US20070044482A1

US20070044482A1 - Cooling system capable of reducing ambient temperature of a computer

Info

Publication number: US20070044482A1
Application number: US11/209,706
Authority: US
Inventors: Chen-Hui Lai
Original assignee: Individual
Current assignee: Individual
Priority date: 2005-08-24
Filing date: 2005-08-24
Publication date: 2007-03-01

Abstract

A cooling system capable of reducing ambient temperature of a computer includes a cooling device, a cool connection part, a heat dissipation part and a base box. The cooling device provides a cool part and a hot part. The cool connection part connects with both the cool part and the hot part. The heat dissipation part connects with both the cool part and the hot part too. The base box receives the preceding parts. The cool part and the hot part create low temperature and high temperature respectively. The hot part is connected to the heat dissipation part so that heat from the hot part is guided outward the base box. Low temperature air moves toward interior of a computer casing due to the cool part connecting with cool connection part. Hence, ambient temperature of the microprocessor reduces abruptly for enhancing heat exchange rate.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention is related to a cooling system capable of reducing ambient temperature of a computer and particularly to a device, which is able to offer low temperature air flow at interior of a computer, such that heat exchange efficiency of the radiator is enhanced substantially.
2. Brief Description of the Related Art
In order to lower working temperature in the casing of a computer, ways such as using a radiator for the microprocessor, cooling fans of the radiator and system fans are mounted and, even more, various intake and outgoing air slots are provided at the computer casing for effectively ventilating air in the computer casing so that heat exchange for the radiator attached to the microprocessor can be enhanced significantly.
There are typical examples of the radiator being fixedly attached to the microprocessor such as Taiwanese Utility Model Application Nos. 087,200,769, 088,220,189, 090,213,401, 090,218,045, 091,203,000, 091,200,680, 091203000 and 09220391.
The preceding prior art devices are made with a cooling fin assembly, which guides and remove heat, are fixedly touched the microprocessor and the heat generated by the microprocessor can be removed via the cooling fin assembly contacting with the air. Hence, the over excessive working temperature of the microprocessor can be restricted. Further, a fan can be joined to the cooling fin assembly to speed up removal of air surrounding the cooling fin assembly by means of air flow created during the fan rotating such that fresh air flow is able to approach the cooling fin assembly for increasing heat exchange efficiency.
Further, the computer casing is mounted a plurality of system fans to guide outside air into the casing and discharge inside air outward to keep the heat exchange of the surroundings continuously as shown in FIG. 1.
However, the preceding conventional simple design of air intake and discharge is incapable of meeting need of the current high speed microprocessor. Because the high speed microprocessor results in fast temperature rise and much higher temperature rise, material of the radiator and cooling fins is strictly restricted to have feature of fast heat guide and fast heat dissipation. Unfortunately, development of the radiator is slow with limited heat dissipation capability. Thus, if ambient temperature of the computer casing is reduced, heat exchange capability of the radiator must increase largely for enhancing effect of the radiator. Therefore, how to offer heat dissipation means suitable for the high speed microprocessor has to be endeavored urgently.

SUMMARY OF THE INVENTION

A primary object of the present invention is to provide a cooling system capable of reducing ambient temperature of a computer according to the present invention includes a cooling device, a cool connection part, a heat dissipation part and a base box. The cooling device provides a cool part and a hot part. The cool connection part connects with both the cool part and the hot part. The heat dissipation part connects with both the cool part and the hot part too. The base box receives the preceding parts. The cool part and the hot part create low temperature and high temperature respectively. The hot part is connected to the heat dissipation part so that heat from the hot part is guided outward the base box. Low temperature air moves toward interior of a computer casing due to the cool part connecting with cool connection part. Hence, ambient temperature of the microprocessor reduces abruptly for enhancing heat exchange rate.

BRIEF DESCRIPTION OF THE DRAWINGS

The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which:
FIG. 1 is a perspective view of the conventional temperature reduction structure;
FIG. 2 is a fragmentary perspective sectional view of a cooling device for reducing ambient temperature of a computer according to the present invention;
FIG. 3 is a side sectional view of the cooling device and heat dissipation device according to the present invention; and
FIG. 4 is a perspective view of the cooling device for reducing ambient temperature of a computer according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 2, 3 and 4, a cooling system for reducing ambient temperature of a computer according to the present invention is disposed in a casing W, which is mounted with a main board W1, a microprocessor W2, a radiator W3 and a fan W4 and the cooling system includes cooling device 1 with cool part 11 and a hot part 12 inside, a cooling connection part 2 connecting with the cool part 11 and the hot part 12, a heat dissipation part 3 connecting with the cool part 11 and the hot part 12 too and a base box 4 receiving the preceding parts.
Wherein, the cooling device 1 is a chip, which is attached to an inner lateral side of the base box 4 to generate a cool temperature and a hot temperature respectively by means of the cool part 11 and the hot part 12. The hot part 12 has a thermal interface 121 to connect with the heat dissipation part 3 and the heat dissipation part 3 is composed of a discharge fan 31 and a heat guide member 32, which keeps touching the hot part 12. The heat guide member 32 absorbs and guides high heat from the hot part 12 so as to be discharged outside the base box 4 directly via the discharge fan 31.
The cool part 11 has a cool interface 111 corresponding to a cool chamber 41 preset in the base box 4 and the cool interface 111 is connected to the cool connection part 2. The cool connection part 2 is composed of a blowing out fan 21 and a cool guide member 22, which touches the cool interface 111. The cool guide member 22 is capable of absorbing low temperature cool energy from the cool part 11 to allow the low temperature cool energy congregating at the outer surface thereof so as to be blown toward outside the base box 4.
Furthermore, an air outlet 42 is disposed at a lateral side of the cool chamber 41 and an oblique guide zone 43 is disposed corresponding to the outlet 42 to allow air being blown by the fan 3 smoothly and to guide air flow. The air outlet 42 can be arranged to face the radiator W3 such that the low temperature air flow is concentrated to move toward the radiator W3 for reducing temperature surrounding the radiator W3 and enhancing heat exchange efficiency thereof.
Besides, a further fan 5 can be added to the casing W based on actual need for guiding outside air into the casing W for increasing exchange between the outside air and the inside air.
Referring to FIG. 4 again, when the cooling device 1 is started, the cool part 11 occurs low and cool temperature and the cool chamber 41 results in a function of congregating cool temperature air by means of the cool interface 111 connecting with the cool connection part 2. Then, the low temperature air is blown to the radiator W3 of the microprocessor W2 via the fan 3. Hence, the ambient temperature of radiator W3 is reduced due to the low temperature air flow and a substantial temperature difference is created to enhance heat exchange rate.
While the invention has been described with referencing to a preferred embodiment thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.

Claims

1. A cooling system capable of reducing ambient temperature of a computer, comprising:

a cooling device, providing a cool part and a hot part;

a cool connection part, connecting with both the cool part and the hot part;

a heat dissipation part, connecting with both the cool part and the hot part too;

a base box, receiving the preceding parts;

wherein, the cool part and the hot part occur low temperature and high temperature respectively; the hot part is connected to the heat dissipation part so that heat from the hot part is guided outward the box; low temperature air moves toward interior of a computer casing due to the cool part connecting with cool connection part.

2. The cooling system capable of reducing ambient temperature of a computer as defined in claim 1, wherein the hot part is a thermal interface to connect with the radiator.

3. The cooling system capable of reducing ambient temperature of a computer as defined in claim 1, wherein the cool part is a cool interface to connect with the cool connection part.

4. The cooling system capable of reducing ambient temperature of a computer as defined in claim 1, wherein the heat dissipation part is composed of a discharge fan and a heat guide member, which keeps touching the thermal interface.

5. The cooling system capable of reducing ambient temperature of a computer as defined in claim 1, wherein the cool connection part is composed of an air out fan and a cool guide member, which keeps touching with the cool interface.

6. The cooling system capable of reducing ambient temperature of a computer as defined in claim 1, wherein the base box has a cool chamber corresponding to the cool part.

7. The cooling system capable of reducing ambient temperature of a computer as defined in claim 1, wherein the base box has an air outlet at a lateral side of the cool chamber for the air out fan moving air flow outward.

8. The cooling system capable of reducing ambient temperature of a computer as defined in claim 1, wherein the base box has an air outlet at a lateral side of the cool chamber for the air out fan moving air flow outward.

9. The cooling system capable of reducing ambient temperature of a computer as defined in claim 1, wherein the cool chamber provides a oblique guide zone corresponding to the air outlet for the air moving outward more smoothly.

10. The cooling system capable of reducing ambient temperature of a computer as defined in claim 1, wherein the casing at least has a fan to enhance exchange between outside air and inside air.

11. The cooling system capable of reducing ambient temperature of a computer as defined in claim 2, wherein the heat dissipation part is composed of a discharge fan and a heat guide member, which keeps touching the thermal interface.

12. The cooling system capable of reducing ambient temperature of a computer as defined in claim 3, wherein the cool connection part is composed of an air out fan and a cool guide member, which keeps touching with the cool interface.

13. The cooling system capable of reducing ambient temperature of a computer as defined in claim 6, wherein the base box has an air outlet at a lateral side of the cool chamber for the air out fan moving air flow outward.

14. The cooling system capable of reducing ambient temperature of a computer as defined in claim 8, wherein the cool chamber provides a oblique guide zone corresponding to the air outlet for the air moving outward more smoothly.