US20080145007A1 - Electronic device and method for manufacturing the same - Google Patents
Electronic device and method for manufacturing the same Download PDFInfo
- Publication number
- US20080145007A1 US20080145007A1 US11/637,780 US63778006A US2008145007A1 US 20080145007 A1 US20080145007 A1 US 20080145007A1 US 63778006 A US63778006 A US 63778006A US 2008145007 A1 US2008145007 A1 US 2008145007A1
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- Prior art keywords
- potting material
- fiber
- cavity
- housing
- optic transceiver
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4285—Optical modules characterised by a connectorised pigtail
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4401—Optical cables
- G02B6/4415—Cables for special applications
- G02B6/4427—Pressure resistant cables, e.g. undersea cables
Definitions
- This invention pertains to electronic devices in general and, more particularly, to an electronic device provided to withstand high pressure conditions and a method for manufacturing the same.
- Fiber-optic transceivers are the heart of a multiplexer system that transmits video and data across a fiber optical cable.
- Fiber-optic cable transmission lines have become more widely used in various electronic applications including fiber-optic transceivers because of their inherent capability of transmitting more data than any comparably sized electrical wire. Since fiber-optic cables do not produce electromagnetic interference and are not susceptible to radio frequency interference, they have become more desirable in computer systems and avionic systems and many other types of systems in which noise interference can cause malfunction thereof.
- fiber optic cable transmission systems have an additional advantage of having lower power requirements than electrical wire transmission lines of comparable data transmission capabilities.
- the fiber-optic transceivers are available and in use for operating in various high pressure applications (at pressures up to 10,000 psi), such as under sea, in deep oil wells or the like.
- high pressure applications at pressures up to 10,000 psi
- the fiber-optic transceivers, mounted to undersea robots or robotic vehicles are subject to water pressure from about 5,000 psi to approximately 10,000 psi.
- the fiber-optic transceivers are subject to comparably high pressure also in decompressing chambers for deep sea divers or the like.
- the fiber-optic transceivers for high pressure applications include specialized high-pressure housings enclosing electronic components of the fiber-optic transceivers and specialized connectors used for power input and signal I/O (input/output).
- these housings are usually custom fabricated of thick gauge titanium, aluminum, composite material or stainless steel to withstand high sub-sea pressures of up to 10,000 psi.
- such a construction makes the metal housings of the fiber-optic transceivers heavy, bulky and expensive.
- the present invention is directed to a novel electronic device provided for operating in various high pressure applications, and a method for manufacturing the same.
- an electronic device for operating in various high pressure applications (at pressures up to 10,000 psi).
- the electronic device comprises a hollow housing defining an enclosed cavity therewithin, an electronic unit disposed within the cavity, and a potting compound filling the cavity in the housing and encapsulating at least one electronic component of the electronic unit.
- the electronic unit includes at least one electronic component.
- the potting material has a compressive strength allowing the electronic device to withstand pressure of up to 10,000 psi.
- a method for manufacturing the electronic device comprises the following steps. First, a hollow housing with the enclosed cavity therewithin is provided. Next, the electronic unit is inserted into the cavity in the housing. Then, the potting material is introduced into the cavity so that a space around the electronic unit is filled with the potting material to encapsulate the electronic unit.
- the potting material has the compressive strength allowing the electronic device to withstand pressure of up to 10,000 psi.
- FIG. 1 is a front perspective view of a fiber-optic transceiver in accordance with a preferred embodiment of the present invention
- FIG. 2 is a rear perspective view of the fiber-optic transceiver in accordance with the preferred embodiment of the present invention
- FIG. 3 is a top view of the fiber-optic transceiver according to the preferred embodiment of the present invention.
- FIG. 4 is a side view of the fiber-optic transceiver of the present invention.
- FIG. 5 is a bottom view of the fiber-optic transceiver of the present invention.
- FIG. 6 is a rear view of the fiber-optic transceiver according to the preferred embodiment of the present invention.
- FIG. 7 is a top view of an electronic unit according to the preferred embodiment of the present invention.
- FIG. 8 is a side view of the electronic unit according to the preferred embodiment of the present invention.
- FIG. 9 is a cross-sectional view of the fiber-optic transceiver according to the preferred embodiment of the present invention.
- FIG. 10 shows the step of degassing a potting material.
- FIGS. 1-9 of the drawings depict a preferred embodiment of the fiber-optic transceiver of the present invention generally denoted by reference numeral 10 . While the preferred embodiment of the present invention is described with reference to the fiber-optic transceiver, it will be appreciated that the present invention is equally applicable to any electronic device packaged into an enclosed housing, especially for various high pressure applications.
- the fiber-optic transceiver 10 comprises a housing 12 that defines an enclosed cavity 14 therein (shown in FIG. 9 ), and an electronic unit 16 disposed within the cavity 14 .
- the housing 12 has opposite top and bottom walls 18 T and 18 B , respectively, opposite right and left side walls 18 SR and 18 SL , respectively, and opposite front and rear walls 18 F and 18 R , respectively.
- the housing 12 further includes a nose portion 20 receiving a proximal end of a fiber optic cable 22 .
- a distal end of the fiber optic cable 22 is provided with a cable connector 23 .
- the nose portion 20 is formed integrally with the housing 12 and extends outwardly from the front wall 18 F thereof.
- the housing 12 is made of complementary top and bottom portions 24 a and 24 b, respectively, connected to each other so as to form the enclosed cavity 14 .
- the housing 12 is made of any appropriate plastic material. It will be appreciated that alternatively the housing 12 may be made of non-corrosive metal, such as stainless steel.
- the cavity 14 is formed so as to accommodate and protect the electronic unit 16 .
- the electronic unit 16 comprises a printed circuit board 26 including at least one electronic component secured thereto, such as semiconductor integrated circuit devices 27 , and a fiber-optic splitter 28 operatively coupled to the printed circuit board 26 and having a terminal 29 .
- the printed circuit board 26 is provided with a transmitter and receiver handling circuitry including a transmitter for converting electrical data signals to corresponding optical data signals and a receiver for converting optical data signals back to electrical data signals.
- the terminal 29 of the fiber-optic splitter 28 is coupled to the proximal end of the fiber optic cable 22 .
- the electronic unit 16 further includes electrical contacts 23 and grounding pins 25 .
- the potting material 30 has compressive strength from about 5,000 psi to about 10,000 psi.
- the compressive strength is a measure of material's ability to withstand a compression force without failure.
- the potting material 30 may be of any composition known to a worker skilled in the art. This may include potting material that is cured with the application of heat or the potting material that is mixed just prior to the filling of the cavity 14 and that hardens due to the mixture of several components.
- the thermally conductive epoxy encapsulating and potting compound 832-TC produced by the MG Chemicals is used as the potting material 30 filling the cavity 14 of the housing 12 .
- the conventional potting material has a compressive strength of well below 5,000 psi when fully cured and hardened.
- the above mentioned potting compound 832-TC produced by the MG Chemicals when fully cured and hardened has the compressive strength of only 4,088 psi.
- Such value of the compressive strength of the conventional potting material is not sufficient for high pressure applications subject to pressure up to 10,000 psi, e.g. under sea, in deep oil wells or the like. Therefore, prior to being introduced into the cavity 14 , the original potting material is degassed (i.e. freed from air bubbles therein) in order to substantially increase the compressive strength thereof.
- a method for manufacturing the fiber-optic transceiver 10 according to the preferred embodiment of the present invention comprises the following steps.
- the complementary top and bottom portions 24 a and 24 b of the housing 12 are provided.
- the housing 12 is formed with one or more access openings provided for introducing the potting material 30 .
- the rear wall 18 R (the upper portion 24 a ) of the housing 12 is formed with two access openings 32 a and 32 b into the cavity 14 .
- the access openings 32 a and 32 b may be formed by any appropriate method known in the art, such as by cutting holes through one of the walls of the housing 12 .
- the printed circuit board 26 of the electronic unit 16 is placed into the bottom portion 24 b of the housing 12 and rested on appropriate mounting pin(s) or ledge(s) or other devices (not shown) that are commonly known to a person skilled in the art to support and properly position the electronic unit 16 within the housing cavity 14 .
- the printed circuit board 26 s placed into the bottom portion 24 b of the housing 12 so as to provide a space between the electronic unit 16 and the bottom portion 24 b.
- the top portion 24 a is attached to the bottom portion 24 b in order to assemble the housing 12 defining the enclosed cavity 14 so as to provide a space between the electronic unit 16 and the top portion 24 a.
- the electronic unit 16 is disposed within the cavity 14 so as to provide the space in the enclosed cavity 14 around the electronic unit 16 .
- the housing 12 is covered with molding clay material (not shown) with the exception of the access openings 32 a and 32 b so as to block gaps in joints between the top and bottom portions 24 a and 24 b of the housing 12 .
- the housing 12 may be placed into an appropriate mold (not shown) covering up the housing 12 , but leaving the access openings 32 a and 32 b open.
- the conventional potting material such as the potting compound 832-TC produced by the MG Chemicals mentioned above.
- the original potting material is mixed and degassed (i.e. freed from air bubbles therein) in order to substantially increase the compressive strength thereof.
- the original potting material 30 is mixed and put into a vacuum chamber 42 within a vacuum bell jar 40 for degassing, as illustrated in FIG. 10 .
- the vacuum chamber 42 of the vacuum bell jar 40 is fluidly connected to a vacuum pump 44 through a vacuum line 46 .
- the original potting material will begin to rise, resembling foam.
- Further increase of the vacuum causes the potting material to fall and not rise any more because substantially all air is removed from the potting material 30 .
- the potting material 30 is substantially degassed.
- the process of vacuuming continues for about 20 more minutes to make certain that all of the air has been removed from the original potting material.
- the potting material 30 is introduced into the cavity 14 of the housing 12 using any appropriate technique known in the art.
- the degassed potting material 30 may be put into a syringe (not shown) and introduced into the cavity 14 using the syringe, or the housing 12 may be put into a mold and the degassed potting material 30 introduced into the cavity 14 using any appropriate injection machine.
- the degassed potting material 30 is introduced (injected) into the cavity 14 of the housing 12 of the fiber-optic transceiver 10 through the first access hole 32 a acting as an inlet port, naturally flows within and fills the cavity 14 encapsulating the electronic unit 16 , and escapes the cavity 14 through the second access hole 32 b acting as an exit port and, possibly, through gaps between the top and bottom portions 24 a and 24 b of the housing 12 .
- the degassed potting material 30 may be introduced into the cavity 14 of the housing 12 through either or both of the access holes 32 a and 32 b. Alternatively, only one access hole in the housing 12 could be provided.
- the potting material 30 is either cured by the application of heat or generates heat on its own due to the chemical reactions required by mixing several components to create a hardened mixture.
- the fiber-optic transceiver 10 is heated in an oven (not shown) to 60° C. to cure and harden the potting material 30 within the housing 12 .
- the housing 12 is trimmed to remove burrs of the excess potting material extending from the gaps in the housing 12 , and the access openings 32 a and 32 b are sealed with the potting material 30 in flush with the rear wall 18 R of the housing 12 .
- the fiber-optic transceiver 10 is electrically tested and pressure cycled, or tested, under fluid pressure of about 10,000 psi.
- the present invention provides a novel electronic device, such as a fiber-optic transceiver 10 , and a method for manufacturing the same, which is securely protected in the high fluid-pressure environment by encapsulating electronic components thereof with a potting material having a compressive strength allowing the electronic device to withstand pressure of up to 10,000 psi.
Abstract
Description
- 1. Field of the Invention
- This invention pertains to electronic devices in general and, more particularly, to an electronic device provided to withstand high pressure conditions and a method for manufacturing the same.
- 2. Description of the Prior Art
- Fiber-optic transceivers are the heart of a multiplexer system that transmits video and data across a fiber optical cable. Fiber-optic cable transmission lines have become more widely used in various electronic applications including fiber-optic transceivers because of their inherent capability of transmitting more data than any comparably sized electrical wire. Since fiber-optic cables do not produce electromagnetic interference and are not susceptible to radio frequency interference, they have become more desirable in computer systems and avionic systems and many other types of systems in which noise interference can cause malfunction thereof. Moreover, fiber optic cable transmission systems have an additional advantage of having lower power requirements than electrical wire transmission lines of comparable data transmission capabilities.
- The fiber-optic transceivers are available and in use for operating in various high pressure applications (at pressures up to 10,000 psi), such as under sea, in deep oil wells or the like. For example, in the under sea applications, the fiber-optic transceivers, mounted to undersea robots or robotic vehicles, are subject to water pressure from about 5,000 psi to approximately 10,000 psi. The fiber-optic transceivers are subject to comparably high pressure also in decompressing chambers for deep sea divers or the like.
- Typically, the fiber-optic transceivers for high pressure applications include specialized high-pressure housings enclosing electronic components of the fiber-optic transceivers and specialized connectors used for power input and signal I/O (input/output). In order to withstand elevated pressure conditions, these housings are usually custom fabricated of thick gauge titanium, aluminum, composite material or stainless steel to withstand high sub-sea pressures of up to 10,000 psi. However, such a construction makes the metal housings of the fiber-optic transceivers heavy, bulky and expensive.
- Thus, while known fiber-optic transceivers, including but not limited to those discussed above, have proven to be acceptable for various high pressure applications, such devices are nevertheless susceptible to improvements that may reduce their weight, size and cost. With this in mind, a need exists to develop improved fiber-optic transceivers that advance the art.
- The present invention is directed to a novel electronic device provided for operating in various high pressure applications, and a method for manufacturing the same.
- According to one aspect of the invention, an electronic device is provided for operating in various high pressure applications (at pressures up to 10,000 psi). The electronic device comprises a hollow housing defining an enclosed cavity therewithin, an electronic unit disposed within the cavity, and a potting compound filling the cavity in the housing and encapsulating at least one electronic component of the electronic unit. The electronic unit includes at least one electronic component. The potting material has a compressive strength allowing the electronic device to withstand pressure of up to 10,000 psi.
- According to another aspect of the invention, a method for manufacturing the electronic device is provided. The method of the present invention comprises the following steps. First, a hollow housing with the enclosed cavity therewithin is provided. Next, the electronic unit is inserted into the cavity in the housing. Then, the potting material is introduced into the cavity so that a space around the electronic unit is filled with the potting material to encapsulate the electronic unit. The potting material has the compressive strength allowing the electronic device to withstand pressure of up to 10,000 psi.
- Objects and advantages of the invention will become apparent from a study of the following specification when viewed in light of the accompanying drawings, wherein:
-
FIG. 1 is a front perspective view of a fiber-optic transceiver in accordance with a preferred embodiment of the present invention; -
FIG. 2 is a rear perspective view of the fiber-optic transceiver in accordance with the preferred embodiment of the present invention; -
FIG. 3 is a top view of the fiber-optic transceiver according to the preferred embodiment of the present invention; -
FIG. 4 is a side view of the fiber-optic transceiver of the present invention; -
FIG. 5 is a bottom view of the fiber-optic transceiver of the present invention; -
FIG. 6 is a rear view of the fiber-optic transceiver according to the preferred embodiment of the present invention; -
FIG. 7 is a top view of an electronic unit according to the preferred embodiment of the present invention; -
FIG. 8 is a side view of the electronic unit according to the preferred embodiment of the present invention; -
FIG. 9 is a cross-sectional view of the fiber-optic transceiver according to the preferred embodiment of the present invention; -
FIG. 10 shows the step of degassing a potting material. - The preferred embodiments of the present invention will now be described with the reference to accompanying drawing.
- For purposes of the following description, certain terminology is used in the following description for convenience only and is not limiting. The words such as “top” and “bottom”, “upper” and “lower”, “left” and “right” designate directions in the drawings to which reference is made. The words “smaller” and “larger” refer to relative size of elements of the apparatus of the present invention and designated portions thereof. The terminology includes the words specifically mentioned above, derivatives thereof and words of similar import. Additionally, the word “a”, as used in the claims, means “at least one”.
- The present invention relates to a fiber-optic transceiver for a multiplexer system that transmits video and data across a fiber optical link.
FIGS. 1-9 of the drawings depict a preferred embodiment of the fiber-optic transceiver of the present invention generally denoted byreference numeral 10. While the preferred embodiment of the present invention is described with reference to the fiber-optic transceiver, it will be appreciated that the present invention is equally applicable to any electronic device packaged into an enclosed housing, especially for various high pressure applications. - The fiber-
optic transceiver 10 comprises ahousing 12 that defines an enclosedcavity 14 therein (shown inFIG. 9 ), and anelectronic unit 16 disposed within thecavity 14. Thehousing 12 has opposite top andbottom walls left side walls rear walls housing 12 further includes anose portion 20 receiving a proximal end of a fiberoptic cable 22. A distal end of the fiberoptic cable 22 is provided with acable connector 23. Thenose portion 20 is formed integrally with thehousing 12 and extends outwardly from thefront wall 18 F thereof. Preferably, thehousing 12 is made of complementary top andbottom portions cavity 14. Further preferably, thehousing 12 is made of any appropriate plastic material. It will be appreciated that alternatively thehousing 12 may be made of non-corrosive metal, such as stainless steel. - The
cavity 14 is formed so as to accommodate and protect theelectronic unit 16. Theelectronic unit 16 comprises aprinted circuit board 26 including at least one electronic component secured thereto, such as semiconductor integrated circuit devices 27, and a fiber-optic splitter 28 operatively coupled to the printedcircuit board 26 and having aterminal 29. The printedcircuit board 26 is provided with a transmitter and receiver handling circuitry including a transmitter for converting electrical data signals to corresponding optical data signals and a receiver for converting optical data signals back to electrical data signals. Theterminal 29 of the fiber-optic splitter 28 is coupled to the proximal end of the fiberoptic cable 22. Theelectronic unit 16 further includeselectrical contacts 23 andgrounding pins 25. - A space in the
enclosed cavity 14 of thehousing 12 around theelectronic unit 16 is filled with apotting material 30, as illustrated inFIG. 9 . According to the present invention, the pottingmaterial 30 has compressive strength from about 5,000 psi to about 10,000 psi. The compressive strength is a measure of material's ability to withstand a compression force without failure. The pottingmaterial 30 may be of any composition known to a worker skilled in the art. This may include potting material that is cured with the application of heat or the potting material that is mixed just prior to the filling of thecavity 14 and that hardens due to the mixture of several components. In the exemplary embodiment of the present invention, the thermally conductive epoxy encapsulating and potting compound 832-TC produced by the MG Chemicals is used as the pottingmaterial 30 filling thecavity 14 of thehousing 12. The conventional potting material has a compressive strength of well below 5,000 psi when fully cured and hardened. For example, the above mentioned potting compound 832-TC produced by the MG Chemicals when fully cured and hardened has the compressive strength of only 4,088 psi. Such value of the compressive strength of the conventional potting material is not sufficient for high pressure applications subject to pressure up to 10,000 psi, e.g. under sea, in deep oil wells or the like. Therefore, prior to being introduced into thecavity 14, the original potting material is degassed (i.e. freed from air bubbles therein) in order to substantially increase the compressive strength thereof. - A method for manufacturing the fiber-
optic transceiver 10 according to the preferred embodiment of the present invention comprises the following steps. - First, the complementary top and
bottom portions housing 12 are provided. Thehousing 12 is formed with one or more access openings provided for introducing thepotting material 30. In the exemplary embodiment shown inFIGS. 1-6 , the rear wall 18 R (theupper portion 24 a) of thehousing 12 is formed with twoaccess openings 32 a and 32 b into thecavity 14. Theaccess openings 32 a and 32 b may be formed by any appropriate method known in the art, such as by cutting holes through one of the walls of thehousing 12. - Next, the printed
circuit board 26 of theelectronic unit 16 is placed into thebottom portion 24 b of thehousing 12 and rested on appropriate mounting pin(s) or ledge(s) or other devices (not shown) that are commonly known to a person skilled in the art to support and properly position theelectronic unit 16 within thehousing cavity 14. Moreover, the printed circuit board 26 s placed into thebottom portion 24 b of thehousing 12 so as to provide a space between theelectronic unit 16 and thebottom portion 24 b. Then, thetop portion 24 a is attached to thebottom portion 24 b in order to assemble thehousing 12 defining theenclosed cavity 14 so as to provide a space between theelectronic unit 16 and thetop portion 24 a. Thus, theelectronic unit 16 is disposed within thecavity 14 so as to provide the space in theenclosed cavity 14 around theelectronic unit 16. - After that, the
housing 12 is covered with molding clay material (not shown) with the exception of theaccess openings 32 a and 32 b so as to block gaps in joints between the top andbottom portions housing 12. Alternatively, thehousing 12 may be placed into an appropriate mold (not shown) covering up thehousing 12, but leaving theaccess openings 32 a and 32 b open. - In the following method step, the conventional potting material, such as the potting compound 832-TC produced by the MG Chemicals mentioned above, is provided. Then, the original potting material is mixed and degassed (i.e. freed from air bubbles therein) in order to substantially increase the compressive strength thereof.
- Specifically, prior to being introduced into the
cavity 14, theoriginal potting material 30 is mixed and put into avacuum chamber 42 within avacuum bell jar 40 for degassing, as illustrated inFIG. 10 . Thevacuum chamber 42 of thevacuum bell jar 40 is fluidly connected to a vacuum pump 44 through avacuum line 46. Once the vacuum within thevacuum chamber 42 reaches 29-30 inches of mercury (as monitored by a vacuum gauge 48), the original potting material will begin to rise, resembling foam. Further increase of the vacuum causes the potting material to fall and not rise any more because substantially all air is removed from the pottingmaterial 30. At this point, the pottingmaterial 30 is substantially degassed. Preferably, the process of vacuuming continues for about 20 more minutes to make certain that all of the air has been removed from the original potting material. - Subsequently, the potting
material 30 is introduced into thecavity 14 of thehousing 12 using any appropriate technique known in the art. For example, the degassedpotting material 30 may be put into a syringe (not shown) and introduced into thecavity 14 using the syringe, or thehousing 12 may be put into a mold and the degassedpotting material 30 introduced into thecavity 14 using any appropriate injection machine. - The degassed
potting material 30 is introduced (injected) into thecavity 14 of thehousing 12 of the fiber-optic transceiver 10 through the first access hole 32 a acting as an inlet port, naturally flows within and fills thecavity 14 encapsulating theelectronic unit 16, and escapes thecavity 14 through thesecond access hole 32 b acting as an exit port and, possibly, through gaps between the top andbottom portions housing 12. In fact, the degassedpotting material 30 may be introduced into thecavity 14 of thehousing 12 through either or both of the access holes 32 a and 32 b. Alternatively, only one access hole in thehousing 12 could be provided. - It will be appreciated that above process of injecting the degassed potting material into the
housing 12 does not usually introduce any new bubbles into the degassed (vacuumed) potting material. However, in order to insure that the pottingmaterial 30 is completely devoid of air bubbles, the entire fiber-optic transceiver 10 is placed back into thevacuum chamber 42 of thevacuum bell jar 40 for a few additional minutes right after filling thehousing 12 with the potting material but before the potting material hardens (or cures) for an additional (repeated) degassing. This process step of additional (second or repeated) degassing also assists the degassed potting material to fill difficult to reach areas of thecavity 14 of thehousing 12 in order to completely fill thecavity 14. - Then, the potting
material 30 is either cured by the application of heat or generates heat on its own due to the chemical reactions required by mixing several components to create a hardened mixture. In the exemplary embodiment of the present invention, the fiber-optic transceiver 10 is heated in an oven (not shown) to 60° C. to cure and harden thepotting material 30 within thehousing 12. - Subsequently, once the potting
material 30 has fully cured, thehousing 12 is trimmed to remove burrs of the excess potting material extending from the gaps in thehousing 12, and theaccess openings 32 a and 32 b are sealed with the pottingmaterial 30 in flush with therear wall 18 R of thehousing 12. - Finally, the fiber-
optic transceiver 10 is electrically tested and pressure cycled, or tested, under fluid pressure of about 10,000 psi. - Therefore, the present invention provides a novel electronic device, such as a fiber-
optic transceiver 10, and a method for manufacturing the same, which is securely protected in the high fluid-pressure environment by encapsulating electronic components thereof with a potting material having a compressive strength allowing the electronic device to withstand pressure of up to 10,000 psi. - The foregoing description of the preferred embodiment of the present invention has been presented for the purpose of illustration in accordance with the provisions of the Patent Statutes. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. The embodiments disclosed hereinabove were chosen in order to best illustrate the principles of the present invention and its practical application to thereby enable those of ordinary skill in the art to best utilize the invention in various embodiments and with various modifications as suited to the particular use contemplated, as long as the principles described herein are followed. This application is therefore intended to cover any variations, uses, or adaptations of the invention using its general principles. Further, this application is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains. Thus, changes can be made in the above-described invention without departing from the intent and scope thereof. It is also intended that the scope of the present invention be defined by the claims appended thereto.
Claims (19)
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Cited By (6)
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US20110053526A1 (en) * | 2009-06-16 | 2011-03-03 | David Matthew Strei | Wireless process communication adapter with improved encapsulation |
US20120191409A1 (en) * | 2008-03-28 | 2012-07-26 | Hexagon Metrology, Inc. | Systems and methods for improved coordinate acquisition member comprising calibration information |
US10054510B2 (en) | 2015-09-11 | 2018-08-21 | Mitsubishi Heavy Industries, Ltd. | Method of calibrating load measurement apparatus, load measurement system of wind turbine blade, and wind turbine |
US10400750B2 (en) | 2015-09-11 | 2019-09-03 | Mitsubishi Heavy Industries, Ltd. | Wind turbine power generating apparatus and method of connecting the same |
US10697440B2 (en) | 2017-02-13 | 2020-06-30 | Mitsubishi Heavy Industries, Ltd. | Method of detecting damage of wind turbine blade, and wind turbine |
US10761524B2 (en) | 2010-08-12 | 2020-09-01 | Rosemount Inc. | Wireless adapter with process diagnostics |
Citations (18)
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US10761524B2 (en) | 2010-08-12 | 2020-09-01 | Rosemount Inc. | Wireless adapter with process diagnostics |
US10054510B2 (en) | 2015-09-11 | 2018-08-21 | Mitsubishi Heavy Industries, Ltd. | Method of calibrating load measurement apparatus, load measurement system of wind turbine blade, and wind turbine |
US10400750B2 (en) | 2015-09-11 | 2019-09-03 | Mitsubishi Heavy Industries, Ltd. | Wind turbine power generating apparatus and method of connecting the same |
US10697440B2 (en) | 2017-02-13 | 2020-06-30 | Mitsubishi Heavy Industries, Ltd. | Method of detecting damage of wind turbine blade, and wind turbine |
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