42 is a linear groove extending from a central portion of the polishing pad 4 to the edge 44 of the polishing pad 4. The first grooves 41 are intersected with the second grooves 42 to form a plurality of intersection points. The holes 43 are disposed at the intersection points, and the depth of the holes 43 is larger than that of the first grooves 41 and the second grooves 42. The diameter of the hole 43 is larger than the width of the first grooves 41 and the second grooves 42. The difference between the surface texture of the polishing pad 4 of the present embodiment and that of the polishing pad 3 of the first embodiment is that the first groove 411 at the innermost circle of the polishing pad 4 are not intersected with the second grooves 42.
  • EXAMPLE 3
  • [0024]
    Referring to FIG. 5, a top view of the polishing pad according to the third embodiment of the present invention is shown. The surface texture of the polishing pad 5 of the present embodiment comprises a plurality of the first grooves 51, a plurality of the second grooves 52, a plurality of the first holes 53, and a plurality of the second holes 55. The first grooves 51 are a plurality of concentric circular grooves. The second grooves 52 are a plurality of radial grooves, and each of the second grooves 52 is a linear groove extending from a central portion of the polishing pad 5 to the edge 54 of the polishing pad 5. The first grooves 51 are intersected with the second grooves 52 to form a plurality of intersection points. The first holes 53 are disposed at the intersection points, and the depth of the first holes 53 is larger than that of the first grooves 51 and the second grooves 52. The second holes 55 are disposed on the second grooves 52 except for the intersection points, and the depth of the second holes 55 is the same as that of the first holes 53. The diameters of the first hole 53 and the second holes 55 are larger than the widths of the first grooves 51 and the second grooves 52.
  • EXAMPLE 4
  • [0025]
    Referring to FIG. 6, a top view of the polishing pad according to the fourth embodiment of the present invention is shown. The surface texture of the polishing pad 6 of the present embodiment comprises a plurality of the first grooves 61, a plurality of the second grooves 62, and a plurality of holes 63. The first grooves 61 are a plurality of concentric rectangular grooves from the top view, and the first grooves 61 are a plurality of rectangular grooves with different side lengths. The second grooves 62 are a plurality of radial grooves, and each of the second grooves 62 is a linear groove extending from a central portion of the polishing pad 6 to the edge 64 of the polishing pad 6. The first grooves 61 are intersected with the second grooves 62 to form a plurality of intersection points. The holes 63 are disposed at the intersection points, and the depth of the holes 63 is larger than that of the first grooves 61 and the second grooves 62.
  • EXAMPLE 5
  • [0026]
    Referring to FIG. 7, a top view of the polishing pad according to the fifth embodiment of the present invention is shown. The surface texture of the polishing pad 7 of the present embodiment comprises a first groove 71, a plurality of the second grooves 72, and a plurality of holes 73. The first groove 71 is a spiral groove from the top view. The second grooves 72 are a plurality of radial grooves, and each of the second grooves 72 is a linear groove extending from a central portion of the polishing pad 7 to the edge 74 of the polishing pad 7. The first groove 71 is intersected with the second grooves 72 to form a plurality of intersection points. The holes 73 are disposed at the intersection points, and the depth of the holes 73 is larger than that of the first groove 71 and the second grooves 72. The diameter of the hole 73 is larger than the widths of the first grooves 71 and the second grooves 72.
  • EXAMPLE 6
  • [0027]
    Referring to FIG. 8, a top view of the polishing pad according to the sixth embodiment of the present invention is shown. The surface texture of the polishing pad 8 of the present embodiment comprises a plurality of the first grooves 81, a plurality of the second grooves 82, and a plurality of holes 83. The first grooves 81 are a plurality of concentric circular grooves. The second grooves 82 are a plurality of radial grooves, and each of the second grooves 82 is an arced groove extending from a central portion of the polishing pad 8 to the edge 84 of the polishing pad 8. The first grooves 81 are intersected with the second grooves 82 to form a plurality of intersection points. The holes 83 are disposed at the intersection points and the depth of the holes 83 is larger than that of the first grooves 81 and the second grooves 82. The diameter of the hole 83 is larger than the widths of the first grooves 81 and the second grooves 82.
  • [0028]
    While several embodiments of the present invention have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention may not be limited to the particular forms as illustrated, and that all modifications which maintain the spirit and scope of the present invention are within the scope as defined in the appended claims.
Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US3006037 *21 Apr 195831 Oct 1961Mec Sant Andrea Novara Spa OffResilient top roll and nippers for drawing frames of spinning machines
US5177908 *22 Jan 199012 Jan 1993Micron Technology, Inc.Polishing pad
US5645469 *6 Sep 19968 Jul 1997Advanced Micro Devices, Inc.Polishing pad with radially extending tapered channels
US5725420 *22 Oct 199610 Mar 1998Nec CorporationPolishing device having a pad which has grooves and holes
US5795218 *30 Sep 199618 Aug 1998Micron Technology, Inc.Polishing pad with elongated microcolumns
US5822251 *29 Sep 199713 Oct 1998Bit Microsystems, Inc.Expandable flash-memory mass-storage using shared buddy lines and intermediate flash-bus between device-specific buffers and flash-intelligent DMA controllers
US5888121 *23 Sep 199730 Mar 1999Lsi Logic CorporationControlling groove dimensions for enhanced slurry flow
US6089966 *18 Nov 199818 Jul 2000Arai; HatsuyukiSurface polishing pad
US6120366 *4 Jan 199919 Sep 2000United Microelectronics Corp.Chemical-mechanical polishing pad
US6159088 *29 Jan 199912 Dec 2000Sony CorporationPolishing pad, polishing apparatus and polishing method
US6254456 *26 Sep 19973 Jul 2001Lsi Logic CorporationModifying contact areas of a polishing pad to promote uniform removal rates
US6273806 *9 Jul 199914 Aug 2001Applied Materials, Inc.Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6692338 *23 Jul 199717 Feb 2004Lsi Logic CorporationThrough-pad drainage of slurry during chemical mechanical polishing
US6729950 *29 Aug 20014 May 2004Skc Co., Ltd.Chemical mechanical polishing pad having wave shaped grooves
US6749714 *14 Mar 200015 Jun 2004Nikon CorporationPolishing body, polisher, polishing method, and method for producing semiconductor device
US7021995 *10 Mar 20054 Apr 2006Noritake Co., LimitedCMP pad conditioner having working surface inclined in radially outer portion
US20030143925 *28 Jan 200231 Jul 2003Yang Charles Chiun-ChiehPolishing pad window for a chemical-mechanical polishing tool
US20040266327 *20 Jul 200430 Dec 2004Liang-Yuh ChenConductive polishing article for electrochemical mechanical polishing
US20050095957 *29 Oct 20035 May 2005International Business Machines CorporationTwo-sided chemical mechanical polishing pad for semiconductor processing
US20050153633 *7 Feb 200314 Jul 2005Shunichi ShibukiPolishing pad, polishing apparatus, and polishing method
US20050260929 *19 May 200524 Nov 2005Jsr CorporationChemical mechanical polishing pad and chemical mechanical polishing method
US20060002377 *1 Jul 20055 Jan 2006Telefonaktiebolaget Lm Ericsson (Publ)Methods and devices for changing quality of service
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7662028 *16 Jun 200816 Feb 2010Bestac Advanced Material Co., Ltd.Polishing pad having groove structure for avoiding stripping of a polishing surface of the polishing pad
US918057016 Mar 200910 Nov 2015Nexplanar CorporationGrooved CMP pad
US9375823 *2 Oct 201528 Jun 2016Nexplanar CorporationGrooved CMP pads
US9415480 *8 Jul 201316 Aug 20163M Innovative Properties CompanyAbrasive pad and method for abrading glass, ceramic, and metal materials
US20090258587 *16 Jun 200815 Oct 2009Bestac Advanced Material Co., Ltd.Polishing pad having groove structure for avoiding the polishing surface stripping
US20150158141 *8 Jul 201311 Jun 20153M Innovative Properties CompanyAbrasive pad and method for abrading glass, ceramic, and metal materials
US20160023321 *2 Oct 201528 Jan 2016Robert KerprichGrooved cmp pads
Classifications
U.S. Classification451/527
International ClassificationB24D11/00
Cooperative ClassificationB24B37/26
European ClassificationB24B37/26
Legal Events
DateCodeEventDescription
21 May 2008ASAssignment
Owner name: SAN FANG CHEMICAL INDUSTRY CO., LTD., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FENG, CHUNG-CHIH;YAO, I-PENG;CHAO, CHEN-HSIANG;AND OTHERS;REEL/FRAME:020998/0831
Effective date: 20080521