US20060242966A1 - Heat-dissipation device and electronic apparatus utilizing the same - Google Patents

Heat-dissipation device and electronic apparatus utilizing the same Download PDF

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Publication number
US20060242966A1
US20060242966A1 US11/413,703 US41370306A US2006242966A1 US 20060242966 A1 US20060242966 A1 US 20060242966A1 US 41370306 A US41370306 A US 41370306A US 2006242966 A1 US2006242966 A1 US 2006242966A1
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United States
Prior art keywords
component
plate
cooling
sensor
electronic apparatus
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/413,703
Inventor
Bang Wang
Chang Li
Kelvin Liao
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BenQ Corp
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BenQ Corp
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Assigned to BENQ CORPORATION reassignment BENQ CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LI, CHANG-CHIEN, LIAO, KELVIN, WANG, BANG-JI
Publication of US20060242966A1 publication Critical patent/US20060242966A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to an electronic apparatus and a heat-dissipation device thereof, and in particular, to a heat-dissipation device with various cooling functions for various components.
  • a worst condition for all components inside the electronic apparatus such as voltage, atmospheric temperature, humidity, or load, is previously assumed. Then, a safe cooling condition is obtained.
  • fans and other heat-dissipation devices are disposed.
  • the fans and other heat-dissipation devices can change its rotational speed or other cooling parameters according to sensors.
  • the fans and other heat-dissipation devices may overly cool other components due to the components those are difficult to be cooled. Thus, noise increases, and energy is wasted.
  • An exemplary embodiment of an electronic apparatus comprises a plate and a heat-dissipation device.
  • the plate comprises a first component and a second component.
  • the heat-dissipation device is disposed adjacent to the plate, and comprises a first sensor, a first cooling component, a second sensor, and a second cooling component.
  • the first sensor measures the temperature of the plate around the first component.
  • the first cooling component is coupled to the first sensor to adjust the temperature of the plate around the first component.
  • the second sensor measures the temperature of the plate around the second component.
  • the second cooling component is coupled to the second sensor to adjust the temperature of the plate around the second component.
  • the electronic apparatus is a projector, and the plate is a ballast.
  • Each of the first cooling component and the second cooling component may be a thermoelectric cooling chip, a miniature fan, or a miniature heat-dissipation module respectively.
  • Heat-dissipation devices are provided.
  • An exemplary embodiment of a heat-dissipation device comprises a body, a plurality of sensors, and a plurality of cooling components.
  • the body comprises a plurality of adjacent zones.
  • Each sensor is disposed in each zone respectively.
  • Each cooling component is disposed in each zone respectively, and coupled to the corresponding sensor that is located in the same zone.
  • Another exemplary embodiment of an electronic apparatus comprises a plate, a first component, a second component, a first sensor, a first cooling component, a second sensor, and a second cooling component.
  • the first component is disposed on the plate.
  • the second component is disposed on the plate.
  • the first sensor is disposed on the plate, and corresponds to the first component to measure the temperature of the plate around the first component.
  • the first cooling component is disposed on the plate and coupled to the first sensor, and corresponds to the first component to adjust the temperature of the plate around the first component.
  • the second sensor is disposed on the plate, and corresponds to the second component to measure the temperature of the plate around the second component.
  • the second cooling component is disposed on the plate and coupled to the second sensor, and corresponds to the second component to adjust the temperature of the plate around the second component.
  • FIG. 1 is a schematic view of an embodiment of a heat-dissipation device
  • FIG. 2 a is a schematic view of an embodiment of an electronic apparatus
  • FIG. 2 b is a schematic view of the assembled electronic apparatus in FIG. 2 a.
  • FIG. 3 is a schematic view of another embodiment of an electronic apparatus.
  • an embodiment of a heat-dissipation device 10 comprises a body 11 , a plurality of sensors 12 , and a plurality of cooling components 13 .
  • the body 11 comprises a plurality of adjacent zones 11 a.
  • Each sensor 12 is disposed in one of the zones 11 a. respectively.
  • Each cooling component 13 is also disposed in one of the zones 11 a respectively, and is coupled to the corresponding sensor 12 that is located in the same zone 11 a.
  • Each sensor 12 may be an electronic thermometer, and each cooling component 13 may be a thermoelectric cooling chip, a miniature fan, or a miniature heat-dissipation module.
  • an embodiment of an electronic apparatus 100 comprises a plate 20 and the heat-dissipation device 10 .
  • the plate 20 comprises a first component 21 and a second component 22 thereon.
  • the heat-dissipation device 10 is disposed adjacent to the plate 20 .
  • a sensor corresponding to the first component 21
  • a cooling component corresponding to the first component 21
  • a first cooling component 13 a is referred to as a first cooling component 13 a, and adjusts the temperature of the plate 20 around the first component 21 .
  • a sensor, corresponding to the second component 22 is referred as a second sensor 12 b, and measures the temperature of the plate 20 around the second component 22 .
  • a cooling component, corresponding to the second component 22 is referred to as a second cooling component 13 b, and adjusts the temperature of the plate 20 around the second component 22 .
  • the first sensor 12 a When the temperature of the first component 21 is increased, the first sensor 12 a can detect an increase in the temperature of the plate 20 around the first component 21 . Then, the first sensor 12 a outputs a signal to the first cooling component 13 a to decrease the temperature of the plate 20 around the first component 21 . Similarly, when the temperature of the second component 22 is increased, the second sensor 12 b can detect an increase in the temperature of the plate 20 around the second component 22 . The second sensor 12 b then outputs a signal to the second cooling component 13 b to decrease the temperature of the plate 20 around the second component 22 . Note that the sensors and the cooling components, not corresponding to the heated components, are idle.
  • the electronic apparatus 100 may be a projector, and the plate 20 may be a ballast.
  • the heat-dissipation device comprises the sensor and the cooling component in each zone, the device can be conveniently mass-produced and can be applied to various electronic apparatuses. Additionally, since various components can be cooled separately, the cooling function can be optimized, thus reducing cost and prolonging product life.
  • FIG. 3 is a schematic view of another embodiment of an electronic apparatus 200 .
  • the electronic apparatus 200 of FIG. 3 differs from the electronic apparatus 100 of FIG. 2 in that the design concept of the heat-dissipation device 10 of FIG. 1 is directly applied in a plate 210 of the electronic apparatus 200 .
  • the electronic apparatus 200 comprises a plate 210 , a first component 220 , a second component 230 , a first sensor 240 , a first cooling component 250 , a second sensor 260 , and a second cooling component 270 .
  • the first and second components 220 and 230 are disposed on the plate 210 .
  • the first sensor 240 is disposed on the plate 210 , and corresponds to the first component 220 to measure the temperature of the plate 210 around the first component 220 .
  • the first cooling component 250 is disposed on the plate 210 and coupled to the first sensor 240 , and corresponds to the first component 220 to adjust the temperature of the plate 210 around the first component 220 .
  • the second sensor 260 is disposed on the plate 210 , and corresponds to the second component 230 to measure the temperature of the plate 210 around the second component 230 .
  • the second cooling component 270 is disposed on the plate 210 and coupled to the second sensor 260 , and corresponds to the second component 230 to adjust the temperature of the plate 210 around the second component 230 .
  • sensors and cooling components can be disposed on zones without heated components, of the plate.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An electronic apparatus and a heat-dissipation device thereof. The electronic apparatus includes a plate and the heat-dissipation device. The plate includes a first component and a second component thereon. The heat-dissipation device is adjacent to the plate, and includes a first sensor, a first cooling component, a second sensor, and a second cooling component thereon. The first sensor measures the temperature of the plate around the first component. The first cooling component is coupled to the first sensor to adjust the temperature of the plate around the first component. The second sensor measures the temperature of the plate around the second component. The second cooling component is coupled to the second sensor to adjust the temperature of the plate around the second component.

Description

    BACKGROUND
  • The invention relates to an electronic apparatus and a heat-dissipation device thereof, and in particular, to a heat-dissipation device with various cooling functions for various components.
  • When determining a cooling condition in an electronic apparatus, a worst condition for all components inside the electronic apparatus, such as voltage, atmospheric temperature, humidity, or load, is previously assumed. Then, a safe cooling condition is obtained.
  • To cool the components inside the electronic apparatus, fans and other heat-dissipation devices are disposed. For more accurate heat-dissipation, the fans and other heat-dissipation devices can change its rotational speed or other cooling parameters according to sensors. However, since some components inside the electronic apparatus are difficult to be cooled, the fans and other heat-dissipation devices may overly cool other components due to the components those are difficult to be cooled. Thus, noise increases, and energy is wasted.
    • SUMMARY
  • Electronic apparatuses are provided. An exemplary embodiment of an electronic apparatus comprises a plate and a heat-dissipation device. The plate comprises a first component and a second component. The heat-dissipation device is disposed adjacent to the plate, and comprises a first sensor, a first cooling component, a second sensor, and a second cooling component. The first sensor measures the temperature of the plate around the first component. The first cooling component is coupled to the first sensor to adjust the temperature of the plate around the first component. The second sensor measures the temperature of the plate around the second component. The second cooling component is coupled to the second sensor to adjust the temperature of the plate around the second component.
  • Note that the electronic apparatus is a projector, and the plate is a ballast. Each of the first cooling component and the second cooling component may be a thermoelectric cooling chip, a miniature fan, or a miniature heat-dissipation module respectively.
  • Heat-dissipation devices are provided. An exemplary embodiment of a heat-dissipation device comprises a body, a plurality of sensors, and a plurality of cooling components. The body comprises a plurality of adjacent zones. Each sensor is disposed in each zone respectively. Each cooling component is disposed in each zone respectively, and coupled to the corresponding sensor that is located in the same zone.
  • Another exemplary embodiment of an electronic apparatus comprises a plate, a first component, a second component, a first sensor, a first cooling component, a second sensor, and a second cooling component. The first component is disposed on the plate. The second component is disposed on the plate. The first sensor is disposed on the plate, and corresponds to the first component to measure the temperature of the plate around the first component. The first cooling component is disposed on the plate and coupled to the first sensor, and corresponds to the first component to adjust the temperature of the plate around the first component. The second sensor is disposed on the plate, and corresponds to the second component to measure the temperature of the plate around the second component. The second cooling component is disposed on the plate and coupled to the second sensor, and corresponds to the second component to adjust the temperature of the plate around the second component.
    • DESCRIPTION OF THE DRAWINGS
  • The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
  • FIG. 1 is a schematic view of an embodiment of a heat-dissipation device;
  • FIG. 2 a is a schematic view of an embodiment of an electronic apparatus;
  • FIG. 2 b is a schematic view of the assembled electronic apparatus in FIG. 2 a; and
  • FIG. 3 is a schematic view of another embodiment of an electronic apparatus.
    • DETAILED DESCRIPTION
  • Referring to FIG. 1, an embodiment of a heat-dissipation device 10 comprises a body 11, a plurality of sensors 12, and a plurality of cooling components 13. The body 11 comprises a plurality of adjacent zones 11 a. Each sensor 12 is disposed in one of the zones 11 a. respectively. Each cooling component 13 is also disposed in one of the zones 11 a respectively, and is coupled to the corresponding sensor 12 that is located in the same zone 11 a.
  • Each sensor 12 may be an electronic thermometer, and each cooling component 13 may be a thermoelectric cooling chip, a miniature fan, or a miniature heat-dissipation module.
  • Referring to FIGS. 2 a and 2 b, an embodiment of an electronic apparatus 100 comprises a plate 20 and the heat-dissipation device 10. The plate 20 comprises a first component 21 and a second component 22 thereon. The heat-dissipation device 10 is disposed adjacent to the plate 20. In FIG. 2 a, a sensor, corresponding to the first component 21, is referred as a first sensor 12 a, and measures the temperature of the plate 20 around the first component 21. A cooling component, corresponding to the first component 21, is referred to as a first cooling component 13 a, and adjusts the temperature of the plate 20 around the first component 21. A sensor, corresponding to the second component 22, is referred as a second sensor 12 b, and measures the temperature of the plate 20 around the second component 22. A cooling component, corresponding to the second component 22, is referred to as a second cooling component 13 b, and adjusts the temperature of the plate 20 around the second component 22.
  • When the temperature of the first component 21 is increased, the first sensor 12 a can detect an increase in the temperature of the plate 20 around the first component 21. Then, the first sensor 12 a outputs a signal to the first cooling component 13 a to decrease the temperature of the plate 20 around the first component 21. Similarly, when the temperature of the second component 22 is increased, the second sensor 12 b can detect an increase in the temperature of the plate 20 around the second component 22. The second sensor 12 b then outputs a signal to the second cooling component 13 b to decrease the temperature of the plate 20 around the second component 22. Note that the sensors and the cooling components, not corresponding to the heated components, are idle.
  • The electronic apparatus 100 may be a projector, and the plate 20 may be a ballast.
  • As previously described, since the heat-dissipation device comprises the sensor and the cooling component in each zone, the device can be conveniently mass-produced and can be applied to various electronic apparatuses. Additionally, since various components can be cooled separately, the cooling function can be optimized, thus reducing cost and prolonging product life.
  • FIG. 3 is a schematic view of another embodiment of an electronic apparatus 200. The electronic apparatus 200 of FIG. 3 differs from the electronic apparatus 100 of FIG. 2 in that the design concept of the heat-dissipation device 10 of FIG. 1 is directly applied in a plate 210 of the electronic apparatus 200.
  • Specifically, referring to FIG. 3, the electronic apparatus 200 comprises a plate 210, a first component 220, a second component 230, a first sensor 240, a first cooling component 250, a second sensor 260, and a second cooling component 270. The first and second components 220 and 230 are disposed on the plate 210. The first sensor 240 is disposed on the plate 210, and corresponds to the first component 220 to measure the temperature of the plate 210 around the first component 220. The first cooling component 250 is disposed on the plate 210 and coupled to the first sensor 240, and corresponds to the first component 220 to adjust the temperature of the plate 210 around the first component 220. The second sensor 260 is disposed on the plate 210, and corresponds to the second component 230 to measure the temperature of the plate 210 around the second component 230. The second cooling component 270 is disposed on the plate 210 and coupled to the second sensor 260, and corresponds to the second component 230 to adjust the temperature of the plate 210 around the second component 230.
  • For convenience of mass production, sensors and cooling components can be disposed on zones without heated components, of the plate.
  • Since the concept of the heat-dissipation device in FIG. 1 is directly applied to the plate of the electronic apparatus in FIG. 3, the heat dissipation of the electronic apparatus can be optimized.
  • While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims (13)

1. An electronic apparatus comprising:
a plate comprising a first component and a second component; and
a heat-dissipation device, disposed adjacent to the plate, comprising a first sensor, a first cooling component, a second sensor, and a second cooling component, wherein the first a sensor measures the temperature of the plate around the first component, the first cooling component is coupled to the first sensor to adjust the temperature of the plate around the first component, the second sensor measures the temperature of the plate around the second component, and the second cooling component is coupled to the second sensor to adjust the temperature of the plate around the second component.
2. The electronic apparatus as claimed in claim 1, wherein the electronic apparatus is a projector, and the plate is a ballast.
3. The electronic apparatus as claimed in claim 1, wherein each of the first cooling component and the second cooling component is a thermoelectric cooling chip respectively.
4. The electronic apparatus as claimed in claim 1, wherein each of the first cooling component and the second cooling component is a miniature fan respectively.
5. The electronic apparatus as claimed in claim 1, wherein each of the first cooling component and the second cooling component is a miniature heat-dissipation module respectively.
6. A heat-dissipation device comprising:
a body comprising a plurality of adjacent zones;
a plurality of sensors disposed in the zones respectively; and
a plurality of cooling components disposed in the zones respectively and coupled to the corresponding sensor that is located in the same zone.
7. The heat-dissipation device as claimed in claim 6, wherein each cooling component is a thermoelectric cooling chip.
8. The heat-dissipation device as claimed in claim 6, wherein each cooling component is a miniature fan.
9. The heat-dissipation device as claimed in claim 6, wherein each cooling component is a miniature heat-dissipation module.
10. An electronic apparatus comprising:
a plate;
a first component disposed on the plate;
a second component disposed on the plate;
a first sensor, disposed on the plate, corresponding to the first component to measure the temperature of the plate around the first component;
a first cooling component, disposed on the plate and coupled to the first sensor, corresponding to the first component to adjust the temperature of the plate around the first component;
a second sensor, disposed on the plate, corresponding to the second component to measure the temperature of the plate around the second component; and
a second cooling component, disposed on the plate and coupled to the second sensor, corresponding to the second component to adjust the temperature of the plate around the second component.
11. The electronic apparatus as claimed in claim 10, wherein each of the first cooling component and the second cooling component is a thermoelectric cooling chip respectively.
12. The electronic apparatus as claimed in claim 10, wherein each, of the first cooling component and the second cooling component is a miniature fan respectively.
13. The electronic apparatus as claimed in claim 10, wherein each of the first cooling component and the second cooling component is a miniature heat-dissipation module respectively.
US11/413,703 2005-04-29 2006-04-28 Heat-dissipation device and electronic apparatus utilizing the same Abandoned US20060242966A1 (en)

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TW094113889A TWI272055B (en) 2005-04-29 2005-04-29 Heat-dissipation device and electronic device utilizing the same
TWTW94113889 2005-04-29

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CN104635797B (en) * 2014-12-16 2017-01-25 浪潮电子信息产业股份有限公司 Area detection control method for temperature of server mainboard

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3527621A (en) * 1964-10-13 1970-09-08 Borg Warner Thermoelectric assembly
US5431021A (en) * 1992-11-27 1995-07-11 Gwilliam; Scott B. Thermoelectric device with a plurality of modules individually controlled
US6670780B2 (en) * 2001-10-26 2003-12-30 Matsushita Electric Industrial Co., Ltd. Method for operating high-pressure discharge lamp, lighting apparatus, and high-pressure discharge lamp apparatus
US6727422B2 (en) * 2000-09-18 2004-04-27 Chris Macris Heat sink/heat spreader structures and methods of manufacture
US20050000559A1 (en) * 2003-03-24 2005-01-06 Yuma Horio Thermoelectric generator
US6880345B1 (en) * 2003-11-04 2005-04-19 Intel Corporation Cooling system for an electronic component

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3527621A (en) * 1964-10-13 1970-09-08 Borg Warner Thermoelectric assembly
US5431021A (en) * 1992-11-27 1995-07-11 Gwilliam; Scott B. Thermoelectric device with a plurality of modules individually controlled
US6727422B2 (en) * 2000-09-18 2004-04-27 Chris Macris Heat sink/heat spreader structures and methods of manufacture
US6670780B2 (en) * 2001-10-26 2003-12-30 Matsushita Electric Industrial Co., Ltd. Method for operating high-pressure discharge lamp, lighting apparatus, and high-pressure discharge lamp apparatus
US20050000559A1 (en) * 2003-03-24 2005-01-06 Yuma Horio Thermoelectric generator
US6880345B1 (en) * 2003-11-04 2005-04-19 Intel Corporation Cooling system for an electronic component

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TW200638854A (en) 2006-11-01

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Owner name: BENQ CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, BANG-JI;LI, CHANG-CHIEN;LIAO, KELVIN;REEL/FRAME:017621/0062

Effective date: 20060417

STCB Information on status: application discontinuation

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