US20050178528A1 - Electronic apparatus having cooling system, radiator thereof, and method for manufacturing thereof - Google Patents
Electronic apparatus having cooling system, radiator thereof, and method for manufacturing thereof Download PDFInfo
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- US20050178528A1 US20050178528A1 US10/792,689 US79268904A US2005178528A1 US 20050178528 A1 US20050178528 A1 US 20050178528A1 US 79268904 A US79268904 A US 79268904A US 2005178528 A1 US2005178528 A1 US 2005178528A1
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- Prior art keywords
- radiator
- plate
- plural number
- metal thin
- pair
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/04—Arrangements for sealing elements into header boxes or end plates
- F28F9/16—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
- F28F9/18—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
- F28F9/182—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding the heat-exchange conduits having ends with a particular shape, e.g. deformed; the heat-exchange conduits or end plates having supplementary joining means, e.g. abutments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B23/00—Portable grinding machines, e.g. hand-guided; Accessories therefor
- B24B23/08—Portable grinding machines designed for fastening on workpieces or other parts of particular section, e.g. for grinding commutators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0007—Movable machines
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/05316—Assemblies of conduits connected to common headers, e.g. core type radiators
- F28D1/05333—Assemblies of conduits connected to common headers, e.g. core type radiators with multiple rows of conduits or with multi-channel conduits
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
In an electronic apparatus having a liquid cooling system, and enabling to obtain the optical cooling characteristic or capacitor with an aid of a radiator, which can be disposed or located fitting to a narrow space within a housing thereof, wherein a CPU 200 in deed of cooling thereof is installed within the housing 100, and the liquid cooling system for cooling the CPU comprises a cooling jacket 50 and a radiator therein, and wherein the radiator has a pair of headers 62 and 62, being constructed with disposing a large number of metal thin tubes 61, 61 . . . therebetween, aligning in parallel to each other, and can be change in an outer configuration thereof, easily and freely, and therefore it can be positioned even in the narrow space. Further, a cooling fan 64 or 66 for cooling the radiator 60 compulsively may be disposed therein, and in that case; it is also possible to maintain a position for setting up a motor 65 or 67 for rotationally driving the fan, including therein.
Description
- The present invention relates to an electronic apparatus, such as, a personal computer, being so-called a desktop-type or a notebook-type, or a server, etc., and in particular, it relates to an electronic apparatus having a liquid cooling system therein, thereby being able to cool down a heat-generation element mounted within an inside thereof, such as, a semiconductor integrated circuit (IC), effectively with an aid of a liquid refrigerant or coolant, and further the structure of a radiator suitable thereto and a manufacturing method thereof.
- In order to maintain a normal operation thereof, cooling is necessary for the heat-generation element, such as, the semiconductor IC element, being mounted within an electronic apparatus, including a personal computer, of so-called the desktop-type or the notebook-type, as well as, a server, etc., and in particular, the heat-generation element, such as, a CPU (Central Processing Unit), as a representative one thereof, for example. For this reason, conventionally, such the cooling is achieved generally by using a heat transfer element, being so-called a heat sink that is formed with fins thereon, as well as a fan, being provided for sending a cooling air thereto. However, small-sizing and high integration of such the semiconductor IC element, such as the heat-generation element, in recent years, brings about localization of the heat generating at a portion thereof within the heat-generation element, and also for this reason, attention comes to be paid onto a cooling system of a liquid type of using the liquid coolant therein, such as a water, for example, being high in the cooling efficiency thereof, in the place of the conventional cooling system of an air-cooling type.
- Namely, with the liquid cooling system of being high in the cooling efficiency thereof, which is used in the personal computer, of so-called the desktop-type or the notebook-type, and also the server, etc., as is known from the following patent documents, for example, in general, an element being so-called by a heat-receiving (or cooler) jacket is mounted on the surface of the heat-generating element, i.e., the CPU, directly, while conducting the liquid coolant within a flow passage formed within the heat-receiving jacket, so as to transmit or convey the heat generated from the CPU to the coolant flowing within the jacket mentioned above, thereby cooling down the heat-generating element with high efficiency. Further, in such the cooling system of the liquid-cooling type, normally, a heat cycle is made up with the cooler jacket, as the heat-receiving portion thereof, and in more details thereof, it comprises a circulation pump for circulating the liquid coolant mentioned above within the cycle, so-called a radiator, being a heat-radiation portion for irradiating heat of the liquid coolant mentioned above into an outside, and further a coolant tank provided in a part of the cycle depending on the necessity thereof. And, those are connected through a tube made of a metal and/or an elastic material, such as rubber or the like, for example.
- Patent Document 1: Japanese Patent Laying-Open No. Hei 6-266474 (1995); and
- Patent Document 2: Japanese Patent Laying-Open No. Hei 5-264139 (1994).
- By the way, with the cooling system in relation to the conventional arts mentioned above, as a heat radiating portion for radiation the heat of the liquid coolant receiving heat within the cooler jacket mentioned above into an outside of the apparatus, such as, the radiator, normally a device is used in many cases, which is made up by winding around a metal thin tube, being made of copper, for example, in a zigzag manner, and further attached with fins for use of heat radiation on this metal thin tube, so as to improve the heat-radiation characteristic or capacity thereof. Or, alternately, it is made up with the metal thin tube, on which the fins are attached in advance, being wound around in the zigzag manner.
- However, with such the radiator of the conventional arts, in particular, being made up with attaching the heat radiation fins on the metal thin tube zigzagged, which is actually used widely in the personal computer, being so-called the desktop type, and/or the server, etc., it has a drawback that the production process thereof is complex and takes much man-hour, therefore is relatively expensive on costs thereof. Also, with such the radiator of the conventional arts, due to the structure thereof, normally it must be manufactured into a predetermined shape, mainly in a plate-like or a cubic-like outer configuration of the radiator, as a whole.
- On the other hand, for such computer of the desktop-type personal and the server, etc., in particular, due to the demands upon small-sizing and space-saving made in recent years, and also the recent currency of lowering the selling price thereof, it is not always possible to keep an enough space therein, to dispose the radiator having such the predetermined shape or configuration therein, so as obtain the optimal cooling characteristics or performances therefrom. However, actually, there are rather cases very often, wherein the radiator must be stuff into a narrow space remaining within an inside of the housing, forcefully. In such the cases, it is impossible to obtain the cooling function, fully from the radiator, and therefore there is a problem that the distinctive character of the liquid cooling system cannot be achieved in the actual use thereof. In addition thereto, with such the conventional arts mentioned above, also due to the complex manufacturing process thereof, it is difficult to manufacture the radiator having an outer shape or configuration being freely variable fitting to the narrow space remaining within the housing.
- Then, an object according to the present invention, being accomplished by taking the drawbacks of the conventional arts mentioned above into the consideration thereof, it is to provide a radiator having the structure, so that it can be easily disposed even within the narrow space remaining within the housing, fitting thereof, and can be altered in the outer configuration thereof, as well as, can be manufactured cheaply, thereby to provide an electronic apparatus having the liquid cooling system therein, which can obtain the optimal cooling characteristics with using such the radiator, and further a manufacturing method of such the radiator.
- According to the present invention, for accomplishing such the object mentioned above, firstly, there is provided an electronic apparatus, installing a semiconductor element within a housing thereof, which necessitates cooling for maintaining normal operation thereof, in a part of the housing, and having a cooling system, within said housing or in a part thereof, said cooling system, comprising: a cooling jacket, being thematically connected with said semiconductor element, for transmitting heat generated therein to a liquid coolant flowing within an inside thereof; a radiator for radiating the heat transmitted into the liquid coolant within said cooling jacket into an outside of the apparatus; and a circulation pump for circulating said liquid coolant in a loop, including said cooling jacket and said radiator therein, wherein: said radiator is built up, by disposing a plural number of metal thin tubes aligning in parallel to each other. Further, according to the present invention, it is preferable, in the electronic apparatus, as described in above, that said metal thin tube has a circular cross-section thereof, and said radiator comprises a ventilating means in a part thereof.
- Also, according to the present invention, for accomplishing such the object mentioned above, there is provided a radiator for use in the electronic apparatus described in the claim 1, comprising: at least, a pair of header portions disposed opposing to each other, wherein each of said pair of the header portions comprises: a plate-like member being made from a member, which is plate-like and is processed into a predetermined shape, with forming a plural number of penetrating holes therein, into which said plural number of the metal thin tubes are inserted; and a cover portion being formed to have an outer configuration corresponding to that of said plate-like member, and having a recess portion on an interior side thereof, wherein: said plural number of the metal thin tubes are fixed into said penetrating holes formed at positions corresponding thereto on said plate-like member building up said pair of the header portions, each being inserted therein at a tip thereof, thereby disposing said plural number of the metal thin tubes in parallel with each other. Further, according to the present invention, it is preferable, in the radiator as described in the above, that said plate-like member and said cover portion are formed to have outer configurations, corresponding to each other, or each of said plural number of the metal tin tubes fixed to said penetrating holes, being inserted therein at the tips thereof, has flange portions in vicinity of both end portions thereof.
- In addition thereto, according to the present invention, for accomplishing such the object mentioned above, there is also provided a method for manufacturing the radiator, described in the claim 3, comprising the following steps of: preparing said plate-like members and said cover portions for building up said pair of the header portions, and further said plural pieces of the metal thin tubes; disposing and fixing said plural number of the metal thin tubes on said plate-like members for building up said pair of the header portions, at positions corresponding thereto, respectively; and disposing and fixing said cover portions on said plate-like members after disposing and fixing said plural number of the metal thin tubes at the corresponding positions. Further, according to the present invention, in the method for manufacturing the radiator, described in the above, it is preferable that said plural number of the penetrating holes are formed on a surface of said plate-like member through punching process, or that said plural number of the metal thin tubes are fixed on said plate-like members for building up said pair of the headers, at the corresponding positions, through brazing.
- Those and other features, objects and advantages of the present invention will become more apparent from the following description when taken in conjunction with the accompanying drawings wherein:
-
FIG. 1 is an exploded perspective view of a radiator portion, which builds up the distinctive feature according to the present invention, for showing the detailed structure thereof; -
FIG. 2 is a perspective view for showing an example of the arrangement of each part partially exploded thereof, within a personal computer, of so-called the desktop type, for example; -
FIG. 3 is a perspective view of an electronic circuit portion within the electronic apparatus mentioned above, in particular, for showing the entirety of the cooling system thereof; - FIGS. 4(a) to 4(d) are views for explaining an example of the details of processes for manufacturing the radiator mentioned above;
-
FIG. 5 is a cross-section view for showing a portion of a metal thin pile enlargedly, which has flange portions on both end thereof, for showing a variation of the radiator mentioned above in the manufacturing method thereof; -
FIG. 6 is a view for showing an example of arrangement of the radiator mentioned above, with using a space within the housing thereof, in the actual apparatus; - FIGS. 7(a) and 7(b) are views for showing other example of arrangement of the radiator mentioned above, with using a space within the housing thereof, in the actual apparatus; and
- FIGS. 8(a) and 8(b) are views for showing examples of dispositions of a large number of metal thin tubes, in the radiator mentioned above.
- Hereinafter, explanation will be given on the embodiments according to the present invention, in details thereof, by referring to the drawings attached herewith.
- First,
FIG. 2 attached herewith shows an example of the entire structure of an electronic apparatus having a liquid cooling system therein, according to one embodiment of the present invention. However, in this embodiment, there is shown a case, where the present invention is applied into a main portion of a personal computer, such as, of the desktop type, for example. - As shown in the figure, the main part or portion of the desktop type personal computer comprises a
housing 100, which is formed from a metal plate into a cubic shape thereof, for example, and on afront panel portion 101 thereof are provided various kinds of switches, including an electric power switch therein, and indicator lamps, etc. Also, within an inside thereof is disposed adriver device 102, for driving various kinds of external information recording medium, such as, a floppy disk, a CD, and a DVD, etc., so that it positions an opening thereof on thefront panel portion 101. Also, areference numeral 103 in the figure depicts a memory portion provided within thehousing 100 mentioned above, comprising a hard disk device therein, for example. And also, areference numeral 104 in the figure depicts a cover to be put on thehousing 100 mentioned above. - While on a rear side of the
housing 100 is disposed anelectronic circuit portion 105, having a liquid cooling system according to the present invention, and areference numeral 106 in the figure depicts an electric power source portion for supplying from a commercial electric power source, a desired electric power to each of the portions, including, thedriver device 102, thememory portion 103, and theelectronic circuit portion 105 mentioned above. - Next, in
FIG. 3 attached herewith is shown theelectronic circuit portion 105 of the electronic apparatus, the brief structure of which was explained in the above; i.e., within the desktop type personal computer, in particular, mainly around aheat receiving jacket 50 for mounting thereon a heat-generation element, such as, a CPU, as a main or principle structure thereof. However, in this embodiment, a chip 200 of the CPU, being the heat-generation element, is mounted on the lower side surface of the heat-receivingjacket 50 mentioned above, being in contact with, directly, therefore it is not illustrated on the figure, herein. - And, as is apparent from the figure, this
electronic circuit portion 105 comprises the above-mentioned heat-receiving (or cooling)jacket 50 for mounting the CPU thereon, aradiator portion 60 for radiating heat generated from the CPU into an outside of the apparatus, apump 70 for building up a cooling system, and further flow passages are formed by connecting tubes (conduits) 81, 82 . . . , being made of a metal, or an elastic material, such as a rubber or the like, being covered with a metal film, etc. on the outer surface thereof, so as to prevent the liquid coolant inside from leaking outside, for conducting or communicating a liquid coolant (for example, a water, or a mixture of water with a so-called anti-freezing solution, such as, propylene glycol, at a predetermined ratio thereof) to each of those portions building up the heat cycle. Also, in apart of theradiator portion 60 mentioned above, there are attached with plate-likeshaped fans thin pipes heat receiving jacket 50 mentioned above, compulsively into an outside. Further, this heat-receiving (or cooling)jacket 50 is a plate-like member, being made of a metal having high heat conductivity, such as cupper or the like, and being formed with a cooling passage within an inside thereof, to conduct or communicate the liquid coolant into the passage thereof, thereby removing (moving) the heat generated from the CPU into the outside. - Following to the above,
FIG. 1 attached herewith shows the details of the structure of theradiator portion 60 mentioned above, in the form of an exploded view thereof. Namely, as is apparent from this figure, theradiator portion 60 is built up with a pair ofheaders thin tubes thin tubes 61 are shown therein while being enlarged in the diameter thereof, for the purpose of explanation. In more details, the radiator according to the present example, it is built up, by connecting about 400 pieces of thethin tubes headers 62 having the sized of 100 mm×40 mm, for example, in parallel with, respectively. - Explaining in more details thereof, as is apparent form the figure, each of the
headers 62 mentioned above comprises one (1) piece of plate-like member 621, having a predetermined shape (in this example, a square shape), and also acover member 623, which has an outer configuration corresponding to that of the plate-like member 621 (thus, being square in this example) and is formed with a recess or concavedportion 622 on an inner side thereof. On the each plate-like member 621, there are openedpenetration holes 624, into which tip portion of thethin tubes 61 are inserted, in the number same to that of the tubes. However, each of those plate-like members 621 and thecover members 623 can be manufactured, easily from a metal plate having superior heat conductivity, such as, copper and/or aluminum, etc., being cut out into the predetermined shape through conducting the punching or drawing process thereon. Also, areference numeral 625 in the figure depicts tube-like members, each being attached onto the eachcover member 623 mentioned above, thereby forming an inlet opening and an outlet opening for the liquid coolant, respectively. The eachheader 62 carries out the function as a reservoir tank for the liquid coolant, therefore the internal volume thereof is determined by an amount of liquid to be held within the cooling system (i.e., an amount of liquid being sufficient to compensate the amount of the liquid reduced accompanying with a long-time operation). Also, the outlet opening of the radiator is located in a lower side thereof, thereby to be connected to the suction side of the pump, and then an air mixing within the liquid coolant is held within the upper-side header (i.e., the inlet-opening side of the radiator); therefore, it is possible to prevent the air from being sucked into the pump. - Next, FIGS. 4(a) to 4(d) attached herewith show an example of the processes for inserting/fixing the metal
thin tubes 61 into the penetratingholes 624 formed in the plate-like member 621, which builds up theheader 62 mentioned above. First, the plate-like member 621 being made up in such the manner as was mentioned above and the metalthin tubes 61 are prepared (seeFIG. 4 (a)). Next, the metalthin tubes 61 are inserted into the penetratingholes 621 formed on the plate-like member 621 prepared, in such the extent that each protrudes the tip thereof a little bit (seeFIG. 4 (b)). Thereafter, the protruded portions of the metalthin tubes 61 and the plate-like member 621 are bonded and fixed together, therebetween through the brazing, or the like (seeFIG. 4 (c)). Finally, thecover member 623 mentioned above is mounted thereon from the above, and then those plate-like member 621 and thecover member 623 are bonded together with, around the outer peripheral portion thereof, through the electric welding, etc. (i.e., an outer-peripheral welding portion 626), thereby completing the radiator (seeFIG. 4 (d)). Or alternately, it is also possible to apply a method of bonding them together, collectively, within a furnace, etc., while putting a brazing material on the connection portions in advance. - Also, during the manufacturing processes of the
header 62 explained in the above, in particular, in a case where the metalthin tubes 61 are inserted into the penetratingholes 624, which are formed in the plate-like member 621, it is possible to make aflange portion 611 in advance, in particular, in the vicinity of the tip portion of the metalthin tube 61 to be inserted into, as shown inFIG. 5 attached herewith, for example (i.e., in the present example, at an upper or lower end portion). In this manner, with provision of theflange portion 611 inadvances, in the vicinity of the tip portion of the metalthin tube 61, as is shown in the figure, it can bring about an easiness in bonding and inserting of the metalthin tubes 61 into the penetrating holes formed on the plate-like member 621, since theflange portion 611 carries out a role or function of positioning or stopping the metalthin tube 61 when it is inserted into the penetratinghole 624. - Next, explanation will be made about various embodiments, altering the
radiator 60 in the outer configuration thereof, which can be manufactured easily, through the processes mentioned above. However, as is apparent from the explanation given in the above, with such the structure of theradiator 60 according to the present invention mentioned above, it is apparent that the configuration thereof can be changed easily, depending upon the shape of a pair of theheaders - As an example thereof,
FIG. 6 attached herewith shows an example of theradiator 60′ suitable to be disposed within the narrow space, being narrow in the width but extending in the horizontal direction. As is apparent from the figure, the configuration of the pair ofheaders thin tubes 61 are disposed in parallel with between them, thereby building up theradiator 60′. Namely, with such the configuration of theradiator 60′, as is shown in the figure, a coolingfan 64 can be disposed within a recess portion 63 formed in a part thereof, and thereby enabling an effective utilization of the limited space at the maximum. Further, an arrow shown in this figure indicates an airflow generated through the rotation of the coolingfan 64 mentioned above. - Further, FIGS. 7(a) and 7(b) show an example of a
radiator 60″ suitable for to be disposed within a space remaining within the housing of the apparatus, being about cubic in the shape thereof and opening only in an upper portion thereof, as other example. Namely, as is apparent from the figure, each of the pair ofheaders radiator 62″ mentioned above, is square in the outer configuration thereof, and is formed with a circular opening in the central portion thereof, respectively, in this embodiment. With theradiator 60″ having such the configuration as was mentioned above, as is apparent fromFIG. 7 (b), in particular, it is possible to dispose acentrifugal fan 66 and anelectric motor 67 for rotational driving thereof, into a space having a circular cross-section and opened in a central portion of theradiator 60″. Thus, with such the structure, as is indicated by arrows in the figure, it is possible to suck an air from the space above theradiator 60″, to be discharged or spouted out in the periphery thereof. In this manner, it is possible to make a setup, freely, including the disposition of the fan for conducting an air-blow and also the motor for rotational driving thereof, with utilizing the space remaining within the housing of an apparatus. - Although those
radiators headers thin tubes 61 building up the heat-radiating portion thereof has no fin attached on the periphery thereof, in the structure, and further the outer periphery thereof is curved in the cylinder-like manner, therefore dusts hardly stick or adhere on the periphery thereof. Namely, adhesion of dusts on the heat-radiating portion is small in an amount thereof even with continuous use thereof for a long time period. For this reason, it is difficult to generate blocking in the passages for the cooling air, and therefore, reduction in the cooling capacity hardly occurs due to such the adhesion of such the dusts, etc. Furthermore, such the feature would be advantageous, in particular, to the server, etc., which should be continuously operated for a relatively long time period, from a viewpoint of maintenance thereof. - In addition thereto, the large number of metal
thin tubes 61, building up such theradiators like member 621 thereof), in a grid-like manner or a zigzag manner. Furthermore, other than those, those can be disposed at random in the position as far as they are in concert with each other between the positions where they are attached on the pair ofheaders - As was fully explained in the above, according to the present invention mentioned above, it is possible to achieve the radiator having such the structure, that it can be also disposed in the narrow space remaining within the housing, easily, for example, in the personal computer of so-called the desktop type and the server, etc., and can be changed in the outer configuration thereof with easily, and manufactured cheaply, thereby to provide an electronic apparatus having the cooling system, in which the optimal cooling characteristic or capacity can be obtained with utilizing such the radiator, as well as the manufacturing method of such the radiator.
- The present invention may be embodied in other specific forms without departing from the spirit or essential feature or characteristics thereof. The present embodiment(s) is/are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the forgoing description and range of equivalency of the claims are therefore to be embraces therein.
Claims (11)
1. An electronic apparatus, installing a semiconductor element within a housing thereof, which necessitates cooling for maintaining normal operation thereof, in a part of the housing, and having a cooling system, with in said housing or in a part thereof, said cooling system, comprising:
a cooling jacket, being thematically connected with said semiconductor element, for transmitting heat generated therein to a liquid coolant flowing within an inside thereof;
a radiator for radiating the heat transmitted into the liquid coolant within said cooling jacket into an outside of the apparatus; and
a circulation pump for circulating said liquid coolant in a loop, including said cooling jacket and said radiator therein, wherein:
said radiator is built up, by disposing a plural number of metal thin tubes aligning in parallel to each other.
2. The electronic apparatus, as described in the claim 1 , wherein said metal thin tube has a circular cross-section thereof, and said radiator comprises a ventilating means in a part thereof.
3. A radiator for use in the electronic apparatus described in the claim 1 , comprising:
at least, a pair of header portions disposed opposing to each other, wherein each of said pair of the header portions comprises:
a plate-like member being made from a member, which is plate-like and is processed into a predetermined shape, with forming a plural number of penetrating holes therein, into which said plural number of the metal tin tubes are inserted; and
a cover portion being formed to have an outer configuration corresponding to that of said plate-like member, and having a recess portion on an interior side thereof, wherein:
said plural number of the metal thin tubes are fixed into said penetrating holes formed at positions corresponding thereto on said plate-like member building up said pair of the header portions, each being inserted therein at a tip thereof, thereby disposing said plural number of the metal thin tubes in parallel with each other.
4. The radiator, as described in the claim 3 , wherein said plate-like member and said cover portion are formed to have outer configurations, corresponding to each other.
5. The radiator, as described in the claim 3 , wherein each of said plural number of the metal thin tubes fixed to said penetrating holes, being inserted therein at the tips thereof, has flange portions in vicinity of both end portions thereof.
6. A radiator for use in the electronic apparatus described in the claim 2 , comprising:
at least, a pair of header portions disposed opposing to each other, wherein each of said pair of the header portions comprises:
a plate-like member being made from a member, which is plate-like and is processed into a predetermined shape, with forming a plural number of penetrating holes therein, into which said plural number of the metal tin tubes are inserted; and
a cover portion being formed to have an outer configuration corresponding to that of said plate-like member, and having a recess portion on an interior side thereof, wherein:
said plural number of the metal thin tubes are fixed into said penetrating holes formed at positions corresponding thereto on said plate-like member building up said pair of the header portions, each being inserted therein at a tip thereof, thereby disposing said plural number of the metal thin tubes in parallel with each other.
7. The radiator, as described in the claim 6 , wherein said plate-like member and said cover portion are formed to have outer configurations, corresponding to each other.
8. The radiator, as described in the claim 6 , wherein each of said plural number of the metal tin tubes fixed to said penetrating holes, being inserted therein at the tips thereof, has flange portions in vicinity of both end portions thereof.
9. A method for manufacturing the radiator, described in the claim 3 , comprising the following steps of:
preparing said plate-like members and said cover portions for building up said pair of the header portions, and further said plural pieces of the metal thin tubes;
disposing and fixing said plural number of the metal thin tubes on said plate-like members for building up said pair of the header portions, at positions corresponding thereto, respectively; and
disposing and fixing said cover portions on said plate-like members after disposing and fixing said plural number of the metal thin tubes at the corresponding positions.
10. The method for manufacturing the radiator, described in the claim 9 , wherein said plural number of the penetrating holes are formed on a surface of said plate-like member through punching process.
11. The method for manufacturing the radiator, described in the claim 9 , wherein said plural number of the metal thin tubes are fixed on said plate-like members for building up said pair of the headers, at the corresponding positions, through brazing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004038148A JP2005229032A (en) | 2004-02-16 | 2004-02-16 | Electronic apparatus having liquid-cooled system, its radiator, and its manufacturing method |
JP2004-038148 | 2004-02-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050178528A1 true US20050178528A1 (en) | 2005-08-18 |
Family
ID=34747404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/792,689 Abandoned US20050178528A1 (en) | 2004-02-16 | 2004-03-05 | Electronic apparatus having cooling system, radiator thereof, and method for manufacturing thereof |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050178528A1 (en) |
EP (1) | EP1571534A3 (en) |
JP (1) | JP2005229032A (en) |
KR (1) | KR20050081815A (en) |
CN (1) | CN1658121A (en) |
Cited By (14)
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US20050088820A1 (en) * | 2003-10-27 | 2005-04-28 | Takashi Naganawa | Liquid cooling system |
US20060090888A1 (en) * | 2004-11-03 | 2006-05-04 | Forward Electronics Co., Ltd. | Heat-exchange type cooler |
US20060137863A1 (en) * | 2004-12-24 | 2006-06-29 | Foxconn Technology Co., Ltd. | Liquid cooling device |
US20070064393A1 (en) * | 2005-09-21 | 2007-03-22 | Chien-Jung Chen | Heat dissipating system |
US20070091565A1 (en) * | 2005-10-25 | 2007-04-26 | Malone Christopher G | Impingement cooling of components in an electronic system |
US20100181057A1 (en) * | 2008-10-03 | 2010-07-22 | Danfoss Drives A/S | Flow distributor assembly and a cooling unit with a flow distributor assembly |
US20110100612A1 (en) * | 2009-10-30 | 2011-05-05 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Liquid cooling device |
US20130213602A1 (en) * | 2012-02-21 | 2013-08-22 | Huawei Technologies Co., Ltd. | Cooling system and method for cooling a heat generating unit |
US20130284404A1 (en) * | 2011-11-11 | 2013-10-31 | Showa Denko K.K. | Liquid-cooled-type cooling device and manufacturing method for same |
US20140332184A1 (en) * | 2013-05-09 | 2014-11-13 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system and rack-mount server using the same |
US20150330718A1 (en) * | 2013-08-28 | 2015-11-19 | Hamilton Sundstrand Corporation | Integrated blower diffuser-fin single phase heat exchanger |
US20190212066A1 (en) * | 2018-01-11 | 2019-07-11 | Asia Vital Components Co., Ltd. | Water-cooling radiator assembly with internal horiziontal partition members and flow disturbing members |
US20200137929A1 (en) * | 2018-10-24 | 2020-04-30 | Nidec Corporation | Cooling device |
CN113370056A (en) * | 2021-05-31 | 2021-09-10 | 贵州航天电子科技有限公司 | Polishing method of radiator |
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JP4742965B2 (en) * | 2006-04-18 | 2011-08-10 | パナソニック株式会社 | Heat transfer device and liquid cooling system using it |
KR100873843B1 (en) | 2007-02-27 | 2008-12-15 | 한국생산기술연구원 | Water-cooled chiller of semiconductor device |
CN105202844B (en) * | 2015-10-20 | 2017-06-16 | 中国电子科技集团公司第四十四研究所 | High efficiency water cooling box |
CN111556694B (en) * | 2020-04-30 | 2021-04-06 | 苏州市通准精密塑胶五金有限责任公司 | Radiating fin |
CN112860042A (en) * | 2021-02-09 | 2021-05-28 | 华勤技术股份有限公司 | Liquid cooling device and equipment |
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US20130213602A1 (en) * | 2012-02-21 | 2013-08-22 | Huawei Technologies Co., Ltd. | Cooling system and method for cooling a heat generating unit |
US9173328B2 (en) * | 2013-05-09 | 2015-10-27 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation system and rack-mount server using the same |
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US20150330718A1 (en) * | 2013-08-28 | 2015-11-19 | Hamilton Sundstrand Corporation | Integrated blower diffuser-fin single phase heat exchanger |
US20190212066A1 (en) * | 2018-01-11 | 2019-07-11 | Asia Vital Components Co., Ltd. | Water-cooling radiator assembly with internal horiziontal partition members and flow disturbing members |
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CN113370056A (en) * | 2021-05-31 | 2021-09-10 | 贵州航天电子科技有限公司 | Polishing method of radiator |
Also Published As
Publication number | Publication date |
---|---|
EP1571534A3 (en) | 2006-07-26 |
KR20050081815A (en) | 2005-08-19 |
CN1658121A (en) | 2005-08-24 |
JP2005229032A (en) | 2005-08-25 |
EP1571534A2 (en) | 2005-09-07 |
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Legal Events
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Owner name: HITACHI, LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OHASHI, SHIGEO;NAGANAWA, TAKASHI;MINAMITANI, RINTARO;AND OTHERS;REEL/FRAME:015602/0070 Effective date: 20040225 |
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STCB | Information on status: application discontinuation |
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