US20060054711A1 - IC card and method of manufacturing the same - Google Patents
IC card and method of manufacturing the same Download PDFInfo
- Publication number
- US20060054711A1 US20060054711A1 US11/264,010 US26401005A US2006054711A1 US 20060054711 A1 US20060054711 A1 US 20060054711A1 US 26401005 A US26401005 A US 26401005A US 2006054711 A1 US2006054711 A1 US 2006054711A1
- Authority
- US
- United States
- Prior art keywords
- sealing portion
- card
- case
- semiconductor chip
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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- B29C2045/1673—Making multilayered or multicoloured articles with an insert injecting the first layer, then feeding the insert, then injecting the second layer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
Description
- The present invention relates to IC (integrated circuit) cards and manufacturing techniques thereof, for example, a technique effective when adapted to a semiconductor memory card (which will hereinafter be called “memory card”).
- A variety of IC cards have been used and semiconductor memory cards (which will hereinafter be called “memory cards”, simply) such as multimedia cards (having standards standardized by Multimedia Card Association) and SD memory cards (having standards standardized by SD Card Association) can be classified as memory devices capable of storing information in semiconductor memory chips inside thereof. When they are used, information is available by accessing directly and electrically to a non-volatile memory of the semiconductor memory chip, and a memory medium can be change easily without controlling the machine system. Thus, they have excellent features. Owing to compact size and light weight, they are used as an auxiliary storage unit for apparatuses which require portability such as mobile personal computer, mobile phone and digital camera.
- In the manufacture of a small-size memory card, it is the common practice to cover a wiring substrate and a semiconductor chip with a case made of plastic. As a manufacturing method of a smaller and thinner memory card, there exists a technique of carrying out injection molding of an epoxy resin (thermosetting resin) while putting, in a mold, a circuit substrate having a semiconductor memory chip mounted thereon, thereby forming the memory card integral with its case (for example, refer to
Patent Document 1 and Patent Document 2). - Patent Document 1: Japanese Patent Application Laid-Open No. 2001-325578
- Patent Document 2: Japanese Patent Application Laid-Open No. 2002-176066
- A memory card formed integral with its card case has the advantage that strength is high and water does not penetrate into it easily, because it has less space in it compared with a memory card inserted in a case.
- IC cards are however required to be produced at a reduced cost as well as to have higher strength, and in order to satisfy this, there is a demand for reducing the cost of materials therefor and improving their mass productivity.
- A thermosetting resin ordinarily employed for sealing of a semiconductor, for example, a filler-containing epoxy resin, has a silica powder filled in the resin for a reduction in thermal stress with an Si chip and improvement of the strength of the material. According to the investigation by the present inventors, use of a molding resin having such a high modulus of elasticity for the formation of the outer face of the IC card is accompanied with the problem that upon inserting or removing the IC card in or from a slot, a coating such as Au plating formed on the surface of the electrode in the slot is impaired.
- When a solder connection for electrically connecting a semiconductor chip to an interconnect over a wiring substrate is exposed from the wiring substrate, it is necessary, upon molding, to select a processing temperature so that the temperature of the solder connection will not exceed the melting point of the solder, which, however, imposes a severe limitation on the kind of a usable resin.
- An object of the present invention is to provide an IC card with high reliability and a manufacturing method thereof.
- Another object of the present invention is to provide an IC card which can be produced at a reduced cost and a manufacturing method thereof.
- The above-described and the other objects as well as novel features of the present invention will be apparent from the description herein and accompanying drawings.
- Of the inventions disclosed by the present application, typical ones will next be outlined simply.
- In one aspect of the present invention, there is thus provided An IC card which comprises a semiconductor device having a semiconductor chip at least partially sealed with a first sealing portion made of a thermosetting resin material and having, over a first surface of the semiconductor device, an external connection terminal electrically connected to the semiconductor chip; a case which is made of a thermoplastic resin material and over which the semiconductor device is to be loaded; and a second sealing portion which is made of a thermoplastic resin material and seals the semiconductor device so as to expose the external connection terminal, thereby integrating the semiconductor device with the case.
- In another aspect of the present invention, there is also provided a manufacturing method of an IC card, which comprises the steps of: preparing a semiconductor device having a semiconductor chip at least partially sealed with a first sealing portion made of a thermosetting resin material and having, over a first surface of the semiconductor chip, an external connection terminal electrically connected to the semiconductor chip; preparing a case which is made of a thermoplastic resin material and over which the semiconductor device can be loaded; loading the semiconductor device over the case; and sealing the semiconductor device with a second sealing portion made of a thermoplastic resin material so as to expose the external connection terminal, thereby integrating the semiconductor device with the case.
-
FIG. 1 is a perspective view illustrating the appearance of an IC card according to one embodiment of the present invention; -
FIG. 2 is a cross-sectional view of the IC card ofFIG. 1 in a longitudinal direction (line A-A); -
FIG. 3 is a perspective view illustrating the appearance of the IC body used for the IC card ofFIG. 1 ; -
FIG. 4 is a bottom (back side) view of the IC body ofFIG. 3 : -
FIG. 5 is a cross-sectional view of the IC body taken along a line B-B ofFIG. 3 ; -
FIG. 6 is a cross-sectional view of the IC body ofFIG. 3 during its manufacturing step; -
FIG. 7 is a cross-sectional view of the IC body during its manufacturing step following the step ofFIG. 6 ; -
FIG. 8 is a cross-sectional view of the IC body during its manufacturing step following the step ofFIG. 7 ; -
FIG. 9 is a cross-sectional view of the IC body during its manufacturing step following the step ofFIG. 8 ; -
FIG. 10 is a perspective view illustrating the appearance of another IC body used for the IC card ofFIG. 1 ; -
FIG. 11 is a bottom (back side) view of the IC body ofFIG. 10 ; -
FIG. 12 is a cross-sectional view of the IC body taken along a line C-C ofFIG. 10 ; -
FIG. 13 is a perspective view illustrating the appearance of a further IC body used for the IC card ofFIG. 1 ; -
FIG. 14 is a bottom (back side) view of the IC body ofFIG. 13 ; -
FIG. 15 is a cross-sectional view of the IC body taken along a line D-D ofFIG. 13 ; -
FIG. 16 is a perspective view illustrating the appearance of a case used for the IC card ofFIG. 1 ; -
FIG. 17 is a cross-sectional view of the case taken along a line E-E ofFIG. 16 ; -
FIG. 18 is a cross-sectional view of the IC card ofFIG. 1 during its manufacturing step; -
FIG. 19 is a cross-sectional view of the IC card during its manufacturing step following the step ofFIG. 18 ; -
FIG. 20 is a cross-sectional view of the IC card during its manufacturing step following the step ofFIG. 19 ; -
FIG. 21 is a cross-sectional view of the IC card during its manufacturing step following the step ofFIG. 20 ; -
FIG. 22 is a cross-sectional view of an IC card according to another embodiment of the present invention during its manufacturing step; -
FIG. 23 is a cross-sectional view of the IC card during its manufacturing step following the step ofFIG. 22 ; -
FIG. 24 is a cross-sectional view of the IC card during its manufacturing step following the step ofFIG. 23 ; -
FIG. 25 is a perspective view illustrating the appearance of a semiconductor chip used for an IC card according to a further embodiment of the present invention; -
FIG. 26 is a plan (bottom) view of the semiconductor chip ofFIG. 25 ; -
FIG. 27 is a perspective view illustrating the semiconductor chip ofFIG. 25 mounted on a wiring substrate; -
FIG. 28 is a bottom view ofFIG. 27 ; -
FIG. 29 is a perspective view illustrating the appearance of the IC body; -
FIG. 30 is a cross-sectional view of an IC card according to a still further embodiment of the present invention during its manufacturing step; -
FIG. 31 is a cross-sectional view of the IC card during its manufacturing step following the step ofFIG. 30 ; -
FIG. 32 is a perspective view of the IC card ofFIG. 31 ; -
FIG. 33 is a perspective view illustrating the appearance of an IC card according to a still further embodiment of the present invention; -
FIG. 34 is a cross-sectional view of the IC card taken along a line F-F ofFIG. 33 ; -
FIG. 35 is a perspective view illustrating the appearance of an IC card according to a still further embodiment of the present invention; -
FIG. 36 is a cross-sectional view of the IC card taken along a line G-G ofFIG. 35 ; -
FIG. 37 is a cross-sectional perspective view illustrating the structure of an IC body used for the IC card ofFIG. 35 ; -
FIG. 38 is a cross-sectional perspective view illustrating the structure of another IC body used for the IC card ofFIG. 35 ; -
FIG. 39 is a cross-sectional view of the IC card ofFIG. 35 during its manufacturing step; -
FIG. 40 is a cross-sectional view of the IC card during its manufacturing step following the step ofFIG. 39 ; -
FIG. 41 is a plan view of an IC card according to a still further aspect of the present invention; -
FIG. 42 is a perspective view for explaining a fitting manner of a mechanically operated part in the IC card; -
FIG. 43 is a fragmentary cross-sectional view illustrating the mechanically operated part fitted in a fitting portion of the IC card; -
FIG. 44 is a fragmentary cross-sectional view taken along a line H-H ofFIG. 43 ; -
FIG. 45 is a plan view of an IC card according to a still further aspect of the present invention; -
FIG. 46 is a cross-sectional view of an IC card according to a still further aspect of the present invention; -
FIG. 47 is a cross-sectional view of an IC card according to a still further aspect of the present invention; -
FIG. 48 is a plan view of an IC card according to a still further embodiment of the present invention during its manufacturing step; -
FIG. 49 is a plan view of the IC card during its manufacturing step following the step ofFIG. 48 ; -
FIG. 50 is a plan view of the IC card during its manufacturing step following the step ofFIG. 49 ; and -
FIG. 51 is a plan view of the IC card during its manufacturing step following the step ofFIG. 50 . - In the below-described embodiments, a description will be made after divided in plural sections or in plural embodiments if necessary for convenience's sake. These plural sections or embodiments are not independent each other, but in a relation such that one is a modification example, details or complementary description of a part or whole of the other one unless otherwise specifically indicated. In the below-described embodiments, when a reference is made to the number of elements (including the number, value, amount and range), the number of elements is not limited to a specific number but can be greater than or less than the specific number unless otherwise specifically indicated or in the case it is principally apparent that the number is limited to the specific number. Moreover in the below-described embodiments, it is needless to say that the constituting elements (including element steps) are not always essential unless otherwise specifically indicated or in the case where it is principally apparent that they are essential. Similarly, in the below-described embodiments, when a reference is made to the shape or positional relationship of the constituting elements, that substantially analogous or similar to it is also embraced unless otherwise specifically indicated or in the case where it is utterly different in principle. This also applies to the above-described value and range. In all the drawings for describing the below-described embodiments, elements having like function will be identified by like reference numerals and overlapping descriptions will be omitted. In the drawings used in these embodiments, even a plan view is sometimes hatched to facilitate understanding of the drawing. The embodiments of the present invention will hereinafter be described specifically based on accompanying drawings.
- The IC card of this embodiment and its manufacturing steps will next be described with reference to drawings.
FIG. 1 is a perspective view illustrating the appearance of an IC card according to this embodiment of the present invention, whileFIG. 2 is a cross-sectional view of the IC card ofFIG. 1 along a longitudinal direction (line A-A). - The
IC card 1 of this embodiment as illustrated inFIGS. 1 and 2 is a memory card usable mainly as an auxiliary storage unit for various portable electronic devices, for example, information processing units such as mobile computer, image processing units such as digital camera, communications devices such as mobile phone. It is usable while being installed in the electronic devices as described above.IC card 1 is, for example, a small thin plate having a rectangular plane (card shape) and it may have various outside dimensions, for example, having a long side of about 32 mm, a short side of about 24 mm and a thickness of 1.4 mm. It is a card having similar outside dimension standards and functions to those of a so-called multimedia card (which will hereinafter be abbreviated a “MMC”). TheIC card 1 may be imparted with similar outside dimension standards and functions to an SD memory card (which will hereinafter be called “SD card”) or another memory card. - The
IC card 1 of this embodiment as illustrated inFIGS. 1 and 2 have acase 2 constituting the external shape of theIC card 1 and an IC body (semiconductor device) 4 bonded to or integrally formed with thecase 2 via a sealing portion (molding resin, sealing resin) 3. Thecase 2 and the sealingportion 3 are each made of a thermoplastic resin material. As can be seen from the cross-sectional view ofFIG. 2 , the IC card is rounded at the corners thereof for preventing injuries upon handling it. -
FIG. 3 is a perspective view illustrating the appearance of theIC body 4 used for theIC card 1 of this embodiment;FIG. 4 is a bottom (back side: first surface) of theIC body 4 ofFIG. 3 ; andFIG. 5 is a cross-sectional view of theIC body 4 taken along a line B-B ofFIG. 3 . - The
IC body 4 of this embodiment is a portion (semiconductor device) having a main function of theIC card 1, for example, having a function as a storage unit and has a substrate orwiring substrate 5, a plurality ofexternal connection terminals 6 formed or disposed on the back side (first surface) of thewiring substrate 5, asemiconductor chip 7 disposed or mounted over the main surface (surface) of thewiring substrate 5, and a sealing portion (molding resin, sealing resin) 8 for sealing thesemiconductor chip 7. Thesemiconductor chip 7 is a semiconductor chip for memory (ex. flash memory) or semiconductor chip for control and one orplural semiconductor chips 7 are mounted over thesemiconductor substrate 5 as needed. An electrode or bonding pad of thesemiconductor chip 7 is electrically connected to aninterconnect 10 of thewiring substrate 5 via abonding wire 9 made of a thin metal wire such as a gold (Au) wire. The sealingportion 8 is formed over thewiring substrate 5 so as to cover thesemiconductor chip 7 and the connection (bonding wire 9 in this embodiment) between thesemiconductor chip 7 andwiring substrate 5. Alternatively, thesemiconductor chip 7 is mounted over thewiring substrate 5, for example, by forming thesemiconductor chip 7 to have a bump electrode (solder bump or gold bump) and adopting a flip chip connection (flip chip bonding) technique. In the case of flip chip connection, the sealingportion 8 may be formed to fill (charge) a space between thesemiconductor chip 7 andsemiconductor substrate 5. Parts other than the semiconductor chip may be mounted over thewiring substrate 5. Theinterconnect 10 over the main surface (surface) of thewiring substrate 5 is electrically connected, via a through-hole, to theexternal connection terminal 6 on the back side surface of thewiring substrate 5. In other words, thesemiconductor chip 7 mounted over thewiring substrate 5 is electrically connected to theexternal connection terminal 6 over the back side surface of thewiring substrate 5 via abonding wire 9 and interconnect on thewiring substrate 5. - In this Embodiment, the
case 2 and sealingportion 3 of theIC card 1 is made of a thermoplastic resin material, while the sealingportion 8 of theIC body 4 is made of a thermosetting resin material. - The
IC body 4 is mounted (fitted) in a dent orrecess portion 2 a of thecase 2 so that the surface of thewiring substrate 5 over which thesemiconductor chip 7 is mounted comes inside and it is sealed with the sealingportion 3, whereby theIC body 4 is formed integral with thecase 2 by the sealingportion 3. In other words, the back side surface (surface on the side having the external connection terminal 6) of the IC body 4 (wiring substrate 5) and at least a portion of the surface of thecase 2 on the side on which theIC body 4 is mounted are covered with the sealingportion 3, whereby thecase 2 is formed integral with theIC body 4 and theIC card 1 having, as an external shape, a card shape is formed. The sealingportion 3 may be formed in a region between thecase 2 and theIC body 4. The sealingportion 3 is disposed in a region other than the upper part of theexternal connection terminal 6 so that theexternal connection terminal 6 is exposed. TheIC card 1 has therefore an outer profile (surface) made almost of thecase 2 and the sealingportion 3, that is, a thermoplastic resin material and has a structure in which theexternal connection terminal 6 is exposed on the end side on one surface. The sealingportion 3 and thecase 2 are welded at their interface. - A description will next be made of manufacturing steps of the
IC card 1 of this Embodiment. First, theIC body 4 is prepared. FIGS. 6 to 9 are cross-sectional views of theIC body 4 used for theIC card 1 of the present embodiment in its manufacturing steps. - The
IC body 4 can be prepared, for example, in the following manner. As illustrated inFIG. 6 , awiring substrate 5 having anexternal connection terminal 6 formed over the back side surface thereof is prepared. Theexternal connection terminal 6 of thewiring substrate 5 is electrically connected, via a through-hole, to aninterconnect 10 formed over the surface (main surface) of thewiring substrate 5. As illustrated inFIG. 7 , a semiconductor chip 7 (one or plural) for memory or control is disposed or mounted over the main surface (surface) of thewiring substrate 5. Upon mounting of the semiconductor chip, when the semiconductor chip is fixed using a thermosetting resin, disposal of the semiconductor chip must be followed by heat treatment for thermosetting the resin. As illustrated inFIG. 8 , wire bonding is conducted to electrically connect the bonding pad of thesemiconductor chip 7 to theinterconnect 10 over the main surface of thewiring substrate 5 via abonding wire 9. Then, as illustrated inFIG. 9 , thesemiconductor chip 7 is sealed with a sealingportion 8. In this step, the sealingportion 8 made of a thermosetting resin material is formed over thewiring substrate 5 by transfer mold or the like method so as to cover thesemiconductor chip 7 andbonding wire 9 with the material. The sealingportion 8 is made of, for example, an epoxy resin and it may contain a silica filler. In the above-described manner, theIC body 4 can be formed or manufactured. - When, as a material of the
semiconductor chip 7, a material having a thermal expansion coefficient smaller than that of thewiring substrate 5 or sealing portion 3 (molding resin) is used, it is effective to cover, in advance, the main surface of thesemiconductor chip 7 with a sealingportion 8 made of a resin having a thermal expansion coefficient falling within a range between those of thesemiconductor chip 7 and sealingportion 3 in order to reduce a thermal stress which will otherwise occur owing to a mismatch of the thermal expansion coefficient between thesemiconductor chip 7 and the other member. In this embodiment, when thesemiconductor chip 7 formed using an Si semiconductor substrate is adopted, the reliability of theIC card 1 can be improved further by forming the sealingportion 8 from an epoxy resin, which has a silica filler contained therein to adjust the thermal expansion coefficient, to cover thesemiconductor chip 7. - In addition, the reliability of the
IC card 1 can be improved more by covering the main surface of thesemiconductor chip 7 in advance with the sealingportion 8 made of a resin having an alkali ion concentration smaller than that of the sealing portion 3 (molding resin), in order to prevent contamination of thesemiconductor chip 7 by an alkali ion contained in an organic resin and a deterioration in electric properties due to the contamination. - In this embodiment, the
IC body 4 has thesemiconductor chip 7 mounted directly on thewiring substrate 5 as described above and is therefore a semiconductor device in the form of COB (chip on board). A variety of semiconductor devices other than that in the COP form are usable as theIC body 4.FIG. 10 is a perspective view illustrating the appearance of anotherIC body 4 a used for the IC card of this embodiment;FIG. 11 is a bottom (back side, first surface) view of theIC body 4 a ofFIG. 10 ;FIG. 12 is a cross-sectional view of theIC body 4 a taken along a line C-C ofFIG. 10 ;FIG. 13 is a perspective view illustrating the appearance of afurther IC body 4 b used for theIC card 1 of this embodiment;FIG. 14 is a bottom (back side, first surface) view of theIC body 4 b ofFIG. 13 ; andFIG. 15 is a cross-sectional view of theIC body 4 b taken along a line D-D ofFIG. 13 . - The
IC body 4 a as illustrated in FIGS. 10 to 12 is a semiconductor device in the MAP (mold array package) form. ThisIC body 4 a can be formed, for example, in the following manner. First, a plurality ofsemiconductor chips 7 are disposed over awiring substrate 5 and they are each electrically connected to aninterconnect 10 of thewiring substrate 5 via abonding wire 9. Then, the plurality of thesemiconductor chips 7 are sealed, in block, with a sealingportion 8 made of a thermosetting resin (block molding method). The sealingportion 8 and thewiring substrate 5 are diced and cut or separated into a piece (IC body 4 a), whereby theIC body 4 a is manufactured. - The
IC body 4 b as illustrated in FIGS. 13 to 15 is a semiconductor device manufactured using a lead frame such as QFN (quad flat non leaded package). TheIC body 4 a can be manufactured, for example, in the following manner. First, asemiconductor chip 7 is mounted over adie pad 11 of a lead frame and an electrode pad of thesemiconductor chip 7 is electrically connected to alead portion 12 of the lead frame via abonding wire 9. A sealingportion 8 b is then formed from a similar thermosetting resin material to that used for the above-describedsealing portion 8 so as to cover thesemiconductor chip 7,bonding wire 9, diepad 11 andlead portion 12 with the sealingportion 8 b. Thelead portion 12 has been bent to a fixed shape and anexternal connection terminal 6 is formed by partially exposing the outer surface of thebent lead portion 12 from the back side of the sealingportion 8 b. Thelead portion 12 protruded from the side surface of the sealingportion 8 b is cut, whereby theIC body 4 b is manufactured. Accordingly, theIC body 4 b has a structure in which its outer face is formed by the sealingportion 8 b made of a thermosetting resin and on the back side, theexternal connection terminal 6 made of the outer surface of thelead portion 12 is exposed. - After preparation of the IC body 4 (or 4 a or 4 b), a
case 2 is prepared.FIG. 16 is a perspective view illustrating the appearance of thecase 2 used for the manufacture of theIC card 1 of this embodiment.FIG. 17 is a cross-sectional view of thecase 2 taken along a line E-E ofFIG. 16 . - The manufacture of the
case 2 may be conducted before, after or simultaneously with the preparation of theIC body 4. Thecase 2 is made of a thermoplastic resin material. Examples of the usable material include polycarbonate, ABS (acrylonitrile butadiene styrene resin), PBT (polybutylene terephthalate), PPE (polyphenylene ether), nylon, LCP (liquid crystal polymer), and PET (polyethylene terephthalate), and mixtures thereof. The thermoplastic resin material for the formation of thecase 2 may contain a glass filler. When the content of the glass filler becomes as high as that of the glass filler in the sealingportion 8, the hardness of thecase 2 becomes high, which presumably causes an inconvenience, for example, of damaging Au plating on the surface of an electrode terminal in a slot which a memory card (IC card 1) is inserted in or removed from. It is therefore preferred to adjust the content of the glass filler contained in thecase 2 to be less than that of the glass filler in the sealingportion 8. A variety of methods can be used for the formation of thecase 2. For example, it can be formed by injection molding using a mold with a cavity having a shape corresponding to that of thecase 2. Thecase 2 has, in the outer shape of a card shape, a structure in which a dent orrecess portion 2 a having a shape permitting theIC body 4 to fit therein has been disposed. - The
IC body 4 is then installed in therecess portion 2 a of thecase 2. FIGS. 18 to 21 are cross-sectional views of theIC Card 1 during the step of installing theIC body 4 in thecase 2 and steps thereafter, and correspond toFIG. 2 andFIG. 17 . - As illustrated in
FIG. 18 , theIC body 4 is installed (fitted) in therecess portion 2 a of thecase 2 so as to position the sealingportion 8 on the inner side and theexternal connection terminal 6 on the outer surface side. Therecess portion 2 a of thecase 2 has a shape corresponding to theIC body 4 so that by fitting theIC body 4 in therecess portion 2 a of thecase 2, theIC body 4 can be fixed to thecase 2. With regards to the positioning of theIC body 4 in thecase 2, the IC body in the XY direction (a planar direction parallel to the main surface of the case 2) can be fixed by fitting it in the rcess portion of thecase 2, while the IC body in the Z direction (direction vertical to the main surface of the case 2) can be fixed bymolds IC body 4 can be fixed by temporarily adhering theIC body 4 in therecess portion 2 a of thecase 2 with an adhesive. - As illustrated in
FIG. 19 , thecase 2 having theIC body 4 installed in therecess portion 2 a is then sandwiched between themolds case 2 having theIC body 4 installed therein is disposed between themolds cavity 16 is formed in a region in which a sealingportion 3 is to be formed. As illustrated inFIG. 20 , a resin material (molding resin) 3 a is introduced (injected) or filled in thecavity 16 by injection molding or the like method. Theresin material 3 a filled in thecavity 16 is made of a thermoplastic resin material. Examples of the usable material include polycarbonate, ABS (acrylonitrile butadiene styrene resin), PBT (polybutylene terephthalate), PPE (polyphenylene ether), nylon, LCP (liquid crystal polymer), and PET (polyethylene terephthalate) and mixtures thereof. Theresin material 3 a may contain a glass filler. As in thecase 2, however, when the glass filler content becomes as high as that of the sealingportion 8, the hardness of the sealingportion 3 becomes high, which presumably causes an inconvenience, for example, of damaging Au plating on the surface of an electrode terminal in a slot which a memory card (IC card 1) is inserted in or removed from. It is therefore preferred to adjust the glass filler content in theresin material 3 a to be less than that in the sealingportion 8. Theresin material 3 a to be introduced in thecavity 16 preferably has a high fluidity. The glass filler content of theresin material 3 a for the formation of the sealingportion 3 is therefore preferably lower than that of the resin material (thermoplastic resin material) for the formation of thecase 2. - The temperature of the
resin material 3 a to be introduced in thecavity 16 upon injection molding ranges, for example, from about 200 to 450° C. The temperature of each of themold molds molds molds case 2. Prior to the introduction of theresin material 3 a in thecavity 16, the temperature of thecase 2 is lower than the melting or softening point of thecase 2 so that thecase 2 does not lose its original shape by melting or softening. The temperature of theresin material 3 a to be introduced in thecavity 16 is higher than the melting or softening point of thecase 2. In other words, upon introduction of theresin material 3 a in thecavity 16, theresin material 3 a is heated in advance to a temperature higher than the softening point of thecase 2. Anexternal connection terminal 6 of theIC body 4 is in contact with the surface of themold 15 a to prevent the introduction of theresin material 3 a over theexternal connection terminal 6. - The resin material (thermoplastic resin material) introduced in the
cavity 16 by injection molding covers an exposed surface (back side surface of thewiring substrate 5, surface of thewiring substrate 5 and a portion of the sealing portion 8) except theexternal connection terminal 6 of theIC body 4 and fills the space, if any, between theIC body 4 andcase 2. Theresin material 3 a also covers at least partially over the surface of thecase 2 on the side on which theIC body 4 is installed. When theresin material 3 a introduced into thecavity 16 is brought into contact with thecase 2, it increases the temperature of the contacted part of thecase 2. Thecase 2 is made of a thermoplastic resin so that it has a relatively low thermal conductivity. In thecase 2, therefore, only the surface of thecase 2 brought into contact with theresin material 3 a introduced in thecavity 16 and a portion in the vicinity thereof (for example, a portion of from several μm to hundred μm deep from the surface) are melted or softened by heating (heating to the melting or softening point of the case material or greater) and thecase 2 reacts or is mixed with theresin material 3 a. It is more preferred that thecase 2 and theresin material 3 a are made of respective materials having high affinity each other, because if so, the molten or softened surface of thecase 2 reacts or is mixed with theresin material 3 a and they adhere (are welded) easily. In order to improve the reactivity or adhesion between the surface of thecase 2 and theresin material 3 a, thermoplastic resin materials similar in kind can be used therefor. It is also possible to use thermoplastic resin materials different in kind for thecase 2 and theresin material 3 a. - The
resin material 3 a is injected in thecavity 16 while covering thesemiconductor chip 7 of theIC body 4 or thebonding wire 9 with the sealingportion 8 made of a thermosetting resin so that theresin material 3 a heated to high temperature is not brought into contact with thesemiconductor chip 7 of theIC body 4 orbonding wire 9. In addition, the sealing portion of theIC body 4 is formed from a thermosetting resin material so that contact, with the sealingportion 8, of theresin material 3 a heated to high temperature causes neither melting nor softening of the sealingportion 8. The injection of theresin material 3 a (molding step of the sealing portion 3) does not adversely affect thesemiconductor chip 7 of theIC body 4, thebonding wire 9, a connection between thesemiconductor chip 7 and thebinding wire 9 or a connection between thewiring substrate 5 and thebonding wire 9. - After the
resin material 3 a is filled in thecavity 16, the temperature of theresin material 3 a in thecavity 16 gradually lowers because themolds resin material 3 a made of a thermoplastic resin material cures to be a sealingportion 3. As described above, the surface portion of thecase 2 and theresin material 3 a are molten, reacted or mixed so that after theresin material 3 a and the surface portion of thecase 2 are cooled and cured (solidified), the surface portion of thecase 2 adheres firmly with and therefore is formed integral with the sealingportion 3. The surface portion of thecase 2 and sealingportion 3 are welded so that thecase 2 is formed integral with theIC body 4 via the sealingportion 3, whereby a highstrength IC card 1 is formed. IC cards are thin and bent easily so that there is fear that peeling of theIC body 4 occurs without the sealingportion 3. Such a fear is however unnecessary in this embodiment, because the sealingportion 3 is formed integral with thecase 2 and it supports theIC body 4 firmly as if it sandwiches theIC body 4. The sealingportion 3 is formed to cover a region of theIC body 4 except theexternal connection terminal 6 and to make the outside shape of theIC card 1 a substantially card shape. Then, themolds IC card 1 is taken out. The outer face of theIC card 1 is made of a thermoplastic resin so that it can be easily separated from the molds. In the above-described manner, theIC card 1 of this embodiment as illustrated inFIG. 21 is manufactured. - In this Embodiment, the
IC body 4 installed in thecase 2 is sealed with the sealingportion 3 so that the IC body is formed integral with the case. Therefore, no space exists in the IC card, which enables heightening of the strength of the IC card and prevention of the penetration of water therein. - In this Embodiment, the
case 2 and the sealingportion 3 of theIC card 1 are each made of a thermoplastic resin material, while the sealing portion of theIC body 4 is made of a thermosetting resin material. Use of an inexpensive molding resin is effective for reducing the material cost, but the resin material for the sealingportion 8 which seals thesemiconductor chip 7 is required to have properties such as weather resistance, high adhesion and chemical stability (slow decomposition of the resin owing to a time-dependent change and less degassing). To satisfy the above-described requirement, a silica-filler-containing epoxy resin is preferred as a material for the sealingportion 8. This makes it possible to improve the reliability of theIC card 1. As a resin material for molding thecase 2 and the sealingportion 3 of theIC card 1, preferred is the use of a thermoplastic resin (thermoplastic plastic) which is more inexpensive and permits shortening of the time (TAT (turn around time)) spent for the sealing step. This makes it possible to reduce the manufacturing cost of the semiconductor device. - For the improvement of mass productivity, shortening of the time spent for molding is required. Since the curing of thermosetting resins proceeds with polymerization reaction which is a chemical process, it is difficult to increase the curing rate of the resins and in turn, improve the productivity. In thermoplastic resins, on the other hand, curing of the resins is attained by depriving thermal energy from the resin, making it possible to complete the curing more quickly compared with the thermosetting resins. In this Embodiment, time spent for molding, particularly, for curing of a resin can be reduced by adopting a thermoplastic resin as a molding resin of the
case 2 and sealingportion 3. This leads to shortening of the manufacturing time of the IC card. - Thermoplastic resins have a lower modulus of elasticity than epoxy resins. In this Embodiment, use of a thermoplastic resin as a molding resin of the
case 2 and sealingportion 3 makes it possible to form the outer face of the IC card from this thermoplastic resin having a relatively low modulus of elasticity, whereby upon insertion or removal of the IC card in or from a slot of an electronic device, it is possible to avoid such a problem as damage of coating such as Au plating formed over the electrode surface in the slot. Use of the thermoplastic resin is therefore advantageous. - In this Embodiment, during the molding step of the sealing
portion 3, by using a thermoplastic resin for thecase 2 serving as a base and the molding resin (resin material 3 a) and setting the injection temperature of the molding resin higher than the softening point of the base (case 2), fusion bonding occurs at the interface between the molding resin with the base (case 2), which facilitates the retention of the adhesion strength at the interface between the base (case 2) and the molding resin (sealing portion 3) and at the same time, enables prevention of water penetration from the interface. - Thermoplastic resins are however characterized by that compared with thermosetting resins which cause a chemical change upon curing, thermoplastic resins usually have low chemical stability after curing and have low weather resistance and adhesion force. It is therefore preferred to use a thermosetting resin such as epoxy resin as a resin material for the sealing portion of the
semiconductor chip 7. This makes it possible to improve the reliability of the IC card. - It is necessary to omit an exposed solder connection from the constitution in order to eliminate a limitation to the processing temperature upon molding (upon molding of the sealing portion 3) and select a molding resin (
resin material 3 a) more freely. As countermeasures against such a problem, first one is to form a connection between the semiconductor chip and wiring substrate by using a high-melting-point metal. In this Embodiment, thesemiconductor chip 7 andwiring substrate 5 are electrically connected by employing the wire bonding connection method using a metal wire (bonding wire 9) formed from a high-melting-point metal such as Au. The connection having such a constitution has the merit of withstanding high processing temperatures. A second countermeasure is to, supposing that a solder which is a low-melting-point metal is used for the formation of the connection between the semiconductor chip and the wiring substrate, protect the connection in advance with a resin which is insulative and more temperature resistant than the solder so that the connection is not damaged by the injection of the molding resin even if the solder is molten by the processing temperature upon molding. One specific example of this countermeasure is to install a package such as semiconductor chip using a solder bump, CSP or BGA as described later inEmbodiment 3 and at the same time, insulate between terminals by an underfill resin in order to protect these terminals. By carrying out any one of the above-described countermeasures, it is possible to select the molding resin (resin material 3 a) more freely. - Thermosetting resins cure by the polymerization reaction caused by heating so that after curing, they can withstand even at a temperature higher than the processing temperature upon curing without softening. Thermoplastic resins, on the other hand, softens by heating even after curing so that a resin having a sufficiently high softening point must be selected in order to attain heat resistance required for the product. Supposing that a final product is required to have predetermined temperature resistance, the temperature upon molding step using a thermoplastic resin must be set higher than that upon molding step using a thermosetting resin. In the process (molding step) using a thermoplastic resin, it is therefore effective to adopt any one of the above-described countermeasures to eliminate the limitation to the processing temperature, because the processing temperature upon injection of a thermoplastic resin must be set higher (for example, from 200 to 450° C.) than that upon injection of a thermosetting resin in order to attain fusion bonding of the molding resin (sealing portion 3) and the base (case 2).
- When a material having a smaller thermal expansion coefficient compared with that of the
wiring substrate 5 or molding resin (sealing portion 3) is used for thesemiconductor chip 7, it is effective to cover in advance the main surface of thesemiconductor chip 7 with the sealingportion 8 made of a resin having a thermal expansion coefficient between that of thesemiconductor chip 7 and that of the molding resin (sealing portion 3) in order to reduce a thermal stress which will otherwise occur owing to unconformity of the thermal expansion coefficient between thesemiconductor chip 7 and the other member. In this Embodiment, the reliability of theIC card 1 can be improved further by forming the sealingportion 8 so as to cover thesemiconductor chip 7 with a silica-filler-containing epoxy resin, thereby adjusting the thermal expansion coefficient. - The reliability of the
IC card 1 can be improved further by covering the main surface of thesemiconductor chip 7 in advance with the sealingportion 8 made of a resin having a smaller alkali ion concentration compared with that of the molding resin (sealing portion 3) in order to prevent contamination of thesemiconductor chip 7 with an alkali ion contained in an organic resin and a deterioration in electric properties due to the contamination. - FIGS. 22 to 24 are cross-sectional views of an IC card according to another embodiment of the present invention during its manufacturing steps. To facilitate the understanding, the inside structure (
semiconductor chip 7,bonding wire 9 and interconnect 10) of theIC body 4 is not illustrated inFIGS. 23 and 24 . - In
Embodiment 1, theIC card 1 was manufactured by installing theIC body 4 in thecase 2 prepared in advance, and forming thecase 2 integral with theIC body 4 by molding the sealingportion 3. In this Embodiment, on the other hand, molding of thecase 2, installing of theIC body 4 in thecase 2, and molding of the sealingportion 3 are carried out by injecting a resin material twice in a mold. - As illustrated in
FIG. 22 , a mold (base mold, lower mold) 20 and another mold (upper mold) 21 for the formation of a case are prepared as illustrated inFIG. 22 . Acavity 22 having a shape corresponding to thecase 2 is formed by themold 20 andmold 21. A resin material made of a thermoplastic material is then introduced or injected into thecavity 22 by injection molding. The resin material to be introduced in thecavity 22 is made of a thermoplastic material. Examples of the usable material include polycarbonate, ABS, PBT, PPE, nylon, LCP and PET, and mixtures thereof. By this introduction, thecase 2 having a similar shape to that ofEmbodiment 1 is formed (molded). - Then, the
mold 21 is removed from themold 20, followed by installing theIC body 4, which has been prepared (manufactured) in advance, in arecess portion 2 a of thecase 2 remaining over themold 20 and having the upper surface thereof exposed. TheIC body 4 can be fixed to thecase 2, for example, by fitting theIC body 4 in the recess portion of thecase 2. As illustrated inFIG. 23 , a mold (upper mold) 23 for the formation of a sealing portion is then attached to themold 20. By thesemolds cavity 24 having a shape corresponding to the formation region of the sealingportion 3 is formed. It is also possible, after removal of thecase 2 from themold 20, to fit theIC body 4 in the recess portion of thecase 2 and then return the case having theIC body 4 therein to themold 20. Or, after removal of thecase 2 from themold 20, theIC body 4 may be fitted in the recess portion of thecase 2, followed by installing thecase 2 having theIC body 4 therein in a mold other than themold 20. In the latter case, the mold in which thecase 2 having theIC body 4 therein is to be installed may have a dent similar to or different from that of themold 20. Anyway, the mold may have at least a dent capable of stably fixing or keeping therein thecase 2 having theIC body 4 installed therein. - A resin material made of a thermoplastic resin material is then introduced or injected in the
cavity 24 by injection molding. The resin material to be introduced in thecavity 24 is made of a thermoplastic material. Examples of the usable material include polycarbonate, ABS, PBT, PPE, nylon, LCP and PET, and mixtures thereof. By this step, a sealingportion 3 is formed (molded). Themold 20 andmold 23 are removed (separated), whereby theIC card 1 of this embodiment as illustrated inFIG. 24 is manufactured. - It is more preferred to use the same material as the resin material to be filled in the
cavity 22 for the formation of thecase 2 and the resin material to be filled in thecavity 24 for the formation of the sealingportion 3, because if so, thecase 2 and sealingportion 3 can be molded successively by using the same injection molder. This makes it possible to heighten the adhesion between thecase 2 and sealingportion 3, thereby improving the strength of theIC card 1 and at the same time, to reduce the manufacturing time and manufacturing cost of theIC card 1. - According to this Embodiment, the molding of the
case 2, installing of theIC body 4 and the molding of the sealingportion 3 can be carried out successively so that a manufacturing time and manufacturing cost of the IC card can be reduced. In addition, only by changing the upper mold, the IC card can be manufactured by twice injection molding by using the same injection molder so that the manufacturing steps of the IC card can be simplified further. - In
Embodiment 1, described was the manufacture of theIC card 1 by mounting thesemiconductor chip 7 over thewiring substrate 5, carrying out wire bonding, and forming the sealingportion 8 so as to cover thesemiconductor chip 7 and thebonding wire 9. In this embodiment, on the other hand, mounting of thesemiconductor chip 7 over thewiring substrate 5 by flip chip connection (flip chip bonding) will be described. -
FIG. 25 is a perspective view illustrating the appearance of asemiconductor chip 7 a used in this embodiment; andFIG. 26 is its plan (bottom) view.FIG. 27 is a perspective view illustrating thesemiconductor chip 7 a ofFIG. 25 orFIG. 26 mounted over thewiring substrate 5; andFIG. 28 is its bottom view.FIG. 29 is a perspective view illustrating the appearance of theIC body 4 a of this embodiment. - As illustrated in
FIGS. 25 and 26 , over one of the main surfaces of thesemiconductor chip 7 a, a plurality of solder bumps (bump electrodes) 31 electrically connected to a semiconductor device inside of thesemiconductor chip 7 a are formed. As illustrated inFIGS. 27 and 28 ,such semiconductor chip 7 a is installed or mounted over the surface (main surface) of thewiring substrate 5 by flip chip connection. Described specifically, thesemiconductor chip 7 a is electrically connected to the interconnect of thewiring substrate 5 via the solder bumps 31 and moreover, electrically connected to an external connection terminal on the back side of thewiring substrate 5 via a through-hole of thewiring substrate 5. As illustrated inFIG. 29 , a sealing portion made of a thermosetting resin material (for example, a silica-filler-containing epoxy resin), which is an underfill resin (sealing portion) 32 here, is formed to fill between thesemiconductor chip 7 a and thewiring substrate 5 and cover the solder bumps 31 connecting thesemiconductor chip 7 a andwiring substrate 5, whereby anIC body 4 c as illustrated inFIG. 29 is manufactured. By forming the underfill resin (sealing portion) 32, melting of thesolder bump 31 by an injected resin can be prevented in the subsequent molding step of the sealingportion 3, and the solder bumps 31 can be insulated each other so that they are not brought into contact each other even if they are melted by the injected resin. Upon formation of the sealingportion 32, it is demanded that a processing temperature does not exceed the melting point of the solder bumps 31 and the completed sealingportion 32 has properties capable of withstanding a temperature at least as high as the melting point of the solder bumps 31. Use of a thermosetting resin as theunderfill resin 32 is preferred in order to satisfy the above-described demands. Use of a thermosetting resin facilitates completion of the thermosetting step at a temperature not greater than the melting point of the solder bumps 31 in the underfilling step and at the same time, preparation of the sealingportion 32, which has completed the thermosetting reaction, having the properties capable of withstanding the molding step using a thermoplastic resin and using the melting point of the solder bumps 31 or higher. - FIGS. 30 to 32 are cross-sectional views and perspective view illustrating the manufacturing steps of the IC card according to this embodiment.
FIG. 32 corresponds to the perspective view of the IC card ofFIG. 31 ; and FIGS. 30 to 31 are cross-sectional views. - As illustrated in
FIG. 30 , theIC body 4 c is installed (fitted) in a recess portion of acase 2 made of a thermoplastic resin material in a similar manner to that employed inEmbodiment 1. The material and formation method of thecase 2 and installing method of theIC body 4 a in the recess portion of thecase 2 are substantially similar to those employed inEmbodiment 1 so that a description on them is omitted. - As in
Embodiment 1, a sealingportion 3 made of a thermoplastic resin material is formed by injection molding so as to cover the exposed surface of theIC body 4 c other than theexternal connection terminal 6 and form thecase 2 integral with theIC body 4 c, whereby theIC card 1 a of this embodiment as illustrated inFIGS. 31 and 32 are manufactured. The material and the formation method of the sealingportion 3 are substantially similar to those ofEmbodiment 1 so that a description on them is omitted. - In this Embodiment, terminals or connections, such as solder bumps 31, whose exposure to high temperatures is not desirable, are protected and insulated in advance by using a sealing portion made of a thermosetting resin, the
underfill resin 32 in this embodiment, so as to prevent the connections from being damaged by the injection of a molding resin (resin material 3 a) upon molding of the sealingportion 3. It is therefore possible to appropriately prevent the connections such as solder bumps 31 from being damaged upon molding of the sealingportion 3, and in addition to select the molding resin (resin material 3 a) more freely. - Also in this Embodiment, the whole surface of the
semiconductor chip 7 a can be covered with a thermosetting resin material (material of the underfill resin 32) as inEmbodiment 1 upon formation of the underfill resin (sealing portion) 32. - In this Embodiment, formation of the
IC body 4 c by mounting, over thewiring substrate 5, thesemiconductor chip 7 a having bump electrodes was explained. Alternatively, theIC body 4 c can be manufactured by mounting, as in thesemiconductor chip 7 a, a semiconductor chip (semiconductor device) formed as a package such as BGA (ball grid array) or CSP (chip size (scale) package) over thewiring substrate 5. Also in this case similar to the mounting of thesemiconductor chip 7 a, the connections such as solder bumps may be covered with an underfill resin made of a thermosetting resin material. - In
Embodiment 1, theexternal connection terminal 6 was formed on the back side surface of thewiring substrate 5, but the back side surface of thewiring substrate 5 and the surface of the external connection terminal are almost flat. In order to form the sealingportion 3 so as to expose only the external connection terminal, the sealingportion 3 must be formed so as to cover a region, other than theexternal connection terminal 6, on the back side surface of thewiring substrate 5. In theIC card 1 thus manufactured, the surface of the sealingportion 3 is a little protruded relative to the surface of theexternal connection terminal 6 and a step difference appears on the surface of the IC card on the side of theexternal connection terminal 6. In this Embodiment, a description will be made of an IC card having a planarized surface on the side of the external connection terminal. -
FIG. 33 is a perspective view illustrating the appearance of an IC card according to the above-describedEmbodiment 1; andFIG. 34 is a cross-sectional view of the IC card taken along a line F-F ofFIG. 33 .FIG. 35 is a perspective view illustrating the appearance of the IC card according to the present embodiment; andFIG. 36 is a cross-sectional view of the IC card taken along a line G-G ofFIG. 35 . For facilitating the understanding, the structure inside of the IC body (such assemiconductor chip 7,bonding wire 9 and interconnect 10) is omitted inFIGS. 34 and 36 . - The
IC card 1 b as illustrated inFIGS. 33 and 34 are manufactured as in the IC card ofEmbodiment 1 and has a substantially similar structure to that of theIC card 1 ofEmbodiment 1 except that the number and function of theexternal connection terminal 6 are different. In theIC card 1 ofEmbodiment 1, or theIC card 1 b as illustrated inFIGS. 33 and 34 , the sealingportion 3 is a little protruded and not planarized on the surface on the side of the external connection terminal. - In the
IC card 1 c of the present embodiment as illustrated inFIGS. 35 and 36 , on the other hand, the surface of theIC card 1 c on the side of theexternal connection terminal 6 is planarized. Such a structure is available by disposing a step difference on the back side surface of theIC body 4 d which is to be installed in thecase 2, disposing anexternal connection terminal 6 over the projecting portion and forming the sealingportion 3 so as to constitute the surface of the sealingportion 3 for sealing theIC body 4 on much the same level with theexternal connection terminal 6. Accordingly, theIC card 1 c has a structure having theexternal connection terminal 6 disposed over a flat surface. -
FIG. 37 is a cross-sectional perspective view illustrating the structure of theIC body 4 d used for theIC card 1 c of this embodiment. It has a structure in which a step difference is disposed on the back side surface of theIC body 4 d; anexternal connection terminal 6 is disposed over the projectingportion 41, and a formation region of theexternal connection terminal 6 is protruded relative to a region, other than the formation region of theexternal connection terminal 6, on the back side surface of theIC body 4 d. - The
IC body 4 d ofFIG. 37 can be formed or manufactured, for example, in the following manner. First, prepared is awiring substrate 5 a having a protruded structure relative to a region other than the formation region of theexternal connection terminal 6 by disposing a step difference on the back side surface of the IC body and then disposing theexternal connection terminal 6 over the projectingportion 41. Asemiconductor chip 7 is mounted over the surface of thewiring substrate 5 a and thesemiconductor chip 7 andwiring substrate 5 a are electrically connected via abonding wire 9. Then, thesemiconductor chip 7 andbonding wire 9 are sealed with a sealingportion 8 made of a thermosetting resin material, whereby the IC body 43 d of this embodiment is formed. - The
IC body 4 d as illustrated inFIG. 37 corresponds to a semiconductor device in the form of MAP (mold array package) or COB (clip on board). As the IC body, a semiconductor device in the form of QFN (quad flat non leaded package is also usable.FIG. 38 is a cross-sectional perspective view illustrating the structure of anotherIC body 4 e usable for theIC card 1 c of this embodiment. - The
IC body 4 e ofFIG. 38 has, similar to theIC body 4 d ofFIG. 37 , a structure in which a step difference is disposed over the back side surface of theIC body 4 e; anexternal connection terminal 6 is disposed over its projectingportion 45; and on the back side surface of theIC body 4 e, the formation region of theexternal connection terminal 6 is protruded relative to a region other than the formation region of theexternal connection terminal 6. - The
IC body 4 e ofFIG. 38 can be formed or manufactured, for example, in the following manner. Asemiconductor chip 7 is mounted over adie pad 42 of a lead frame and an electrode pad of thesemiconductor chip 7 is electrically connected to alead portion 43 of the lead frame via abonding wire 9. A sealingportion 44 made of a thermosetting resin material is formed to cover thesemiconductor chip 7,bonding wire 9, diepad 42 andlead portion 43. Thelead portion 43 is bent into a predetermined shape and the outer surface of thelead portion 43 thus bent is partially exposed from the back side surface of the sealingportion 44, whereby anexternal connection terminal 6 is formed. In this molding step of this sealingportion 44, by adjusting the shape of the cavity of the mold for the formation of the sealingportion 44, a step difference is disposed on the back side surface of the sealingportion 44 and theexternal connection terminal 6 is formed by partially exposing the outer surface of thelead portion 43 from the projectingportion 45 on the back side surface of the sealingportion 44. Thelead portion 43 protruded from the sealingportion 44 is cut, whereby theIC body 4 e is manufactured as illustrated inFIG. 38 . Accordingly, theIC body 4 e has a structure in which an outer face is constituted by the sealingportion 44 made of a thermosetting resin and theexternal connection terminal 6 is exposed from the projectingportion 45 on the back side surface. - In the next place, the manufacturing (fabrication) steps of the IC card of this embodiment will be described.
FIGS. 39 and 40 are cross-sectional views of theIC card 1 c according to this embodiment during its manufacturing steps. To facilitate the understanding, the structure inside of theIC body 4 d (such assemiconductor chip 7,bonding wire 9 and interconnect 10) is not illustrated inFIGS. 39 and 40 . - As described above, a step difference is disposed over the back side surface and the
IC body 4 d (or 4 e) having theexternal connection terminal 6 disposed over its projecting portion is installed in therecess portion 2 a of thecase 2 made of a thermoplastic resin material, as illustrated inFIG. 39 . Therecess portion 2 a of thecase 2 has a shape permitting theIC body 4 d to fit therein. In addition, a step difference on the back side surface of thewiring substrate 5, the depth of therecess portion 2 a of thecase 2 or the thickness of thecase 2 is adjusted so that theexternal connection terminal 6 will protrude relative to a surface other than therecess portion 2 a of thecase 2 when theIC body 4 b is installed in therecess portion 2 a of thecase 2. As illustrated inFIG. 40 , the sealingportion 3 made of a thermoplastic resin material is formed to expose theexternal connection terminal 6 and to cover thecase 2 and the back side surface of theIC body 4 d except theexternal connection terminal 6. In this embodiment, the sealingportion 3 is molded over a region other than the formation region of theexternal connection terminal 6 while only the formation region of theexternal connection terminal 6 is protruded so that it is possible to mold the sealingportion 3 to planarize the external connection terminal 6 (the projectingportion 41 on the back side surface of the wiring substrate 5) and sealingportion 3. In this manner, theIC card 1 c of this embodiment is manufactured. The surface of theIC card 1 c on the side on which theexternal connection terminal 6 has been disposed is planarized. TheIC card 1 c as illustrated inFIG. 35 is different from theIC card 1 ofFIG. 1 in the number or arrangement of theexternal connection terminals 6, but the number or arrangement of theexternal connection terminals 6 can be changed, depending on the design. - The surface of the
IC card 1 c on the side opposite to the side on which theexternal connection terminals 6 have been disposed can be easily planarized by planarizing the surface of thecase 2 on the side opposite to the side on which theIC body 4 d is installed. - In
Embodiment 1, the thickness of thecase 2 in a region other than therecess portion 2 a substantially corresponds to the thickness of theIC card 1. In this embodiment, the total of the thickness of thecase 2 in a region other than therecess portion 2 a and the thickness of the sealingportion 3 formed thereover substantially correspond to the thickness ofIC card 1 c. - In the IC card according to
Embodiment 1, a mechanically operated part such as slidable part can be disposed, for example, over the main surface or side surface of the IC card. In this Embodiment, the term “mechanical operated part” means a part bonded to the IC card (mechanically) operatively.FIG. 41 is a plan view illustrating theIC card 1 d of the present embodiment having a mechanically operatedpart 51 disposed thereon. The mechanically operatedpart 51 of theIC card 1 d can be moved or slid in a direction parallel to the side surface of theIC card 1 d and it is used, for example, to switch between a write enabled state and a write protected state into the IC card. - When the mechanically operated
part 51 is attached to the IC card prior to the formation of the sealingportion 3, in other words, when molding of the sealingportion 3 is conducted while having the mechanically operatedpart 51 attached to thecase 2, there is a fear of the molding resin material of the sealingportion 3 adhering to the mechanically operatedpart 51, and integrating the mechanically operatedpart 51 with the sealingportion 3. Another fear is that the mechanically operatedpart 51 undergoes deformation by the heat of the molding resin material of the sealingportion 3 during the molding step of the sealingportion 3. Such adhesion or deformation may presumably act to disturb the smooth operation of the mechanically operatedpart 51, and make normal operation of the mechanically operatedpart 51 impossible. - In this Embodiment, after the formation of the sealing
portion 3, the mechanically operatedpart 51 is attached to theIC card 1 d. The formation step (molding step of the sealingportion 3 therefore does not adversely affect the mechanically operatedpart 51. -
FIG. 42 is a perspective view for explaining the fitting manner of the mechanically operatedpart 51 in theIC card 1 d.FIGS. 43 and 44 are fragmentary cross-sectional views illustrating the mechanically operatedpart 51 fitted in afitting portion 52 of theIC card 1 d.FIG. 43 corresponds to the cross-section vertical to the side surface on which the mechanically operatedpart 51 of theIC card 1 d has been attached and the main surface of theIC card 1 d, whileFIG. 44 corresponds to the cross-section taken along a line H-H ofFIG. 43 . - As illustrated in FIGS. 42 to 44, upon attaching the mechanically operated
part 51 to theIC card 1 d, the mechanically operatedpart 51 is fitted in the fitting portion 52 (protrusion, trench, projection, or recess, or their combination) which is a projection-recess portion for the attachment of the mechanically operatedpart 51 of theIC card 1 d. The fitting portion may be formed in advance in thecase 2 or may be formed from a molding resin material of the sealingportion 3 in the molding step of the sealingportion 3, without forming in thecase 2. It is however preferred to form the sealingportion 3 integral with thefitting portion 52 by using a molding resin material in the molding step of the sealingportion 3, because deformation of thefitting portion 52 which will otherwise occur by the heat upon molding of the sealingportion 3 can be prevented without failure. The structure and manufacturing steps of theIC card 1 d are similar to those of theIC card 1 ofEmbodiment 1 except for the disposal of thefitting portion 52, so that a detailed description is omitted here. - In this Embodiment, after molding of the sealing
portion 3, the mechanically operatedpart 51 is fitted in thefitting portion 52 and it is bonded or attached movably to theIC card 1 d. The mechanically operatedpart 51 and thefitting portion 52 can take any form. For example, the projecting portion of thefitting portion 52 can be fitted in the recess portion of the mechanically operatedpart 51, or the projecting portion of the mechanically operatedpart 51 can be fitted in the recess portion of thefitting portion 52. - In the structure as illustrated in FIGS. 42 to 44, the mechanically operated
part 51 fitted in thefitting portion 52 is formed movably in a direction along the side surface of theIC card 1 d (direction vertical to the paper inFIG. 43 , up/down direction parallel to the paper inFIG. 44 ). In the structure as illustrated in FIGS. 42 to 44, a protrudedfitting portion 52 having a relatively large end portion is inserted in the mechanically operatedpart 51 and the mechanically operatedpart 51 having thefitting portion 52 inserted therein is movable (slidable) in a direction along the side surface of theIC card 1 d. - The mechanically operated
part 51 and thefitting portion 52 have a structure for positioning the mechanically operatedpart 51, for example, at the write enabled position and write protected position to the IC card. For example, when adent portion 51 a of the mechanically operatedpart 51 is engaged with aprotrusion fitting portion 52, the position of the mechanically operatedpart 51 becomes stable, or is fixed. By setting the position at which thedent portion 51 a of the mechanically operatedpart 51 is engaged with theprotrusion 53 of thefitting portion 52 as a write enabled position to the IC card and the position at which it is engaged with theprotrusion 54 as a write protected position to the IC card, movement of the mechanically operatedpart 51 between the write enabled position and the write protected position and fixation of it at each position can be carried out smoothly. - The mechanically operated
part 51 can be disposed not only on the side surface of the IC card but at any position and the number of it is not limited (singular or plural). The mechanically operatedpart 51 can be moved in any direction. For example, as illustrated in the plan view ofFIG. 45 , over the main surface of theIC card 1 d, the mechanically operatedpart 51 is disposed movably in a direction parallel to the main surface of theIC card 1 d. Alternatively, afitting portion 52 is disposed in theIC body 4 and the mechanically operatedpart 51 can be installed to thefitting portion 52 disposed in theIC body 4. In this case, in the molding step of the sealingportion 3, a care must be taken so as not to inject the molding resin material in thefitting portion 52 disposed in theIC body 4 and in the vicinity thereof. In order to attain this, it is recommended to adjust the shape of the cavity of the mold, thereby preventing the sealingportion 3 from being formed over thefitting portion 52 disposed in theIC body 4 and theexternal connection terminal 6. -
FIGS. 46 and 47 are cross-sectional views of theIC cards semiconductor chip 7,bonding wire 9 and interconnect 10) of theIC body 4 are omitted fromFIGS. 46 and 47 . - In
Embodiment 1, in thecase 2, theIC body 4 which has a relatively small planar area (size) compared with the case is installed and the sealingportion 3 is formed so as to cover a region of theIC body 4 fitted in thecase 2 except theexternal connection terminal 6, as illustrated inFIG. 2 . The sealingportion 3 is formed over a predetermined region over one of the surfaces of the case 2 (main surface on the side on which theIC body 4 has been mounted), for example, about half of thecase 2, to cover a region of theIC body 4 except theexternal connection terminal 6. - It is however only necessary to form the
case 2 integral with theIC body 4 while sealing theIC body 4 to expose theexternal connection terminal 6 and a ratio of the sealingportion 3 to the main surface of thecase 2 is not limited. A ratio of the size of theIC body 4 to the size of the case 2 (IC card) is also not limited. - For example, the sealing
portion 3 can be formed almost all over the one of the surfaces of the case 2 (main surface on the side on which theIC body 4 is mounted) so as to cover a region of theIC body 4 except theexternal connection terminal 6, as in theIC card 1 e illustrated inFIG. 46 . - Alternatively, the
IC card 1 f can be formed by fitting theIC body 4 having a size close to that of the case 2 (IC card) in the dent or recess portion of thecase 2 and then molding the sealingportion 3, as in theIC card 1 f illustrated inFIG. 47 . - FIGS. 48 to 51 are plan views for explaining the manufacturing steps of the IC card according to a still further embodiment of the present invention.
- As illustrated in
FIG. 48 , aframe 61 having an array ofplural cases 2 is formed using a thermoplastic resin, for example, by injection molding. Theframe 61 has a structure in whichplural cases 2, five cases in the above diagram, have been connected to aframe body 61 a via a fine joint 61 b. - As illustrated in
FIG. 49 , anIC body 4 is then loaded (fitted) in arecess portion 2 a of each of thecases 2 constituting theframe 61. - As illustrated in
FIG. 50 , sealingportions 3 for sealing theIC body 4 are molded in block by transfer molding so as to cover a region of theIC body 4 except theexternal connection terminals 6, whereby theIC body 4 is bonded to or integrally formed with each of thecases 2 of theframe 61 via the sealingportion 3. In the molding step of the sealingportion 3, it is preferred to mold in block the sealingportions 3 of all thecases 2 constituting theframe 61, because it enables production of a large number of IC cards on an assembly line. As another method for molding the sealingportion 3, the sealingportions 3 can be formed respectively for thecases 2 constituting theframe 61. - As illustrated in
FIG. 51 , theframe 61 is cut at the peripheral portion of eachcase 2, that is, the joint 61 b to separate into pieces, that is,IC cards 1, wherebyplural IC cards 1, fiveIC cards 1 in this embodiment, can be manufactured from oneframe 61. - The manufacturing method according to this embodiment enables production of a plurality of
IC cards 1 at once and production of a large number ofIC cards 1 in a short time. It can reduce the manufacturing time and manufacturing cost of the IC card. Accordingly, the manufacturing steps of this embodiment are suited for mass production of theIC card 1. - In this Embodiment, the
frame 61 having an array of fivecases 2 is used, however, the number of thecases 2 constituting theframe 61 is not limited to five. It is possible to manufacture IC cards by using theframe 61 having an array of any number (plural) ofcases 2. - The invention made by the present inventors was described specifically based on embodiments thereof. It should however be born in mind that the present invention is not limited to them but can be modified within an extent not departing from the gist of the invention.
- The present invention can be applied not only to memory cards having therein a flash memory (EEPROM) such as MMC (multimedia card) and SD card, but also memory cards having therein a memory circuit such as SRAM (static random access memory), FRAM (ferroelectric random access memory) and MRAM (magnetic random access memory) and IC (integrated circuit) cards without a memory circuit.
- Advantages available by the typical inventions, among the inventions disclosed by the present application, will next be described simply.
- By installing a semiconductor-device which has a semiconductor chip sealed at least partially with a first sealing portion made of a thermosetting resin material in a case made of a thermoplastic resin material and sealing the resulting case with a second sealing portion made of a thermoplastic resin material, it is possible to improve the reliability of the IC card. In addition, the manufacturing cost of the IC card can be reduced.
Claims (14)
1-11. (canceled)
12. A manufacturing method of an IC card, comprising the steps of:
(a) preparing a semiconductor device having a semiconductor chip sealed at least partially with a first sealing portion made of a thermosetting resin material and having, over a first surface, an external connection terminal electrically connected to the semiconductor chip;
(b) preparing a case which is made of a thermoplastic resin material and to which the semiconductor device can be loaded;
(c) loading the semiconductor device in the case; and
(d) sealing the semiconductor device with a second sealing portion made of a thermoplastic resin material so as to expose the external connection terminal, thereby forming the semiconductor device integral with the case.
13. A manufacturing method of an IC card according to claim 12 , wherein the step (a) comprises the steps of:
(a1) preparing a wiring substrate having the external connection terminal and interconnect;
(a2) disposing the semiconductor chip over the wiring substrate and electrically connecting the semiconductor chip to the external connection terminal via the interconnect; and
(a3) forming the first sealing portion made of a thermosetting resin material so as to seal at least a portion of the semiconductor chip over the wiring substrate.
14. A manufacturing method of an IC card according to claim 13 , wherein in the step (a3), the first sealing portion is formed to cover the semiconductor chip.
15. A manufacturing method of an IC card according to claim 13 ,
wherein in the step (a2), the interconnect is electrically connected to the semiconductor chip via a connecting member, and
wherein in the step (a3), the connecting member is covered with the first sealing portion.
16. A manufacturing method of an IC card according to claim 13 , wherein in the second step (a2), the semiconductor chip is disposed over a surface of the wiring substrate on the side opposite to the surface over which the external connection terminal is formed.
17. A manufacturing method of an IC card according to claim 12 , wherein in the step (d), the second sealing portion is formed to cover a region, other than the external connection terminal, of the first surface of the semiconductor device.
18. A manufacturing method of an IC card according to claim 12 ,
wherein a projecting portion is formed over the first surface of the semiconductor device, and the external connection terminal is formed over the projecting portion, and
wherein in the step (d), the second sealing portion is formed to cover a region, other than the projecting portion, of the first surface of the semiconductor device.
19. A manufacturing method of an IC card according to claim 12 ,
wherein in the step (b), the case is formed by injection molding using a first lower mold and a first upper mold,
wherein in the step (c), the semiconductor device is loaded over the case after the step (b), and
wherein in the step (d), the second sealing portion is formed by injection molding using the first lower mold and a second upper mold after the step (c).
20. A manufacturing method of an IC card according to claim 12 , wherein a thermoplastic resin used for the formation of the case in the step (b) and a thermoplastic resin used for the formation of the second sealing portion in the step (d) are the same material.
21. A manufacturing method of an IC card according to claim 12 , further comprising, after the step (d), a step of:
attaching a mechanically operated part.
22. A manufacturing method of an IC card according to claim 12 ,
wherein the step (d) further comprises a step of disposing the case having the semiconductor device loaded thereto in a cavity of a mold, introducing a thermoplastic resin material in the cavity, and forming the second sealing portion, and
wherein the thermoplastic resin material is heated in advance to a temperature higher than the softening temperature of the case upon introduction of the thermoplastic resin material in the cavity.
23. A manufacturing method of an IC card according to claim 12 , wherein the step (a) comprises the steps of:
preparing a lead frame having a die pad portion and a lead portion;
loading the semiconductor chip to the die pad portion and wire bonding the semiconductor chip to the lead portion; and
forming the first sealing portion made of a thermosetting resin material so as to cover the semiconductor chip, the die pad portion and the lead portion and to expose, from the outer surface of the first sealing portion, a portion of the outer surface of the lead portion as the external connection terminal.
24. A manufacturing method of an IC card according to claim 12 ,
wherein in the step (a), a plurality of the semiconductor devices are prepared,
wherein in the step (b), a frame having an array of a plurality of the cases is prepared,
wherein in the step (c), the semiconductor device is loaded in each of the plurality of the cases constituting the frame, and
wherein in the step (d), the second sealing portions are formed in block for the plurality of the cases constituting the frame, respectively.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US11/264,010 US20060054711A1 (en) | 2002-10-08 | 2005-11-02 | IC card and method of manufacturing the same |
US11/423,755 US7382045B2 (en) | 2002-10-08 | 2006-06-13 | IC card and method of manufacturing the same |
US12/116,190 US7615855B2 (en) | 2002-10-08 | 2008-05-06 | IC card and method of manufacturing the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2002294721A JP3866178B2 (en) | 2002-10-08 | 2002-10-08 | IC card |
JP2002-294721 | 2002-10-08 | ||
US10/668,229 US6988668B2 (en) | 2002-10-08 | 2003-09-24 | IC card and method of manufacturing the same |
US11/264,010 US20060054711A1 (en) | 2002-10-08 | 2005-11-02 | IC card and method of manufacturing the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/668,229 Continuation US6988668B2 (en) | 2002-10-08 | 2003-09-24 | IC card and method of manufacturing the same |
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US11/423,755 Continuation US7382045B2 (en) | 2002-10-08 | 2006-06-13 | IC card and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
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US20060054711A1 true US20060054711A1 (en) | 2006-03-16 |
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US11/264,010 Abandoned US20060054711A1 (en) | 2002-10-08 | 2005-11-02 | IC card and method of manufacturing the same |
US11/423,755 Expired - Fee Related US7382045B2 (en) | 2002-10-08 | 2006-06-13 | IC card and method of manufacturing the same |
US12/116,190 Expired - Lifetime US7615855B2 (en) | 2002-10-08 | 2008-05-06 | IC card and method of manufacturing the same |
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US10/668,229 Expired - Lifetime US6988668B2 (en) | 2002-10-08 | 2003-09-24 | IC card and method of manufacturing the same |
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US11/423,755 Expired - Fee Related US7382045B2 (en) | 2002-10-08 | 2006-06-13 | IC card and method of manufacturing the same |
US12/116,190 Expired - Lifetime US7615855B2 (en) | 2002-10-08 | 2008-05-06 | IC card and method of manufacturing the same |
Country Status (5)
Country | Link |
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US (4) | US6988668B2 (en) |
JP (1) | JP3866178B2 (en) |
KR (2) | KR100870374B1 (en) |
CN (2) | CN100483692C (en) |
TW (2) | TW200709071A (en) |
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US8079528B2 (en) * | 2007-01-10 | 2011-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Input/output pads placement for a smart card chip |
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US20120012659A1 (en) * | 2010-07-13 | 2012-01-19 | Denso Corporation | Card key having function of performing radio communication with on-vehicle device |
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EP2688098A4 (en) * | 2011-03-17 | 2014-07-30 | Sumitomo Electric Industries | Semiconductor device and method for manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
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CN101494214A (en) | 2009-07-29 |
US20040066693A1 (en) | 2004-04-08 |
KR100870374B1 (en) | 2008-11-25 |
US6988668B2 (en) | 2006-01-24 |
KR20080074056A (en) | 2008-08-12 |
JP3866178B2 (en) | 2007-01-10 |
TWI328774B (en) | 2010-08-11 |
KR20040037268A (en) | 2004-05-06 |
US7615855B2 (en) | 2009-11-10 |
JP2004133516A (en) | 2004-04-30 |
CN100483692C (en) | 2009-04-29 |
CN1512445A (en) | 2004-07-14 |
US7382045B2 (en) | 2008-06-03 |
US20080211074A1 (en) | 2008-09-04 |
TW200709071A (en) | 2007-03-01 |
US20060220202A1 (en) | 2006-10-05 |
TW200405985A (en) | 2004-04-16 |
KR100870601B1 (en) | 2008-11-25 |
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