US20070201212A1 - Interposable Heat Sink for Adjacent Memory Modules - Google Patents
Interposable Heat Sink for Adjacent Memory Modules Download PDFInfo
- Publication number
- US20070201212A1 US20070201212A1 US11/746,322 US74632207A US2007201212A1 US 20070201212 A1 US20070201212 A1 US 20070201212A1 US 74632207 A US74632207 A US 74632207A US 2007201212 A1 US2007201212 A1 US 2007201212A1
- Authority
- US
- United States
- Prior art keywords
- memory modules
- members
- electronic components
- pair
- another
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates generally to a heat sink device configured to dissipate heat from electronic components of a conventional memory module, such as a SIMM or DIMM.
- Conventional memory modules include multiple individual memory chips arranged on a printed circuit board that is configured to mate with a conventional connector of a motherboard of a PC, etc. Such conventional memory modules conform to industry standards of size, configuration etc. Exemplary memory modules include SIMMs and DIMMs.
- FIGS. 1 and 2 are diagrammatic plan and side views of the memory module.
- the memory module is generally designated with reference number 10 , and includes a number of packaged memory ICs 12 and a plurality of chip-type capacitors 14 mounted on each face of a printed circuit board 16 .
- the printed circuit board 16 has an array of contacts 18 provided along a long-side edge of each face of the printed circuit board 16 for electrical connection with an appropriate mating socket of a motherboard, etc.
- the semiconductor memory ICs 12 and the chip-type capacitors 14 are mounted on each face of the printed circuit board 16 (in a DIMM), and the memory module 10 is inserted into a connector slot (not shown) within a system such as a personal computer or other information processing system. Therefore, heat generated in the memory ICs 12 is radiated from only the surface of the memory ICs 12 .
- the present invention provides a heat sink device for conventional memory modules, such as DIMMs, that is configured to be interposed between adjacent memory modules, and to dissipate heat from separate, adjacent memory modules.
- the heat sink device includes thermally conductive first and second members. Each member has a respective surface configured to thermally couple with electronic components of a conventional memory module.
- the first and second members are resiliently biased away from one another.
- the resilient bias causes the first and second members of the heat sink device to abut respective electronic components on opposed surfaces of the adjacent memory modules.
- a separate wedge member, or a lever-mounted wedge member is driven between the first and second members to urge them away from one another and into abutting relationship electronic components on opposed surfaces of the adjacent memory modules.
- a single heat sink device When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
- FIGS. 1 and 2 are diagrammatic plan and side views, respectively, of an exemplary memory module of the prior art
- FIG. 3 is a diagrammatic side view of a plurality of heat sink devices according to a first embodiment of the present invention, shown interposed among an array of exemplary memory modules of FIGS. 1 and 2 ;
- FIG. 4 is a diagrammatic top view of the heat sink devices and memory modules of FIG. 3 ;
- FIG. 5 is an alternative exemplary embodiment of a heat sink device in accordance with the present invention.
- FIG. 6 is a diagrammatic side view of the exemplary heat sink device of FIG. 5 , shown interposed between adjacent memory modules;
- FIG. 7 is a diagrammatic side view of another alternative exemplary embodiment of a heat sink device in accordance with the present invention.
- FIG. 8 is a diagrammatic side view of the heat sink of FIG. 7 , shown with a lever-style wedge mechanism.
- the present invention provides a heat sink device configured to dissipate heat from electronic components of a conventional memory module, such as a DIMM. Unlike a conventional heat sink device that is attached directly to a memory in an “on-the-module” design, the present invention provides heat sink devices configured to be interposed between adjacent memory modules in a “between-the-modules” design.
- heat sink devices 20 in accordance with one embodiment of the present invention are shown. It will be appreciated from FIGS. 3 and 4 that the heat sink devices 20 are configured to dissipate heat from conventional memory modules, such as DIMMs, while further, the inventive heat sink devices 20 can be installed and used without any need for any modification to the conventional memory module, and without the need for any tools. Further still, the heat sink devices are configured to be fitted to conventional memory modules after such modules are mounted as conventional connectors of a printer circuit board, such connectors being relied upon to provide positional stability used in accordance with the present invention.
- conventional memory modules such as DIMMs
- the heat sink devices 20 are shown in a conventional environment, namely, among conventional memory modules 10 a , 10 b , 10 c , 10 d (DIMMs in FIGS. 3 and 4 ) that are supported in substantially parallel positions on adjacent connectors 52 of a printed circuit board 50 , such as a motherboard of a PC or other information processing system.
- a printed circuit board 50 such as a motherboard of a PC or other information processing system.
- the heat sink devices 20 include first and second members 22 , 24 .
- Each member 22 , 24 is constructed of a suitable thermally conductive material, such as copper or aluminum, and is thus suitable for use as a heat spreader or heat sink to facilitate heat dissipation and corresponding connective cooling of memory modules.
- Each of the first and second members 22 , 24 has a respective first surface 22 a , 24 a configured to thermally couple with electronic components of conventional memory modules e.g. memory ICs 12 .
- the first surface 22 a of the first member 22 will couple with electronic components of a first memory module (e.g. 10 b ) and the second surface 24 a of the second member 24 will couple with electronic components of a second memory module (e.g. 10 c ), as discussed in greater detail below.
- the first and second members 22 , 24 are resiliently biased away from one another.
- This bias causes the first and second members 22 , 24 to abut respective electronic components 12 a , 12 b on the opposed surfaces 16 a , 16 b of adjacent memory modules 10 b , 10 c .
- this bias facilitates wedging of the heat sink device 20 between adjacent memory modules. Accordingly, a single heat sink device 20 is used to dissipate heat from two adjacent memory modules.
- the first and second members 22 , 24 are biased by a spring member 36 joined to one of the first and second members 22 , 24 .
- the first member 22 includes a plurality of elongated sockets 30 a , 30 b , 30 c , 30 d .
- the second member 24 includes a plurality of complementary elongated pins 32 a , 32 b , 32 c , 32 d , each riding in a respective socket.
- the first member 22 includes the pins and the second member 24 includes the sockets.
- each member includes at least one pin and at least one socket, and the other member includes complementary pins and sockets.
- each spring members 36 a , 36 b , 36 c , 36 d includes a coil spring, which optionally is generally conical in shape.
- Each spring member is preferably positioned within a respective socket, and optionally is joined to the pin or the socket, or both the pin and the socket.
- each pin may include a peripheral groove for receiving and retaining a portion of the coil spring.
- the pin may be integrally formed with or mechanically joined to the pin or socket.
- each member 22 , 24 includes a respective set of conductive fins 42 , 44 , to enhance the cooling effect provided by the heat sink device 20 .
- the fins 42 , 44 are preferably arranged on each member such that the fins 42 of the first member 22 are positioned to interleave with the fins 44 of the second member 24 , as shown in FIGS. 3 and 4 .
- This type of arrangement is preferred to allow the fins to be relatively long. i.e., longer than half of the distance between the members 22 , 24 .
- any suitable configuration of fins may be employed.
- the exemplary device 20 may also be used to cool a memory module on a periphery of an array of memory modules, i.e., where there is no second memory module between which the device 20 may be interposed.
- a memory module is shown at A in FIGS. 3 and 4 .
- the motherboard 50 or housing (not shown) of an information processing system, etc. may optionally be provided with a brace 60 , such that the device 20 may be interposed between a memory module 10 d and the brace 60 , with the brace 60 acting as a substitute for an adjacent memory module.
- this embodiment of the heat sink device 20 is first squeezed to compress the spring member(s) move the first and second members 22 , 24 toward one another.
- the heat sink device 28 is readily manually positioned between adjacent memory modules 10 b , 10 c (or between a memory module 10 d and a brace 60 ). Once positioned between adjacent memory modules 10 b , 10 c , the squeezing force is released to allow the spring member(s) 36 a , 36 b , 36 c and 36 d to resile.
- the resiling of the spring members causes the first and second members 22 , 24 to move outwardly, away from one another, and into abutting relationship with the electronic components 12 of the adjacent memory modules 10 b , 10 c .
- This abutting relationship provides thermal coupling of the electronic components 12 with the heat sink device 20 to facilitate convective cooling of the memory modules 10 a , 10 b .
- the heat sink device 20 may be installed and retained in a tool free manner, without the need to modify a conventional memory module.
- the device 20 further includes a retention module 70 .
- the retention module 70 is made of a highly thermally conductive material such as copper or aluminum, i.e. a material similar to that of the members 22 , 24 .
- the retention module 70 is made of a material having a thermal conductivity less than that of the first and second members.
- the retention module 70 is formed as a unitary body, e.g. by stamping and crimping sheet metal stock, by forming an injection molded body, etc.
- the retention module 70 includes a pair of opposing legs 72 , 74 to which the first and second members 22 , 24 are mounted, e.g. by heat staking, mechanical fasteners, etc.
- each of the legs 72 , 74 defines a plurality of openings 76 for admitting passage of air adjacent the first and second members to facilitate convective cooling.
- FIG. 6 is a diagrammatic side view of the exemplary heat sink device 20 of FIG. 5 , shown interposed between adjacent memory modules 10 a , 10 b .
- the legs 72 , 74 are resiliently deflectable toward one another to resiliently bias the first and second members 22 , 24 away from one another.
- the retention module 70 is configured so that in its relaxed state it is not readily insertable between adjacent memory modules 10 a , 10 b . Instead, the legs 72 , 74 are squeezed together (e.g. manually) during insertion of the head sink device 20 between adjacent memory modules 10 a , 10 b.
- this embodiment of the heat sink device 20 is first squeezed to resiliently deflect the legs 72 , 74 inwardly and to move the first and second members 22 , 24 toward one another.
- the heat sink device 20 is readily manually positioned between adjacent memory modules 10 a , 10 b .
- the legs 72 , 74 are permitted to resile.
- the resiling of the legs 72 , 74 causes the first and second members 22 , 24 to move outwardly, away from one another, and into abutting relationship with the electronic components 12 a , 12 b of the adjacent memory modules 10 a , 10 b .
- This resiling effectively wedges the heat sink device 20 between the adjacent memory modules, the heat sink being capable of retained in place by friction alone.
- This abutting relationship provides thermal coupling of the electronic components 12 with the heat sink device 20 to facilitate convective cooling of the memory modules 10 a , 10 b . Accordingly, the heat sink device 20 may be installed and retained in a tool free manner, without the need to modify a conventional memory module.
- FIG. 7 is a side view of another alternative exemplary embodiment of a heat sink device in accordance with the present invention. This embodiment is similar to that of FIG. 6 . However, in this embodiment, the retention module 70 is not configured to have, or to rely upon, outward resilient biasing of the module's legs 72 , 74 . Instead, the retention module 70 is configured to be readily insertable in its relaxed state between adjacent memory modules 10 a , 10 b , as shown in FIG. 7 .
- a wedge member 80 ( FIG. 7 ) is selectively positionable between the first and second members 22 , 24 to urge the first and second members away from one another and into abutting relationship with respective electronic components 12 a , 12 b of opposed/facing surfaces of adjacent memory modules 10 a , 10 b.
- the wedge member 80 is provided as a discrete member that is positionable between the opposing legs 72 , 74 to urge the first and second members 22 , 24 away from one another, e.g. by manually pressing the wedge 80 between the legs 72 , 74 .
- this embodiment of the retention module 70 is simply manually positioned between adjacent memory modules 10 a , 10 b .
- a wedge member 80 is then manually pressed between the legs 72 , 74 to urge the first and second members 22 , 24 away from one another and into abutting relationship with the electronic components 12 a , 12 b of the adjacent memory modules 10 a , 10 b .
- This provides thermal coupling of the electronic components 12 a , 12 b with the heat sink device 20 to facilitate convective cooling of the memory modules 10 a , 10 b.
- the heat sink device 20 may be installed and retained in a tool free manner, without the need to modify a conventional memory module.
- the printed circuit board 50 is specially configured in accordance with the present invention to include a lever 90 pivotably mounted to the printed circuit board 50 on supports 92 .
- the lever 90 supports the wedge member(s) 80 and is selectively pivotable between a first position, in which the wedge member 80 will not interfere with the device 20 during its insertion between adjacent memory modules 10 a , 10 b , and a second position, in which the wedge member 80 is interposed between the opposing legs 72 , 74 to urge the first and second members 22 , 24 away from one another and into contact with adjacent memory modules.
- this embodiment of the retention module 70 is simply manually positioned between adjacent memory modules 10 a , 10 b with the lever 90 in the first position.
- the lever 90 is then pivoted from the first position to the second position to drive the wedge(s) between the legs 72 , 74 of the retention module 70 .
- the interposition of the wedge(s) urges the first and second members 22 , 24 into abutting relationship with the electronic components 12 a , 12 b of the adjacent memory modules 10 a , 10 b , and thereby provides thermal coupling of the electronic components with the heat sink device 20 to facilitate convective cooling of the memory modules 10 a , 10 b.
Abstract
Description
- The present invention relates generally to a heat sink device configured to dissipate heat from electronic components of a conventional memory module, such as a SIMM or DIMM.
- Conventional memory modules include multiple individual memory chips arranged on a printed circuit board that is configured to mate with a conventional connector of a motherboard of a PC, etc. Such conventional memory modules conform to industry standards of size, configuration etc. Exemplary memory modules include SIMMs and DIMMs.
- Recent increases in the integration density of memory integrated circuits on memory modules, and the development of newer memory ICs, such as DDR2 ICs, have resulted in memory modules that run “hotter.” Further, many vendors of conventional memory modules have lowered the DIMM junction temperature specifications while power requirements have increased. Further still, newer CPUs are tending to run hotter, and the memory modules are receiving preheated air from the exhaust of the CPU's heat sink, making it more difficult to cool memory modules in a conventional manner.
- An exemplary conventional module is shown in
FIGS. 1 and 2 , which are diagrammatic plan and side views of the memory module. As shown inFIGS. 1 and 2 , the memory module is generally designated withreference number 10, and includes a number of packagedmemory ICs 12 and a plurality of chip-type capacitors 14 mounted on each face of a printedcircuit board 16. The printedcircuit board 16 has an array ofcontacts 18 provided along a long-side edge of each face of the printedcircuit board 16 for electrical connection with an appropriate mating socket of a motherboard, etc. - As seen from
FIGS. 1 and 2 , thesemiconductor memory ICs 12 and the chip-type capacitors 14 are mounted on each face of the printed circuit board 16 (in a DIMM), and thememory module 10 is inserted into a connector slot (not shown) within a system such as a personal computer or other information processing system. Therefore, heat generated in thememory ICs 12 is radiated from only the surface of thememory ICs 12. - The present invention provides a heat sink device for conventional memory modules, such as DIMMs, that is configured to be interposed between adjacent memory modules, and to dissipate heat from separate, adjacent memory modules.
- The heat sink device includes thermally conductive first and second members. Each member has a respective surface configured to thermally couple with electronic components of a conventional memory module.
- In one embodiment, the first and second members are resiliently biased away from one another. When placed between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board, the resilient bias causes the first and second members of the heat sink device to abut respective electronic components on opposed surfaces of the adjacent memory modules.
- In another embodiment, a separate wedge member, or a lever-mounted wedge member is driven between the first and second members to urge them away from one another and into abutting relationship electronic components on opposed surfaces of the adjacent memory modules.
- When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
- The present invention will now be described by way of example with reference to the following drawings in which:
-
FIGS. 1 and 2 are diagrammatic plan and side views, respectively, of an exemplary memory module of the prior art; -
FIG. 3 is a diagrammatic side view of a plurality of heat sink devices according to a first embodiment of the present invention, shown interposed among an array of exemplary memory modules ofFIGS. 1 and 2 ; -
FIG. 4 is a diagrammatic top view of the heat sink devices and memory modules ofFIG. 3 ; -
FIG. 5 is an alternative exemplary embodiment of a heat sink device in accordance with the present invention; -
FIG. 6 is a diagrammatic side view of the exemplary heat sink device ofFIG. 5 , shown interposed between adjacent memory modules; -
FIG. 7 is a diagrammatic side view of another alternative exemplary embodiment of a heat sink device in accordance with the present invention; and -
FIG. 8 is a diagrammatic side view of the heat sink ofFIG. 7 , shown with a lever-style wedge mechanism. - The present invention provides a heat sink device configured to dissipate heat from electronic components of a conventional memory module, such as a DIMM. Unlike a conventional heat sink device that is attached directly to a memory in an “on-the-module” design, the present invention provides heat sink devices configured to be interposed between adjacent memory modules in a “between-the-modules” design.
- Referring now to
FIGS. 3 and 4 ,heat sink devices 20 in accordance with one embodiment of the present invention are shown. It will be appreciated fromFIGS. 3 and 4 that theheat sink devices 20 are configured to dissipate heat from conventional memory modules, such as DIMMs, while further, the inventiveheat sink devices 20 can be installed and used without any need for any modification to the conventional memory module, and without the need for any tools. Further still, the heat sink devices are configured to be fitted to conventional memory modules after such modules are mounted as conventional connectors of a printer circuit board, such connectors being relied upon to provide positional stability used in accordance with the present invention. Accordingly, theheat sink devices 20 are shown in a conventional environment, namely, amongconventional memory modules FIGS. 3 and 4 ) that are supported in substantially parallel positions onadjacent connectors 52 of a printedcircuit board 50, such as a motherboard of a PC or other information processing system. - Referring again to
FIGS. 3 and 4 , theheat sink devices 20 include first andsecond members member - Each of the first and
second members first surface e.g. memory ICs 12. Thefirst surface 22 a of thefirst member 22 will couple with electronic components of a first memory module (e.g. 10 b) and thesecond surface 24 a of thesecond member 24 will couple with electronic components of a second memory module (e.g. 10 c), as discussed in greater detail below. - In this embodiment of the present invention, the first and
second members second members electronic components opposed surfaces adjacent memory modules heat sink device 20 between adjacent memory modules. Accordingly, a singleheat sink device 20 is used to dissipate heat from two adjacent memory modules. - In
FIGS. 3 and 4 , the first andsecond members second members first member 22 includes a plurality ofelongated sockets second member 24 includes a plurality of complementaryelongated pins first member 22 includes the pins and thesecond member 24 includes the sockets. In another alternative embodiment, each member includes at least one pin and at least one socket, and the other member includes complementary pins and sockets. - Preferably, each
spring members - Preferably, each
member conductive fins heat sink device 20. Thefins fins 42 of thefirst member 22 are positioned to interleave with thefins 44 of thesecond member 24, as shown inFIGS. 3 and 4 . This type of arrangement is preferred to allow the fins to be relatively long. i.e., longer than half of the distance between themembers - Optionally, the
exemplary device 20 may also be used to cool a memory module on a periphery of an array of memory modules, i.e., where there is no second memory module between which thedevice 20 may be interposed. Such a memory module is shown at A inFIGS. 3 and 4 . To use the device in this manner, themotherboard 50 or housing (not shown) of an information processing system, etc. may optionally be provided with abrace 60, such that thedevice 20 may be interposed between amemory module 10 d and thebrace 60, with thebrace 60 acting as a substitute for an adjacent memory module. - In use, this embodiment of the
heat sink device 20 is first squeezed to compress the spring member(s) move the first andsecond members adjacent memory modules memory module 10 d and a brace 60). Once positioned betweenadjacent memory modules second members electronic components 12 of theadjacent memory modules electronic components 12 with theheat sink device 20 to facilitate convective cooling of thememory modules heat sink device 20 may be installed and retained in a tool free manner, without the need to modify a conventional memory module. - In the alternative embodiment of
FIG. 5 , thedevice 20 further includes aretention module 70. In one embodiment, theretention module 70 is made of a highly thermally conductive material such as copper or aluminum, i.e. a material similar to that of themembers retention module 70 is made of a material having a thermal conductivity less than that of the first and second members. Preferably, theretention module 70 is formed as a unitary body, e.g. by stamping and crimping sheet metal stock, by forming an injection molded body, etc. - The
retention module 70 includes a pair of opposinglegs second members legs openings 76 for admitting passage of air adjacent the first and second members to facilitate convective cooling. -
FIG. 6 is a diagrammatic side view of the exemplaryheat sink device 20 ofFIG. 5 , shown interposed betweenadjacent memory modules legs second members retention module 70 is configured so that in its relaxed state it is not readily insertable betweenadjacent memory modules legs head sink device 20 betweenadjacent memory modules - In use, this embodiment of the
heat sink device 20 is first squeezed to resiliently deflect thelegs second members heat sink device 20 is readily manually positioned betweenadjacent memory modules adjacent memory modules legs legs second members electronic components adjacent memory modules heat sink device 20 between the adjacent memory modules, the heat sink being capable of retained in place by friction alone. This abutting relationship provides thermal coupling of theelectronic components 12 with theheat sink device 20 to facilitate convective cooling of thememory modules heat sink device 20 may be installed and retained in a tool free manner, without the need to modify a conventional memory module. -
FIG. 7 is a side view of another alternative exemplary embodiment of a heat sink device in accordance with the present invention. This embodiment is similar to that ofFIG. 6 . However, in this embodiment, theretention module 70 is not configured to have, or to rely upon, outward resilient biasing of the module'slegs retention module 70 is configured to be readily insertable in its relaxed state betweenadjacent memory modules FIG. 7 . - Accordingly, in the embodiment of
FIG. 7 , no tools and no squeezing force is required. In this embodiment, a wedge member 80 (FIG. 7 ) is selectively positionable between the first andsecond members electronic components adjacent memory modules - In this exemplary embodiment, the
wedge member 80 is provided as a discrete member that is positionable between the opposinglegs second members wedge 80 between thelegs - In use, this embodiment of the
retention module 70 is simply manually positioned betweenadjacent memory modules wedge member 80 is then manually pressed between thelegs second members electronic components adjacent memory modules electronic components heat sink device 20 to facilitate convective cooling of thememory modules - Accordingly, the
heat sink device 20 may be installed and retained in a tool free manner, without the need to modify a conventional memory module. - In the alternative embodiment shown in
FIG. 8 , the printedcircuit board 50 is specially configured in accordance with the present invention to include alever 90 pivotably mounted to the printedcircuit board 50 on supports 92. Thelever 90 supports the wedge member(s) 80 and is selectively pivotable between a first position, in which thewedge member 80 will not interfere with thedevice 20 during its insertion betweenadjacent memory modules wedge member 80 is interposed between the opposinglegs second members - In use, this embodiment of the
retention module 70 is simply manually positioned betweenadjacent memory modules lever 90 in the first position. Thelever 90 is then pivoted from the first position to the second position to drive the wedge(s) between thelegs retention module 70. The interposition of the wedge(s) urges the first andsecond members electronic components adjacent memory modules heat sink device 20 to facilitate convective cooling of thememory modules - While there has been described herein the principles of the invention, it is to be understood by those skilled in the art that this description is made only by way of example and not as a limitation to the scope of the invention. Accordingly, it is intended by the appended claims, to cover all modifications of the invention which fall within the true spirit and scope of the invention.
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/746,322 US7342797B2 (en) | 2005-03-30 | 2007-05-09 | Interposable heat sink for adjacent memory modules |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/093,445 US7289331B2 (en) | 2005-03-30 | 2005-03-30 | Interposable heat sink for adjacent memory modules |
US11/746,322 US7342797B2 (en) | 2005-03-30 | 2007-05-09 | Interposable heat sink for adjacent memory modules |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/093,445 Continuation US7289331B2 (en) | 2005-03-30 | 2005-03-30 | Interposable heat sink for adjacent memory modules |
Publications (2)
Publication Number | Publication Date |
---|---|
US20070201212A1 true US20070201212A1 (en) | 2007-08-30 |
US7342797B2 US7342797B2 (en) | 2008-03-11 |
Family
ID=37070133
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/093,445 Expired - Fee Related US7289331B2 (en) | 2005-03-30 | 2005-03-30 | Interposable heat sink for adjacent memory modules |
US11/746,322 Active US7342797B2 (en) | 2005-03-30 | 2007-05-09 | Interposable heat sink for adjacent memory modules |
US11/748,020 Active US7339793B2 (en) | 2005-03-30 | 2007-05-14 | Interposable heat sink for adjacent memory modules |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/093,445 Expired - Fee Related US7289331B2 (en) | 2005-03-30 | 2005-03-30 | Interposable heat sink for adjacent memory modules |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/748,020 Active US7339793B2 (en) | 2005-03-30 | 2007-05-14 | Interposable heat sink for adjacent memory modules |
Country Status (1)
Country | Link |
---|---|
US (3) | US7289331B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130194755A1 (en) * | 2012-01-30 | 2013-08-01 | Wei Ling | Board-level heat transfer apparatus for communication platforms |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4321478B2 (en) * | 2005-03-31 | 2009-08-26 | 日本電気株式会社 | Information processing blade and information processing apparatus |
US7365990B2 (en) * | 2005-12-19 | 2008-04-29 | Infineon Technologies Ag | Circuit board arrangement including heat dissipater |
US20080266807A1 (en) * | 2007-04-27 | 2008-10-30 | Cray Inc. | Electronic assembly with emi shielding heat sink |
US7679913B2 (en) * | 2007-05-11 | 2010-03-16 | Ming-Yang Hsieh | Memory module assembly and heat sink thereof |
US20090165997A1 (en) * | 2007-12-27 | 2009-07-02 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US9342121B2 (en) | 2008-05-06 | 2016-05-17 | International Business Machines Corporatoin | Cooling system for electronic components |
US7643300B1 (en) * | 2008-12-16 | 2010-01-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device for memory module cards |
US7821785B1 (en) * | 2009-04-20 | 2010-10-26 | Hewlett-Packard Development Company, L.P. | Heatsinks and a spring in a baffle slot between adjacent components |
US8102651B2 (en) * | 2009-10-02 | 2012-01-24 | International Business Machines Corporation | Airflow barriers for efficient cooling of memory modules |
US8767403B2 (en) * | 2009-10-30 | 2014-07-01 | Hewlett-Packard Development Company, L.P. | Frame having frame blades that participate in cooling memory modules |
WO2011053310A1 (en) * | 2009-10-30 | 2011-05-05 | Hewlett-Packard Development Company, L.P. | Cooling memory modules using cold plate blades coupled to the memory modules via clips |
WO2011053313A1 (en) * | 2009-10-30 | 2011-05-05 | Hewlett-Packard Development Company, L.P. | Cooling memory modules using wedge-shaped heat spreaders in thermal contact with cold plate blades and memory modules |
US8570744B2 (en) * | 2009-10-30 | 2013-10-29 | Hewlett-Packard Development Company, L.P. | Cold plate having blades that interleave with memory modules |
US8416572B2 (en) * | 2010-01-20 | 2013-04-09 | Dell Products L.P. | System and method for cooling information handling resources |
US7969736B1 (en) | 2010-02-08 | 2011-06-28 | International Business Machines Corporation | System for cooling memory modules |
US8139355B2 (en) * | 2010-05-24 | 2012-03-20 | International Business Machines Corporation | Memory module connector having memory module cooling structures |
US8385069B2 (en) | 2010-05-24 | 2013-02-26 | International Business Machines Corporation | Liquid coolant conduit secured in an unused socket for memory module cooling |
US20120149799A1 (en) | 2010-12-10 | 2012-06-14 | Stebbins Mathew T | Cellulosic uv curable compositions and articles |
US9307674B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
US8493738B2 (en) * | 2011-05-06 | 2013-07-23 | International Business Machines Corporation | Cooled electronic system with thermal spreaders coupling electronics cards to cold rails |
US9027360B2 (en) | 2011-05-06 | 2015-05-12 | International Business Machines Corporation | Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system |
US20120293952A1 (en) * | 2011-05-19 | 2012-11-22 | International Business Machines Corporation | Heat transfer apparatus |
US9175183B2 (en) | 2011-05-23 | 2015-11-03 | Carestream Health, Inc. | Transparent conductive films, methods, and articles |
US8974900B2 (en) | 2011-05-23 | 2015-03-10 | Carestream Health, Inc. | Transparent conductive film with hardcoat layer |
US8687364B2 (en) | 2011-10-28 | 2014-04-01 | International Business Machines Corporation | Directly connected heat exchanger tube section and coolant-cooled structure |
US9043035B2 (en) | 2011-11-29 | 2015-05-26 | International Business Machines Corporation | Dynamically limiting energy consumed by cooling apparatus |
TW201327114A (en) * | 2011-12-22 | 2013-07-01 | Hon Hai Prec Ind Co Ltd | Heat dissipating device |
US8684757B2 (en) * | 2012-04-27 | 2014-04-01 | International Business Machines Corporation | Memory module connector with air deflection system |
WO2013175616A1 (en) * | 2012-05-24 | 2013-11-28 | 富士通株式会社 | Cooling structure for card-type electronic component, and electronic apparatus |
JP6021170B2 (en) * | 2012-05-28 | 2016-11-09 | Necプラットフォームズ株式会社 | Cooling system |
US8913384B2 (en) | 2012-06-20 | 2014-12-16 | International Business Machines Corporation | Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) |
GB2522441B (en) * | 2014-01-23 | 2017-11-15 | Xyratex Tech Ltd | An apparatus and a method for cooling electronic devices |
CN104812216B (en) * | 2015-04-01 | 2017-05-03 | 太仓陶氏电气有限公司 | Electric welding machine radiator structure |
US20190035709A1 (en) * | 2016-01-26 | 2019-01-31 | Hewlett Packard Enterprise Development Lp | Electronic modules |
US10211124B2 (en) * | 2017-05-12 | 2019-02-19 | Intel Corporation | Heat spreaders with staggered fins |
CN109002127A (en) * | 2017-06-06 | 2018-12-14 | 讯凯国际股份有限公司 | Radiator |
US10636725B2 (en) * | 2017-12-19 | 2020-04-28 | Veoneer Us Inc. | Electrical module cooling through waste heat recovery |
JP6952878B2 (en) * | 2018-03-27 | 2021-10-27 | 三菱電機株式会社 | Cooling device, cooling device with lid, housing with cooling device and inverter device |
US10672679B2 (en) | 2018-08-31 | 2020-06-02 | Micron Technology, Inc. | Heat spreaders for multiple semiconductor device modules |
US10602640B1 (en) * | 2018-11-14 | 2020-03-24 | Hewlett Packard Enterprise Development Lp | Memory coolers |
US10705578B2 (en) * | 2018-11-15 | 2020-07-07 | Hewlett Packard Enterprise Development Lp | Heat removal from memory modules |
US11011452B2 (en) * | 2018-11-29 | 2021-05-18 | Micron Technology, Inc. | Heat spreaders for semiconductor devices, and associated systems and methods |
US20210127529A1 (en) * | 2020-12-02 | 2021-04-29 | Intel Corporation | Cold plate system interface for liquid cooled devices |
CN112783284B (en) * | 2021-01-21 | 2023-09-01 | 重庆城市管理职业学院 | Equipment convenient to change computer memory |
US20230209770A1 (en) * | 2021-12-24 | 2023-06-29 | Celestica Technology Consultancy (Shanghai) Co. Ltd | Cooling assembly and liquid cooling apparatus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6088228A (en) * | 1998-12-16 | 2000-07-11 | 3M Innovative Properties Company | Protective enclosure for a multi-chip module |
US6349035B1 (en) * | 2000-09-29 | 2002-02-19 | Compaq Information Technologies Group, L.P. | Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink |
US6762942B1 (en) * | 2002-09-05 | 2004-07-13 | Gary W. Smith | Break away, high speed, folded, jumperless electronic assembly |
US7023701B2 (en) * | 2003-05-05 | 2006-04-04 | Infineon Technologies, Ag | Device for cooling memory modules |
US20060203454A1 (en) * | 2005-03-14 | 2006-09-14 | Chang Wan C | Heat sink for memory strips |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4190098A (en) * | 1978-02-16 | 1980-02-26 | Ncr Corporation | Multiple component circuit board cooling device |
US4899255A (en) * | 1988-07-25 | 1990-02-06 | Motorola Inc. | Heat sink clip and assembly and method of manufacture |
US5225965A (en) * | 1992-04-24 | 1993-07-06 | Chrysler Corporation | Heat sink load spring assembly |
US5309979A (en) * | 1993-06-08 | 1994-05-10 | Delco Electronics Corp. | Self clamping heat sink assembly |
US5959839A (en) * | 1997-01-02 | 1999-09-28 | At&T Corp | Apparatus for heat removal using a flexible backplane |
US5966287A (en) * | 1997-12-17 | 1999-10-12 | Intel Corporation | Clip on heat exchanger for a memory module and assembly method |
US6021048A (en) * | 1998-02-17 | 2000-02-01 | Smith; Gary W. | High speed memory module |
US6465728B1 (en) * | 1998-03-06 | 2002-10-15 | Rockwell Automation Technologies, Inc. | Spring clip for electronic device and heat sink assembly |
JP3109479B2 (en) * | 1998-06-12 | 2000-11-13 | 日本電気株式会社 | Heat radiator and memory module equipped with heat radiator |
RU2176134C2 (en) * | 1998-07-02 | 2001-11-20 | Закрытое акционерное общество "Техно-ТМ" | Three-dimensional electron module and process of its manufacture |
TW379824U (en) * | 1998-12-28 | 2000-01-11 | Foxconn Prec Components Co Ltd | Heat radiating apparatus |
WO2000041448A1 (en) * | 1998-12-30 | 2000-07-13 | Acqiris Sa | Electronic module containing cooling elements for electronic components |
US6362966B1 (en) * | 1999-05-13 | 2002-03-26 | Intel Corporation | Protective cover and packaging for multi-chip memory modules |
EP2234154B1 (en) * | 2000-04-19 | 2016-03-30 | Denso Corporation | Coolant cooled type semiconductor device |
US6853554B2 (en) * | 2001-02-22 | 2005-02-08 | Hewlett-Packard Development Company, L.P. | Thermal connection layer |
US6882533B2 (en) * | 2001-02-22 | 2005-04-19 | Hewlett-Packard Development Company, L.P. | Thermal connector for cooling electronics |
US6496375B2 (en) * | 2001-04-30 | 2002-12-17 | Hewlett-Packard Company | Cooling arrangement for high density packaging of electronic components |
US6535387B2 (en) * | 2001-06-28 | 2003-03-18 | Intel Corporation | Heat transfer apparatus |
JP3845408B2 (en) * | 2003-10-06 | 2006-11-15 | エルピーダメモリ株式会社 | Memory module heat dissipation device |
US7187552B1 (en) * | 2005-03-04 | 2007-03-06 | Sun Microsystems, Inc. | Self-installing heat sink |
-
2005
- 2005-03-30 US US11/093,445 patent/US7289331B2/en not_active Expired - Fee Related
-
2007
- 2007-05-09 US US11/746,322 patent/US7342797B2/en active Active
- 2007-05-14 US US11/748,020 patent/US7339793B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6088228A (en) * | 1998-12-16 | 2000-07-11 | 3M Innovative Properties Company | Protective enclosure for a multi-chip module |
US6349035B1 (en) * | 2000-09-29 | 2002-02-19 | Compaq Information Technologies Group, L.P. | Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink |
US6762942B1 (en) * | 2002-09-05 | 2004-07-13 | Gary W. Smith | Break away, high speed, folded, jumperless electronic assembly |
US7023701B2 (en) * | 2003-05-05 | 2006-04-04 | Infineon Technologies, Ag | Device for cooling memory modules |
US20060203454A1 (en) * | 2005-03-14 | 2006-09-14 | Chang Wan C | Heat sink for memory strips |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130194755A1 (en) * | 2012-01-30 | 2013-08-01 | Wei Ling | Board-level heat transfer apparatus for communication platforms |
CN104081887A (en) * | 2012-01-30 | 2014-10-01 | 阿尔卡特朗讯 | Board-level heat transfer apparatus for communication platform |
US8913391B2 (en) * | 2012-01-30 | 2014-12-16 | Alcatel Lucent | Board-level heat transfer apparatus for communication platforms |
Also Published As
Publication number | Publication date |
---|---|
US20060221578A1 (en) | 2006-10-05 |
US7339793B2 (en) | 2008-03-04 |
US7289331B2 (en) | 2007-10-30 |
US7342797B2 (en) | 2008-03-11 |
US20070211438A1 (en) | 2007-09-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7289331B2 (en) | Interposable heat sink for adjacent memory modules | |
US8113863B2 (en) | Socket connector having a thermally conductive insert | |
US5966289A (en) | Electronic device securement system | |
US7589972B2 (en) | Electrical connector with clip mechanism | |
US7365990B2 (en) | Circuit board arrangement including heat dissipater | |
US6093961A (en) | Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment | |
US6347036B1 (en) | Apparatus and method for mounting a heat generating component in a computer system | |
US7333338B2 (en) | Memory module assembly including a clip for mounting a heat sink thereon | |
US20060221573A1 (en) | Heat sink for multiple semiconductor modules | |
US8295042B2 (en) | Adjustable retention load plate of electrical connector assembly | |
US7746646B2 (en) | Securing device for assembling heat dissipation module onto electronic component | |
US20120244742A1 (en) | Low profile heat dissipating system with freely-oriented heat pipe | |
US20080198550A1 (en) | Heat sink module for dual heat sources | |
US7708583B2 (en) | Electrical connector assembly with heat dissipating device | |
TWI633831B (en) | Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function | |
US7493940B2 (en) | Heat dissipation device having mounting brackets | |
US8064201B2 (en) | Securing device and thermal module incorporating the same | |
US7736153B2 (en) | Electrical connector assembly having improved clip mechanism | |
US8079406B2 (en) | Thermal module | |
US20070165380A1 (en) | Memory module assembly including a clip for mounting a heat sink thereon | |
US6373701B1 (en) | Heat dissipation assembly | |
US6678160B1 (en) | Heat sink assembly including clip | |
US7708579B2 (en) | Socket assembly with backplane | |
US20100181049A1 (en) | Heat dissipation module | |
US20090166007A1 (en) | Heat dissipation device with a heat pipe |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
REMI | Maintenance fee reminder mailed | ||
FPAY | Fee payment |
Year of fee payment: 4 |
|
SULP | Surcharge for late payment | ||
AS | Assignment |
Owner name: LENOVO INTERNATIONAL LIMITED, HONG KONG Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INTERNATIONAL BUSINESS MACHINES CORPORATION;REEL/FRAME:034194/0291 Effective date: 20140926 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 12 |