US20070137558A1 - Method and apparatus for applying viscous medium onto a substrate - Google Patents
Method and apparatus for applying viscous medium onto a substrate Download PDFInfo
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- US20070137558A1 US20070137558A1 US11/502,477 US50247706A US2007137558A1 US 20070137558 A1 US20070137558 A1 US 20070137558A1 US 50247706 A US50247706 A US 50247706A US 2007137558 A1 US2007137558 A1 US 2007137558A1
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- Prior art keywords
- jetting
- viscous medium
- substrate
- screen printing
- inspection
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Definitions
- the present invention generally relates to the field of providing substrates with viscous medium. More specifically, the invention relates to a method of applying a viscous medium on a substrate, said method comprising the step of screen printing predetermined amounts of the viscous medium on predetermined positions on the substrate; an apparatus for application of a viscous medium onto a substrate, said apparatus comprising a screen printer for screen printing predetermined amounts of the viscous medium on predetermined positions on the substrate; and an apparatus for application of additional viscous medium onto a screen printed substrate.
- the applied viscous medium presents different heights at different positions on the substrate in order to accommodate, e.g., chip components having different heights, components having different lead angle accuracy, or co-planarity requirements.
- a solution to the latter problem that has been suggested in the art is to use so called stepped stencils for the screen printing.
- these stencils present a number of drawbacks that have prevented widespread use of this solution.
- an object of the present invention is to provide a solution to the above stated problems in relation to the application of additional viscous medium to a substrate that already has been subject to initial application of viscous medium through screen printing.
- a method of applying viscous medium on a substrate comprising the steps of screen printing predetermined amounts of the viscous medium on predetermined positions on the substrate, and add-on jetting of predetermined additional amounts of viscous medium on predetermined positions on the screen printed substrate.
- an apparatus for application of a viscous medium onto a substrate comprising a screen printer for screen printing predetermined amounts of the viscous medium on predetermined positions on the substrate, and a jetting device for jetting predetermined additional amounts of viscous medium on predetermined positions on the screen printed substrate.
- an apparatus for application of additional viscous medium onto a screen printed substrate comprising a jetting device for jetting said additional amounts of viscous medium on predetermined positions on the substrate.
- a method of applying viscous medium on a substrate comprising the steps of screen printing viscous medium onto the substrate, and jetting additional viscous medium onto the substrate.
- a method of applying additional viscous medium on a screen printed substrate comprising the step of jetting additional viscous medium onto the substrate.
- viscous medium should be interpreted as solder paste, flux, adhesive, conductive adhesive, or any other kind of medium used for fastening components on a substrate, or resistive paste; and that the term “substrate” should be interpreted as a printed circuit board (PCB), a substrate for ball grid arrays (BGA), chip scale packages (CSP), quad flat packages (QFP), and flip-chips or the like.
- substrate should be interpreted as a printed circuit board (PCB), a substrate for ball grid arrays (BGA), chip scale packages (CSP), quad flat packages (QFP), and flip-chips or the like.
- jetting should be interpreted as a non-contact dispensing process that utilises a fluid jet to form and shoot droplets of a viscous medium from a jet nozzle onto a substrate, e.g.
- the present invention is based on the advantageous idea of using add-on jetting for the application of additional viscous medium onto a substrate onto which viscous medium previously has been applied through screen printing.
- jetting overcomes a number of the above stated problems relating to screen printing.
- jetting enables the application of viscous medium of a different type or sort than what has been initially applied.
- the use of jetting also enables the application of viscous medium in any desired pattern, which is not possible through screen printing.
- the application of viscous medium of varying height is also achievable through jetting.
- jetting is advantageous to conventional dispensing in that it is faster, more accurate, and more flexible.
- the use of conventional dispensing often provide a bottle neck that increases the cycle time in the overall component mounting process, as compared to the use of jetting. It has also been found that it is possible to achieve smaller dots when using jetting than when using conventional dispensing.
- one of the main advantages obtained by using jetting for applying additional viscous medium onto a screen printed substrate is that it is possible to apply viscous medium at positions where viscous medium already has been applied. Thereby, it will be possible to easily increase the height of the applied viscous medium at a specific location without any danger of the nozzle of the jetting device being smeared by the viscous medium already applied on the substrate.
- the results of the application of viscous medium onto the substrate is inspected, errors of the application is determined based on said inspection, and at least some of said errors are corrected, wherein said correction comprises jetting of additional viscous medium onto the substrate.
- said correction comprises jetting of additional viscous medium onto the substrate.
- Said inspection can be performed between the screen printing and the add-on jetting of viscous medium, following the add-on jetting of viscous medium, or both. If the inspection is performed between the screen printing and the add-on jetting, the predetermined add-on jetting can be combined with the correction jetting, either by determining the positions where jetting is required and the amount, or by performing the add-on jetting and the jetting correction in sequence.
- a single jetting device performs both the add-on jetting and the jetting correction, which decreases the physical complexity of the system.
- this is performed by a separate jetting device.
- the correction can be performed in a separate machine. This decreases the cycle time for the overall viscous medium application process, but increases the line length. If a separate machine is used for the jetting correction, the inspection, evaluation and determination of errors is preferably, but not necessarily, performed in the same machine.
- the correction of applied viscous medium also comprises the removal of surplus viscous medium.
- this is performed at specific locations on the substrate only, at which the inspection has revealed that too much viscous medium has been applied.
- This can refer to the amount of viscous medium for a given location, the height of the applied viscous medium, the applied viscous medium being offset from the intended position, or that viscous medium has been applied at a position where it was not supposed to.
- an evaluation is performed to determine whether the number or the severity of detected errors are such that correction of applied viscous medium is worthwhile.
- Such an evaluation can be performed regardless of whether the inspection is performed before or after the add-on jetting of additional viscous medium. That is, if there are a large number of corrective actions required, then it might be more economical to simply discard the substrate. This is of course dependent on the type of substrate and the cost involved for the substrate. If correction is not deemed worthwhile, the substrate is preferably cleaned from any applied viscous medium and reused. On the other hand, if cleaning the substrate is not considered economical, the substrate is preferably discarded.
- the screen printing and the subsequent jetting of viscous medium is for the purposes of this application not limited to the use of one viscous medium for both the screen printing and the jetting. Consequently, a number of different types and sorts of viscous medium can be used. For instance, the screen printing is performed for a viscous medium, then add-on jetting of another viscous medium is performed. Additionally, the subsequent jetting, the add-on jetting and/or the correction jetting, can be performed in sequences with different sorts of viscous medium. Then, more than one jetting device is preferably used to avoid unwanted mixing of the different viscous medium and/or to avoid increased cycle time due to change of the viscous medium supply and possible cleaning of the jetting device.
- FIGS. 1-3 are block diagrams illustrating arrangements according to alternative embodiments of the present invention.
- FIGS. 4-6 illustrate in flow chart form the alternative embodiments shown in FIGS. 1-3 .
- the thick-lined arrows depict the movement of a substrate 1 through the production line.
- the dashed boxes simply indicate that the device(s) or apparatus(es) depicted within the box can be incorporated in a single machine.
- FIGS. 1-6 there are illustrated exemplary embodiments of the present invention.
- the specific apparatuses used for screen printing, jetting, inspection of application results, removing solder paste, and component mounting use can be made of suitable apparatuses which by themselves are known within the art, and the constructional features of which are also known. Therefore, detailed constructional and functional description of each separate apparatus have been omitted.
- the viscous medium of the description of exemplary embodiments below is solder paste.
- the invention is not restricted to using solder paste. On the contrary, any type of viscous medium can be used.
- a substrate 1 is at step 100 transferred to a screen printer 12 where an initial application of solder paste is performed, at step 102 . Then, the substrate 1 is transferred at step 104 to a machine 16 for performing add-on jetting of additional amounts of solder paste, at step 106 .
- the amounts, patterns, heights, type of solder paste, etc., that is added onto the substrate 1 is predetermined. Thus, there is no inspection if the screen printing results performed prior to the jetting of additional solder paste.
- the substrate 1 is at step 108 transferred to a component mounting machine 18 , where electrical components are mounted on the substrate 1 .
- there may be included a step of inspecting the final results of the combined solder paste application i.e. both the screen printing and the add-on jetting.
- This embodiment also includes an inspection device 14 provided for inspection of the screen printing results.
- the substrate is at step 204 transferred to the inspection device 14 that performs the inspection at step 206 .
- the results of the inspection is recorded and relayed to the device 16 ′ for performing the add-on jetting.
- the jetting device 16 ′ can also perform any required jetting of additional solder paste onto positions on the substrate where insufficient amounts have been applied due to some error in the initial screen printing.
- the jetting device 16 ′ is a combined add-on jetting and correction device 16 ′.
- the add-on jetting and correction device 16 ′ can also comprise a device for removing amounts of solder paste from the substrate. According to this embodiment, the removal is performed through suction of the solder paste at the selected position of the substrate. If the inspection reveals that correction of the substrate 1 is not worthwhile, the substrate 1 is passed by the add-on jetting and correction device 16 ′ without any measures taking place. Then, the substrate 1 is simply taken out of the production line before reaching the component mounting machine 18 .
- the inspection device 14 is preferably incorporated in the same machine as the add-on jetting and correction device 16 ′, thus forming a combined inspection and correction machine 15 . Then, the inspection device 14 could be used to inspect the result of the add-on jetting to further minimise the application errors on the substrate. However, the inspection device 14 can naturally also be a separate machine.
- the substrate is transferred to the component mounting machine 18 , at step 210 .
- FIG. 3 and the flow chart of FIG. 6 illustrate yet another exemplary embodiment of the present invention.
- the screen printer 12 and the inspection device 14 is incorporated in a single machine 10 .
- the substrate 1 is transferred to an add-on jetting and correction device 16 ′.
- the add-on jetting and correction device 16 ′ have the similar features as do the corresponding device 16 ′ of FIG. 2 .
- said device 16 ′ has received information as to the required corrections, if any, to be performed on the substrate 1 .
- the additional solder paste is then added and any application errors corrected, at step 308 , and the substrate 1 is transferred at step 310 to the component mounting machine 18 .
- the substrate 1 is taken out of the production line. In this embodiment, this is performed before the substrate 1 reaches the add-on jetting and correction device 16 ′.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Screen Printers (AREA)
- Printing Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ink Jet (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Coating Apparatus (AREA)
Abstract
Description
- This application is a Divisional of co-pending Application No. 09/901,592, filed on Jul. 11, 2001, the entire contents of which are hereby incorporated by reference and for which priority is claimed under 35 U.S.C. §120.
- The present invention generally relates to the field of providing substrates with viscous medium. More specifically, the invention relates to a method of applying a viscous medium on a substrate, said method comprising the step of screen printing predetermined amounts of the viscous medium on predetermined positions on the substrate; an apparatus for application of a viscous medium onto a substrate, said apparatus comprising a screen printer for screen printing predetermined amounts of the viscous medium on predetermined positions on the substrate; and an apparatus for application of additional viscous medium onto a screen printed substrate.
- The most common method of applying viscous medium, such as solder paste, to a substrate, such as a PCB, in electronics production is by using screen printing. The vast majority of viscous medium deposits can be applied by this method. However, in specific circumstances there is a need for different viscous mediums at different locations on the substrate. This poses a problem, since there are a number of difficulties to overcome when adding viscous medium by performing an extra screen printing procedure, after an initial application of viscous medium. Further, it is sometimes desired to produce patterns of viscous medium that are very difficult to achieve through screen printing, such as the pattern of an unfilled circle.
- It can also be desired that the applied viscous medium presents different heights at different positions on the substrate in order to accommodate, e.g., chip components having different heights, components having different lead angle accuracy, or co-planarity requirements. A solution to the latter problem that has been suggested in the art is to use so called stepped stencils for the screen printing. However, these stencils present a number of drawbacks that have prevented widespread use of this solution.
- Also, the application of very small deposits, primarily circular, i.e. dots, of viscous medium is not possible to obtain through screen printing, since the adhesion forces from the stencil would become to great in comparison to the adhesion forces from the substrate. As a consequence, very small deposits would attach to and follow the stencil when the stencil is removed. It could be imagined that this problem is overcome by using a thinner stencil. However, that would have undesired drawbacks in that it would result in an overall decrease of the height of the deposits, and thus the overall volume, which is undesired and would pose a problem for larger deposits.
- According to the state of the art, efforts have been made to solve the above stated problems by using a conventional dispensing equipment. By using a conventional dispenser it is possible to add viscous medium following an initial screen printing of the substrate for producing said patterns of viscous medium that are not easily achieved through screen printing. With a conventional dispenser it can also be possible to apply viscous medium having different height at different locations on the board. However, the conventional dispensers have a number of disadvantages. The process of conventional dispensing of viscous medium is relatively slow, the application of very small deposits of viscous medium through conventional dispensing is difficult, and it is also difficult to apply additional viscous medium onto a location on the substrate that has already been provided with viscous medium.
- Thus, an object of the present invention is to provide a solution to the above stated problems in relation to the application of additional viscous medium to a substrate that already has been subject to initial application of viscous medium through screen printing.
- This and other objects are achieved according to the present invention by providing a method and an apparatus as described below.
- According to a first aspect of the invention, there is provided a method of applying viscous medium on a substrate, comprising the steps of screen printing predetermined amounts of the viscous medium on predetermined positions on the substrate, and add-on jetting of predetermined additional amounts of viscous medium on predetermined positions on the screen printed substrate.
- According to a second aspect of the invention, there is provided an apparatus for application of a viscous medium onto a substrate, comprising a screen printer for screen printing predetermined amounts of the viscous medium on predetermined positions on the substrate, and a jetting device for jetting predetermined additional amounts of viscous medium on predetermined positions on the screen printed substrate.
- According to a third aspect of the invention, there is provided an apparatus for application of additional viscous medium onto a screen printed substrate, comprising a jetting device for jetting said additional amounts of viscous medium on predetermined positions on the substrate.
- According to a fourth aspect of the invention, there is provided a method of applying viscous medium on a substrate comprising the steps of screen printing viscous medium onto the substrate, and jetting additional viscous medium onto the substrate.
- According to a fifth aspect of the invention, there is provided a method of applying additional viscous medium on a screen printed substrate, comprising the step of jetting additional viscous medium onto the substrate.
- For the purposes of this application, it is to be noted that the term “viscous medium” should be interpreted as solder paste, flux, adhesive, conductive adhesive, or any other kind of medium used for fastening components on a substrate, or resistive paste; and that the term “substrate” should be interpreted as a printed circuit board (PCB), a substrate for ball grid arrays (BGA), chip scale packages (CSP), quad flat packages (QFP), and flip-chips or the like. It is also to be noted that the term “jetting” should be interpreted as a non-contact dispensing process that utilises a fluid jet to form and shoot droplets of a viscous medium from a jet nozzle onto a substrate, e.g. as described in the published International Application WO 99/64167, as compared to a contact dispensing process, such as “fluid wetting”, which is the act of the viscous medium leaving the dispense tip, contacting and clinging to the substrate and remaining on the substrate as the dispense tip pulls away. Further, the term “add-on” refers herein to the application of additional viscous medium, i.e. not the initial application.
- Thus, the present invention is based on the advantageous idea of using add-on jetting for the application of additional viscous medium onto a substrate onto which viscous medium previously has been applied through screen printing.
- The use of jetting overcomes a number of the above stated problems relating to screen printing. First, jetting enables the application of viscous medium of a different type or sort than what has been initially applied. The use of jetting also enables the application of viscous medium in any desired pattern, which is not possible through screen printing. The application of viscous medium of varying height is also achievable through jetting. Also, jetting is advantageous to conventional dispensing in that it is faster, more accurate, and more flexible. In fact, the use of conventional dispensing often provide a bottle neck that increases the cycle time in the overall component mounting process, as compared to the use of jetting. It has also been found that it is possible to achieve smaller dots when using jetting than when using conventional dispensing.
- Further, one of the main advantages obtained by using jetting for applying additional viscous medium onto a screen printed substrate, is that it is possible to apply viscous medium at positions where viscous medium already has been applied. Thereby, it will be possible to easily increase the height of the applied viscous medium at a specific location without any danger of the nozzle of the jetting device being smeared by the viscous medium already applied on the substrate.
- According to a specific embodiment of the present invention, the results of the application of viscous medium onto the substrate is inspected, errors of the application is determined based on said inspection, and at least some of said errors are corrected, wherein said correction comprises jetting of additional viscous medium onto the substrate. This means that not only the predetermined additional amounts of viscous medium is applied onto the substrate through jetting, but also any additional amount of viscous medium that is determined to be required as a result of errors in the regular viscous medium application.
- Said inspection can be performed between the screen printing and the add-on jetting of viscous medium, following the add-on jetting of viscous medium, or both. If the inspection is performed between the screen printing and the add-on jetting, the predetermined add-on jetting can be combined with the correction jetting, either by determining the positions where jetting is required and the amount, or by performing the add-on jetting and the jetting correction in sequence.
- Preferably, a single jetting device performs both the add-on jetting and the jetting correction, which decreases the physical complexity of the system. Alternatively, this is performed by a separate jetting device.
- When the inspection is performed following the add-on jetting only, the correction can be performed in a separate machine. This decreases the cycle time for the overall viscous medium application process, but increases the line length. If a separate machine is used for the jetting correction, the inspection, evaluation and determination of errors is preferably, but not necessarily, performed in the same machine.
- According to a further embodiment of the invention, the correction of applied viscous medium also comprises the removal of surplus viscous medium. Preferably, this is performed at specific locations on the substrate only, at which the inspection has revealed that too much viscous medium has been applied. This can refer to the amount of viscous medium for a given location, the height of the applied viscous medium, the applied viscous medium being offset from the intended position, or that viscous medium has been applied at a position where it was not supposed to.
- According to a further embodiment of the present invention, following the inspection of a substrate, an evaluation is performed to determine whether the number or the severity of detected errors are such that correction of applied viscous medium is worthwhile. Such an evaluation can be performed regardless of whether the inspection is performed before or after the add-on jetting of additional viscous medium. That is, if there are a large number of corrective actions required, then it might be more economical to simply discard the substrate. This is of course dependent on the type of substrate and the cost involved for the substrate. If correction is not deemed worthwhile, the substrate is preferably cleaned from any applied viscous medium and reused. On the other hand, if cleaning the substrate is not considered economical, the substrate is preferably discarded.
- It should be noted that the screen printing and the subsequent jetting of viscous medium is for the purposes of this application not limited to the use of one viscous medium for both the screen printing and the jetting. Consequently, a number of different types and sorts of viscous medium can be used. For instance, the screen printing is performed for a viscous medium, then add-on jetting of another viscous medium is performed. Additionally, the subsequent jetting, the add-on jetting and/or the correction jetting, can be performed in sequences with different sorts of viscous medium. Then, more than one jetting device is preferably used to avoid unwanted mixing of the different viscous medium and/or to avoid increased cycle time due to change of the viscous medium supply and possible cleaning of the jetting device.
- The above mentioned and other aspects, advantages, and features of the invention will be more fully understood from the following description of exemplifying embodiments thereof.
- Exemplifying embodiments of the invention will be described below with reference to the accompanying drawings, in which:
-
FIGS. 1-3 are block diagrams illustrating arrangements according to alternative embodiments of the present invention. -
FIGS. 4-6 illustrate in flow chart form the alternative embodiments shown inFIGS. 1-3 . - In the block diagrams of
FIGS. 1-3 , the thick-lined arrows depict the movement of asubstrate 1 through the production line. The dashed boxes simply indicate that the device(s) or apparatus(es) depicted within the box can be incorporated in a single machine. - With reference to
FIGS. 1-6 , there are illustrated exemplary embodiments of the present invention. As to the specific apparatuses used for screen printing, jetting, inspection of application results, removing solder paste, and component mounting, use can be made of suitable apparatuses which by themselves are known within the art, and the constructional features of which are also known. Therefore, detailed constructional and functional description of each separate apparatus have been omitted. Furthermore, the viscous medium of the description of exemplary embodiments below is solder paste. However, the invention is not restricted to using solder paste. On the contrary, any type of viscous medium can be used. - Turning first to
FIGS. 1 and 4 , there is shown a first exemplary embodiment of the present invention. Asubstrate 1 is atstep 100 transferred to ascreen printer 12 where an initial application of solder paste is performed, atstep 102. Then, thesubstrate 1 is transferred atstep 104 to amachine 16 for performing add-on jetting of additional amounts of solder paste, atstep 106. The amounts, patterns, heights, type of solder paste, etc., that is added onto thesubstrate 1 is predetermined. Thus, there is no inspection if the screen printing results performed prior to the jetting of additional solder paste. Following the add-on jetting step, thesubstrate 1 is atstep 108 transferred to acomponent mounting machine 18, where electrical components are mounted on thesubstrate 1. As an alternative, there may be included a step of inspecting the final results of the combined solder paste application, i.e. both the screen printing and the add-on jetting. - With reference now to
FIGS. 2 and 5 , there is shown another exemplary embodiment of the present invention. This embodiment also includes aninspection device 14 provided for inspection of the screen printing results. Following screen printing atstep 202, the substrate is atstep 204 transferred to theinspection device 14 that performs the inspection atstep 206. The results of the inspection is recorded and relayed to thedevice 16′ for performing the add-on jetting. With the information as to the results of said inspection, the jettingdevice 16′ can also perform any required jetting of additional solder paste onto positions on the substrate where insufficient amounts have been applied due to some error in the initial screen printing. Thus, the jettingdevice 16′ is a combined add-on jetting andcorrection device 16′. Further, according to this embodiment, the add-on jetting andcorrection device 16′ can also comprise a device for removing amounts of solder paste from the substrate. According to this embodiment, the removal is performed through suction of the solder paste at the selected position of the substrate. If the inspection reveals that correction of thesubstrate 1 is not worthwhile, thesubstrate 1 is passed by the add-on jetting andcorrection device 16′ without any measures taking place. Then, thesubstrate 1 is simply taken out of the production line before reaching thecomponent mounting machine 18. - The
inspection device 14 is preferably incorporated in the same machine as the add-on jetting andcorrection device 16′, thus forming a combined inspection andcorrection machine 15. Then, theinspection device 14 could be used to inspect the result of the add-on jetting to further minimise the application errors on the substrate. However, theinspection device 14 can naturally also be a separate machine. - Following the correction and add-on jetting, at
step 208, the substrate is transferred to thecomponent mounting machine 18, atstep 210. - Finally, the block diagram of
FIG. 3 and the flow chart ofFIG. 6 illustrate yet another exemplary embodiment of the present invention. Here, thescreen printer 12 and theinspection device 14 is incorporated in asingle machine 10. Following the screen printing of thesubstrate 1 and the subsequent inspection of the screen printing results in the combined screen printing andinspection machine 10, at steps 300-304, thesubstrate 1 is transferred to an add-on jetting andcorrection device 16′. The add-on jetting andcorrection device 16′ have the similar features as do the correspondingdevice 16′ ofFIG. 2 . When the substrate enters the add-on jetting andcorrection device 16′, saiddevice 16′ has received information as to the required corrections, if any, to be performed on thesubstrate 1. The additional solder paste is then added and any application errors corrected, atstep 308, and thesubstrate 1 is transferred atstep 310 to thecomponent mounting machine 18. Again, if the inspection reveals that thesubstrate 1 is provided with a number of errors resulting from the screen printing, and that correction is deemed not to be worthwhile, thesubstrate 1 is taken out of the production line. In this embodiment, this is performed before thesubstrate 1 reaches the add-on jetting andcorrection device 16′. - As is understood by the man skilled in the art, the above-mentioned steps would require a certain amount of processing, transferring and evaluating information. This, however, can be performed by a conventional processor which is not shown or further described.
- Even though the invention has been described above using exemplifying embodiments thereof, alterations, modifications and combinations thereof, as understood by those skilled in the art, may be made within the scope of the invention, which is defined by the accompanying claims.
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/502,477 US7600548B2 (en) | 2000-07-11 | 2006-08-11 | Method and apparatus for applying viscous medium onto a substrate |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0002619-5 | 2000-07-11 | ||
SE0002619A SE518640C2 (en) | 2000-07-11 | 2000-07-11 | Method, apparatus for applying a viscous medium to a substrate, apparatus for applying additional viscous medium and the use of screen printing |
US09/901,592 US7757391B2 (en) | 2000-07-11 | 2001-07-11 | Method for applying viscous medium on a substrate |
US11/502,477 US7600548B2 (en) | 2000-07-11 | 2006-08-11 | Method and apparatus for applying viscous medium onto a substrate |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/901,592 Division US7757391B2 (en) | 2000-07-11 | 2001-07-11 | Method for applying viscous medium on a substrate |
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US20070137558A1 true US20070137558A1 (en) | 2007-06-21 |
US7600548B2 US7600548B2 (en) | 2009-10-13 |
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US09/901,592 Expired - Fee Related US7757391B2 (en) | 2000-07-11 | 2001-07-11 | Method for applying viscous medium on a substrate |
US11/502,477 Expired - Lifetime US7600548B2 (en) | 2000-07-11 | 2006-08-11 | Method and apparatus for applying viscous medium onto a substrate |
Family Applications Before (1)
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US09/901,592 Expired - Fee Related US7757391B2 (en) | 2000-07-11 | 2001-07-11 | Method for applying viscous medium on a substrate |
Country Status (8)
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---|---|
US (2) | US7757391B2 (en) |
EP (1) | EP1314342B1 (en) |
JP (1) | JP5198709B2 (en) |
AT (1) | ATE406085T1 (en) |
AU (1) | AU2001271170A1 (en) |
DE (1) | DE60135467D1 (en) |
SE (1) | SE518640C2 (en) |
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US20090318051A1 (en) * | 2007-03-28 | 2009-12-24 | Snu Precision Co. Ltd. | Device for supporting substrate and examiner for seal pattern of lcd cell using the same |
EP2906026A1 (en) * | 2014-02-06 | 2015-08-12 | Ekra Automatisierungssysteme GmbH | Method and device for printing on substrates |
JP2017535965A (en) * | 2014-11-20 | 2017-11-30 | コー・ヤング・テクノロジー・インコーポレーテッド | Inspection device and component mounting system having the same |
US20210352808A1 (en) * | 2014-09-09 | 2021-11-11 | Mycronic AB | Method and device for applying solder paste flux |
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SE518642C2 (en) | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Method, device for providing a substrate with viscous medium, device for correcting application errors and the use of projecting means for correcting application errors |
JP4618085B2 (en) * | 2005-09-30 | 2011-01-26 | 株式会社日立プラントテクノロジー | Solder paste printing system |
WO2007054371A1 (en) | 2005-11-14 | 2007-05-18 | Mydata Automation Ab | A jetting apparatus and method of improving the performance of a jetting apparatus by using a flow sensor for measuring the air flow |
JP4869776B2 (en) * | 2006-04-28 | 2012-02-08 | ヤマハ発動機株式会社 | Printing inspection apparatus and printing apparatus |
US7823762B2 (en) * | 2006-09-28 | 2010-11-02 | Ibiden Co., Ltd. | Manufacturing method and manufacturing apparatus of printed wiring board |
DE102009053575B4 (en) * | 2009-11-06 | 2016-06-30 | Ekra Automatisierungssysteme Gmbh | Method and device for printing a substrate, in particular a printed circuit board, with a printing paste |
US9398697B2 (en) | 2013-03-13 | 2016-07-19 | Mycronic AB | Methods and devices for jetting viscous medium on workpiece |
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JP2015109397A (en) * | 2013-12-06 | 2015-06-11 | パナソニックIpマネジメント株式会社 | Electronic component mounting method and electronic component mounting system |
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US11544836B2 (en) * | 2021-03-18 | 2023-01-03 | Inventec (Pudong) Technology Corporation | Grid clustering-based system for locating an abnormal area of solder paste printing and method thereof |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090318051A1 (en) * | 2007-03-28 | 2009-12-24 | Snu Precision Co. Ltd. | Device for supporting substrate and examiner for seal pattern of lcd cell using the same |
US9046716B2 (en) * | 2007-03-28 | 2015-06-02 | Snu Precision Co. Ltd. | Device for supporting substrate and examiner for seal pattern of LCD cell using the same |
EP2906026A1 (en) * | 2014-02-06 | 2015-08-12 | Ekra Automatisierungssysteme GmbH | Method and device for printing on substrates |
US20210352808A1 (en) * | 2014-09-09 | 2021-11-11 | Mycronic AB | Method and device for applying solder paste flux |
JP2017535965A (en) * | 2014-11-20 | 2017-11-30 | コー・ヤング・テクノロジー・インコーポレーテッド | Inspection device and component mounting system having the same |
Also Published As
Publication number | Publication date |
---|---|
US7757391B2 (en) | 2010-07-20 |
SE518640C2 (en) | 2002-11-05 |
US20020015780A1 (en) | 2002-02-07 |
ATE406085T1 (en) | 2008-09-15 |
US7600548B2 (en) | 2009-10-13 |
JP5198709B2 (en) | 2013-05-15 |
JP2004502539A (en) | 2004-01-29 |
EP1314342B1 (en) | 2008-08-20 |
WO2002005608A1 (en) | 2002-01-17 |
AU2001271170A1 (en) | 2002-01-21 |
SE0002619D0 (en) | 2000-07-11 |
EP1314342A1 (en) | 2003-05-28 |
DE60135467D1 (en) | 2008-10-02 |
SE0002619L (en) | 2002-03-08 |
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