US20050133210A1 - Easily assembled cooler - Google Patents
Easily assembled cooler Download PDFInfo
- Publication number
- US20050133210A1 US20050133210A1 US11/013,140 US1314004A US2005133210A1 US 20050133210 A1 US20050133210 A1 US 20050133210A1 US 1314004 A US1314004 A US 1314004A US 2005133210 A1 US2005133210 A1 US 2005133210A1
- Authority
- US
- United States
- Prior art keywords
- cooler
- tubes
- tube
- cooling
- built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
- F28F19/06—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
- F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
- F28D1/0325—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another
- F28D1/0333—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another the plates having integrated connecting members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/04—Fastening; Joining by brazing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a cooler for cooling electronic parts and can be preferably used, particularly, as a cooler for cooling electronic parts of a double-sided cooling type in an inverter for a hybrid electric vehicle. More particularly, the present invention relates to a cooler of a built-up type for cooling an electronic part from both sides thereof.
- Patent document 1 A semiconductor device of a double-sided cooling type is proposed in Patent document 1.
- the device described in Patent document 1 has a configuration in which tubes having a cooling water passage and semiconductor modules of a double-sided cooling type are piled alternately and a pressing force is applied in the direction of built-up of the tubes to hold the semiconductor modules between the tubes.
- Neighboring tubes are coupled to each other by bellows (coupling means) arranged between the neighboring tubes and by communication holes for making the cooling water passages and the insides of the bellows communicate with each other are formed in respective tubes.
- bellows coupling means
- neighboring tubes are coupled to each other by a bellows-shaped elastic cylinder sections and the elastic cylinder sections extend and contract in accordance with the interval between the tubes or the thicknesses of the semiconductor modules.
- a flange-shaped cylinder section with low rigidity is provided in the tube and the flange-shaped cylinder section is made to deform in accordance with the interval between the tubes or the thickness of the semiconductor modules.
- the tube is made thinner to have lower rigidity and the tube itself is made to deform in accordance with the interval between tubes or the thickness of the semiconductor module.
- a cooler of a built-up type 2009 in which a plurality of cooling tubes 2092 are arranged in layers so as to sandwich and hold an electronic part 2004 from both sides thereof and which cools the electronic part 2004 from both sides thereof, as shown in FIG. 39 (refer to Patent document 2).
- the cooler of a built-up type 2009 comprises a supply header 2094 for supplying a cooling medium to the cooling tubes 2092 and a discharge header 2095 for discharging the cooling medium from the cooling tubes 2092.
- a supply header 2094 for supplying a cooling medium to the cooling tubes 2092
- a discharge header 2095 for discharging the cooling medium from the cooling tubes 2092.
- One end of each of the plurality of the cooling tubes 2092 arranged in layers is connected to the supply header 2094 and the other end is connected to the discharge header 2095.
- the cooling tubes 2092 are connected to the supply header 2094 and the discharge header 2095, both being made of a member different from that of the cooling tubes 2092. Because of this, there is the possibility that the manufacture of the cooler of a built-up type 2009 requires a large number of parts and, therefore, the manufacturing cost thereof is high.
- the plurality of the cooling tubes 2092 are fixed to the supply header 2094 and the discharge header 2095 and, therefore, it is difficult to change the intervals between the plurality of the cooling tubes 2092. Because of this, it becomes difficult to insert the electronic part 2004 between the cooling tubes 2092 so as to bring the cooling pipes 2092 into close contact with both main surfaces of the electronic part 2004 without fail.
- a cooler of a built-up type 2090 which is configured in such a manner that a plurality of the cooling tubes 2092 are arranged so as to sandwich and hold an electronic part 2004 from both sides and, at the same time, a plurality of the cooling tubes 2092 are made to connect with each other via connecting pipe 2093 so that a cooling medium can flow to each cooling tube 2092, as shown in FIG. 40 (refer to Patent document 1).
- Patent document 1 Japanese Unexamined Patent Publication (Kokai) No.2002-26215
- Patent document 2 Japanese Unexamined Patent Publication (Kokai) No.2001-320005
- the first conventional device and the second conventional device require the elastic cylinder sections or the flange-shaped cylinder sections, the number of which corresponding to the number of piled layers of the tubes and, therefore, a problem arises in that the number of parts of a product is increased.
- the third conventional device As the tube is deformed in an arc shape, it is not possible for the tube to completely come into close contact with the surface of the semiconductor module and a problem arises in that the contact area between two decreases. Moreover, the third conventional device brings about a problem in that, when the tube deforms, stress tend to concentrate on the joined parts between the tubes and the header tanks.
- an object of the present invention is to provide a cooler capable of reducing the forming process cost and further, the manufacturing cost. Another object of the present invention is to make it possible to ensure a sufficient contact area between an electronic part and a tube without increasing the number of parts.
- a cooler comprises: a plurality of tubes ( 1 ) internally including a fluid passage ( 10 ) through which a cooling fluid flows and piled at predetermined intervals in a direction perpendicular to a direction (X) in which the cooling fluid flows through the fluid passage ( 10 ); and coupling means ( 2 ) arranged between the neighboring tubes ( 1 ) and for coupling the neighboring tubes ( 1 ); and in the tube ( 1 ), connection holes ( 11 ) are formed which make the fluid passage ( 10 ) and the inside of the coupling means ( 2 ) communicate with each other, electronic parts ( 6 ) are held between the neighboring tubes ( 1 ), each of the tubes ( 1 ) is formed by joining edge parts of plates ( 1 a, 1 b, 1 c ) formed into a predetermined shape by press molding, and fins ( 5 ) for accelerating heat exchange are arranged in each of the tube ( 1 ).
- the first aspect it is possible to dispense with the inner wall, which is required and therefore exists when the tube is manufactured by extrusion and, therefore, a process for removing the inner wall can also be dispensed with. Moreover, it becomes possible to seal the tube without the side cap present in the extruded tube. Still moreover, as the thickness of the plate can be reduced, a process for drilling the connection holes is made easier. Therefore, the forming process (fabrication) cost can be reduced.
- the manufacturing process is made easier and the manufacturing cost can be reduced.
- the fins when a semiconductor modules are sandwiched and pressed by plate springs, the fins can deform elastically or buckle without inflicting damage on the semiconductor modules (without destroying circuits, etc.).
- the thickness of the fin in this case was equal to or less than 0.4 mm.
- each of the fins ( 5 ) is joined to the tube ( 1 ) and the portions of the fin ( 5 ), which are joined to the tube ( 1 ), are arc-shaped.
- both the fact that the portions of the fin, which are joined to the tube, are arc-shaped and the fact that the tube and the fins can be made thin produce a synergic effect to make it easier for the tubes to deform when an electronic part is held between the tubes and, therefore, the contact surface between the tube and the electronic part is made easier to fit and the adhesiveness is improved. As a result, the contact thermal resistance can be reduced.
- the fins ( 5 ) when viewed in the direction (Y) of built-up of the tubes ( 1 ), the fins ( 5 ) are arranged at positions at which the fins ( 5 ) do not overlap the connection holes ( 11 ), and when viewed in a direction (Y) of built-up of the tubes ( 1 ), the electronic parts ( 6 ) are within the areas of installation of the fins ( 5 ).
- the pressure loss can be reduced compared to the case where the fins are present in the entire area in the tube because the fins do not occupy excess area.
- a plurality of the fins ( 5 ) are arranged in the single tube ( 1 ) and, at the same time, the fins ( 5 ) are arranged at intervals ( ⁇ ) along the direction (X) in which the cooling fluid flows through the fluid passage ( 10 ).
- the plurality of the fins are arranged in the single tube, it is possible to properly use fins of different heat exchange performance in accordance with, for example, the amount of heat produced by the electronic parts.
- the interval By providing the interval, the velocity boundary layer of the cooling fluid is cleared in the interval and the thermal boundary layer of the cooling fluid is also removed and, therefore, the ability to cool the electronic parts on the downstream side of the interval is improved. It is effective for the interval ( 6 ) to be equal to or greater than 1 mm, as shown in a sixth aspect of the present invention.
- connection holes ( 11 ) As shown in a seventh aspect of the present invention, it is possible to reduce the fabrication cost by forming the connection holes ( 11 ) by press molding.
- the tubes ( 1 ) may be formed by joining the two plates ( 1 a, 1 b ). Moreover, as shown in a ninth aspect of the present invention, the tubes ( 1 ) may be formed by bending and joining the single plate ( 1 c ).
- the coupling means ( 2 ) are bellows. According to the tenth aspect, it is possible to change the dimension between neighboring tubes in accordance with the thickness of an electronic part by extending and contracting the bellows.
- the fins ( 5 ) are corrugated fins that divide the fluid passage ( 10 ) into two or more fine flow passages and the height (hf) of the fins ( 5 ) is greater than the width (wf) of the fine flow passage of the fin ( 5 ) at the central position of the fine flow passage in a direction of height of the tube.
- the heat transfer area of the fin is increased and the cooling performance of the cooler is improved. It is preferable that the width (wf) of the fin flow passage be equal to 1 . 2 mm or less as in a twelfth aspect of the present invention or that the height (hf) of the fin ( 5 ) be 1 to 10 mm as in a thirteenth aspect of the present invention.
- the thickness (tf) of the fins ( 5 ) is less that the thickness (tp) of the plates ( 1 a, 1 b, 1 c ).
- the fourteenth aspect when pressure is applied to an electronic part in order to bring the electronic part into closer contact with the plate surfaces (the tube surfaces), as the fins deform more readily than the plates do, it is made easier for the electronic part and the plate surfaces to come into closer contact and, therefore, the contact thermal resistance is reduced and the cooling efficiency is improved.
- the thickness (tf) of the fins ( 5 ) be 0.03 to 1.0 mm as in a fifteenth aspect of the present invention or that the thickness (tp) of the plates ( 1 a, 1 b, 1 c ) be 0.1 to 5.0 mm as in a sixteenth aspect of the present invention.
- the tube ( 1 ) is formed by brazing the plates ( 1 a, 1 b, 1 c ) and the plates are made of a bare material.
- the plates are made of a bare material, it is unlikely that the plate surface (the tube surface) becomes rough due to brazing. Therefore, the contact thermal resistance between the electronic part and the plates is reduced and the cooling efficiency is improved.
- the tube ( 1 ) is formed by brazing the plates ( 1 a, 1 b, 1 c ), the plates ( 1 a, 1 b, 1 c ) are made of a brazing sheet having a core material and a sacrifice anode material, and the tube ( 1 ) has the core material at the outside thereof.
- the tube can be prevented from being pitted by making the sacrifice anode material first corrode before the core material to prevent the corrosion of the core material of the plate. Moreover, as the core material is located at the outside of the tube, it is unlikely that the plate surface (the tube surface) becomes rough due to brazing and, therefore, the contact thermal resistance between the electronic part and the plates is reduced and the cooling efficiency is improved.
- the tube ( 1 ) is formed by brazing the plates ( 1 a, 1 b, 1 c ), the plates ( 1 a, 1 b, 1 c ) are made of a brazing sheet having a core material and a brazing material, and the tube ( 1 ) has the core material at the outside thereof.
- the time (man-hour) for an assembling process including steps, such as a step of attaching a paste brazing material, can be reduced.
- the core material is located at the outside of the tube, it is unlikely that the plate surface (the tube surface) becomes rough due to the brazing and, therefore, the contact thermal resistance between the electronic part and the plates is reduced and the cooling efficiency is improved.
- the tube ( 1 ) is formed by brazing the plate ( 1 a, 1 b, 1 c ), the plates ( 1 a, 1 b, 1 c ) are made of a brazing sheet having a sacrifice anode material arranged between a core material and a brazing material, and the tube ( 1 ) has the core material at the outside thereof.
- the time (man-hour) for an assembling process including steps, such as a step of attaching a paste brazing material, can be reduced.
- the tube can be prevented from being pitted by making the sacrifice anode material first corrode with priority over the core material to prevent the corrosion of the core material of the plate.
- the tube has the core material located at the outside thereof, it is unlikely that the plate surface (the tube surface) becomes rough due to the brazing and, therefore, the contact thermal resistance between the electronic part and the plates is reduced and the cooling efficiency is improved.
- the material of the fins ( 5 ) is potentially baser than that of the plates ( 1 a, 1 b, 1 c ). According to the twenty-first aspect, as the fin is made to corrode before the plates, the tube can be prevented from being pitted.
- the flat tube deforms readily in the direction of built-up of the tubes at the narrow parts in accordance with the interval between the flat tubes and the thickness of the electronic part.
- the part of the flat tube between the narrow parts does not deform in an arc-shape and, therefore, it is possible for the flat tube and the electronic part to come into close contact with each other at the entire opposing surfaces of both and a sufficient contact area between the electronic part and the tube can be ensured.
- the brazing material gathers at the narrow parts and, therefore, the brazing material can be prevented from flowing up to the position of contact between the flat tube and the electronic part.
- the narrow parts ( 501 b ) are located at portions at which the electronic parts ( 507 ) are not held in the flat tube ( 501 ).
- a reinforcement plate ( 509 ) having greater rigidity in the direction of built-up of the tubes (Y) than the flat tube ( 501 ) is provided at one end in the direction of built-up (Y) of the tubes.
- the cooler itself to support the pressing force in the direction of built-up of the tubes. Moreover, as the strength of the cooler can be increased, it is possible to prevent the cooler itself from deforming when the cooler is transported in a state in which an electronic parts are not held in the cooler yet.
- a plurality of rows of electronic parts ( 507 ) are arranged when viewed in the direction of built-up of the tubes (Y) and a pressing force is applied to each row independently of each other.
- the twenty-fifth aspect as a pressing force is applied to each row independently of each other, even if neighboring electronic parts vary in thickness, the variation can be absorbed and the contact thermal resistance can be reduced.
- the narrow parts ( 501 b ) extend in a direction perpendicular to the direction of built-up (Y) of the tubes and, at the same time, extending in the direction perpendicular to the direction of flow of the cooling fluid (X) in the fluid passage ( 501 a ).
- the fins ( 2 ) for accelerating heat exchange are arranged at positions in the flat tube ( 1 ), where the narrow parts ( 501 b ) are not formed.
- the narrow parts can be used for determining the positions of the fins.
- the present invention relates to a cooler of a built-up type for cooling electronic parts from both sides thereof
- the cooler of a built-up type comprises: a plurality of flat cooling tubes, each having a refrigerant flow passage through which a cooling medium flows and arranged in layers so as to sandwich and hold the electronic parts at both sides thereof; a supply header section for supplying the cooling medium to the refrigerant flow passage; and a discharge header section for discharging the cooling medium from each of the refrigerant flow passages; wherein each of the cooling tubes is provided with protruding pipe parts opening and protruding toward the direction of built-up of the cooling tubes and neighboring cooling tubes make the refrigerant flow passages thereof communicate with each other by inserting the protruding pipe parts into each other and, at the same time, joining the sidewalls of the protruding pipe parts to each other, and thus forming the supply header section and the discharge header section (the twenty eighth aspect of the present invention).
- the refrigerant flow passages in neighboring cooling tubes are made to connect with each other. Due to this, it is not necessary, in particular, to connect the plurality of cooling tubes via members separately provided and, therefore, the number of parts can be reduced and the manufacture thereof is made easier.
- the protruding pipe parts in neighboring cooling tubes are connected by joining the sidewalls of the protruding pipe parts to each other. Therefore, it is possible for the supply header section and the discharge header section to ensure a diameter of a flow passage substantially equal to the inner diameter of the protruding pipe part. Due to this, the flow resistance of the supply header section and the discharge header section can be reduced and the pressure loss can also be reduced. Therefore, it is possible to distribute the cooling medium evenly to each of the plurality of the cooling tubes and, as a result, the electronic parts can be cooled evenly.
- the electronic part may be, for example, a semiconductor module that incorporates semiconductor elements, such as an IGBT, and diodes.
- the semiconductor module can be used in an inverter for a vehicle, a motor drive inverter for industrial equipment, an air-conditioner inverter for air-conditioning buildings, etc.
- a power transistor In addition to the semiconductor module described above, a power transistor, a power FET, an IGBT, etc., can be used as the electronic parts.
- cooling medium for example, water mixed with an ethylene glycol base antifreeze liquid, a natural refrigerant such as water and ammonia, a fluorocarbon base refrigerant such as fluorinate, a chlorofluorocarbon base refrigerant such as HCFC123 and HFC134a, an alcohol-based refrigerant such as methanol and alcohol, and a ketone-based refrigerant such as acetone may be used.
- a natural refrigerant such as water and ammonia
- a fluorocarbon base refrigerant such as fluorinate
- a chlorofluorocarbon base refrigerant such as HCFC123 and HFC134a
- an alcohol-based refrigerant such as methanol and alcohol
- ketone-based refrigerant such as acetone
- diaphragm parts that deform in the direction of built-up are formed around the protruding pipe parts of the cooling tube (a twenty-ninth aspect of the present invention).
- the electronic parts When arranging electronic parts in the cooler of a built-up type described above, it is possible to sandwich and hold the electronic parts between the cooling tubes by, for example, deforming the diaphragm parts toward the inside of the cooling tube. Moreover, the electronic parts may be sandwiched and held between the cooling tubes by temporarily deforming the diaphragm part toward the outside of the cooling tube to widen the interval between the neighboring cooling tubes and narrowing the interval between the cooling tubes after inserting the electronic part therebetween.
- the diaphragm part be formed around one of a pair of the protruding pipes arranged in opposition to each other of the cooling tube and be not formed around the other protruding pipe part (a thirtieth aspect of the present invention).
- both the diaphragm parts may vary in the amount of deformation from each other. Then, in this case, if an attempt is made to adjust the amount of deformation of each diaphragm part, it becomes necessary to accurately control various conditions, such as the throttle (area-reducing) rate of the cooling tube during press molding and the plate thickness thereof.
- the diaphragm part by providing the diaphragm part to only one of the protruding pipe parts, it becomes easy to perform specific deformation of the diaphragm parts when the electronic parts are sandwiched and held by the cooling tubes substantially in accordance with the design It is preferable that the diaphragm part be formed around the protruding pipe part formed on the downstream side of the supply header section, which is one of the pair of the protruding pipe parts of the cooling tube (a thirty-first aspect of the present invention).
- a throttle (area-reduced) part for narrowing the width of the refrigerant flow passage be provided at the inlet part of the refrigerant flow passage in the cooling tube (a thirty-second aspect of the present invention).
- the cooling tube has a pair of outer shell plates, an intermediate plate arranged between a pair of the outer shell plates, and a corrugated inner fins arranged between the intermediate plate and the outer shell plates (a thirty-third aspect of the present invention).
- the outer shell plates are made of a brazing sheet having a core material and a brazing metal arranged on an inner surface of the core material
- the intermediate plate and the inner fins are made of a metal plate including a metal baser than the core material of the outer shell plates, and a pair of the outer shell plates are joined to each other at the inner surfaces thereof at the ends (a thirty-fourth aspect of the present invention).
- the brazing material is arranged on the joined surface between a pair of the outer shell plates and, therefore, it is possible to easily join a pair of the outer shell plates by brazing and to easily manufacture the cooling tube.
- a metal baser than the core material means a metal, the corrosion potential of which is lower than that of the metal used as the core material.
- a metal material, which is aluminum added with zinc (Zn) can be used as a metal plate used for the intermediate plate and the inner fin.
- the outer shell plates are made of a brazing sheet having a core material, a sacrifice anode material arranged on the inner surface of the core material, and the brazing material arranged on the inner surface of the sacrifice anode material. (a thirty-fifth aspect of the present invention).
- a meta material which is aluminum added with zinc (Zn) can be used as the sacrifice anode material.
- the outer shell plates are made of a brazing sheet having a core material and a sacrifice anode material arranged on the inner surface of the core material
- the intermediate plate is made of a brazing sheet having core material and brazing materials arranged on both surfaces of the core material
- the inner fins are made of a metal plate including a metal baser than the core material of the outer shell plate
- a pair of the outer shell plates are formed by joining the inner surface at ends thereof to both surfaces at the ends of the intermediate plate (a thirty-sixth aspect of the present invention).
- a pair of the outer shell plates are joined to the end parts of both surfaces of the intermediate plate, both surfaces of which are provided with the brazing material. Therefore, it is possible to easily join a pair of the outer shell plates to the intermediate plate by brazing and, therefore, to easily manufacture the cooling tube.
- a first cooling tube which has been arranged at one end in the direction of built-up of a plurality of the cooling tubes, has a refrigerant introduction inlet for introducing the cooling medium to the supply header section and a refrigerant discharge outlet for discharging the cooling medium from the discharge header section and, at the same time, the refrigerant introduction inlet and the refrigerant discharge outlet have a protruding opening part protruding toward the outside of the first cooling tube, and a refrigerant introduction pipe and a refrigerant discharge pipe are inserted into the protruding opening parts at the refrigerant introduction inlet and the refrigerant discharge outlet, respectively (a thirty-seventh aspect of the present invention).
- the first cooling tube also to ensure the sectional area of the flow passage similar to that of other cooling tubes and it becomes possible to evenly cool the electronic parts.
- the above-mentioned protruding opening part can be formed by means of, for example, burring process by erecting the protruding opening part on the main surface of the cooling tube substantially vertically.
- the protruding opening part can be made to protrude, for example, 2 mm.
- FIG. 1 is a front view of a cooler according to a first embodiment of the present invention.
- FIG. 2 is a sectional view of an important part, along the I-I line in FIG. 1 .
- FIG. 3A is a front view of a tube alone in FIG. 1 .
- FIG. 3B is a plan view of the tube in FIG. 3A .
- FIG. 4 is an enlarged view of an important part of an inner fin in FIG. 2 .
- FIG. 5 is a diagram showing a relationship between the fin flow passage width wf and the tube surface temperature Tw.
- FIG. 6 is a diagram showing a relationship between the fin height hf and the tube surface temperature Tw.
- FIG. 7 is a diagram showing a relationship between the fin plate thickness tf and the tube surface temperature Tw.
- FIG. 8 a diagram showing a relationship between the plate thickness tp of plates 1 a and 1 b and the tube surface temperature Tw.
- FIG. 9A is a front view of a cooler according to a second embodiment of the present invention.
- FIG. 9B is a plan view of the cooler in FIG. 9A .
- FIG. 10 is a sectional view of a tube alone in a cooler according to a third embodiment of the present invention.
- FIG. 11A is a sectional view of a tube 1 in a free state in a cooler according to a fourth embodiment of the present invention.
- FIG. 11B is a sectional view of a fin 5 in a state of being buckled.
- FIG. 12A is a sectional view of a tube alone in a cooler according to a fifth embodiment.
- FIG. 12B is an enlarged sectional view of part B in FIG. 12A .
- FIG. 13A is a sectional view of a tube alone in a cooler according to a sixth embodiment of the present invention.
- FIG. 13B is an enlarged sectional view of part C in FIG. 13A .
- FIG. 14A is a sectional view of a tube alone in a cooler according to a seventh embodiment of the present invention.
- FIG. 14B is an enlarged sectional view of part D in FIG. 14A .
- FIG. 15A is a sectional view of a tube alone in a cooler according to an eighth embodiment of the present invention.
- FIG. 15B is an enlarged sectional view of part E in FIG. 15A .
- FIG. 16 is a front view of the cooler according to the first embodiment of the present invention.
- FIG. 17 is a plan view of the cooler in FIG. 16 .
- FIG. 18 is a sectional view along the II-II line in FIG. 16 .
- FIG. 19 is a sectional view of a tube along the III-III line in FIG. 17 .
- FIG. 20 is an enlarged view of part C in FIG. 16 .
- FIG. 21 is a front view of the cooler according to the second embodiment of the present invention.
- FIG. 22 is a plan view of a cooler of a built-up type in an eleventh embodiment.
- FIG. 23 is a sectional view in the vicinity of a supply header section of the cooler of a built-up type in the eleventh embodiment.
- FIG. 24 is a sectional view in the vicinity of the supply header section in the eleventh embodiment before a diaphragm part is deformed.
- FIG. 25 is a sectional perspective view of a cooling tube in the eleventh embodiment.
- FIG. 26 is a sectional view of a connection part of a refrigerant introduction pipe (or a refrigerant discharge pipe) and a refrigerant introduction inlet (or a refrigerant discharge outlet) in the eleventh embodiment.
- FIG. 27 is a sectional view in the vicinity of a supply header section of a cooler of a built-up type in a twelfth embodiment.
- FIG. 28 is a sectional view in-the vicinity of the supply header section in the twelfth embodiment when the radius of curvature at the rise part of a protruding pipe part is increased.
- FIG. 29 is a sectional view in the vicinity of the supply header section in the twelfth embodiment when the rise part of the protruding pipe part is reinforced with a fillet made of a brazing material.
- FIG. 30 is a sectional view in the vicinity of a supply header section of a cooler of a built-up type in a comparative example.
- FIG. 31 is a sectional view in the vicinity of a supply header section of a cooler of a built-up type in a thirteenth embodiment.
- FIG. 32 is a sectional view of a cooling tube, which is perpendicular to a refrigerant flow passage in a fourteenth embodiment.
- FIG. 33 is a sectional view of a supply header section (a discharge header section) in the fourteenth embodiment.
- FIG. 34 is a sectional view of a cooling tube, which is perpendicular to a refrigerant flow passage in a fifteenth embodiment.
- FIG. 35 is a sectional view of a supply header section (or a discharge header section) in the fifteenth embodiment.
- FIG. 36 is a sectional view of a cooling tube, which is perpendicular to a refrigerant flow passage in a sixteenth embodiment.
- FIG. 37 is a sectional view of a supply header section (or a discharge header section) in the sixteenth embodiment.
- FIG. 38 is a perspective view of a tube alone in a conventional cooler.
- FIG. 39 is a plan view of a cooler of a built-up type in a conventional example.
- FIG. 40 is a sectional view of a cooler of a built-up type in another conventional example.
- FIG. 1 is a front view of the cooler according to the first embodiment
- FIG. 2 is a sectional view of an important part along the I-I line in FIG. 1
- FIG. 3A is a front view of a tube alone in FIG. 1
- FIG. 3B is a plan view of the tube in FIG. 3A
- FIG. 4 is an enlarged view of an important part of a fin in FIG. 2 .
- the cooler of the present invention can be used to cool a semiconductor module of a double-sided cooling type in an inverter for a hybrid electric vehicle.
- the cooler comprises: a plurality of tubes 1 in which a fluid passage 10 is formed internally through which a cooling fluid flows and piled at predetermined intervals in the direction Y (hereinafter, referred to as the direction of built-up Y) perpendicular to the direction X (hereinafter, referred to as the direction of flow X) of flow of the cooling fluid in the fluid passage 10 ; bellows 2 arranged between neighboring tubes 1 and coupling the neighboring tubes 1 ; an inlet pipe 3 joined by brazing to the tube 1 located at the end in the direction of built-up Y and into which the cooling fluid flows; an outlet pipe 4 joined by brazing to the tube 1 located at the end in the direction of built-up Y and from which the cooling fluid flows out; and fins 5 arranged within the fluid passage 10 and accelerating heat exchange.
- the bellows 2 correspond to coupling means of the present invention.
- the cooling fluid water mixed with an ethylene glycol base antifreeze liquid is used in the present embodiment.
- the tube 1 comprises two plates 1 a and 1 b, which are made by forming a thin plate made of aluminum into a predetermined shape by press molding, and is formed by joining by brazing the edges of the two plates 1 a and 1 b in a state in which the fin 5 , which is made by forming a thin plate made of aluminum into a corrugated plate by press molding, is sandwiched between the two plates 1 a and lb.
- the plates 1 a and 1 b and the fin 5 use a brazing sheet material with a sacrifice anode material attached to the inside thereof, in order to prevent pitting corrosion.
- the joined part is brazed using a paste brazing material, etc.
- the fin uses a brazing sheet material, both surfaces of which are clad with a brazing material.
- connection holes 11 which allow the fluid passage 10 and the inside of the bellows 2 to connect with each other, are formed at both ends in the direction of the cooling fluid flow within the fluid passage 10 and, at the same time, at the end faces in the direction of built-up Y.
- the connection holes 11 are formed by press molding before joining by brazing.
- the bellows 2 is a bellows-shaped pipe and can extend and contract readily in the direction of built-up Y.
- the bellows 2 is made of aluminum and is joined by brazing to the tubes 1 so as to surround each of the connection holes 11 of the tube 1 adjacent thereto.
- the inlet pipe 3 and the outlet pipe 4 are made of aluminum, and inserted into the connection holes 11 of the tube 1 located at the end in the direction of built-up Y and are joined by brazing to the tube 1 .
- the inlet pipe 3 and outlet pipe 4 are connected to a pump (not shown) for circulating the cooling fluid and a heat exchanger (not shown) for cooling the cooling fluid.
- the fin 5 is partly joined by brazing to the tube 1 and the portions of the fin 5 , which are joined to the tube 1 , are formed into an arc shape.
- the fins 5 are arranged in areas so that the fins 5 do not overlap the connection holes 11 when viewed in the direction of built-up Y.
- the fin 5 divides the fluid passage 10 within the tube 1 into a plurality of fine (small) flow passages.
- a semiconductor module of a double-sided cooling type 6 which is a heat producing body, incorporates an IGBT element and a diode, corresponding to an electronic part according to the present invention.
- the semiconductor module 6 is arranged between neighboring tubes 1 and the tubes 1 and the semiconductor module 6 come into contact with each other directly, or via an insulating material (a ceramic plate, in most cases) or a thermally conductive grease.
- the semiconductor module 6 is held between the tubes 1 by sandwiching and pressing the piled tubes 1 from both ends in the direction of built-up Y using plate springs, not shown.
- the cooling fluid that has flowed in from the inlet pipe 3 flows into one end of the fluid passage 10 of each of the tubes 1 through the bellows 2 , flows through the fluid passage 10 along the direction of flow X, and reaches the outlet pipe 4 through the bellows 2 from the other end of the fluid passage 10 . Then, heat exchange is effected between the cooling fluid flowing through the fluid passage 10 and the semiconductor module 6 and, thus, the semiconductor module 6 is cooled.
- the specifications of the plates 1 a and 1 b and the fin 5 are designed and optimized so that a temperature Tw (hereinafter, referred to as a tube surface temperature) at the portion of the tube 1 , with which the semiconductor module 6 comes into contact, falls below a predetermined temperature (110° C., in the present embodiment).
- Tw a temperature at the portion of the tube 1 , with which the semiconductor module 6 comes into contact
- the fin flow passage width wf is a dimension in the direction perpendicular to both the direction of flow X and the direction of built-up Y, at a central position in the direction of fin height in the fine flow passage.
- the design conditions are as follows: the temperature of the cooling fluid that flows into the cooler is 65° C.; the heating value of the semiconductor module 6 is 400 W/unit; and the flow rate of the cooling fluid in the single tube 1 is a constant value of 1 L/min.
- the relationship between a plate width wp and a width we of the semiconductor module 6 is determined so that wp>we holds.
- the plate width wp is a dimension in the direction perpendicular to both the direction of flow X and the direction of built-up Y in a flat surface of the tube 1 in opposition to the semiconductor module 6 .
- the width we of the semiconductor module 6 is a dimension thereof in the direction perpendicular to both the direction of flow X and the direction of built-up Y.
- FIG. 5 shows the tube surface temperature Tw when the fin flow passage width wf is varied.
- the fin height hf is set to 4.0 mm
- the fin plate thickness tf is set to 0.2 mm
- the plate thickness tp is set to 0.4 mm.
- the fin flow passage width wf it is found possible to reduce the tube surface temperature Tw to 110° C. or lower by setting the fin flow passage width wf to 1.2 mm or less. It is preferable that the fin flow passage width wf be about 0.9 mm if clogging with foreign matter and the cooling performance are taken into account.
- FIG. 6 shows the tube surface temperature Tw when the fin height hf is varied.
- the fin flow passage width wf is set to 0.9 mm
- the fin plate thickness is set to 0.2 mm
- the plate thickness tp is set to 0.4 mm.
- the tube surface temperature Tw to 110° C. or lower by setting the fin height hf to 1 mm to 10 mm. It is preferable that the fin height hf be about 4 mm if the dimension of the cooler in the direction of built-up Y and cooling performance are taken into account.
- FIG. 7 shows the tube surface temperature Tw when the fin plate thickness tf is varied.
- the fin flow passage width wf is set to 0.9 mm
- the fin height hf is set to 4.0 mm
- the plate thickness tp is set to 0.4 mm.
- the tube surface temperature Tw to 110° C. or lower by setting the fin plate thickness tf to 1 mm or less. It is most preferable that the fin plate thickness tf be 0.2 mm from the standpoint of cooling performance. Currently, the limit of the plate thickness is about 0.03 mm.
- FIG. 8 shows the tube surface temperature Tw when the plate thickness tp is varied.
- the fin flow passage width wf is set to 0.9 mm
- the fin height hf is set to 4.0 mm
- the fin plate thickness tf is set to 0.2 mm.
- the tube surface temperature Tw to 110° C. or lower by setting the plate thickness tp to 5 mm or less. It is preferable that the plate thickness tp be 0.1 mm or greater from the standpoint of moldability in the press working and that the plate thickness tp be about 0.4 mm if the ease of fitting between the semiconductor module 6 and the surfaces of the plates 1 a and 1 b (the tube surface) and moldability are taken into account.
- the tube 1 is formed by joining the edges of the two plates 1 a and 1 b formed by press molding, the inner wall of the coupling part that exists when the tube is manufactured by extrusion can be removed and it is no longer necessary to remove the inner wall by machining. Moreover, as the plate thickness of the plates 1 a and 1 b can be reduced, drilling the connection holes 11 is made easy. Therefore, the fabrication cost can be reduced.
- the fin 5 as well as the tube 1 , can also be formed by press molding, the manufacturing process is simplified and the manufacturing cost can be reduced.
- both the fact that the portion of the fin 5 , which is joined to the tube 1 , is arc-shaped and the fact that the tube 1 and the fin 5 can be made thin produce a synergic effect to make it easier for the tube 1 to deform when the semiconductor module 6 is held between the tubes 1 and, therefore, the opposing contact surfaces of the tube 1 and the semiconductor module 6 are made easier to fit with each other and the adhesiveness thereof is improved. As a result, the contact thermal resistance thereof can be reduced.
- the sectional area of the flow passage of the fluid passage 10 can be increased accordingly.
- the flow resistance thereof can be reduced and the power of the pump required to circulate the cooling fluid can also be reduced.
- the fins 5 are arranged in areas in which the fins 5 do not overlap the connection holes 11 when viewed in the direction of built-up Y of the tubes 1 , the fins 5 do not occupy any excess area and, therefore, the pressure loss can be reduced accordingly compared to the case where the fin 5 occupies the entire area within the tube 1 .
- the bellows 2 can extend and contract readily in the direction of built-up Y, it is possible to easily vary the distance between neighboring tubes 1 in accordance with the thickness of the semiconductor module 6 when sandwiching and pressing the laminated (piled) tubes 1 in the direction of built-up Y using the plate springs.
- the heat transfer area of the fin 5 increases and the cooling performance improves.
- the fin plate thickness tf is set to less than the plate thickness tp
- the semiconductor module 6 is made to come into closer contact with the surfaces of the plates 1 a and 1 b (the surfaces of the tube 1 ) by applying pressure to the semiconductor module 6
- the surfaces of the semiconductor module 6 and the plates la and 1 b become easier to fit with each other because the fin 5 is easier to deform compared to the plates 1 a and 1 b, and, therefore, the contact thermal resistance therebetween is reduced and the cooling efficiency is improved.
- FIG. 9A is a front view of the cooler according to the second embodiment and FIG. 9B is a plan view of the cooler in FIG. 9A .
- the same numerals or letters are assigned to the parts the same as or similar to those in the first embodiment and no explanation thereof will be given here.
- the broken line denotes the position at which the fin 5 is arranged and the alternate long and short dash line denotes the position at which the semiconductor module 6 is arranged.
- the two fins 5 are arranged in the single tube 1 and the two fins 5 are arranged apart from each other at an interval 6 , along the direction of flow X of the cooling fluid within the fluid passage 10 .
- the semiconductor module 6 is arranged within the area in which the fin 5 is arranged when viewed in the direction of built-up Y of the tubes 1 .
- the two fins 5 are arranged in the single tube 1 , it is possible to properly use the two fins 5 having different heat exchange performance according to the heating value, etc. of the semiconductor module.
- the cooling fluid receives the heat generated by the semiconductor module 6 on the upstream side and rises in temperature
- the semiconductor module 6 on the downstream side relatively rises in temperature accordingly, but it is possible to improve the cooling performance of the semiconductor module 6 on the downstream side by changing the type of the fin 5 on the downstream side to a type having higher performance (for example, an offset fin).
- the cooling performance can be improved by arranging the fin 5 having higher performance on the upstream side.
- the velocity boundary layer of the cooling fluid is cleared in the interval and the thermal boundary layer of the cooling fluid is also removed and, therefore, the ability to cool the semiconductor module 6 on the downstream side of the interval 6 is improved. It is effective for the interval 8 to be equal to or greater than 1 mm.
- FIG. 10 is a sectional view of a tube in the cooler according to the third embodiment.
- the configuration of the tube 1 differs from that in the first embodiment but the other parts are the same as those in the first embodiment.
- the tube 1 in the present embodiment is formed by bending a plate 1 c, which is a thin plate formed into a predetermined shape by press molding, and joining by brazing the edges of the plate 1 c in a state in which the fin 5 is sandwiched between the bent plate 1 c.
- the plate 1 c uses a brazing sheet material having a sacrifice anode material attached to the inside thereof in order to prevent the pitting corrosion and a brazing material attached to the outside thereof in order to effectively perform the joining, respectively.
- the fin use a brazing sheet having both surfaces clad with a brazing material.
- FIG. 11A is a sectional view of the tube 1 in the cooler according to the fourth embodiment in a free state
- FIG. 11B is a sectional view in a state in which the fin 5 is deformed by buckling force.
- the configuration of the fin 5 differs from that in the first embodiment and other parts are the same as those in the first embodiment.
- the arc-shaped fin 5 the portion of which to be joined to the tube 1 has been formed into an arc shape, is used, but in the present embodiment, a rectangular fin 5 , the portion of which to be joined to the tube 1 has been formed into a flat shape as shown in FIG. 11A , is used.
- FIG. 12A is a sectional view of a tube alone in the cooler according to the fifth embodiment and FIG. 12B is an enlarged sectional view of part B in FIG. 12A .
- the configurations of the tube 1 and the fin 5 differ from those in the first embodiment and the other parts are the same as those in the first embodiment.
- the plates 1 a and 1 b in the present embodiment are each made of a bare material made of aluminum, and the fin 5 is made of a brazing sheet, which comprises an aluminum core material 50 and brazing materials 51 coated on the both sides thereof. Zinc (Zn) is added to the core material 50 .
- the plates 1 a and 1 b and the fin 5 are joined by the brazing materials 51 of the fin and the two plates 1 a and 1 b are joined by a paste brazing material, a pre-placed brazing material, or the like.
- the melting point of the brazing materials 51 is lower than the melting point of the core material 50 of the fin 5 and the melting point of the plates 1 a and 1 b.
- the plates 1 a and 1 b are each made of a bare material, it is unlikely that the surfaces of the plate 1 a and 1 b (the surface of the tube 1 ) become rough due to brazing and, therefore, the contact thermal resistance between the semiconductor module 6 and the plates 1 a and 1 b is reduced and the cooling efficiency is improved.
- the fin 5 As zinc (Zn) is added to the core material 50 of the fin 5 , the fin 5 becomes potentially baser than the plates 1 a and 1 b. Therefore, the fin 5 corrodes before the plates 1 a and 1 b and it is possible to prevent the tube 1 from being pitted.
- FIG. 13A is a sectional view of a tube alone in the cooler according to the sixth embodiment and FIG. 13B is an enlarged sectional view of part C in FIG. 13A .
- the configurations of the tube 1 and the fin 5 differ from those in the first embodiment and the other parts are the same as those in the first embodiment.
- the plates 1 a and 1 b in the present embodiment are each made of a brazing sheet, which is an aluminum core material 100 one side of which is coated with a sacrifice anode material 101 , and both plates are joined so that the core material 100 is located on the outside and the sacrifice anode material 101 is located on the inside.
- the sacrifice anode material 101 is potentially (electrically) baser than the core material 100 .
- the fin 5 is identical to the fin 5 in the fifth embodiment.
- the sacrifice anode material 101 corrodes before the core material 100 in the plates 1 a and 1 b and, therefore, the core material 100 of the plates 1 a and 1 b can be prevented from corroding and the tube 1 can be prevented from being pitted.
- the fin 5 becomes potentially baser than the plates la and 1 b. Therefore, the fin 5 corrodes before the plates 1 a and 1 b and it is possible to prevent the tube 1 from being pitted.
- FIG. 14A is a sectional view of a tube in the cooler according to the seventh embodiment and FIG. 14B is an enlarged sectional view of part D in FIG. 14A .
- the configurations of the tube 1 and the fin 5 differ from those in the first embodiment and the other parts are the same as those in the first embodiment.
- the plates 1 a and 1 b in the present embodiment are each made of a brazing sheet, which is the aluminum core material 100 one side of which has been coated with a brazing material 102 , and both plates are joined so that the core material 100 is located on the outside and the brazing material 102 is located on the inside.
- the fin 5 is identical to the fin 5 in the fifth embodiment.
- the time (man-hour) of assembling processes such as a process in which a paste brazing material is attached can be reduced.
- the fin 5 As Zn has been added to the core material 50 of the fin 5 , the fin 5 becomes potentially baser than the plates 1 a and 1 b. Therefore, the fin 5 corrodes before the plates 1 a and 1 b and it is possible to prevent the tube 1 from being pitted.
- FIG. 15A is a sectional view of a tube in the cooler according to the eighth embodiment and FIG. 15B is an enlarged sectional view of part E in FIG. 15A .
- the configurations of the tube 1 and the fin 5 differ from those in the first embodiment but the other parts are the same as those in the first embodiment.
- the plates 1 a and 1 b in the present embodiment are each made of a brazing sheet, in which the sacrifice anode material 101 is arranged between the aluminum core material 100 and the brazing material 102 , and both plates are joined so that the core material 100 is located on the outside and the brazing material 102 is located on the inside.
- the fin 5 is identical to the fin 5 in the fifth embodiment.
- the time (man-hour) of assembling processes such as a process in which a-paste brazing material is attached, can be reduced.
- the sacrifice anode material 101 corrodes before the core material 100 in the plates 1 a and 1 b and, therefore, the core material 100 of the plates 1 a and 1 b can be prevented from corroding and it is possible to prevent the tube 1 from being pitted.
- the fin 5 As Zn has been added to the core material 50 of the fin 5 , the fin 5 becomes potentially baser than the plates 1 a and 1 b. Therefore, the fin 5 corrodes before the plates 1 a and 1 b and it is possible to prevent the tube 1 from being pitted.
- FIG. 16 is a front view of the cooler according to the ninth embodiment
- FIG. 17 is a top plan view of the cooler in FIG. 16
- FIG. 18 is a sectional view along the II-II line in FIG. 16
- FIG. 19 is a sectional view of a tube along the III-III line in FIG. 17
- FIG. 20 is an enlarged view of part C in FIG. 16 .
- the cooler comprises a plurality of flat tubes 501 having, internally, a fluid passage 501 a through which a cooling fluid flows.
- the plurality of flat tubes 501 are arranged in layers at predetermined intervals in the direction Y (hereinafter, referred to as the direction of built-up Y) perpendicular to the direction X in which the cooling fluid flows within the fluid passage 501 a (referred to as the direction of flow X).
- the direction of built-up Y perpendicular to the direction X in which the cooling fluid flows within the fluid passage 501 a
- water mixed with an ethylene glycol base antifreeze liquid is used as the cooling fluid.
- the flat tube- 501 comprises two plates, which are an aluminum thin plate formed into a predetermined shape by press molding.
- the flat tube 501 is formed by joining by brazing the edges of the two plates in a state in which a fin 502 , which is an aluminum thin plate formed into a corrugated shape by press molding, is sandwiched between the two plates.
- the flat tube 501 in total, three narrow parts 501 b, which become narrow in the direction of built-up Y, are formed in the vicinity of both ends in the direction of flow X and at the central part, respectively.
- the narrow parts 501 b extend in the direction perpendicular to the direction of built-up Y and the direction of flow X.
- the narrow parts 501 b are located at portions of the flat tube 501 at which are semiconductor modules (to be described in detail later) are not held.
- the fins 502 accelerate heat exchange between the cooling fluid and the flat tube 501 and are arranged at positions at which the narrow parts 501 b are not formed.
- an inlet header tank 503 made of aluminum for distributing the cooling fluid to the flat tubes 501 is joined by brazing, and to one end of the inlet header tank 503 , an inlet pipe 504 made of aluminum, through which the cooling fluid flows in, is joined by brazing.
- an outlet header tank 505 made of aluminum for gathering the cooling fluid from the flat tubes 501 is joined by brazing, and to one end of the outlet header tank 505 , an outlet pipe 506 made of aluminum, through which the cooling fluid flows out, is joined by brazing.
- the inlet pipe 504 and the outlet pipe 506 are connected to a pump (not shown) for circulating the cooling fluid and to a heat exchanger (not shown) for cooling the cooling fluid.
- Two semiconductor modules, of a double-sided cooling type 507 which are heat producing bodies, are arranged between neighboring flat tubes 501 .
- the semiconductor modules 507 are arranged in two or more rows (two rows in the present embodiment) when viewed in the direction of built-up Y.
- the flat tube 501 and the semiconductor module 507 come into contact with each other directly or via an insulating material (a ceramic plate, in most cases) or thermally conductive grease.
- the semiconductor module 507 in the present embodiment which incorporates an IGBT element and a diode and corresponds to the electronic part in the present invention.
- the semiconductor module 507 is held between the flat tubes 501 , to which a pressing force is applied in the direction of built-up Y, by sandwiching and pressing the laminated (piled) flat tubes 501 from both ends in the direction of built-up Y using plate springs 508 .
- the plate spring 508 applies a pressing force to each of a plurality of the rows of the semiconductor modules 507 independently of each other by independently sandwiching and pressing each of the rows in which a plurality of the semiconductor modules 507 are arranged.
- the flat tube 501 deforms in the direction of built-up Y at the narrow parts 501 , as shown in FIG. 20 , in accordance with the interval between the flat tubes 501 and the thickness of the semiconductor module 507 . Due to this, both the flat tubes 501 and the semiconductor module 507 come into close contact with each other over the entire surfaces thereof in opposition to each other. Moreover, as a pressing force is applied to each of the rows independently of each other, even if neighboring semiconductor modules 507 vary in thickness from each other, the flat tube 501 deforms in the direction of built-up Y at the portion of the central narrow part 501 b, thereby the variation is absorbed.
- the cooling fluid that has flowed in through the inlet pipe 504 flows into one end of the fluid passage 501 a of each of the flat tubes 501 through the inlet header tank 503 , flows into the outlet header tank 505 through the fluid passage 501 a, and reaches the outlet pipe 506 . Then heat exchange is effected between the cooling fluid flowing through the fluid passage 501 a and the semiconductor module 507 and the semiconductor module is thus cooled.
- the flat tube 501 deforms readily in the direction of built-up Y at the narrow parts 501 b in accordance with the interval between the flat tubes 501 and the thickness of the semiconductor modules 507 .
- the flat tube 501 and the semiconductor module 7 come into close contact with each other at the entire surfaces thereof in opposition to each other and a sufficient contact area can be ensured between the semiconductor module 507 and the flat tube 501 .
- the brazing material gathers in the narrow parts 501 b and, therefore, it is possible to prevent the brazing material from flowing up to the part at which the flat tube 501 and the semiconductor module 507 come into contact with each other.
- the narrow parts 501 b are located at the portions of the flat tubes 501 at which the semiconductor modules 507 are not held, it is possible to prevent the contact area between the semiconductor module 507 and the flat tube 501 from being reduced.
- the narrow parts 501 b extend perpendicular to both the direction of built-up Y and the direction of flow X, it is possible to easily deform the flat tubes 501 in the direction of built-up Y at the narrow parts 501 b.
- the fins 502 are arranged at positions in the flat tube 501 , at which the narrow parts 501 b are not formed, it is possible to utilize the narrow parts 501 b to determine the positions of the fins 502 in the manufacturing process.
- FIG. 21 is a front view of the cooler according to the tenth embodiment.
- the same numerals or letters are assigned to the same or equivalent parts as those in the ninth embodiment and no explanation will be given to them here.
- a reinforcement plate 509 the rigidity of which, in the direction of built-up Y, is higher than that of the flat tube 501 , is provided.
- the reinforcement plate 509 is made of aluminum and both ends thereof are joined by brazing to the header tanks 503 and 505 and the intermediate part is in contact with the flat tube 501 at one end in the direction of built-up Y.
- coil springs 511 are provided between the flat tube 501 at the other end in the direction of built-up Y and a fixed wall 510 of the vehicle.
- a pressing force is applied in the direction of built-up Y by the coil springs 511 and, thereby, the semiconductor modules 507 are held between the flat tubes 501 .
- the pressing force of the coil springs 511 is supported by the reinforcement plate 509 .
- the coil spring 511 presses each of the rows of the semiconductor modules 507 , which are arranged in two or more rows, independently of each other.
- the flat tubes 501 deform in the direction of built-up Y at the narrow parts 501 b in accordance with the interval between the flat tubes 501 and the thickness of the semiconductor modules 507 and, thereby the flat tubes 501 and the semiconductor module 507 come into close contact at the entire surfaces thereof in opposition to each other.
- the flat tube 501 deforms in the direction of built-up Y at the center narrow part 501 b and, thereby the variation is absorbed.
- the strength of the cooler can be improved by the reinforcement plate 509 , it is possible to prevent the cooler itself from deforming during the transportation of the cooler that does not hold a semiconductor module 507 .
- a pressing force may be applied in the direction of built-up Y by plate springs.
- a cooler of built-up type according to an embodiment of the present invention is explained below with reference to FIG. 22 to FIG. 26 .
- a cooler of built-up type 1001 cools an electronic parts 1004 from both sides thereof, each of which accommodates an power element, etc., for controlling large power and is formed into a plate-like shape.
- the electronic part 1004 is formed into a flat rectangular solid, in which an electrode for power extends from the outer surface including one long side and another electrode for control extends from the outer surface including the other long side.
- a cooling tube 1002 is arranged in contact with one of the main surfaces of the electronic part 1004 and another cooling tube 1002 is arranged in contact with the other main surface of the electronic part 1004 .
- These cooling tubes 1002 are connected to a supply header section 1011 and a discharge header section 1012 provided at both ends of the cooling tubes 1002 .
- a plurality of the electronic parts 1004 are cooled from both sides thereof. Because of this, a plurality of the electronic parts 1004 and a plurality of the cooling tubes 1002 are arranged alternately.
- the cooling tubes 1002 are arranged at both ends of the assembled body in the direction of built-up thereof.
- the cooler of a built-up type 1001 comprises a plurality of the cooling tubes 1002 , which are each flat and are provided with a refrigerant flow passage 1021 through which a cooling medium 1005 flows, and which are arranged in layers so as to sandwich and hold the electronic parts 1004 from both sides thereof.
- the cooler of a built-up type 1001 comprises the supply header section 1011 for supplying the cooling medium 1005 to each of the refrigerant flow passages 1021 and the discharge header section 1012 for discharging the cooling medium 1005 from each of the refrigerant flow passages 1021 .
- the above-mentioned cooling tube 1002 is provided with protruding pipe parts 1022 that protrude as well as opening toward the direction of built-up.
- the cooling tube 1002 is made up by building plates made of metal having a high thermal conductivity, such as aluminum or copper, and by joining the plates by means of joining techniques such as brazing.
- the plates have a substantially rectangular shape as a whole.
- An outer shell plate 1027 that makes up the outer shell of the cooling tube 1002 comprises parts making up a flat pipe that comes into contact with the electronic part 1004 to take heat therefrom and parts making up the supply header section 1011 and the discharge header section 1012 .
- the parts making up the supply header section 1011 and the discharge header section 1012 are formed at both ends of the outer shell plate 1027 .
- the parts making up the supply header section 1011 and the discharge header section 1012 of the outer shell plate 1027 are characterized by the protruding pipe parts 1022 protruding in the vertical direction from the plate-shaped surface of the outer shell plate 1027 and diaphragm parts 1023 formed into an annular shape on the periphery of the root parts of the protruding pipe parts 1022 and having a predetermined width in the radial direction.
- the respective protruding pipe parts 1022 couple neighboring cooling tubes 1002 in the direction of built-up, make up the supply header section 1011 and the discharge header section 1012 , and provide a strength that can prevent buckling in the direction of built-up.
- the cooling tube 1002 can comprise the flat pipe part, the diaphragm parts 1023 , and the protruding pipe parts 1022 extending in the direction of built-up.
- the protruding pipe part 1022 may comprise a pipe-shaped member separately provided.
- the protruding pipe parts 1022 are connected using counter-lock joints (like female and male joints).
- the protruding pipe part 1022 has a stepped protruding pipe part having a large diameter 1223 arranged outside and a protruding pipe part having a small diameter 1222 inserted into the inside of the protruding pipe part having a large diameter 1223 .
- the cooler of a built-up type 1001 comprises at least two kinds of outer shell plates 1027 .
- One of the two kinds of outer shell plates 1027 has the protruding pipe part having a large diameter 1223 and the other kind of outer shell plates 1027 has the protruding pipe part having a small diameter 1222 .
- the cooler of a built-up type 1001 further comprises the outer shell plates 1027 for end use at both ends thereof.
- one of the outer shell plates 1027 for end use neither forms the protruding pipe part 1022 nor opens.
- the other outer shell plate 1027 for end use is the outer shell plate 1027 to be used for a cooling pipe 1020 , which will be described later, and forms a protruding opening parts 1024 for connecting a refrigerant introduction pipe 1031 and a refrigerant discharge pipe 1032 instead of the protruding pipe parts 1022 , as shown in FIG. 26 .
- the protruding pipe part having a large diameter 1223 accommodates the protruding pipe part having a small diameter 1222 therein.
- the stepped part formed in the protruding pipe part having a large diameter 1223 functions as a control part for controlling the insertion length of the protruding pipe part having a small diameter 1222 .
- the front end of the protruding pipe part having a small diameter 1222 comes into contact with the stepped part and thus the insertion length in the axial direction is controlled.
- the controlled part can be composed of a swelling part or a bulged part formed on the outer surface of the protruding pipe part with small diameter 1222 in a protruding manner.
- the protruding pipe parts 1022 provide rigidity that can prevent buckling even if a pressure in the axial direction, namely in the direction of built-up, which can plastically deform the diaphragm part 1023 , is applied thereto.
- an outer wall surface 1274 that is erected in the direction of built-up, a flange part 1275 having a narrow width and extending from the outer wall surface 1274 toward the outside, and an edge part 1276 further extending obliquely from the front end of the flange part 1275 are formed, as shown in FIG. 23 and FIG. 24 .
- the flange part 1275 provides a plane extending in the direction perpendicular to the direction of built-up.
- a pair of the outer shell plates 1027 is joined by brazing in a state in which the flange parts 1275 thereof are arranged so as to be parallel to and in contact with each other. Therefore, the outer shell plates 1027 are piled and joined at the outer edge part thereof by the flange part 1275 via a plane perpendicular to the direction of built-up in between. On the other hand, the outer shell plates 1027 are piled and joined at the parts making up the supply header section 1011 and the discharge header section 1012 by connecting the protruding pipe parts 1022 using counter-lock joints via a cylindrical plane in parallel to the direction of built-up in between.
- the configuration in which the protruding pipe parts 1022 are connected using counter-lock joints has advantages that the degree of freedom in adjusting the length in the axial direction is higher compared to the structure in which built-up is conducted via a plane perpendicular to the direction of built-up in between, that the manufacture of the outer shell plate 1027 in the forming process is easy, and that the cost is low.
- neighboring cooling tubes 1002 make the refrigerant flow passages 1021 thereof communicate with each other by joining the sidewalls of the protruding pipe parts 1022 as well as inserting the protruding pipe parts 1022 into each other. Due to this, the supply header section 1011 and the discharge header section 1012 are formed.
- the cooling tube 1002 comprises the diaphragm parts 1023 that deform in the direction of built-up and which are formed around the protruding pipe parts 1022 .
- the diaphragm part 1023 deforms toward the inside of the cooling tube 1002 when the electronic part 1004 is arranged in the cooler of a built-up type 1001 and the interval between neighboring cooling tubes 1002 is narrowed.
- the cooler of a built-up type 1001 laminates a plurality of the cooling tubes 1002 at intervals somewhat wider than the thickness of the electronic parts 1004 and connects the cooling tubes 1002 at the protruding pipe parts 1022 thereof, as shown in FIG. 24 .
- a plurality of the electronic parts 1004 are arranged between the cooling tubes 1002 of the cooler of a built-up type 1001 in such a state. After this, the cooler of a built-up type 1001 is compressed in the direction of built-up.
- the cooling tube 1002 comprises a pair of the outer shell plates 1027 , an intermediate plate 1028 arranged between the pair of the outer shell plates 1027 , and a corrugated inner fins 1029 arranged between the intermediate plate 1028 and the outer shell plates 1027 , as shown in FIG. 25 .
- the refrigerant flow passages 1021 are formed between the intermediate plate 28 and the outer shell plates 27 .
- outer shell plates 1027 , the intermediate plate 1028 , and the inner fins 1029 are joined to one another by brazing to make up the cooling tube 1002 .
- the intermediate plate 1028 is a rectangular plate-like shape.
- the intermediate plate 1028 has circular opening parts 1284 at both ends thereof corresponding to the supply header section 1011 and the discharge header section 1012 .
- the outer edge part of the intermediate plate 1028 may be sandwiched and held between the outer shell plates 1027 .
- a first cooling tube 1020 among a plurality of the cooling tubes 1002 which is arranged at one end in the direction of built-up, comprises a refrigerant introduction inlet 1013 for introducing the cooling medium 1005 to the supply header section 1011 and a refrigerant discharge outlet 1014 for discharging the cooling medium 1005 from the discharge header section 1012 .
- the refrigerant introduction inlet 1013 and the refrigerant discharge outlet 1014 comprise the respective protruding opening parts 1024 protruding toward the outside of the first cooling tube 1020 , as shown in FIG. 26 . Then, the respective refrigerant introduction pipe 1031 and the refrigerant discharge pipe 1032 are inserted into the respective protruding opening parts 1024 of the refrigerant introduction inlet 1013 and the refrigerant discharge outlet 1014 .
- the protruding opening part 1024 protrudes about 2 mm from the main surface of the first cooling tube 1020 as well as rising substantially vertically on the main surface thereof by means of a burring process.
- the refrigerant introduction pipe 1031 and the refrigerant discharge pipe 1032 are each provided with a flange part 1034 at a part about 2 mm apart away from the end surface of each of opening front end parts 1033 .
- each of the opening front end parts 1033 of the refrigerant introduction pipe 1031 and the refrigerant discharge pipe 1032 are inserted into the insides of the respective protruding opening parts 1024 and, at the same time, the flange parts 1034 come into contact with the front ends of the protruding opening parts 1024 . Due to this, each of the opening front end parts 1033 of the refrigerant introduction pipe 1031 and the refrigerant discharge pipe 1032 is unlikely to be inserted as far as the inside of the outer shell plate 1027 in the cooling tube 1002 and, therefore, the refrigerant flow passage 1021 is unlikely to be cut off.
- the above-mentioned electronic part 1004 is a semiconductor module that incorporates semiconductor elements such as an IGBT and diodes.
- the semiconductor module makes up a part of an inverter for a vehicle.
- cooling medium 1005 water mixed with an ethylene glycol base antifreeze liquid is used.
- the electronic part 1004 can be arranged in a state in which the electronic part is in direct contact with the cooling tube 1002 .
- the respective refrigerant flow passages 1021 of neighboring cooling tubes are communicated with each other by inserting the protruding pipe parts 1022 formed on the cooling tubes 1002 , with each other. Because of this, it is not necessary for a plurality of the cooling tubes 1002 to be connected specifically via members separately provided and, therefore, the number of parts can be reduced and the manufacture of the cooler is easy.
- the protruding pipe parts 1022 of neighboring cooling tubes 1002 are connected by joining the sidewalls of the protruding pipe parts 1022 to each other. Therefore, it is possible for the supply header section 1011 and the discharge header section 1012 to ensure a flow passage diameter substantially the same as the inner diameter of the protruding pipe part 1022 . Due to this, it is possible to not only reduce the flow resistance in the supply header section 1011 and the discharge header section 1012 but also to prevent pressure loss. Because of this, the cooling medium 1005 can be supplied evenly into a plurality of the cooling tubes 1002 and, moreover, a plurality of the electronic parts 1004 can be cooled evenly.
- the cooling tube 1002 comprises the diaphragm parts 1023 formed around the protruding pipe parts 1022 . Due to this, it is possible to easily adjust the interval between neighboring cooling tubes 1002 and to easily and firmly arrange the electronic parts 1004 between neighboring cooling tubes 1002 . As a result, the electronic part 1004 can be made to come into close contact with the cooling tubes 1002 .
- the cooling tube 1002 comprises a pair of the outer shell plates 1027 , the intermediate plate 1028 , and the inner fins 1029 . Because of this, it is possible to obtain the cooling tube 1002 having a so-called drawn-cup structure by joining together the outer shell plates 1027 , the intermediate plate 1028 , and the inner fins 29 after separate manufacture thereof by press molding, etc. Therefore, the cooling tube 1002 can be manufactured easily.
- the inner fins 1029 it becomes easy to form the inner fins 1029 at desired positions (areas). Because of this, the forming of the supply header section 1011 and the discharge header section 1012 can be made easy by not arranging the inner fins 1029 at areas at which the supply header section 1011 and the discharge header section 1012 are formed.
- the refrigerant flow passages 1021 are formed in two rows in the direction of built-up of the cooling tubes 1002 , as a result. Because of this, it is possible to prevent the transfer of heat between the electronic parts 1004 arranged at both ends of the cooling tube 1002 . Therefore, it is possible, for example, to prevent the rapid rise in temperature of one of the electronic parts 1004 from affecting another electronic part 1004 .
- the refrigerant introduction inlet 1013 and the refrigerant discharge outlet 1014 of the first cooling tube 1020 are each provided with the protruding opening part 1024 , as shown in FIG. 26 . Because of this, it is possible to prevent the refrigerant introduction pipe 1031 and the refrigerant discharge pipe 1032 from cutting off the flow passage between the supply header section 1011 or the discharge header section 1012 and the refrigerant flow passage 1021 . Therefore, it is also possible for the first cooling tube 1020 to ensure a flow passage sectional area similar to that of the other cooling tubes 1002 and, as a result, the electronic parts 1004 can be cooled evenly.
- a cooler of a built-up type capable of not only reducing the manufacturing cost but also making a cooling medium flow evenly to a plurality of cooling tubes.
- a twelfth embodiment is an embodiment, as shown in FIG. 27 to FIG. 29 , in which a cooling tube 1002 comprises a diaphragm part 1023 formed around one of a pair of protruding pipe parts 1022 arranged in opposition to each other, and does not comprise a diaphragm part 1023 around the other protruding pipe part 1022 .
- the cooling tube 1002 comprises the diaphragm part 1023 formed around one of a pair of the protruding pipe parts 1022 which is provided on the downstream side of the supply header section 1011 .
- a flow rectifying part 1025 is provided at the inlet part of the cooling tube 1002 which is a part of the intermediate plate 1028 deformed so as to be involved in the upstream side of the supply header section 1011 .
- the flow rectifying part 1025 controls the flow passage sectional area at the inlet part of one of the two rows of refrigerant flow passages 1021 sandwiching the intermediate plate 1028 to be equal to that of the other refrigerant flow passage 1021 .
- the flow rectifying part 1025 is formed at the edge of the opening part 1284 of the intermediate plate 1028 .
- the flow rectifying part 1025 adjusts the flow rate of the refrigerant fluid to be distributed to the upper and lower flow passages defined by the intermediate plate 1028 . It is possible to adjust the flow rate of the refrigerant fluid to be distributed evenly or unevenly by the shape of the flow rectifying part 1025 in accordance with, for example, the need to cool the electronic parts 1004 , which are objects to be cooled.
- the flow rectifying part 1025 is formed by deforming the edge part of the opening part of the intermediate plate 1028 by a predetermined deformation amount in the same direction as that in which the diaphragm part 1023 , provided to only one of the cooling tubes 1002 , deforms.
- methods for forming the diaphragm part 1023 around only one of the protruding pipes 1022 includes, for example, a method in which the other protruding pipe part 1022 is prevented from being deformed by a pressing force in the direction of built-up by reinforcing the rising part of the other protruding pipe part 1022 , as shown in FIG. 28 and FIG. 29 .
- the method shown in FIG. 28 is a method in which the radius of curvature of the outer shell plate 1027 is increased at the rising part of the other protruding pipe part 1022 .
- 29 is a method in which a fillet 1221 made of a brazing material, which is formed by joining the protruding pipe parts 1022 of neighboring cooling tubes 1002 by brazing, is made to overlap the rise part of the other protruding pipe part 1022 .
- the cooler of a built-up type 1 so as to have a constant shape in a state in which the electronic part 1004 is sandwiched and held therebetween.
- the two protruding pipe parts may vary in the amount of deformation from each other. Then, in this case, if an attempt is made to adjust the amount of deformation of the diaphragm parts 1023 , it becomes necessary to accurately control various conditions such as the throttle (reducing area) rate during press molding and the plate thickness of the cooling tube 1002 .
- the cooling tube 1002 comprises the diaphragm part 1023 formed around the protruding pipe part 1022 formed on the downstream side of the supply header section 1011 , which is one of a pair of the protruding pipe parts 1022 . Because of this, it is possible to prevent the smooth supply of the cooling medium 1005 from the supply header section 1011 to the cooling pipe 1002 from being blocked by the diaphragm part 1023 .
- the diaphragm part 1023 is provided around only one of a pair of the protruding pipe parts 1022 which is formed on the upstream side of the supply header section 1011 , the smooth supply of the cooling medium 1005 from the supply header section 1011 to the cooling tube 1002 may be blocked.
- the flow of the cooling medium 1005 may separate in the vicinity of the diaphragm part 1023 .
- a thirteenth embodiment is an embodiment, as shown in FIG. 31 , in which the cooling tube 1002 comprises a throttle (reducing area) part 1026 for narrowing the width of the refrigerant flow passage 1021 at the inlet part of the refrigerant flow passage 1021 .
- the cooling tube 1002 is provided with the diaphragm part 1023 and the flow rectifying part 1025 as in the twelfth embodiment.
- the throttle part 1026 is formed simultaneously when the outer shell plate 1027 is formed by press molding.
- the throttle part 1026 extends continuously across a part of the outer shell plate 1027 in the direction of width of the outershell plate, which makes up the flat part of the cooling tube 1002 .
- the throttle part 1026 is formed on the outer shell plate 1027 into a groove-like shape when viewed from the outside thereof.
- the throttle part 1026 reduces the height of the refrigerant flow passage 1021 in the direction of built-up.
- the throttle part 1026 can be formed as a recess part arranged discretely.
- the throttle part 1026 is arranged on the downstream side of the diaphragm part 1023 .
- the throttle part 1026 is arranged between a portion of the cooling tube 1002 , which comes into contact with the electronic part 1004 , and the diaphragm part 1023 .
- the throttle part 1026 is arranged on the upstream side of the portion of the cooling tube 1002 , which comes into contact with the electronic part 1004 .
- the throttle part 1026 can also be arranged on the downstream side of the portion of the cooling tube 1002 , which comes into contact with the electronic part 1004 . Further, the throttle part 1026 can also be arranged on both the upstream side and the downstream side of the portion of the cooling tube 1002 , which comes into contact with the electronic part 1004 .
- the throttle part 1026 has greater rigidity than that of the diaphragm part 1023 .
- the diaphragm part 1023 can be regarded as a part having relatively small rigidity, which readily deforms plastically in the direction of built-up.
- the shape of the throttle part 1026 is specified so that the flow passage sectional area of the refrigerant flow passage 1021 at the throttle part 1026 is a minimum. Then, all of the cooling tubes 1002 are made to have the same minimum flow passage sectional area.
- the flow rate in the refrigerant flow passage can be adjusted to a desired value by means of the throttle part 1026 .
- This configuration exhibits an advantageous effect when the amount of deformation varies among a plurality of the diaphragm parts 1023 .
- the amount of deformation varies among the diaphragm parts 1023 , it becomes easy to make the minimum flow passage sectional area uniform in a plurality of the refrigerant flow passages 1021 and, therefore, the flow rate of the cooling medium 1005 to the respective refrigerant flow passages 1021 can be made uniform.
- a fourteenth embodiment is an embodiment, as shown in FIG. 32 and FIG. 33 , in which metal plates are used as an outer shell plate 1027 , an intermediate plate 1028 , and an inner fin 1029 all making up the cooling tube 1002 .
- the outer shell plate 1027 is made of a brazing sheet having a core material 1271 and a brazing material 1272 arranged on the inner surface of the core material 1271 .
- the intermediate plate 1028 and the inner fin 1029 are composed of metal plates including a metal baser (that is, the corrosion potential is lower) than the core material 1271 of the outer shell plate 1027 .
- a pair of the outer shell plates 1027 join the inner surfaces, at end parts thereof, to each other.
- the protruding pipe part 1022 is provided with the brazing material 1272 arranged on the inner surface thereof. Then, when the protruding pipe parts 1022 of neighboring cooling tubes 1002 are inserted into each other, the brazing material 1272 arranged on the inner surface of one of the protruding pipe parts 1022 comes into contact with the outer surface of the core material 1271 of the other protruding pipe part 1022 . Therefore, by heating the contact part in this state, the protruding pipe parts 1022 are joined to each other by the brazing material 1272 .
- Aluminum (Al) can be used as the core material 1271 and the brazing material 1272 of the outer shell plate 1027 and a metallic material, which is aluminum to which zinc (Zn) has been added, can be used as the intermediate plate 1028 , the inner fin 1029 , etc.
- FIG. 33 shows a state of the diaphragm part 1023 before deformed. This is applicable to FIG. 35 to FIG. 37 , which will be described later.
- the outer shell plate 1027 can be prevented from corroding. Because of this, the cooling medium 1005 can be prevented from leaking from the cooling tube 1002 .
- brazing material 1272 is arranged on the surfaces, to be joined, of a pair of the outer shell plates 1027 , it is possible to easily join a pair of outer shell plates 1027 to each other by brazing and to easily manufacture the cooling tube 1002 .
- the brazing material 1272 is arranged on the inner surface of the protruding pipe part 1022 and, therefore, when the protruding pipe parts 1022 of neighboring cooling tubes 1002 are inserted into each other, the brazing material 1272 arranged on the inner surface of one of the protruding pipe parts 1022 comes into contact with the outer surface of the core material 1271 of the other protruding pipe part 1022 . Because of this, it is possible to easily join the protruding pipe parts 1022 to each other using the brazing material 1272 .
- a fifteenth embodiment is an embodiment, as shown in FIG. 34 and FIG. 35 , in which as the outer shell plate 1027 , a brazing sheet is used, having a core material 1271 , a sacrifice anode material 1273 arranged on the inner surface of the core material 1271 , and a brazing material 1272 arranged on the inner surface of the sacrifice anode material 1273 .
- a metallic material which is aluminum (Al) to which zinc (Zn) has been added, can be used as the sacrifice anode material 1273 .
- the core material 1271 can be prevented from corroding. Because of this, corrosion is unlikely to advance in the direction of thickness of the outer shell plate 1027 and the cooling tube 1002 can be prevented from being pitted.
- a sixteenth embodiment is an embodiment, as shown in FIG. 36 and FIG. 37 , in which, as the outer shell plate 1027 , a brazing sheet having a core material 1271 and a sacrifice anode material 1273 arranged on the inner surface of the core material 1271 , is used.
- An intermediate plate 1028 is made of a brazing sheet having a core material 1281 and a brazing material 1282 arranged on both sides of the core material 1281 .
- An inner fin 1029 is composed of a metallic plate including a metal baser (a metal having a lower corrosion potential) than the core material 1271 of the outer shell plate 1027 .
- a metallic material which is aluminum (Al) to which zinc (Zn) has been added, can be used as a metallic plate making up the inner fin 1029 , and a sacrifice anode material 1273 .
- a pair of the outer shell plates 1027 is formed by joining the inner surfaces at the ends thereof to both sides at the ends of the intermediate plate 1028 .
- the protruding pipe part 1022 is composed of the outer shell plate 1027 on which the brazing material is not arranged. Therefore, the protruding pipe parts 1022 of neighboring cooling tubes 1002 are joined by newly arranging a paste brazing material, a ring brazing material, etc (not shown).
- a pair of the outer shell plates 1027 are joined to the end parts of both sides of the intermediate plate 1028 , on both sides of which the brazing material 1282 has been arranged. Therefore, it is possible to easily join a pair of the outer shell plates 1027 to the intermediate plate 1028 by brazing and to easily manufacture the cooling tube 1002 .
- aluminum is used as a material of a tube and a fin
- a metallic material such as copper and resin can also be used as a material of a tube and a fin, and in this case, a material having a high thermal conductivity is preferable.
- water mixed with an ethylene glycol base antifreeze liquid is used as a cooling fluid, but a natural refrigerant such as water and ammonia, a fluorocarbon base refrigerant such as fluorinate, a chlorofluorocarbon base refrigerant such as HCFC123 and HFC134a, an alcohol-based refrigerant such as methanol and alcohol, and a ketone-based refrigerant such as acetone can also be used as a cooling fluid.
- a natural refrigerant such as water and ammonia
- a fluorocarbon base refrigerant such as fluorinate
- a chlorofluorocarbon base refrigerant such as HCFC123 and HFC134a
- an alcohol-based refrigerant such as methanol and alcohol
- a ketone-based refrigerant such as acetone
- the present invention is applied to cooling of a semiconductor module of a double-sided cooling type of an inverter for a hybrid electric vehicle, but the present invention can also be applied to cooling of, for example, a semiconductor module of a motor drive inverter for industrial equipment, an air-conditioning inverter for air-conditioning buildings, etc.
- the cooler according to the present invention can also cool an electronic part such as a power transistor, a power FET, and an IGBT, in addition to the semiconductor module 6 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts 6 are held between neighboring tubes 1, each of the tubes 1 is formed by joining the edges of plates 1 a, 1 b, each of which is formed into a predetermined shape by press molding, and fins 5 for accelerating heat exchange are arranged in the tube 1. As an inner wall conventionally exists when the tube 1 is manufactured by extrusion, can be removed, it is no longer necessary to remove the inner wall by machining, therefore, the fabrication cost can be reduced.
Description
- 1. Field of the Invention
- The present invention relates to a cooler for cooling electronic parts and can be preferably used, particularly, as a cooler for cooling electronic parts of a double-sided cooling type in an inverter for a hybrid electric vehicle. More particularly, the present invention relates to a cooler of a built-up type for cooling an electronic part from both sides thereof.
- 2. Description of the Related Art
- Conventionally, a known semiconductor module (an electronic part) is attached to a cooler of a water-cooling type for cooling. A semiconductor device of a double-sided cooling type is proposed in
Patent document 1. The device described inPatent document 1 has a configuration in which tubes having a cooling water passage and semiconductor modules of a double-sided cooling type are piled alternately and a pressing force is applied in the direction of built-up of the tubes to hold the semiconductor modules between the tubes. Neighboring tubes are coupled to each other by bellows (coupling means) arranged between the neighboring tubes and by communication holes for making the cooling water passages and the insides of the bellows communicate with each other are formed in respective tubes. InPatent document 1, many examples are described in which the semiconductor module and the tube are brought into close contact with each other even if there are variations in the interval between tubes and in the thickness of the semiconductor modules. - In one of the examples (hereinafter, referred to as a first conventional device), neighboring tubes are coupled to each other by a bellows-shaped elastic cylinder sections and the elastic cylinder sections extend and contract in accordance with the interval between the tubes or the thicknesses of the semiconductor modules.
- In another example (hereinafter, referred to as a second conventional device), a flange-shaped cylinder section with low rigidity is provided in the tube and the flange-shaped cylinder section is made to deform in accordance with the interval between the tubes or the thickness of the semiconductor modules.
- In still another example (hereinafter, referred to as a third conventional device), the tube is made thinner to have lower rigidity and the tube itself is made to deform in accordance with the interval between tubes or the thickness of the semiconductor module.
- Conventionally, a cooler of a built-up
type 2009 is known, in which a plurality ofcooling tubes 2092 are arranged in layers so as to sandwich and hold anelectronic part 2004 from both sides thereof and which cools theelectronic part 2004 from both sides thereof, as shown inFIG. 39 (refer to Patent document 2). - The cooler of a built-up
type 2009 comprises asupply header 2094 for supplying a cooling medium to thecooling tubes 2092 and adischarge header 2095 for discharging the cooling medium from thecooling tubes 2092. One end of each of the plurality of thecooling tubes 2092 arranged in layers is connected to thesupply header 2094 and the other end is connected to thedischarge header 2095. - However, in the conventional cooler of a built-up
type 2009, thecooling tubes 2092 are connected to thesupply header 2094 and thedischarge header 2095, both being made of a member different from that of thecooling tubes 2092. Because of this, there is the possibility that the manufacture of the cooler of a built-uptype 2009 requires a large number of parts and, therefore, the manufacturing cost thereof is high. - Moreover, in the cooler of a built-up
type 2009, the plurality of thecooling tubes 2092 are fixed to thesupply header 2094 and thedischarge header 2095 and, therefore, it is difficult to change the intervals between the plurality of thecooling tubes 2092. Because of this, it becomes difficult to insert theelectronic part 2004 between thecooling tubes 2092 so as to bring thecooling pipes 2092 into close contact with both main surfaces of theelectronic part 2004 without fail. - On the other hand, a cooler of a built-up
type 2090 is known, which is configured in such a manner that a plurality of thecooling tubes 2092 are arranged so as to sandwich and hold anelectronic part 2004 from both sides and, at the same time, a plurality of thecooling tubes 2092 are made to connect with each other via connectingpipe 2093 so that a cooling medium can flow to eachcooling tube 2092, as shown inFIG. 40 (refer to Patent document 1). - However, in this cooler of a built-up
type 2090 also, it is necessary to join the connectingpipe 2093, which are made of a member different from that of thecooling tubes 2092, to thecooling tubes 2092 to assemble the cooler of a built-uptype 2090. Because of this, a problem arises in that the manufacturing cost is high and, at the same time, the productivity is difficult to improve. - [Patent document 1] Japanese Unexamined Patent Publication (Kokai) No.2002-26215
- [Patent document 2] Japanese Unexamined Patent Publication (Kokai) No.2001-320005
- However, as in the device described in
Patent document 1, when a tube is manufactured by extrusion,inner walls 2001x are formed on the inside of thetube 2001 in order to accelerate heat exchange and to ensure the strength thereof, and theinner walls 2001x exist in the entire area in the direction of extrusion, as shown inFIG. 38 . In addition, after extrusion, it is necessary to remove theinner wall 2001x of thetube 2001 at the portion where thetube 2001 and a bellows are joined, that is, at the portion where aconnection hole 2011 is formed. Therefore, this process raises the cost. Moreover, theextruded tube 1 requires side caps and this also raises the cost. - Moreover, the first conventional device and the second conventional device require the elastic cylinder sections or the flange-shaped cylinder sections, the number of which corresponding to the number of piled layers of the tubes and, therefore, a problem arises in that the number of parts of a product is increased.
- In the third conventional device, as the tube is deformed in an arc shape, it is not possible for the tube to completely come into close contact with the surface of the semiconductor module and a problem arises in that the contact area between two decreases. Moreover, the third conventional device brings about a problem in that, when the tube deforms, stress tend to concentrate on the joined parts between the tubes and the header tanks.
- The above-mentioned problems being taken into account, an object of the present invention is to provide a cooler capable of reducing the forming process cost and further, the manufacturing cost. Another object of the present invention is to make it possible to ensure a sufficient contact area between an electronic part and a tube without increasing the number of parts.
- In order to attain the above-mentioned objects, a cooler according to a first aspect of the present invention comprises: a plurality of tubes (1) internally including a fluid passage (10) through which a cooling fluid flows and piled at predetermined intervals in a direction perpendicular to a direction (X) in which the cooling fluid flows through the fluid passage (10); and coupling means (2) arranged between the neighboring tubes (1) and for coupling the neighboring tubes (1); and in the tube (1), connection holes (11) are formed which make the fluid passage (10) and the inside of the coupling means (2) communicate with each other, electronic parts (6) are held between the neighboring tubes (1), each of the tubes (1) is formed by joining edge parts of plates (1 a, 1 b, 1 c) formed into a predetermined shape by press molding, and fins (5) for accelerating heat exchange are arranged in each of the tube (1).
- According to the first aspect, it is possible to dispense with the inner wall, which is required and therefore exists when the tube is manufactured by extrusion and, therefore, a process for removing the inner wall can also be dispensed with. Moreover, it becomes possible to seal the tube without the side cap present in the extruded tube. Still moreover, as the thickness of the plate can be reduced, a process for drilling the connection holes is made easier. Therefore, the forming process (fabrication) cost can be reduced.
- As it is possible to form the fin by press molding, as well as the tube, the manufacturing process is made easier and the manufacturing cost can be reduced.
- In a second aspect of the present invention, when a semiconductor modules are sandwiched and pressed by plate springs, the fins can deform elastically or buckle without inflicting damage on the semiconductor modules (without destroying circuits, etc.). According to the experimental result, the thickness of the fin in this case was equal to or less than 0.4 mm.
- In a third aspect of the present invention, each of the fins (5) is joined to the tube (1) and the portions of the fin (5), which are joined to the tube (1), are arc-shaped.
- According to the third aspect, both the fact that the portions of the fin, which are joined to the tube, are arc-shaped and the fact that the tube and the fins can be made thin produce a synergic effect to make it easier for the tubes to deform when an electronic part is held between the tubes and, therefore, the contact surface between the tube and the electronic part is made easier to fit and the adhesiveness is improved. As a result, the contact thermal resistance can be reduced.
- In a fourth aspect of the present invention, when viewed in the direction (Y) of built-up of the tubes (1), the fins (5) are arranged at positions at which the fins (5) do not overlap the connection holes (11), and when viewed in a direction (Y) of built-up of the tubes (1), the electronic parts (6) are within the areas of installation of the fins (5).
- According to the fourth aspect, the pressure loss can be reduced compared to the case where the fins are present in the entire area in the tube because the fins do not occupy excess area.
- In a fifth aspect of the present invention, a plurality of the fins (5) are arranged in the single tube (1) and, at the same time, the fins (5) are arranged at intervals (δ) along the direction (X) in which the cooling fluid flows through the fluid passage (10).
- According to the fifth aspect, as the plurality of the fins are arranged in the single tube, it is possible to properly use fins of different heat exchange performance in accordance with, for example, the amount of heat produced by the electronic parts.
- By providing the interval, the velocity boundary layer of the cooling fluid is cleared in the interval and the thermal boundary layer of the cooling fluid is also removed and, therefore, the ability to cool the electronic parts on the downstream side of the interval is improved. It is effective for the interval (6) to be equal to or greater than 1 mm, as shown in a sixth aspect of the present invention.
- As shown in a seventh aspect of the present invention, it is possible to reduce the fabrication cost by forming the connection holes (11) by press molding.
- As shown in an eighth aspect of the present invention, the tubes (1) may be formed by joining the two plates (1 a, 1 b). Moreover, as shown in a ninth aspect of the present invention, the tubes (1) may be formed by bending and joining the single plate (1 c).
- In a tenth aspect of the present invention, the coupling means (2) are bellows. According to the tenth aspect, it is possible to change the dimension between neighboring tubes in accordance with the thickness of an electronic part by extending and contracting the bellows.
- In an eleventh aspect of the present invention, the fins (5) are corrugated fins that divide the fluid passage (10) into two or more fine flow passages and the height (hf) of the fins (5) is greater than the width (wf) of the fine flow passage of the fin (5) at the central position of the fine flow passage in a direction of height of the tube.
- According to the eleventh aspect, the heat transfer area of the fin is increased and the cooling performance of the cooler is improved. It is preferable that the width (wf) of the fin flow passage be equal to 1.2 mm or less as in a twelfth aspect of the present invention or that the height (hf) of the fin (5) be 1 to 10 mm as in a thirteenth aspect of the present invention.
- In a fourteenth aspect of the present invention, the thickness (tf) of the fins (5) is less that the thickness (tp) of the plates (1 a, 1 b, 1 c).
- According to the fourteenth aspect, when pressure is applied to an electronic part in order to bring the electronic part into closer contact with the plate surfaces (the tube surfaces), as the fins deform more readily than the plates do, it is made easier for the electronic part and the plate surfaces to come into closer contact and, therefore, the contact thermal resistance is reduced and the cooling efficiency is improved.
- It is preferable that the thickness (tf) of the fins (5) be 0.03 to 1.0 mm as in a fifteenth aspect of the present invention or that the thickness (tp) of the plates (1 a, 1 b, 1 c) be 0.1 to 5.0 mm as in a sixteenth aspect of the present invention.
- In a seventeenth aspect of the present invention, the tube (1) is formed by brazing the plates (1 a, 1 b, 1 c) and the plates are made of a bare material.
- According to the seventeenth aspect, as the plates are made of a bare material, it is unlikely that the plate surface (the tube surface) becomes rough due to brazing. Therefore, the contact thermal resistance between the electronic part and the plates is reduced and the cooling efficiency is improved.
- In an eighteenth aspect of the present invention, the tube (1) is formed by brazing the plates (1 a, 1 b, 1 c), the plates (1 a, 1 b, 1 c) are made of a brazing sheet having a core material and a sacrifice anode material, and the tube (1) has the core material at the outside thereof.
- According to the eighteenth aspect, the tube can be prevented from being pitted by making the sacrifice anode material first corrode before the core material to prevent the corrosion of the core material of the plate. Moreover, as the core material is located at the outside of the tube, it is unlikely that the plate surface (the tube surface) becomes rough due to brazing and, therefore, the contact thermal resistance between the electronic part and the plates is reduced and the cooling efficiency is improved.
- In a nineteenth aspect of the present invention, the tube (1) is formed by brazing the plates (1 a, 1 b, 1 c), the plates (1 a, 1 b, 1 c) are made of a brazing sheet having a core material and a brazing material, and the tube (1) has the core material at the outside thereof.
- According to the nineteenth aspect, as the plate is provided with the brazing material, the time (man-hour) for an assembling process including steps, such as a step of attaching a paste brazing material, can be reduced. Moreover, as the core material is located at the outside of the tube, it is unlikely that the plate surface (the tube surface) becomes rough due to the brazing and, therefore, the contact thermal resistance between the electronic part and the plates is reduced and the cooling efficiency is improved.
- In a twentieth aspect of the present invention, the tube (1) is formed by brazing the plate (1 a, 1 b, 1 c), the plates (1 a, 1 b, 1 c) are made of a brazing sheet having a sacrifice anode material arranged between a core material and a brazing material, and the tube (1) has the core material at the outside thereof.
- According to the twentieth aspect, as the plate is provided with the brazing material, the time (man-hour) for an assembling process including steps, such as a step of attaching a paste brazing material, can be reduced. Moreover, the tube can be prevented from being pitted by making the sacrifice anode material first corrode with priority over the core material to prevent the corrosion of the core material of the plate. Still moreover, as the tube has the core material located at the outside thereof, it is unlikely that the plate surface (the tube surface) becomes rough due to the brazing and, therefore, the contact thermal resistance between the electronic part and the plates is reduced and the cooling efficiency is improved.
- In a twenty-first aspect of the present invention, the material of the fins (5) is potentially baser than that of the plates (1 a, 1 b, 1 c). According to the twenty-first aspect, as the fin is made to corrode before the plates, the tube can be prevented from being pitted.
- A cooler according to a twenty-second aspect of the present invention comprises: a plurality of flat tubes (501) internally including a fluid passage (501 a) through which a cooling fluid flows and piled at predetermined intervals in a direction perpendicular to a direction (X) in which the cooling fluid flows through the fluid passage (501 a); and header tanks (503, 505) arranged at both ends of the flat tubes (501) and for distributing and gathering the cooling fluid; and wherein electronic parts (507) arranged between the neighboring flat tubes (501) are held by applying a pressing force thereto in a direction of built-up of the tubes (Y) and the flat tube (501) is provided with narrow parts (501 b) that become narrower in the direction of built-up of the tubes (Y).
- According to the twenty-second aspect, the flat tube deforms readily in the direction of built-up of the tubes at the narrow parts in accordance with the interval between the flat tubes and the thickness of the electronic part. At this time, the part of the flat tube between the narrow parts does not deform in an arc-shape and, therefore, it is possible for the flat tube and the electronic part to come into close contact with each other at the entire opposing surfaces of both and a sufficient contact area between the electronic part and the tube can be ensured.
- As only the narrow parts are formed in the flat tube, the number of parts is not increased in the present embodiment.
- Moreover, as the flat tubes readily deform in the direction of built-up of the tubes at the narrow parts, it is unlikely that stress concentrates on the joined parts between the flat tubes and the header tanks when the flat tubes deform and, thus, the stress due to deformation can be reduced.
- When the header tank and the flat tube are brazed, the brazing material gathers at the narrow parts and, therefore, the brazing material can be prevented from flowing up to the position of contact between the flat tube and the electronic part.
- In a twenty-third aspect of the present invention, the narrow parts (501 b) are located at portions at which the electronic parts (507) are not held in the flat tube (501).
- According to the twenty-third aspect, it is possible to prevent the contact area between the electronic part and the flat tube from decreasing.
- In a twenty-fourth aspect of the present invention, a reinforcement plate (509) having greater rigidity in the direction of built-up of the tubes (Y) than the flat tube (501) is provided at one end in the direction of built-up (Y) of the tubes.
- According to the twenty-fourth aspect, it is possible for the cooler itself to support the pressing force in the direction of built-up of the tubes. Moreover, as the strength of the cooler can be increased, it is possible to prevent the cooler itself from deforming when the cooler is transported in a state in which an electronic parts are not held in the cooler yet.
- In a twenty-fifth aspect of the present invention, a plurality of rows of electronic parts (507) are arranged when viewed in the direction of built-up of the tubes (Y) and a pressing force is applied to each row independently of each other.
- According to the twenty-fifth aspect, as a pressing force is applied to each row independently of each other, even if neighboring electronic parts vary in thickness, the variation can be absorbed and the contact thermal resistance can be reduced.
- In a twenty-sixth aspect of the present invention, the narrow parts (501 b) extend in a direction perpendicular to the direction of built-up (Y) of the tubes and, at the same time, extending in the direction perpendicular to the direction of flow of the cooling fluid (X) in the fluid passage (501 a).
- According to the twenty-sixth aspect, it is possible to readily deform the flat tube in the direction of built-up of the tubes at the narrow parts.
- In a twenty-seventh aspect of the present invention, the fins (2) for accelerating heat exchange are arranged at positions in the flat tube (1), where the narrow parts (501 b) are not formed.
- According to the twenty-seventh aspect, during the manufacture process of a cooler, the narrow parts can be used for determining the positions of the fins.
- The present invention relates to a cooler of a built-up type for cooling electronic parts from both sides thereof, the cooler of a built-up type comprises: a plurality of flat cooling tubes, each having a refrigerant flow passage through which a cooling medium flows and arranged in layers so as to sandwich and hold the electronic parts at both sides thereof; a supply header section for supplying the cooling medium to the refrigerant flow passage; and a discharge header section for discharging the cooling medium from each of the refrigerant flow passages; wherein each of the cooling tubes is provided with protruding pipe parts opening and protruding toward the direction of built-up of the cooling tubes and neighboring cooling tubes make the refrigerant flow passages thereof communicate with each other by inserting the protruding pipe parts into each other and, at the same time, joining the sidewalls of the protruding pipe parts to each other, and thus forming the supply header section and the discharge header section (the twenty eighth aspect of the present invention).
- Next, the functions and effects of the present invention are explained below.
- In the cooler of a built-up type, by inserting the protruding pipe parts formed on each of the cooling tubes into each other, the refrigerant flow passages in neighboring cooling tubes are made to connect with each other. Due to this, it is not necessary, in particular, to connect the plurality of cooling tubes via members separately provided and, therefore, the number of parts can be reduced and the manufacture thereof is made easier.
- The protruding pipe parts in neighboring cooling tubes are connected by joining the sidewalls of the protruding pipe parts to each other. Therefore, it is possible for the supply header section and the discharge header section to ensure a diameter of a flow passage substantially equal to the inner diameter of the protruding pipe part. Due to this, the flow resistance of the supply header section and the discharge header section can be reduced and the pressure loss can also be reduced. Therefore, it is possible to distribute the cooling medium evenly to each of the plurality of the cooling tubes and, as a result, the electronic parts can be cooled evenly.
- As described above, according to the present invention, it is possible to provide a cooler of a built-up type capable of reducing the manufacturing cost.
- In a twenty-eighth aspect of the present invention, the electronic part may be, for example, a semiconductor module that incorporates semiconductor elements, such as an IGBT, and diodes. The semiconductor module can be used in an inverter for a vehicle, a motor drive inverter for industrial equipment, an air-conditioner inverter for air-conditioning buildings, etc.
- In addition to the semiconductor module described above, a power transistor, a power FET, an IGBT, etc., can be used as the electronic parts.
- As the cooling medium described above, for example, water mixed with an ethylene glycol base antifreeze liquid, a natural refrigerant such as water and ammonia, a fluorocarbon base refrigerant such as fluorinate, a chlorofluorocarbon base refrigerant such as HCFC123 and HFC134a, an alcohol-based refrigerant such as methanol and alcohol, and a ketone-based refrigerant such as acetone may be used.
- It is preferable that diaphragm parts that deform in the direction of built-up are formed around the protruding pipe parts of the cooling tube (a twenty-ninth aspect of the present invention).
- In this case, it is possible to easily adjust the interval between neighboring cooling tubes and to easily and firmly arrange the electronic parts between neighboring cooling tubes. Moreover, it is possible to firmly make the electronic part come into close contact with the cooling tube, or to firmly make the electronic part and the cooling tube come into close contact with a heat transfer member, etc., to be interposed between both.
- When arranging electronic parts in the cooler of a built-up type described above, it is possible to sandwich and hold the electronic parts between the cooling tubes by, for example, deforming the diaphragm parts toward the inside of the cooling tube. Moreover, the electronic parts may be sandwiched and held between the cooling tubes by temporarily deforming the diaphragm part toward the outside of the cooling tube to widen the interval between the neighboring cooling tubes and narrowing the interval between the cooling tubes after inserting the electronic part therebetween.
- It is preferable that the diaphragm part be formed around one of a pair of the protruding pipes arranged in opposition to each other of the cooling tube and be not formed around the other protruding pipe part (a thirtieth aspect of the present invention).
- In this case, it becomes easy to manufacture a cooler of a built-up type so as to have a constant shape in a state in which an electronic parts are sandwiched and held therebetween.
- In other words, if the diaphragm parts are provided around both the protruding pipe parts and are deformed, both the diaphragm parts may vary in the amount of deformation from each other. Then, in this case, if an attempt is made to adjust the amount of deformation of each diaphragm part, it becomes necessary to accurately control various conditions, such as the throttle (area-reducing) rate of the cooling tube during press molding and the plate thickness thereof.
- Therefore, by providing the diaphragm part to only one of the protruding pipe parts, it becomes easy to perform specific deformation of the diaphragm parts when the electronic parts are sandwiched and held by the cooling tubes substantially in accordance with the design It is preferable that the diaphragm part be formed around the protruding pipe part formed on the downstream side of the supply header section, which is one of the pair of the protruding pipe parts of the cooling tube (a thirty-first aspect of the present invention).
- In this case, it is possible to prevent the smooth supply of the cooling medium from the supply header section to the cooling tubes from being blocked by the diaphragm parts.
- It is preferable that a throttle (area-reduced) part for narrowing the width of the refrigerant flow passage be provided at the inlet part of the refrigerant flow passage in the cooling tube (a thirty-second aspect of the present invention).
- In this case, it becomes easy to make the minimum sectional areas of the flow passages in a plurality of the refrigerant flow passages even and it is possible to make the flow rate of the cooling medium to each of the refrigerant flow passages even.
- It is preferable that the cooling tube has a pair of outer shell plates, an intermediate plate arranged between a pair of the outer shell plates, and a corrugated inner fins arranged between the intermediate plate and the outer shell plates (a thirty-third aspect of the present invention).
- In this case, it is possible to obtain a cooling tube having a so-called drawn-cup structure by joining the outer shell plates, the intermediate plate, and the inner fins all together after the separate manufacture thereof by means of press molding. Therefore, it is possible to easily manufacture the cooling tube.
- It becomes easy to form the inner fins at desired areas. Due to this, for example, it is possible to easily form a supply header section and a discharge header section by not arranging the inner fins at the areas at which the supply header section and the discharge header section are formed.
- In this case, two rows of the refrigerant flow passages are formed in the direction of built-up of the cooling tubes, as a result. Therefore, it is possible to prevent the transfer of heat between the electronic parts arranged at both sides of the cooling tube. As a result, it is possible, for example, to prevent the rapid rise in temperature of one of the electronic parts from affecting the other electron part.
- It is preferable that the outer shell plates are made of a brazing sheet having a core material and a brazing metal arranged on an inner surface of the core material, the intermediate plate and the inner fins are made of a metal plate including a metal baser than the core material of the outer shell plates, and a pair of the outer shell plates are joined to each other at the inner surfaces thereof at the ends (a thirty-fourth aspect of the present invention).
- In this case, it is possible to prevent the outer shell plates from corroding by making the inner fins and the intermediate plate corrode before the outer shell plates. Due to this, it is possible to prevent the cooling medium from leaking out from the cooling tubes.
- The brazing material is arranged on the joined surface between a pair of the outer shell plates and, therefore, it is possible to easily join a pair of the outer shell plates by brazing and to easily manufacture the cooling tube.
- The description “a metal baser than the core material” means a metal, the corrosion potential of which is lower than that of the metal used as the core material. For example, when aluminum (Al) is used as the core material and the brazing material, a metal material, which is aluminum added with zinc (Zn) can be used as a metal plate used for the intermediate plate and the inner fin.
- It is preferable that the outer shell plates are made of a brazing sheet having a core material, a sacrifice anode material arranged on the inner surface of the core material, and the brazing material arranged on the inner surface of the sacrifice anode material. (a thirty-fifth aspect of the present invention).
- In this case, it is possible to prevent the core material from corroding by making the sacrifice anode material corrode first before the core material in the outer shell plate. Due to this, it is unlikely that corrosion advances in the direction of thickness of the outer shell plate and it is possible to prevent the cooling tube from being pitted.
- For example, when aluminum (Al) is used as the core material, a meta material, which is aluminum added with zinc (Zn) can be used as the sacrifice anode material.
- It is preferable that the outer shell plates are made of a brazing sheet having a core material and a sacrifice anode material arranged on the inner surface of the core material, the intermediate plate is made of a brazing sheet having core material and brazing materials arranged on both surfaces of the core material, the inner fins are made of a metal plate including a metal baser than the core material of the outer shell plate, and a pair of the outer shell plates are formed by joining the inner surface at ends thereof to both surfaces at the ends of the intermediate plate (a thirty-sixth aspect of the present invention).
- In this case, it becomes possible to cover the entire inner surface of the cooling tube with the sacrifice anode material, and it is possible to prevent the core material of the outer shell plates from corroding and also to prevent the cooling tube from being pitted.
- Moreover, a pair of the outer shell plates are joined to the end parts of both surfaces of the intermediate plate, both surfaces of which are provided with the brazing material. Therefore, it is possible to easily join a pair of the outer shell plates to the intermediate plate by brazing and, therefore, to easily manufacture the cooling tube.
- It is preferable that a first cooling tube, which has been arranged at one end in the direction of built-up of a plurality of the cooling tubes, has a refrigerant introduction inlet for introducing the cooling medium to the supply header section and a refrigerant discharge outlet for discharging the cooling medium from the discharge header section and, at the same time, the refrigerant introduction inlet and the refrigerant discharge outlet have a protruding opening part protruding toward the outside of the first cooling tube, and a refrigerant introduction pipe and a refrigerant discharge pipe are inserted into the protruding opening parts at the refrigerant introduction inlet and the refrigerant discharge outlet, respectively (a thirty-seventh aspect of the present invention).
- In this case, it is possible to prevent the flow passage between the supply header section and the refrigerant flow passage or between the discharge header section and the refrigerant flow passage from being blocked by the above-mentioned refrigerant introduction pipe or the refrigerant discharge pipe. Due to this, it is possible for the first cooling tube also to ensure the sectional area of the flow passage similar to that of other cooling tubes and it becomes possible to evenly cool the electronic parts.
- The above-mentioned protruding opening part can be formed by means of, for example, burring process by erecting the protruding opening part on the main surface of the cooling tube substantially vertically. Moreover, the protruding opening part can be made to protrude, for example, 2 mm.
- The symbols in the parenthesis attached to each means indicate the relationship of correspondence with specific means in embodiments, which will be described later.
- The present invention may be more fully understood from the description of the preferred embodiments of the invention set forth below, together with the accompanying drawings.
-
FIG. 1 is a front view of a cooler according to a first embodiment of the present invention. -
FIG. 2 is a sectional view of an important part, along the I-I line inFIG. 1 . -
FIG. 3A is a front view of a tube alone inFIG. 1 . -
FIG. 3B is a plan view of the tube inFIG. 3A . -
FIG. 4 is an enlarged view of an important part of an inner fin inFIG. 2 . -
FIG. 5 is a diagram showing a relationship between the fin flow passage width wf and the tube surface temperature Tw. -
FIG. 6 is a diagram showing a relationship between the fin height hf and the tube surface temperature Tw. -
FIG. 7 is a diagram showing a relationship between the fin plate thickness tf and the tube surface temperature Tw. -
FIG. 8 a diagram showing a relationship between the plate thickness tp ofplates -
FIG. 9A is a front view of a cooler according to a second embodiment of the present invention. -
FIG. 9B is a plan view of the cooler inFIG. 9A . -
FIG. 10 is a sectional view of a tube alone in a cooler according to a third embodiment of the present invention. -
FIG. 11A is a sectional view of atube 1 in a free state in a cooler according to a fourth embodiment of the present invention. -
FIG. 11B is a sectional view of afin 5 in a state of being buckled. -
FIG. 12A is a sectional view of a tube alone in a cooler according to a fifth embodiment. -
FIG. 12B is an enlarged sectional view of part B inFIG. 12A . -
FIG. 13A is a sectional view of a tube alone in a cooler according to a sixth embodiment of the present invention. -
FIG. 13B is an enlarged sectional view of part C inFIG. 13A . -
FIG. 14A is a sectional view of a tube alone in a cooler according to a seventh embodiment of the present invention. -
FIG. 14B is an enlarged sectional view of part D inFIG. 14A . -
FIG. 15A is a sectional view of a tube alone in a cooler according to an eighth embodiment of the present invention. -
FIG. 15B is an enlarged sectional view of part E inFIG. 15A . -
FIG. 16 is a front view of the cooler according to the first embodiment of the present invention. -
FIG. 17 is a plan view of the cooler inFIG. 16 . -
FIG. 18 is a sectional view along the II-II line inFIG. 16 . -
FIG. 19 is a sectional view of a tube along the III-III line inFIG. 17 . -
FIG. 20 is an enlarged view of part C inFIG. 16 . -
FIG. 21 is a front view of the cooler according to the second embodiment of the present invention. -
FIG. 22 is a plan view of a cooler of a built-up type in an eleventh embodiment. -
FIG. 23 is a sectional view in the vicinity of a supply header section of the cooler of a built-up type in the eleventh embodiment. -
FIG. 24 is a sectional view in the vicinity of the supply header section in the eleventh embodiment before a diaphragm part is deformed. -
FIG. 25 is a sectional perspective view of a cooling tube in the eleventh embodiment. -
FIG. 26 is a sectional view of a connection part of a refrigerant introduction pipe (or a refrigerant discharge pipe) and a refrigerant introduction inlet (or a refrigerant discharge outlet) in the eleventh embodiment. -
FIG. 27 is a sectional view in the vicinity of a supply header section of a cooler of a built-up type in a twelfth embodiment. -
FIG. 28 is a sectional view in-the vicinity of the supply header section in the twelfth embodiment when the radius of curvature at the rise part of a protruding pipe part is increased. -
FIG. 29 is a sectional view in the vicinity of the supply header section in the twelfth embodiment when the rise part of the protruding pipe part is reinforced with a fillet made of a brazing material. -
FIG. 30 is a sectional view in the vicinity of a supply header section of a cooler of a built-up type in a comparative example. -
FIG. 31 is a sectional view in the vicinity of a supply header section of a cooler of a built-up type in a thirteenth embodiment. -
FIG. 32 is a sectional view of a cooling tube, which is perpendicular to a refrigerant flow passage in a fourteenth embodiment. -
FIG. 33 is a sectional view of a supply header section (a discharge header section) in the fourteenth embodiment. -
FIG. 34 is a sectional view of a cooling tube, which is perpendicular to a refrigerant flow passage in a fifteenth embodiment. -
FIG. 35 is a sectional view of a supply header section (or a discharge header section) in the fifteenth embodiment. -
FIG. 36 is a sectional view of a cooling tube, which is perpendicular to a refrigerant flow passage in a sixteenth embodiment. -
FIG. 37 is a sectional view of a supply header section (or a discharge header section) in the sixteenth embodiment. -
FIG. 38 is a perspective view of a tube alone in a conventional cooler. -
FIG. 39 is a plan view of a cooler of a built-up type in a conventional example. -
FIG. 40 is a sectional view of a cooler of a built-up type in another conventional example. - A cooler according to a first embodiment of the present invention is explained below.
FIG. 1 is a front view of the cooler according to the first embodiment,FIG. 2 is a sectional view of an important part along the I-I line inFIG. 1 ,FIG. 3A is a front view of a tube alone inFIG. 1 ,FIG. 3B is a plan view of the tube inFIG. 3A , andFIG. 4 is an enlarged view of an important part of a fin inFIG. 2 . - The cooler of the present invention can be used to cool a semiconductor module of a double-sided cooling type in an inverter for a hybrid electric vehicle.
- As shown in
FIG. 1 andFIG. 2 , the cooler comprises: a plurality oftubes 1 in which afluid passage 10 is formed internally through which a cooling fluid flows and piled at predetermined intervals in the direction Y (hereinafter, referred to as the direction of built-up Y) perpendicular to the direction X (hereinafter, referred to as the direction of flow X) of flow of the cooling fluid in thefluid passage 10; bellows 2 arranged between neighboringtubes 1 and coupling the neighboringtubes 1; aninlet pipe 3 joined by brazing to thetube 1 located at the end in the direction of built-up Y and into which the cooling fluid flows; an outlet pipe 4 joined by brazing to thetube 1 located at the end in the direction of built-up Y and from which the cooling fluid flows out; andfins 5 arranged within thefluid passage 10 and accelerating heat exchange. Thebellows 2 correspond to coupling means of the present invention. As the cooling fluid, water mixed with an ethylene glycol base antifreeze liquid is used in the present embodiment. - As shown in
FIG. 2 toFIG. 4 , thetube 1 comprises twoplates plates fin 5, which is made by forming a thin plate made of aluminum into a corrugated plate by press molding, is sandwiched between the twoplates 1 a and lb. It is preferable that theplates fin 5 use a brazing sheet material with a sacrifice anode material attached to the inside thereof, in order to prevent pitting corrosion. The joined part is brazed using a paste brazing material, etc. Moreover, it is also preferable that the fin uses a brazing sheet material, both surfaces of which are clad with a brazing material. - In the
tube 1, circular connection holes 11, which allow thefluid passage 10 and the inside of thebellows 2 to connect with each other, are formed at both ends in the direction of the cooling fluid flow within thefluid passage 10 and, at the same time, at the end faces in the direction of built-up Y. The connection holes 11 are formed by press molding before joining by brazing. - The
bellows 2 is a bellows-shaped pipe and can extend and contract readily in the direction of built-up Y. In addition, thebellows 2 is made of aluminum and is joined by brazing to thetubes 1 so as to surround each of the connection holes 11 of thetube 1 adjacent thereto. - The
inlet pipe 3 and the outlet pipe 4 are made of aluminum, and inserted into the connection holes 11 of thetube 1 located at the end in the direction of built-up Y and are joined by brazing to thetube 1. Theinlet pipe 3 and outlet pipe 4 are connected to a pump (not shown) for circulating the cooling fluid and a heat exchanger (not shown) for cooling the cooling fluid. - The
fin 5 is partly joined by brazing to thetube 1 and the portions of thefin 5, which are joined to thetube 1, are formed into an arc shape. Thefins 5 are arranged in areas so that thefins 5 do not overlap the connection holes 11 when viewed in the direction of built-up Y. In addition, thefin 5 divides thefluid passage 10 within thetube 1 into a plurality of fine (small) flow passages. - A semiconductor module of a double-
sided cooling type 6, which is a heat producing body, incorporates an IGBT element and a diode, corresponding to an electronic part according to the present invention. As shown inFIG. 1 , thesemiconductor module 6 is arranged between neighboringtubes 1 and thetubes 1 and thesemiconductor module 6 come into contact with each other directly, or via an insulating material (a ceramic plate, in most cases) or a thermally conductive grease. Thesemiconductor module 6 is held between thetubes 1 by sandwiching and pressing the piledtubes 1 from both ends in the direction of built-up Y using plate springs, not shown. - In the above-mentioned configuration, the cooling fluid that has flowed in from the
inlet pipe 3 flows into one end of thefluid passage 10 of each of thetubes 1 through thebellows 2, flows through thefluid passage 10 along the direction of flow X, and reaches the outlet pipe 4 through thebellows 2 from the other end of thefluid passage 10. Then, heat exchange is effected between the cooling fluid flowing through thefluid passage 10 and thesemiconductor module 6 and, thus, thesemiconductor module 6 is cooled. - In order to reduce the temperature of the
semiconductor module 6 below the warranty temperature, the specifications of theplates fin 5 are designed and optimized so that a temperature Tw (hereinafter, referred to as a tube surface temperature) at the portion of thetube 1, with which thesemiconductor module 6 comes into contact, falls below a predetermined temperature (110° C., in the present embodiment). - The result of the discussion on the specifications of the
plates fin 5 is explained below. Here, a fin flow passage width wf, a fin height hf, a fin plate thickness tf, and a plate thickness tp are discussed. The fin flow passage width wf is a dimension in the direction perpendicular to both the direction of flow X and the direction of built-up Y, at a central position in the direction of fin height in the fine flow passage. - The design conditions are as follows: the temperature of the cooling fluid that flows into the cooler is 65° C.; the heating value of the
semiconductor module 6 is 400 W/unit; and the flow rate of the cooling fluid in thesingle tube 1 is a constant value of 1 L/min. In addition, the relationship between a plate width wp and a width we of thesemiconductor module 6 is determined so that wp>we holds. The plate width wp is a dimension in the direction perpendicular to both the direction of flow X and the direction of built-up Y in a flat surface of thetube 1 in opposition to thesemiconductor module 6. The width we of thesemiconductor module 6 is a dimension thereof in the direction perpendicular to both the direction of flow X and the direction of built-up Y. -
FIG. 5 shows the tube surface temperature Tw when the fin flow passage width wf is varied. Here, the fin height hf is set to 4.0 mm, the fin plate thickness tf is set to 0.2 mm, and the plate thickness tp is set to 0.4 mm. - From the result, it is found possible to reduce the tube surface temperature Tw to 110° C. or lower by setting the fin flow passage width wf to 1.2 mm or less. It is preferable that the fin flow passage width wf be about 0.9 mm if clogging with foreign matter and the cooling performance are taken into account.
-
FIG. 6 shows the tube surface temperature Tw when the fin height hf is varied. Here, the fin flow passage width wf is set to 0.9 mm, the fin plate thickness is set to 0.2 mm, and the plate thickness tp is set to 0.4 mm. - From the result, it is found possible to reduce the tube surface temperature Tw to 110° C. or lower by setting the fin height hf to 1 mm to 10 mm. It is preferable that the fin height hf be about 4 mm if the dimension of the cooler in the direction of built-up Y and cooling performance are taken into account.
-
FIG. 7 shows the tube surface temperature Tw when the fin plate thickness tf is varied. Here, the fin flow passage width wf is set to 0.9 mm, the fin height hf is set to 4.0 mm, and the plate thickness tp is set to 0.4 mm. - From the result, it is found possible to reduce the tube surface temperature Tw to 110° C. or lower by setting the fin plate thickness tf to 1 mm or less. It is most preferable that the fin plate thickness tf be 0.2 mm from the standpoint of cooling performance. Currently, the limit of the plate thickness is about 0.03 mm.
-
FIG. 8 shows the tube surface temperature Tw when the plate thickness tp is varied. Here, the fin flow passage width wf is set to 0.9 mm, the fin height hf is set to 4.0 mm, and the fin plate thickness tf is set to 0.2 mm. - From the result, it was found possible to reduce the tube surface temperature Tw to 110° C. or lower by setting the plate thickness tp to 5 mm or less. It is preferable that the plate thickness tp be 0.1 mm or greater from the standpoint of moldability in the press working and that the plate thickness tp be about 0.4 mm if the ease of fitting between the
semiconductor module 6 and the surfaces of theplates - In the present embodiment, as the
tube 1 is formed by joining the edges of the twoplates plates - As the
fin 5, as well as thetube 1, can also be formed by press molding, the manufacturing process is simplified and the manufacturing cost can be reduced. - Both the fact that the portion of the
fin 5, which is joined to thetube 1, is arc-shaped and the fact that thetube 1 and thefin 5 can be made thin produce a synergic effect to make it easier for thetube 1 to deform when thesemiconductor module 6 is held between thetubes 1 and, therefore, the opposing contact surfaces of thetube 1 and thesemiconductor module 6 are made easier to fit with each other and the adhesiveness thereof is improved. As a result, the contact thermal resistance thereof can be reduced. - As the plate thickness of the
plates fluid passage 10 can be increased accordingly. As a result, the flow resistance thereof can be reduced and the power of the pump required to circulate the cooling fluid can also be reduced. - As the
fins 5 are arranged in areas in which thefins 5 do not overlap the connection holes 11 when viewed in the direction of built-up Y of thetubes 1, thefins 5 do not occupy any excess area and, therefore, the pressure loss can be reduced accordingly compared to the case where thefin 5 occupies the entire area within thetube 1. - As the
bellows 2 can extend and contract readily in the direction of built-up Y, it is possible to easily vary the distance between neighboringtubes 1 in accordance with the thickness of thesemiconductor module 6 when sandwiching and pressing the laminated (piled)tubes 1 in the direction of built-up Y using the plate springs. - As the fin height hf is set greater than the fin flow passage width wf, the heat transfer area of the
fin 5 increases and the cooling performance improves. - As the fin plate thickness tf is set to less than the plate thickness tp, when the
semiconductor module 6 is made to come into closer contact with the surfaces of theplates semiconductor module 6, the surfaces of thesemiconductor module 6 and the plates la and 1 b become easier to fit with each other because thefin 5 is easier to deform compared to theplates - A cooler according to a second embodiment of the present invention is explained below.
FIG. 9A is a front view of the cooler according to the second embodiment andFIG. 9B is a plan view of the cooler inFIG. 9A . The same numerals or letters are assigned to the parts the same as or similar to those in the first embodiment and no explanation thereof will be given here. - In
FIG. 9B , the broken line denotes the position at which thefin 5 is arranged and the alternate long and short dash line denotes the position at which thesemiconductor module 6 is arranged. As shown inFIG. 9B , the twofins 5 are arranged in thesingle tube 1 and the twofins 5 are arranged apart from each other at aninterval 6, along the direction of flow X of the cooling fluid within thefluid passage 10. Thesemiconductor module 6 is arranged within the area in which thefin 5 is arranged when viewed in the direction of built-up Y of thetubes 1. - In the present embodiment, as the two
fins 5 are arranged in thesingle tube 1, it is possible to properly use the twofins 5 having different heat exchange performance according to the heating value, etc. of the semiconductor module. - As the cooling fluid receives the heat generated by the
semiconductor module 6 on the upstream side and rises in temperature, thesemiconductor module 6 on the downstream side relatively rises in temperature accordingly, but it is possible to improve the cooling performance of thesemiconductor module 6 on the downstream side by changing the type of thefin 5 on the downstream side to a type having higher performance (for example, an offset fin). When thesemiconductor module 6 on the upstream side has a high heating value, the cooling performance can be improved by arranging thefin 5 having higher performance on the upstream side. - By providing the
intervals 6, the velocity boundary layer of the cooling fluid is cleared in the interval and the thermal boundary layer of the cooling fluid is also removed and, therefore, the ability to cool thesemiconductor module 6 on the downstream side of theinterval 6 is improved. It is effective for the interval 8 to be equal to or greater than 1 mm. - A cooler according to a third embodiment of the present invention is explained below.
FIG. 10 is a sectional view of a tube in the cooler according to the third embodiment. In the present embodiment, the configuration of thetube 1 differs from that in the first embodiment but the other parts are the same as those in the first embodiment. - As shown in
FIG. 10 , thetube 1 in the present embodiment is formed by bending a plate 1 c, which is a thin plate formed into a predetermined shape by press molding, and joining by brazing the edges of the plate 1 c in a state in which thefin 5 is sandwiched between the bent plate 1 c. - According to the present embodiment, it is possible to reduce the number of parts, the time of the fabricating process and, therefore, the cost compared to the first embodiment in which the
tube 1 is formed by the twoplates - A cooler according to a fourth embodiment of the present invention is explained below.
FIG. 11A is a sectional view of thetube 1 in the cooler according to the fourth embodiment in a free state andFIG. 11B is a sectional view in a state in which thefin 5 is deformed by buckling force. In the present embodiment, the configuration of thefin 5 differs from that in the first embodiment and other parts are the same as those in the first embodiment. - In the first embodiment, the arc-shaped
fin 5, the portion of which to be joined to thetube 1 has been formed into an arc shape, is used, but in the present embodiment, arectangular fin 5, the portion of which to be joined to thetube 1 has been formed into a flat shape as shown inFIG. 11A , is used. - An experiment was conducted as follows. An electronic part (not shown) was sandwiched from both sides thereof by the
tubes 1 according to the present embodiment and stress was applied in the direction of built-up Y. The result was that when the thickness of thefin 5 was 0.4 mm or less, thefin 5 buckled without inflicting damage (for example, the destruction of the circuit) on the electronic part. - From the comparison between the rectangular fin (according to the present embodiment) and the arc-shaped fin (according to the first embodiment) having the same thickness of 0.4 mm and the same pitch, it was found that the arc-shaped fin deformed under less stress than the rectangular fin and the arc-shaped fin was more preferable in shape to reduce the stress applied to the electronic part.
- A cooler according to a fifth embodiment of the present invention is explained below.
FIG. 12A is a sectional view of a tube alone in the cooler according to the fifth embodiment andFIG. 12B is an enlarged sectional view of part B inFIG. 12A . In the present embodiment, the configurations of thetube 1 and thefin 5 differ from those in the first embodiment and the other parts are the same as those in the first embodiment. - The
plates fin 5 is made of a brazing sheet, which comprises analuminum core material 50 andbrazing materials 51 coated on the both sides thereof. Zinc (Zn) is added to thecore material 50. Theplates fin 5 are joined by thebrazing materials 51 of the fin and the twoplates brazing materials 51 is lower than the melting point of thecore material 50 of thefin 5 and the melting point of theplates - According to the present embodiment, as the
plates plate semiconductor module 6 and theplates - As zinc (Zn) is added to the
core material 50 of thefin 5, thefin 5 becomes potentially baser than theplates fin 5 corrodes before theplates tube 1 from being pitted. - A cooler according to a sixth embodiment of the present invention is explained below.
FIG. 13A is a sectional view of a tube alone in the cooler according to the sixth embodiment andFIG. 13B is an enlarged sectional view of part C inFIG. 13A . In the present embodiment, the configurations of thetube 1 and thefin 5 differ from those in the first embodiment and the other parts are the same as those in the first embodiment. - The
plates aluminum core material 100 one side of which is coated with asacrifice anode material 101, and both plates are joined so that thecore material 100 is located on the outside and thesacrifice anode material 101 is located on the inside. Thesacrifice anode material 101 is potentially (electrically) baser than thecore material 100. Thefin 5 is identical to thefin 5 in the fifth embodiment. - According to the present embodiment, even after the
fin 5 has corroded completely, thesacrifice anode material 101 corrodes before thecore material 100 in theplates core material 100 of theplates tube 1 can be prevented from being pitted. - As the
plates core material 100 is located on the outside, it is unlikely that the surfaces of theplates semiconductor module 6 and theplates - As Zn is added to the
core material 50 of thefin 5, thefin 5 becomes potentially baser than the plates la and 1 b. Therefore, thefin 5 corrodes before theplates tube 1 from being pitted. - A cooler according to a seventh embodiment of the present invention is explained below.
FIG. 14A is a sectional view of a tube in the cooler according to the seventh embodiment andFIG. 14B is an enlarged sectional view of part D inFIG. 14A . In the present embodiment, the configurations of thetube 1 and thefin 5 differ from those in the first embodiment and the other parts are the same as those in the first embodiment. - The
plates aluminum core material 100 one side of which has been coated with abrazing material 102, and both plates are joined so that thecore material 100 is located on the outside and thebrazing material 102 is located on the inside. Thefin 5 is identical to thefin 5 in the fifth embodiment. - According to the present embodiment, as the
plates brazing material 102, the time (man-hour) of assembling processes such as a process in which a paste brazing material is attached can be reduced. - As the
plates core material 100 is located on the outside, it is unlikely that the surfaces of theplates semiconductor module 6 and theplates - As Zn has been added to the
core material 50 of thefin 5, thefin 5 becomes potentially baser than theplates fin 5 corrodes before theplates tube 1 from being pitted. - A cooler according to an eighth embodiment of the present invention is explained below.
FIG. 15A is a sectional view of a tube in the cooler according to the eighth embodiment andFIG. 15B is an enlarged sectional view of part E inFIG. 15A . In the present embodiment, the configurations of thetube 1 and thefin 5 differ from those in the first embodiment but the other parts are the same as those in the first embodiment. - The
plates sacrifice anode material 101 is arranged between thealuminum core material 100 and thebrazing material 102, and both plates are joined so that thecore material 100 is located on the outside and thebrazing material 102 is located on the inside. Thefin 5 is identical to thefin 5 in the fifth embodiment. - According to the present embodiment, as the
plates brazing material 102, the time (man-hour) of assembling processes, such as a process in which a-paste brazing material is attached, can be reduced. - Moreover, even after the
fin 5 has corroded completely, thesacrifice anode material 101 corrodes before thecore material 100 in theplates core material 100 of theplates tube 1 from being pitted. - As the
plates core material 100 is located on the outside, it is unlikely that the surfaces of theplates semiconductor module 6 and theplates - As Zn has been added to the
core material 50 of thefin 5, thefin 5 becomes potentially baser than theplates fin 5 corrodes before theplates tube 1 from being pitted. - A cooler according to a ninth embodiment of the present invention is explained below.
FIG. 16 is a front view of the cooler according to the ninth embodiment,FIG. 17 is a top plan view of the cooler inFIG. 16 ,FIG. 18 is a sectional view along the II-II line inFIG. 16 ,FIG. 19 is a sectional view of a tube along the III-III line inFIG. 17 , andFIG. 20 is an enlarged view of part C inFIG. 16 . - As shown in
FIG. 16 toFIG. 19 , the cooler comprises a plurality offlat tubes 501 having, internally, afluid passage 501 a through which a cooling fluid flows. The plurality offlat tubes 501 are arranged in layers at predetermined intervals in the direction Y (hereinafter, referred to as the direction of built-up Y) perpendicular to the direction X in which the cooling fluid flows within thefluid passage 501 a (referred to as the direction of flow X). In the present embodiment, water mixed with an ethylene glycol base antifreeze liquid is used as the cooling fluid. - The flat tube-501 comprises two plates, which are an aluminum thin plate formed into a predetermined shape by press molding. The
flat tube 501 is formed by joining by brazing the edges of the two plates in a state in which afin 502, which is an aluminum thin plate formed into a corrugated shape by press molding, is sandwiched between the two plates. - In the
flat tube 501, in total, threenarrow parts 501 b, which become narrow in the direction of built-up Y, are formed in the vicinity of both ends in the direction of flow X and at the central part, respectively. Thenarrow parts 501 b extend in the direction perpendicular to the direction of built-up Y and the direction of flow X. Thenarrow parts 501 b are located at portions of theflat tube 501 at which are semiconductor modules (to be described in detail later) are not held. - The
fins 502 accelerate heat exchange between the cooling fluid and theflat tube 501 and are arranged at positions at which thenarrow parts 501 b are not formed. - To one end of each
flat tube 501, aninlet header tank 503 made of aluminum for distributing the cooling fluid to theflat tubes 501 is joined by brazing, and to one end of theinlet header tank 503, aninlet pipe 504 made of aluminum, through which the cooling fluid flows in, is joined by brazing. - To the other end of each
flat tube 501, anoutlet header tank 505 made of aluminum for gathering the cooling fluid from theflat tubes 501 is joined by brazing, and to one end of theoutlet header tank 505, anoutlet pipe 506 made of aluminum, through which the cooling fluid flows out, is joined by brazing. - The
inlet pipe 504 and theoutlet pipe 506 are connected to a pump (not shown) for circulating the cooling fluid and to a heat exchanger (not shown) for cooling the cooling fluid. - Two semiconductor modules, of a double-
sided cooling type 507, which are heat producing bodies, are arranged between neighboringflat tubes 501. In other words, thesemiconductor modules 507 are arranged in two or more rows (two rows in the present embodiment) when viewed in the direction of built-up Y. Theflat tube 501 and thesemiconductor module 507 come into contact with each other directly or via an insulating material (a ceramic plate, in most cases) or thermally conductive grease. Thesemiconductor module 507 in the present embodiment which incorporates an IGBT element and a diode and corresponds to the electronic part in the present invention. - The
semiconductor module 507 is held between theflat tubes 501, to which a pressing force is applied in the direction of built-up Y, by sandwiching and pressing the laminated (piled)flat tubes 501 from both ends in the direction of built-up Y using plate springs 508. Theplate spring 508 applies a pressing force to each of a plurality of the rows of thesemiconductor modules 507 independently of each other by independently sandwiching and pressing each of the rows in which a plurality of thesemiconductor modules 507 are arranged. - As described above, when a pressing force is applied in the direction of built-up Y by the
plate spring 508, theflat tube 501 deforms in the direction of built-up Y at thenarrow parts 501, as shown inFIG. 20 , in accordance with the interval between theflat tubes 501 and the thickness of thesemiconductor module 507. Due to this, both theflat tubes 501 and thesemiconductor module 507 come into close contact with each other over the entire surfaces thereof in opposition to each other. Moreover, as a pressing force is applied to each of the rows independently of each other, even if neighboringsemiconductor modules 507 vary in thickness from each other, theflat tube 501 deforms in the direction of built-up Y at the portion of the centralnarrow part 501 b, thereby the variation is absorbed. - In the above-mentioned configuration, the cooling fluid that has flowed in through the
inlet pipe 504 flows into one end of thefluid passage 501 a of each of theflat tubes 501 through theinlet header tank 503, flows into theoutlet header tank 505 through thefluid passage 501 a, and reaches theoutlet pipe 506. Then heat exchange is effected between the cooling fluid flowing through thefluid passage 501 a and thesemiconductor module 507 and the semiconductor module is thus cooled. - In the present embodiment described above, the
flat tube 501 deforms readily in the direction of built-up Y at thenarrow parts 501 b in accordance with the interval between theflat tubes 501 and the thickness of thesemiconductor modules 507. At this time, as the part of theflat tube 501 between thenarrow parts 501 b does not deform in an arc-shape, theflat tube 501 and the semiconductor module 7 come into close contact with each other at the entire surfaces thereof in opposition to each other and a sufficient contact area can be ensured between thesemiconductor module 507 and theflat tube 501. - What is required is only to form the
narrow parts 501 b in theflat tube 501 and, therefore, the above can be achieved without increasing the number of parts. - Moreover, as the
flat tube 501 deforms readily in the direction of built-up Y at thenarrow parts 501 b, stress can be prevented from concentrating on the joined parts d between theflat tube 501 and theheader tanks flat tube 501 deforms (refer toFIG. 20 ) and the stress produced by deformation can be reduced. - When the
header tanks flat tube 501 are brazed, the brazing material gathers in thenarrow parts 501 b and, therefore, it is possible to prevent the brazing material from flowing up to the part at which theflat tube 501 and thesemiconductor module 507 come into contact with each other. - As the
narrow parts 501 b are located at the portions of theflat tubes 501 at which thesemiconductor modules 507 are not held, it is possible to prevent the contact area between thesemiconductor module 507 and theflat tube 501 from being reduced. - As a pressing force is applied to each of the two rows of the
semiconductor modules 507 independently of each other, when viewed in the direction of built-up Y, even if neighboringsemiconductor modules 507 vary in thickness from each other, theflat tube 501 deforms in the direction of built-up Y at the centernarrow part 501 b and, thereby the variation can be absorbed and the contact thermal resistance can be reduced. - As the
narrow parts 501 b extend perpendicular to both the direction of built-up Y and the direction of flow X, it is possible to easily deform theflat tubes 501 in the direction of built-up Y at thenarrow parts 501 b. - As the
fins 502 are arranged at positions in theflat tube 501, at which thenarrow parts 501 b are not formed, it is possible to utilize thenarrow parts 501 b to determine the positions of thefins 502 in the manufacturing process. - A cooler according to a tenth embodiment of the present invention is explained below.
FIG. 21 is a front view of the cooler according to the tenth embodiment. The same numerals or letters are assigned to the same or equivalent parts as those in the ninth embodiment and no explanation will be given to them here. - In the present embodiment, as shown in
FIG. 21 , areinforcement plate 509, the rigidity of which, in the direction of built-up Y, is higher than that of theflat tube 501, is provided. Thereinforcement plate 509 is made of aluminum and both ends thereof are joined by brazing to theheader tanks flat tube 501 at one end in the direction of built-up Y. - After the cooler is mounted on, for example, a vehicle, coil springs 511 are provided between the
flat tube 501 at the other end in the direction of built-up Y and afixed wall 510 of the vehicle. A pressing force is applied in the direction of built-up Y by the coil springs 511 and, thereby, thesemiconductor modules 507 are held between theflat tubes 501. At this time, the pressing force of the coil springs 511 is supported by thereinforcement plate 509. Thecoil spring 511 presses each of the rows of thesemiconductor modules 507, which are arranged in two or more rows, independently of each other. - As described above, due to the application of the pressing force in the direction of built-up Y by the
coil spring 511, theflat tubes 501 deform in the direction of built-up Y at thenarrow parts 501 b in accordance with the interval between theflat tubes 501 and the thickness of thesemiconductor modules 507 and, thereby theflat tubes 501 and thesemiconductor module 507 come into close contact at the entire surfaces thereof in opposition to each other. Moreover, as a pressing force is applied to each of the rows independently of each other, even if neighboringsemiconductor modules 507 vary in thickness from each other, theflat tube 501 deforms in the direction of built-up Y at the centernarrow part 501 b and, thereby the variation is absorbed. - In the present embodiment, as the strength of the cooler can be improved by the
reinforcement plate 509, it is possible to prevent the cooler itself from deforming during the transportation of the cooler that does not hold asemiconductor module 507. - Although coil springs 511 are used in the present embodiment, a pressing force may be applied in the direction of built-up Y by plate springs.
- A cooler of built-up type according to an embodiment of the present invention is explained below with reference to
FIG. 22 toFIG. 26 . - As shown in
FIG. 22 , a cooler of built-uptype 1001 according to the present embodiment cools anelectronic parts 1004 from both sides thereof, each of which accommodates an power element, etc., for controlling large power and is formed into a plate-like shape. Theelectronic part 1004 is formed into a flat rectangular solid, in which an electrode for power extends from the outer surface including one long side and another electrode for control extends from the outer surface including the other long side. - A
cooling tube 1002 is arranged in contact with one of the main surfaces of theelectronic part 1004 and anothercooling tube 1002 is arranged in contact with the other main surface of theelectronic part 1004. Thesecooling tubes 1002 are connected to asupply header section 1011 and adischarge header section 1012 provided at both ends of thecooling tubes 1002. In the present embodiment, a plurality of theelectronic parts 1004 are cooled from both sides thereof. Because of this, a plurality of theelectronic parts 1004 and a plurality of thecooling tubes 1002 are arranged alternately. In an assembled body in which a plurality of theelectronic parts 1004 and a plurality of thecooling tubes 1002 are arranged in layers, thecooling tubes 1002 are arranged at both ends of the assembled body in the direction of built-up thereof. - The cooler of a built-up
type 1001 comprises a plurality of thecooling tubes 1002, which are each flat and are provided with arefrigerant flow passage 1021 through which acooling medium 1005 flows, and which are arranged in layers so as to sandwich and hold theelectronic parts 1004 from both sides thereof. The cooler of a built-uptype 1001 comprises thesupply header section 1011 for supplying the cooling medium 1005 to each of therefrigerant flow passages 1021 and thedischarge header section 1012 for discharging the cooling medium 1005 from each of therefrigerant flow passages 1021. - As shown in
FIG. 22 andFIG. 23 , the above-mentionedcooling tube 1002 is provided with protrudingpipe parts 1022 that protrude as well as opening toward the direction of built-up. As shown inFIG. 25 , thecooling tube 1002 is made up by building plates made of metal having a high thermal conductivity, such as aluminum or copper, and by joining the plates by means of joining techniques such as brazing. The plates have a substantially rectangular shape as a whole. Anouter shell plate 1027 that makes up the outer shell of thecooling tube 1002 comprises parts making up a flat pipe that comes into contact with theelectronic part 1004 to take heat therefrom and parts making up thesupply header section 1011 and thedischarge header section 1012. The parts making up thesupply header section 1011 and thedischarge header section 1012 are formed at both ends of theouter shell plate 1027. - The parts making up the
supply header section 1011 and thedischarge header section 1012 of theouter shell plate 1027 are characterized by the protrudingpipe parts 1022 protruding in the vertical direction from the plate-shaped surface of theouter shell plate 1027 anddiaphragm parts 1023 formed into an annular shape on the periphery of the root parts of the protrudingpipe parts 1022 and having a predetermined width in the radial direction. The respective protrudingpipe parts 1022 couple neighboringcooling tubes 1002 in the direction of built-up, make up thesupply header section 1011 and thedischarge header section 1012, and provide a strength that can prevent buckling in the direction of built-up. - The
cooling tube 1002 can comprise the flat pipe part, thediaphragm parts 1023, and the protrudingpipe parts 1022 extending in the direction of built-up. The protrudingpipe part 1022 may comprise a pipe-shaped member separately provided. - The protruding
pipe parts 1022 are connected using counter-lock joints (like female and male joints). In other words, the protrudingpipe part 1022 has a stepped protruding pipe part having alarge diameter 1223 arranged outside and a protruding pipe part having asmall diameter 1222 inserted into the inside of the protruding pipe part having alarge diameter 1223. Because of this, the cooler of a built-uptype 1001 comprises at least two kinds ofouter shell plates 1027. One of the two kinds ofouter shell plates 1027 has the protruding pipe part having alarge diameter 1223 and the other kind ofouter shell plates 1027 has the protruding pipe part having asmall diameter 1222. These two kinds ofouter shell plates 1027 are laminated (piled) alternately in such a manner that the top surface of one (first) kind of the outer shell plates faces the undersurface of the other kind, the topsurface of which in turn faces the undersurface of the first kind, and so on. - The cooler of a built-up
type 1001 further comprises theouter shell plates 1027 for end use at both ends thereof. In other words, one of theouter shell plates 1027 for end use neither forms the protrudingpipe part 1022 nor opens. The otherouter shell plate 1027 for end use is theouter shell plate 1027 to be used for acooling pipe 1020, which will be described later, and forms a protrudingopening parts 1024 for connecting arefrigerant introduction pipe 1031 and arefrigerant discharge pipe 1032 instead of the protrudingpipe parts 1022, as shown inFIG. 26 . - The protruding pipe part having a
large diameter 1223 accommodates the protruding pipe part having asmall diameter 1222 therein. The stepped part formed in the protruding pipe part having alarge diameter 1223 functions as a control part for controlling the insertion length of the protruding pipe part having asmall diameter 1222. The front end of the protruding pipe part having asmall diameter 1222 comes into contact with the stepped part and thus the insertion length in the axial direction is controlled. The controlled part can be composed of a swelling part or a bulged part formed on the outer surface of the protruding pipe part withsmall diameter 1222 in a protruding manner. There exists an interval between the inner surface of the protruding pipe part having alarge diameter 1223 and the outer surface of the protruding pipe part having asmall diameter 1222, which may allow an insertion in the assembling process thereof, but the interval is closed and sealed by joining both protruding pipe parts by brazing. - After being joined, the protruding
pipe parts 1022 provide rigidity that can prevent buckling even if a pressure in the axial direction, namely in the direction of built-up, which can plastically deform thediaphragm part 1023, is applied thereto. - On each of the outer edge parts of the
outer shell plate 1027, anouter wall surface 1274 that is erected in the direction of built-up, aflange part 1275 having a narrow width and extending from theouter wall surface 1274 toward the outside, and anedge part 1276 further extending obliquely from the front end of theflange part 1275 are formed, as shown inFIG. 23 andFIG. 24 . Theflange part 1275 provides a plane extending in the direction perpendicular to the direction of built-up. - A pair of the
outer shell plates 1027 is joined by brazing in a state in which theflange parts 1275 thereof are arranged so as to be parallel to and in contact with each other. Therefore, theouter shell plates 1027 are piled and joined at the outer edge part thereof by theflange part 1275 via a plane perpendicular to the direction of built-up in between. On the other hand, theouter shell plates 1027 are piled and joined at the parts making up thesupply header section 1011 and thedischarge header section 1012 by connecting the protrudingpipe parts 1022 using counter-lock joints via a cylindrical plane in parallel to the direction of built-up in between. It may be possible to adopt a configuration in which flange parts are provided at the front ends of the protrudingpipe parts 1022 extending in the directions in opposition to each other and the outer shell plates are piled and joined via a plane perpendicular to the direction of built-up in between. - The configuration in which the protruding
pipe parts 1022 are connected using counter-lock joints has advantages that the degree of freedom in adjusting the length in the axial direction is higher compared to the structure in which built-up is conducted via a plane perpendicular to the direction of built-up in between, that the manufacture of theouter shell plate 1027 in the forming process is easy, and that the cost is low. - As described above, neighboring
cooling tubes 1002 make therefrigerant flow passages 1021 thereof communicate with each other by joining the sidewalls of the protrudingpipe parts 1022 as well as inserting the protrudingpipe parts 1022 into each other. Due to this, thesupply header section 1011 and thedischarge header section 1012 are formed. - Moreover, as shown in
FIG. 23 , thecooling tube 1002 comprises thediaphragm parts 1023 that deform in the direction of built-up and which are formed around the protrudingpipe parts 1022. Thediaphragm part 1023 deforms toward the inside of thecooling tube 1002 when theelectronic part 1004 is arranged in the cooler of a built-uptype 1001 and the interval between neighboringcooling tubes 1002 is narrowed. - In other words, before sandwiching and holding the
electronic parts 1004, the cooler of a built-uptype 1001 laminates a plurality of thecooling tubes 1002 at intervals somewhat wider than the thickness of theelectronic parts 1004 and connects thecooling tubes 1002 at the protrudingpipe parts 1022 thereof, as shown inFIG. 24 . A plurality of theelectronic parts 1004 are arranged between the coolingtubes 1002 of the cooler of a built-uptype 1001 in such a state. After this, the cooler of a built-uptype 1001 is compressed in the direction of built-up. Due to this, a pressing force is applied to thediaphragm parts 1023 via the protrudingpipe parts 1022 and thediaphragm parts 1023 deform toward the inside of thecooling tube 1002, as shown inFIG. 23 . As a result, the interval between neighboringcooling tubes 1002 is narrowed, thecooling tubes 1002 and theelectronic part 1004 come into close contact with each other, and the electronic part 4001 is sandwiched and held by thecooling tubes 1002. - Moreover, the
cooling tube 1002 comprises a pair of theouter shell plates 1027, anintermediate plate 1028 arranged between the pair of theouter shell plates 1027, and a corrugatedinner fins 1029 arranged between theintermediate plate 1028 and theouter shell plates 1027, as shown inFIG. 25 . - The
refrigerant flow passages 1021 are formed between the intermediate plate 28 and the outer shell plates 27. - Moreover, the
outer shell plates 1027, theintermediate plate 1028, and theinner fins 1029 are joined to one another by brazing to make up thecooling tube 1002. - The
intermediate plate 1028 is a rectangular plate-like shape. Theintermediate plate 1028 hascircular opening parts 1284 at both ends thereof corresponding to thesupply header section 1011 and thedischarge header section 1012. The outer edge part of theintermediate plate 1028 may be sandwiched and held between theouter shell plates 1027. - As shown in
FIG. 22 , afirst cooling tube 1020 among a plurality of thecooling tubes 1002, which is arranged at one end in the direction of built-up, comprises arefrigerant introduction inlet 1013 for introducing the cooling medium 1005 to thesupply header section 1011 and arefrigerant discharge outlet 1014 for discharging the cooling medium 1005 from thedischarge header section 1012. Therefrigerant introduction inlet 1013 and therefrigerant discharge outlet 1014 comprise the respectiveprotruding opening parts 1024 protruding toward the outside of thefirst cooling tube 1020, as shown inFIG. 26 . Then, the respectiverefrigerant introduction pipe 1031 and therefrigerant discharge pipe 1032 are inserted into the respectiveprotruding opening parts 1024 of therefrigerant introduction inlet 1013 and therefrigerant discharge outlet 1014. - The protruding
opening part 1024 protrudes about 2 mm from the main surface of thefirst cooling tube 1020 as well as rising substantially vertically on the main surface thereof by means of a burring process. - Moreover, the
refrigerant introduction pipe 1031 and therefrigerant discharge pipe 1032 are each provided with aflange part 1034 at a part about 2 mm apart away from the end surface of each of openingfront end parts 1033. - The respective opening
front end parts 1033 of therefrigerant introduction pipe 1031 and therefrigerant discharge pipe 1032 are inserted into the insides of the respectiveprotruding opening parts 1024 and, at the same time, theflange parts 1034 come into contact with the front ends of the protrudingopening parts 1024. Due to this, each of the openingfront end parts 1033 of therefrigerant introduction pipe 1031 and therefrigerant discharge pipe 1032 is unlikely to be inserted as far as the inside of theouter shell plate 1027 in thecooling tube 1002 and, therefore, therefrigerant flow passage 1021 is unlikely to be cut off. - The above-mentioned
electronic part 1004 is a semiconductor module that incorporates semiconductor elements such as an IGBT and diodes. The semiconductor module makes up a part of an inverter for a vehicle. - As the cooling medium 1005, water mixed with an ethylene glycol base antifreeze liquid is used.
- Moreover, the
electronic part 1004 can be arranged in a state in which the electronic part is in direct contact with thecooling tube 1002. However, it is possible, as the case may be, to interpose an insulating plate such as ceramic, thermally conductive grease, etc. between theelectronic part 1004 and thecooling tube 1002. - Next, the functions and effects of the present embodiment are explained below.
- In the above-mentioned cooler of a built-up
type 1, as shown inFIG. 22 andFIG. 23 , the respectiverefrigerant flow passages 1021 of neighboring cooling tubes are communicated with each other by inserting the protrudingpipe parts 1022 formed on thecooling tubes 1002, with each other. Because of this, it is not necessary for a plurality of thecooling tubes 1002 to be connected specifically via members separately provided and, therefore, the number of parts can be reduced and the manufacture of the cooler is easy. - Moreover, as shown in
FIG. 23 , the protrudingpipe parts 1022 of neighboringcooling tubes 1002 are connected by joining the sidewalls of the protrudingpipe parts 1022 to each other. Therefore, it is possible for thesupply header section 1011 and thedischarge header section 1012 to ensure a flow passage diameter substantially the same as the inner diameter of the protrudingpipe part 1022. Due to this, it is possible to not only reduce the flow resistance in thesupply header section 1011 and thedischarge header section 1012 but also to prevent pressure loss. Because of this, the cooling medium 1005 can be supplied evenly into a plurality of thecooling tubes 1002 and, moreover, a plurality of theelectronic parts 1004 can be cooled evenly. - As shown in
FIG. 23 , thecooling tube 1002 comprises thediaphragm parts 1023 formed around the protrudingpipe parts 1022. Due to this, it is possible to easily adjust the interval between neighboringcooling tubes 1002 and to easily and firmly arrange theelectronic parts 1004 between neighboringcooling tubes 1002. As a result, theelectronic part 1004 can be made to come into close contact with thecooling tubes 1002. - The
cooling tube 1002 comprises a pair of theouter shell plates 1027, theintermediate plate 1028, and theinner fins 1029. Because of this, it is possible to obtain thecooling tube 1002 having a so-called drawn-cup structure by joining together theouter shell plates 1027, theintermediate plate 1028, and the inner fins 29 after separate manufacture thereof by press molding, etc. Therefore, thecooling tube 1002 can be manufactured easily. - Moreover, it becomes easy to form the
inner fins 1029 at desired positions (areas). Because of this, the forming of thesupply header section 1011 and thedischarge header section 1012 can be made easy by not arranging theinner fins 1029 at areas at which thesupply header section 1011 and thedischarge header section 1012 are formed. - In this case, as shown in
FIG. 25 , therefrigerant flow passages 1021 are formed in two rows in the direction of built-up of thecooling tubes 1002, as a result. Because of this, it is possible to prevent the transfer of heat between theelectronic parts 1004 arranged at both ends of thecooling tube 1002. Therefore, it is possible, for example, to prevent the rapid rise in temperature of one of theelectronic parts 1004 from affecting anotherelectronic part 1004. - The
refrigerant introduction inlet 1013 and therefrigerant discharge outlet 1014 of thefirst cooling tube 1020 are each provided with the protrudingopening part 1024, as shown inFIG. 26 . Because of this, it is possible to prevent therefrigerant introduction pipe 1031 and therefrigerant discharge pipe 1032 from cutting off the flow passage between thesupply header section 1011 or thedischarge header section 1012 and therefrigerant flow passage 1021. Therefore, it is also possible for thefirst cooling tube 1020 to ensure a flow passage sectional area similar to that of theother cooling tubes 1002 and, as a result, theelectronic parts 1004 can be cooled evenly. - As described above, according to the present embodiment, it is possible to provide a cooler of a built-up type capable of not only reducing the manufacturing cost but also making a cooling medium flow evenly to a plurality of cooling tubes.
- A twelfth embodiment is an embodiment, as shown in
FIG. 27 toFIG. 29 , in which acooling tube 1002 comprises adiaphragm part 1023 formed around one of a pair of protrudingpipe parts 1022 arranged in opposition to each other, and does not comprise adiaphragm part 1023 around the other protrudingpipe part 1022. - The
cooling tube 1002 comprises thediaphragm part 1023 formed around one of a pair of the protrudingpipe parts 1022 which is provided on the downstream side of thesupply header section 1011. - Moreover, a
flow rectifying part 1025 is provided at the inlet part of thecooling tube 1002 which is a part of theintermediate plate 1028 deformed so as to be involved in the upstream side of thesupply header section 1011. Theflow rectifying part 1025 controls the flow passage sectional area at the inlet part of one of the two rows ofrefrigerant flow passages 1021 sandwiching theintermediate plate 1028 to be equal to that of the otherrefrigerant flow passage 1021. - The
flow rectifying part 1025 is formed at the edge of theopening part 1284 of theintermediate plate 1028. Theflow rectifying part 1025 adjusts the flow rate of the refrigerant fluid to be distributed to the upper and lower flow passages defined by theintermediate plate 1028. It is possible to adjust the flow rate of the refrigerant fluid to be distributed evenly or unevenly by the shape of theflow rectifying part 1025 in accordance with, for example, the need to cool theelectronic parts 1004, which are objects to be cooled. Theflow rectifying part 1025 is formed by deforming the edge part of the opening part of theintermediate plate 1028 by a predetermined deformation amount in the same direction as that in which thediaphragm part 1023, provided to only one of thecooling tubes 1002, deforms. - As described above, methods for forming the
diaphragm part 1023 around only one of the protrudingpipes 1022, namely methods for deforming only one part includes, for example, a method in which the other protrudingpipe part 1022 is prevented from being deformed by a pressing force in the direction of built-up by reinforcing the rising part of the other protrudingpipe part 1022, as shown inFIG. 28 andFIG. 29 . In other words, the method shown inFIG. 28 is a method in which the radius of curvature of theouter shell plate 1027 is increased at the rising part of the other protrudingpipe part 1022. The method shown inFIG. 29 is a method in which afillet 1221 made of a brazing material, which is formed by joining the protrudingpipe parts 1022 of neighboringcooling tubes 1002 by brazing, is made to overlap the rise part of the other protrudingpipe part 1022. - Others are the same as those in the eleventh embodiment.
- In the case of the present embodiment, it becomes easy to manufacture the cooler of a built-up
type 1 so as to have a constant shape in a state in which theelectronic part 1004 is sandwiched and held therebetween. - In other words, if the
diaphragm parts 1023 are provided around both the protrudingpipe parts 1022 and deformed as in the eleventh embodiment (refer toFIG. 23 ), the two protruding pipe parts may vary in the amount of deformation from each other. Then, in this case, if an attempt is made to adjust the amount of deformation of thediaphragm parts 1023, it becomes necessary to accurately control various conditions such as the throttle (reducing area) rate during press molding and the plate thickness of thecooling tube 1002. - Therefore, as described above, by providing the
diaphragm part 1023 to only one of the protrudingpipe parts 1022, it becomes easy to perform a specific deformation, when theelectronic part 1004 is sandwiched and held by thecooling tubes 1002, substantially in accordance with the design. - Moreover, the
cooling tube 1002 comprises thediaphragm part 1023 formed around the protrudingpipe part 1022 formed on the downstream side of thesupply header section 1011, which is one of a pair of the protrudingpipe parts 1022. Because of this, it is possible to prevent the smooth supply of the cooling medium 1005 from thesupply header section 1011 to thecooling pipe 1002 from being blocked by thediaphragm part 1023. - In other words, if, as shown in
FIG. 30 , thediaphragm part 1023 is provided around only one of a pair of the protrudingpipe parts 1022 which is formed on the upstream side of thesupply header section 1011, the smooth supply of the cooling medium 1005 from thesupply header section 1011 to thecooling tube 1002 may be blocked. In other words, when the cooling medium 1005 is supplied from thesupply header part 1011 to thecooling tube 1002, the flow of the cooling medium 1005 may separate in the vicinity of thediaphragm part 1023. - Other parts have the same functions and effects as those in the eleventh embodiment.
- A thirteenth embodiment is an embodiment, as shown in
FIG. 31 , in which thecooling tube 1002 comprises a throttle (reducing area)part 1026 for narrowing the width of therefrigerant flow passage 1021 at the inlet part of therefrigerant flow passage 1021. - The
cooling tube 1002 is provided with thediaphragm part 1023 and theflow rectifying part 1025 as in the twelfth embodiment. - The
throttle part 1026 is formed simultaneously when theouter shell plate 1027 is formed by press molding. - The
throttle part 1026 extends continuously across a part of theouter shell plate 1027 in the direction of width of the outershell plate, which makes up the flat part of thecooling tube 1002. Thethrottle part 1026 is formed on theouter shell plate 1027 into a groove-like shape when viewed from the outside thereof. Thethrottle part 1026 reduces the height of therefrigerant flow passage 1021 in the direction of built-up. Thethrottle part 1026 can be formed as a recess part arranged discretely. - The
throttle part 1026 is arranged on the downstream side of thediaphragm part 1023. To be more exact, thethrottle part 1026 is arranged between a portion of thecooling tube 1002, which comes into contact with theelectronic part 1004, and thediaphragm part 1023. In other words, thethrottle part 1026 is arranged on the upstream side of the portion of thecooling tube 1002, which comes into contact with theelectronic part 1004. - The
throttle part 1026 can also be arranged on the downstream side of the portion of thecooling tube 1002, which comes into contact with theelectronic part 1004. Further, thethrottle part 1026 can also be arranged on both the upstream side and the downstream side of the portion of thecooling tube 1002, which comes into contact with theelectronic part 1004. - The
throttle part 1026 has greater rigidity than that of thediaphragm part 1023. Thediaphragm part 1023 can be regarded as a part having relatively small rigidity, which readily deforms plastically in the direction of built-up. - The shape of the
throttle part 1026 is specified so that the flow passage sectional area of therefrigerant flow passage 1021 at thethrottle part 1026 is a minimum. Then, all of thecooling tubes 1002 are made to have the same minimum flow passage sectional area. - Other features are the same as those in the eleventh embodiment.
- In the case of the present embodiment, even if the communication area between the header section and the refrigerant flow passage changes because of the deformation of the
diaphragm part 1023, the flow rate in the refrigerant flow passage can be adjusted to a desired value by means of thethrottle part 1026. This configuration exhibits an advantageous effect when the amount of deformation varies among a plurality of thediaphragm parts 1023. In other words, even if the amount of deformation varies among thediaphragm parts 1023, it becomes easy to make the minimum flow passage sectional area uniform in a plurality of therefrigerant flow passages 1021 and, therefore, the flow rate of the cooling medium 1005 to the respectiverefrigerant flow passages 1021 can be made uniform. - Other parts have the same functions and effects as those in the eleventh embodiment.
- A fourteenth embodiment is an embodiment, as shown in
FIG. 32 andFIG. 33 , in which metal plates are used as anouter shell plate 1027, anintermediate plate 1028, and aninner fin 1029 all making up thecooling tube 1002. - In other words, the
outer shell plate 1027 is made of a brazing sheet having acore material 1271 and abrazing material 1272 arranged on the inner surface of thecore material 1271. - The
intermediate plate 1028 and theinner fin 1029 are composed of metal plates including a metal baser (that is, the corrosion potential is lower) than thecore material 1271 of theouter shell plate 1027. - A pair of the
outer shell plates 1027 join the inner surfaces, at end parts thereof, to each other. - In the case of the present embodiment, as shown in
FIG. 33 , the protrudingpipe part 1022 is provided with thebrazing material 1272 arranged on the inner surface thereof. Then, when the protrudingpipe parts 1022 of neighboringcooling tubes 1002 are inserted into each other, thebrazing material 1272 arranged on the inner surface of one of the protrudingpipe parts 1022 comes into contact with the outer surface of thecore material 1271 of the other protrudingpipe part 1022. Therefore, by heating the contact part in this state, the protrudingpipe parts 1022 are joined to each other by thebrazing material 1272. - Aluminum (Al) can be used as the
core material 1271 and thebrazing material 1272 of theouter shell plate 1027 and a metallic material, which is aluminum to which zinc (Zn) has been added, can be used as theintermediate plate 1028, theinner fin 1029, etc. - Others are the same as those in the eleventh embodiment.
-
FIG. 33 shows a state of thediaphragm part 1023 before deformed. This is applicable toFIG. 35 toFIG. 37 , which will be described later. - In the case of the present embodiment, by making the
inner fin 1029 and theintermediate plate 1028 corrode before theouter shell plate 1027, theouter shell plate 1027 can be prevented from corroding. Because of this, the cooling medium 1005 can be prevented from leaking from thecooling tube 1002. - As the
brazing material 1272 is arranged on the surfaces, to be joined, of a pair of theouter shell plates 1027, it is possible to easily join a pair ofouter shell plates 1027 to each other by brazing and to easily manufacture thecooling tube 1002. - As shown in
FIG. 33 , thebrazing material 1272 is arranged on the inner surface of the protrudingpipe part 1022 and, therefore, when the protrudingpipe parts 1022 of neighboringcooling tubes 1002 are inserted into each other, thebrazing material 1272 arranged on the inner surface of one of the protrudingpipe parts 1022 comes into contact with the outer surface of thecore material 1271 of the other protrudingpipe part 1022. Because of this, it is possible to easily join the protrudingpipe parts 1022 to each other using thebrazing material 1272. - Other parts have the same functions and effects as those in the eleventh embodiment.
- A fifteenth embodiment is an embodiment, as shown in
FIG. 34 andFIG. 35 , in which as theouter shell plate 1027, a brazing sheet is used, having acore material 1271, asacrifice anode material 1273 arranged on the inner surface of thecore material 1271, and abrazing material 1272 arranged on the inner surface of thesacrifice anode material 1273. - A metallic material, which is aluminum (Al) to which zinc (Zn) has been added, can be used as the
sacrifice anode material 1273. - Other parts are the same as those in the fourteenth embodiment.
- In the case of the present embodiment, by making the
sacrifice anode material 1273 corrode before thecore material 1271 also in theouter shell plate 1027, thecore material 1271 can be prevented from corroding. Because of this, corrosion is unlikely to advance in the direction of thickness of theouter shell plate 1027 and thecooling tube 1002 can be prevented from being pitted. - Other features have the same functions and effects as those in the fourteenth embodiment.
- A sixteenth embodiment is an embodiment, as shown in
FIG. 36 andFIG. 37 , in which, as theouter shell plate 1027, a brazing sheet having acore material 1271 and asacrifice anode material 1273 arranged on the inner surface of thecore material 1271, is used. - An
intermediate plate 1028 is made of a brazing sheet having acore material 1281 and abrazing material 1282 arranged on both sides of thecore material 1281. Aninner fin 1029 is composed of a metallic plate including a metal baser (a metal having a lower corrosion potential) than thecore material 1271 of theouter shell plate 1027. - A metallic material, which is aluminum (Al) to which zinc (Zn) has been added, can be used as a metallic plate making up the
inner fin 1029, and asacrifice anode material 1273. - A pair of the
outer shell plates 1027 is formed by joining the inner surfaces at the ends thereof to both sides at the ends of theintermediate plate 1028. - Moreover, as shown in
FIG. 37 , the protrudingpipe part 1022 is composed of theouter shell plate 1027 on which the brazing material is not arranged. Therefore, the protrudingpipe parts 1022 of neighboringcooling tubes 1002 are joined by newly arranging a paste brazing material, a ring brazing material, etc (not shown). - Other features are the same as those in the eleventh embodiment.
- In the case of the present embodiment, it becomes possible to cover the entire inner surface of the
cooling tube 1002 with thesacrifice anode material 1273, to prevent thecore material 1271 of theouter shell plate 1027 from corroding and to prevent thecooling tube 1002 from being pitted. - Moreover, a pair of the
outer shell plates 1027 are joined to the end parts of both sides of theintermediate plate 1028, on both sides of which thebrazing material 1282 has been arranged. Therefore, it is possible to easily join a pair of theouter shell plates 1027 to theintermediate plate 1028 by brazing and to easily manufacture thecooling tube 1002. - Other features have the same functions and effects as those in the eleventh embodiment.
- In the embodiments described above, aluminum is used as a material of a tube and a fin, but a metallic material such as copper and resin can also be used as a material of a tube and a fin, and in this case, a material having a high thermal conductivity is preferable.
- In each of the embodiments described above, water mixed with an ethylene glycol base antifreeze liquid is used as a cooling fluid, but a natural refrigerant such as water and ammonia, a fluorocarbon base refrigerant such as fluorinate, a chlorofluorocarbon base refrigerant such as HCFC123 and HFC134a, an alcohol-based refrigerant such as methanol and alcohol, and a ketone-based refrigerant such as acetone can also be used as a cooling fluid.
- In the embodiments described above, the present invention is applied to cooling of a semiconductor module of a double-sided cooling type of an inverter for a hybrid electric vehicle, but the present invention can also be applied to cooling of, for example, a semiconductor module of a motor drive inverter for industrial equipment, an air-conditioning inverter for air-conditioning buildings, etc.
- The cooler according to the present invention can also cool an electronic part such as a power transistor, a power FET, and an IGBT, in addition to the
semiconductor module 6. - While the invention has been described by reference to specific embodiments chosen for the purposes of illustration, it should be apparent that numerous modifications could be made thereto by those skilled in the art without departing from the basic concept and scope of the invention.
Claims (39)
1. A cooler, comprising:
a plurality of tubes internally including a fluid passage through which a cooling fluid flows and piled at predetermined intervals in a direction perpendicular to a direction (X) in which the cooling fluid flows through the fluid passage; and
coupling means arranged between the neighboring tubes and for coupling the neighboring tubes; wherein
connection holes for making the fluid passage and the inside of the coupling means communicate with each other are formed in each tube,
electronic parts are held between the neighboring tubes,
each of the tubes is formed by joining edge parts of at least a plate formed into a predetermined shape by press molding, and
at least a fin for accelerating heat exchange is arranged in each of the tubes.
2. A cooler as set forth in claim 1 , wherein plate thickness of the fins is equal to or less than 0.4 mm.
3. A cooler as set forth in claim 1 , wherein at least the fin is joined to the tube and portions of the fin, which are joined to the tube, are arc-shaped.
4. A cooler as set forth in claim 1 , wherein at least the fin is arranged at a position at which the fin does not overlap the connection holes when viewed in a direction of built-up (Y) of the tubes, and the electronic part is within an area of installation of the fin when viewed in the direction of built-up (Y) of the tubes.
5. A cooler as set forth in claim 1 , wherein a plurality of the fins are arranged in the single tube at intervals (δ) along the direction (X) in which the cooling fluid flows through the fluid passage.
6. A cooler as set forth in claim 4 , wherein the intervals (δ) are greater than or equal to 1 mm.
7. A cooler as set forth in claim 1 , wherein the connection holes are formed by press molding.
8. A cooler as set forth in claim 1 , wherein each of the tubes is formed by joining the two plates.
9. A cooler as set forth in claim 1 , wherein each of the tubes is formed by bending and joining the single plate.
10. A cooler as set forth in claim 1 , wherein the coupling means are bellows.
11. A cooler as set forth in claim 1 , wherein each of the fins is a corrugated fin that divides the fluid passage into two or more fine flow passages, and
the height (hf) of the fin is greater than width (wf) of the fine flow passage of the fin at a central position of the fine flow passage in a direction of height of the tube.
12. A cooler as set forth in claim 11 , wherein the width (wf) of the fine flow passage is equal to or less than 1.2 mm.
13. A cooler as set forth in claim 11 , wherein the height (hf) of the fin is 1 to 10 mm.
14. A cooler as set forth in claim 1 , wherein the plate thickness (tf) of the fin is less than thickness (tp) of at least the plate.
15. A cooler as set forth in claim 14 , wherein the plate thickness (tf) of the fins is 0.03 to 1.0 mm.
16. A cooler as set forth in claim 14 , wherein the thickness (tp) of at least the plate is 0.1 to 5.0 mm.
17. A cooler as set forth in claim 1 , wherein the tube is formed-by joining at least the plate by brazing, and at least the plate is made of a bare material.
18. A cooler as set forth in claim 1 , wherein the tube is formed by joining at least the plate by brazing, at least the plate is made of a brazing sheet having a core material and a sacrifice anode material, and the core material is located at an outside of the tube.
19. A cooler as set forth in claim 1 , wherein the tube is formed by joining at least the plate by brazing, at least the plate is made of a brazing sheet having a core material and a brazing material, and the core material is located outside the tube.
20. A cooler as set forth in claim 1 , wherein the tube is formed by joining at least the plate by brazing, at least the plate is made of a brazing sheet in which a sacrifice anode material is arranged between a core material and a brazing material, and the core material is located at an outside of the tube.
21. A cooler as set forth in claim 1 , wherein the fins are made of a material that is potentially baser than that of at least the plate.
22. A cooler, comprising:
a plurality of flat tubes internally including a fluid passage through which a cooling fluid flows and piled at predetermined intervals in a direction perpendicular to a direction (X) in which the cooling fluid flows through the fluid passage; and
header tanks arranged at both ends of the flat tubes and for distributing and gathering the cooling fluid; wherein
electronic parts arranged between the neighboring flat tubes are held by applying a pressing force in a direction of built-up (Y) of the tubes; and wherein
narrow parts that become narrower in the direction of built-up (Y) of the tubes are formed in each of the flat tubes.
23. A cooler as set forth in claim 22 , wherein the narrow parts are located at portions of the flat tube, at which the electronic parts are not held.
24. A cooler as set forth in claim 22 , further comprises a reinforcement plate at one end in the direction of built-up (Y) of the tubes, whose rigidity in the direction of built-up (Y) of the tubes is greater than that of each flat tube.
25. A cooler as set forth in claim 22 , wherein the electronic parts are arranged in two or more rows when viewed in the direction of built-up (Y) of the tubes and a pressing force is applied to each of the rows independently of each other.
26. A cooler as set forth in claim 22 , wherein the narrow parts extend in a direction perpendicular to both the direction of built-up (Y) of the tubes and the direction (X) in which the cooling fluid flows through the fluid passage.
27. A cooler as set forth in claim 22 , wherein fins that accelerate heat exchange are arranged at positions in the flat tube, at which the narrow parts are not formed.
28. A cooler of a built-up type for cooling electronic parts from both sides thereof, comprising:
a plurality of flat cooling tubes provided with a refrigerant flow passage through which a cooling medium flows and arranged in layers, so as to sandwich and hold the electronic parts at both sides thereof; and
a supply header section for supplying the cooling medium to each of the refrigerant flow passages; and
a discharge header section for discharging the cooling medium from each of the refrigerant flow passages; wherein
each of the cooling tubes has protruding pipe parts opening and protruding toward the direction of built-up of the cooling tubes, and
neighboring cooling tubes make the refrigerant flow passages thereof communicate with each other by inserting the protruding pipe parts into each other and, at the same time, joining the sidewalls of the protruding pipe parts to each other, and thus forming the supply header section and the discharge header section.
29. A cooler of a built-up type as set forth in claim 28 , wherein each of the cooling tubes has a diaphragm part formed around each of the protruding pipe parts, which deforms in the direction of built-up.
30. A cooler of a built-up type as set forth in claim 29 , wherein the cooling tube has the diaphragm part formed only around one of a pair of the protruding pipe parts arranged in opposition to each other, but not one formed around the other of a pair of the protruding pipe parts.
31. A cooler of a built-up type as set forth in claim 30 , wherein the cooling tube has the diaphragm part formed around one of a pair of the protruding pipe parts, which is formed on the downstream side of the supply header section.
32. A cooler of a built-up type as set forth in claim 28 , wherein the cooling tube has a throttle part at an inlet part of the refrigerant flow passage, which narrows width of the refrigerant flow passage.
33. A cooler of a built-up type as set forth in claim 28 , wherein the cooling tube has a pair of outer shell plates, an intermediate plate arranged between a pair of the outer shell plates, and corrugated inner fins arranged between the intermediate plate and the outer shell plates.
34. A cooler of a built-up type as set forth in claim 33 , wherein the outer shell plates are made of a brazing sheet having a core material and a brazing material arranged on an inner surface of the core material, the intermediate plate and the inner fins are made of a metal plate including a metal baser than the core material of the outer shell plates, and a pair of the outer shell plates are formed by joining the inner surfaces at the ends thereof to each other.
35. A cooler of a built-up type as set forth in claim 34 , wherein each of the outer shell plates is made of a brazing sheet having a core material, a sacrifice anode material arranged on the inner surface of the core material, and the brazing material arranged on an inner surface of the sacrifice anode material.
36. A cooler of a built-up type as set forth in claim 33 , wherein each of the outer shell plate is made of a brazing sheet having a core material and a sacrifice anode material arranged on an inner surface of the core material, the intermediate plate is made of a brazing sheet having a core material and brazing materials arranged on both sides of the core material, the inner fins are made of a metal plate including a metal baser than the core material of the outer shell plate, and a pair of the outer shell plates are formed by joining the inner surfaces at ends thereof to both sides of the intermediate plate at ends thereof.
37. A cooler of a built-up type as set forth in claim 28 , wherein a first cooling tube arranged at one end in the direction of built-up of a plurality of the cooling tubes has a refrigerant introduction inlet for introducing the cooling medium to the supply header section and a refrigerant discharge outlet for discharging the cooling medium from the discharge header section,
each of the refrigerant introduction inlet and the refrigerant discharge outlet has a protruding opening part protruding toward the outside of the first cooling tube, and
a refrigerant introduction pipe and a refrigerant discharge pipe are inserted into the protruding opening parts at the refrigerant introduction inlet and the refrigerant discharge outlet, respectively.
38. A cooler as set forth in claim 1 ,
wherein
electronic parts arranged between the neighboring tubes are held by applying a pressing force in a direction of built-up (Y) of the tubes; and wherein
narrow paths that become narrower in the direction of built-up (Y) of the tubes are formed in each of the tubes.
39. A cooler as set forth in claim 1 , comprising:
a supply header section for supplying the cooling fluid to each of the fluid passages; and
a discharge header section for discharging the cooling fluid from each of the fluid passages; wherein
the coupling means is formed by protruding pipe parts provided on each of the tubes, and opening and protruding toward the direction of built-up of the tubes, and
neighboring tubes make the fluid passages thereof communicate with each other by inserting the protruding pipe parts into each other and, at the same time, joining the sidewalls of the protruding pipe parts to each other, and thus forming the supply header section and the discharge header section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/157,975 US8151868B2 (en) | 2003-12-18 | 2008-06-13 | Easily assembled cooler |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003421340 | 2003-12-18 | ||
JP2003-421340 | 2003-12-18 | ||
JP2004-035226 | 2004-02-12 | ||
JP2004035226A JP2005228877A (en) | 2004-02-12 | 2004-02-12 | Cooling apparatus |
JP2004177351A JP4107267B2 (en) | 2004-06-15 | 2004-06-15 | Stacked cooler |
JP2004-177351 | 2004-06-15 | ||
JP2004-245140 | 2004-08-25 | ||
JP2004245140A JP2005203732A (en) | 2003-12-18 | 2004-08-25 | Cooler |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/157,975 Division US8151868B2 (en) | 2003-12-18 | 2008-06-13 | Easily assembled cooler |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050133210A1 true US20050133210A1 (en) | 2005-06-23 |
Family
ID=34682262
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/013,140 Abandoned US20050133210A1 (en) | 2003-12-18 | 2004-12-15 | Easily assembled cooler |
US12/157,975 Active 2027-01-03 US8151868B2 (en) | 2003-12-18 | 2008-06-13 | Easily assembled cooler |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/157,975 Active 2027-01-03 US8151868B2 (en) | 2003-12-18 | 2008-06-13 | Easily assembled cooler |
Country Status (2)
Country | Link |
---|---|
US (2) | US20050133210A1 (en) |
DE (1) | DE102004059963A1 (en) |
Cited By (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060266501A1 (en) * | 2005-05-24 | 2006-11-30 | So Allan K | Multifluid heat exchanger |
US20070039717A1 (en) * | 2005-08-19 | 2007-02-22 | Denso Corporation | Heat exchanger unit and method of manufacturing the same |
US20080121382A1 (en) * | 2006-11-24 | 2008-05-29 | Dana Canada Corporation | Multifluid two-dimensional heat exchanger |
US20090014164A1 (en) * | 2006-01-19 | 2009-01-15 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090014165A1 (en) * | 2006-01-19 | 2009-01-15 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090020278A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090019696A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090019694A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090019695A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090020277A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090019689A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090056927A1 (en) * | 2006-01-19 | 2009-03-05 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090073658A1 (en) * | 2007-09-13 | 2009-03-19 | Balcerak John A | Modular Liquid Cooling System |
US20090146293A1 (en) * | 2004-11-24 | 2009-06-11 | Danfoss Silicon Power Gmbh | Flow distribution module and a stack of flow distribution modules |
US20090213547A1 (en) * | 2005-10-07 | 2009-08-27 | Jurgen Schulz-Harder | Electrical Module |
EP2228615A2 (en) * | 2009-03-12 | 2010-09-15 | Behr GmbH & Co. KG | Plate heat exchanger, in particular for heat recovery from exhaust gases of a motor vehicle |
FR2945614A1 (en) * | 2009-05-13 | 2010-11-19 | Valeo Systemes Thermiques | TUBE PLATE FOR A HEAT EXCHANGER. |
WO2011051163A2 (en) * | 2009-10-27 | 2011-05-05 | Behr Gmbh & Co. Kg | Exhaust gas evaporator |
US20130062337A1 (en) * | 2010-09-06 | 2013-03-14 | Mitsubishi Heavy Industries, Ltd. | Heat medium heating device and vehicle air conditioning apparatus provided with the same |
US8434227B2 (en) | 2006-01-19 | 2013-05-07 | Modine Manufacturing Company | Method of forming heat exchanger tubes |
US20130220987A1 (en) * | 2010-11-17 | 2013-08-29 | Mitsubishi Heavy Industries Automotive Thermal... | Layered heat exchanger, heat medium heating apparatus and vehicle air-conditioning apparatus using the same |
US8561451B2 (en) | 2007-02-01 | 2013-10-22 | Modine Manufacturing Company | Tubes and method and apparatus for producing tubes |
US20140140118A1 (en) * | 2012-11-19 | 2014-05-22 | Denso Corporation | Connection structure and inverter |
EP2865960A1 (en) * | 2013-10-24 | 2015-04-29 | JTC Energie Sarl | Heat exchange device |
US9041194B2 (en) | 2011-03-17 | 2015-05-26 | Nhk Spring Co., Ltd. | Pressure unit |
US9038267B2 (en) | 2010-06-10 | 2015-05-26 | Modine Manufacturing Company | Method of separating heat exchanger tubes and an apparatus for same |
US20150342092A1 (en) * | 2014-05-23 | 2015-11-26 | Tesla Motors, Inc. | Heatsink with internal cavity for liquid cooling |
CN105518855A (en) * | 2013-08-30 | 2016-04-20 | 株式会社电装 | Stacked cooler |
US20160114646A1 (en) * | 2013-06-03 | 2016-04-28 | Denso Corporation | Cold storage heat exchanger |
US20160223264A9 (en) * | 2012-07-19 | 2016-08-04 | Gränges Ab | Compact aluminium heat exchanger with welded tubes for power electronics and battery cooling |
US20160309622A1 (en) * | 2015-04-15 | 2016-10-20 | Ford Global Technologies, Llc | Power-Module Assembly |
EP2947412A4 (en) * | 2013-01-18 | 2017-05-24 | Taisei Plas Co., Ltd. | Heat exchanger and method for manufacturing same |
EP2660531A4 (en) * | 2010-12-28 | 2017-08-23 | Mitsubishi Heavy Industries Automotive Thermal Systems Co., Ltd. | Method for manufacturing hot-water heater, and hot-water heater manufactured thereby |
CN107339900A (en) * | 2017-08-22 | 2017-11-10 | 无锡马山永红换热器有限公司 | New strip-fin oil cooler |
CN108141989A (en) * | 2015-12-30 | 2018-06-08 | 翰昂汽车零部件有限公司 | For cooling down the heat exchanger of electric device |
US10064310B2 (en) | 2014-06-25 | 2018-08-28 | Hitachi, Ltd. | Power-module device, power conversion device, and method for manufacturing power-module device |
CN108541182A (en) * | 2017-03-06 | 2018-09-14 | 达纳加拿大公司 | Multiple layers of the heat exchanger for cooling down electronic module |
US10147667B2 (en) | 2014-09-23 | 2018-12-04 | Denso Corporation | Cooler module, and method for manufacturing cooler module |
KR20190093277A (en) * | 2018-02-01 | 2019-08-09 | 한온시스템 주식회사 | Electronic unit cooler and method for making the same electronic unit cooler |
US20190264984A1 (en) * | 2016-11-21 | 2019-08-29 | Denso Corporation | Stacked heat exchanger |
US20200196484A1 (en) * | 2017-05-31 | 2020-06-18 | Hanon Systems | Heat exchanger for cooling electrical device |
US10928141B2 (en) | 2017-03-06 | 2021-02-23 | Dana Canada Corporation | Heat exchanger for cooling multiple layers of electronic modules |
US11071233B1 (en) | 2020-03-10 | 2021-07-20 | Borgwarner, Inc. | Auxiliary-cooled electronics assembly with extruded cooling cavity |
CN113594112A (en) * | 2021-08-02 | 2021-11-02 | 毫厘机电(苏州)有限公司 | Laminated liquid cooling heat dissipation module structure with double-sided chip |
US11268769B2 (en) * | 2017-12-08 | 2022-03-08 | Denso Corporation | Heat exchanger |
US11300369B2 (en) * | 2018-11-22 | 2022-04-12 | Hyundai Motor Company | Water cooling apparatus and water cooling type power module assembly including the same |
US11502349B2 (en) | 2020-08-31 | 2022-11-15 | Borgwarner, Inc. | Cooling manifold assembly |
CN116487771A (en) * | 2023-06-20 | 2023-07-25 | 江铃汽车股份有限公司 | Power battery, cooling device and assembly method thereof and electric automobile |
EP4343252A1 (en) * | 2022-09-20 | 2024-03-27 | Alfa Laval Corporate AB | A plate heat exchanger |
US11961784B2 (en) | 2018-11-19 | 2024-04-16 | Mitsubishi Electric Corporation | Semiconductor device |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006332597A (en) * | 2005-04-28 | 2006-12-07 | Denso Corp | Semiconductor cooling unit |
DE102006002627A1 (en) * | 2006-01-19 | 2007-08-02 | Modine Manufacturing Co., Racine | Heat exchanger tube has internal chamber extends from center of tube past location to interior surface of second narrow side |
US8451609B2 (en) * | 2008-05-02 | 2013-05-28 | Danfoss Silicon Power Gmbh | Cooling device for a plurality of power modules |
JP4661966B2 (en) * | 2009-03-06 | 2011-03-30 | 株式会社デンソー | Power converter |
JP5627499B2 (en) * | 2010-03-30 | 2014-11-19 | 株式会社デンソー | Semiconductor device provided with semiconductor module |
JP5545260B2 (en) * | 2010-05-21 | 2014-07-09 | 株式会社デンソー | Heat exchanger |
JP5655676B2 (en) * | 2010-08-03 | 2015-01-21 | 株式会社デンソー | Condenser |
US20140048238A1 (en) * | 2012-08-14 | 2014-02-20 | Caterpillar Inc. | Frameless Heat Exchanger |
JP2014078599A (en) * | 2012-10-10 | 2014-05-01 | Denso Corp | Power conversion device |
DE102013010088A1 (en) * | 2013-06-18 | 2014-12-18 | VENSYS Elektrotechnik GmbH | Cooling device for a power converter module |
DE112014004189T5 (en) * | 2013-09-12 | 2016-06-02 | Hanon Systems | Heat exchanger for cooling an electrical component |
US9847734B1 (en) | 2016-05-24 | 2017-12-19 | Ford Global Technologies, Llc | Power-module assembly |
US9867319B2 (en) | 2016-05-24 | 2018-01-09 | Ford Global Technologies, Llc | Vehicle power module assemblies and manifolds |
CN108575073B (en) * | 2017-03-10 | 2022-01-25 | 讯凯国际股份有限公司 | Liquid-cooled heat exchanger plate capable of being continuously jointed and jointing method |
JP6972645B2 (en) * | 2017-05-10 | 2021-11-24 | 株式会社デンソー | Power converter |
DE102017214482A1 (en) * | 2017-08-21 | 2019-02-21 | Zf Friedrichshafen Ag | Device for cooling electronic components |
KR102197055B1 (en) * | 2019-12-04 | 2020-12-31 | 주식회사 고산 | Heat exchanger for electric element cooling |
CN212084987U (en) * | 2020-07-09 | 2020-12-04 | 宁波市哈雷换热设备有限公司 | Chip cooler with high bearing capacity |
DE102021203869A1 (en) | 2021-04-19 | 2022-10-20 | Zf Friedrichshafen Ag | Cooling arrangement for power semiconductors of an inverter and electronic module |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5053856A (en) * | 1990-09-04 | 1991-10-01 | Sun Microsystems, Inc. | Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices |
US5099912A (en) * | 1990-07-30 | 1992-03-31 | Calsonic Corporation | Housingless oil cooler |
US20010010262A1 (en) * | 1999-08-06 | 2001-08-02 | Shuji Komoda | Heat exchanger |
US20010033477A1 (en) * | 2000-04-19 | 2001-10-25 | Seiji Inoue | Coolant cooled type semiconductor device |
US20020003161A1 (en) * | 1998-07-29 | 2002-01-10 | Makoto Kouno | Method and apparatus for applying flux for use in brazing aluminum material |
US20020007935A1 (en) * | 2000-04-19 | 2002-01-24 | Thermal Form & Function Llc | Cold plate utilizing fin with evaporating refrigerant |
US20020078566A1 (en) * | 1999-05-28 | 2002-06-27 | Eiichi Torigoe | Heat exchanger made of aluminum alloy |
US6412174B1 (en) * | 1998-08-25 | 2002-07-02 | Calsonic Kansei Corporation | Method of manufacturing heat exchange tube |
US6449979B1 (en) * | 1999-07-02 | 2002-09-17 | Denso Corporation | Refrigerant evaporator with refrigerant distribution |
US6563709B2 (en) * | 2000-07-21 | 2003-05-13 | Mitsubishi Materials Corporation | Liquid-cooled heat sink and manufacturing method thereof |
US6639798B1 (en) * | 2002-06-24 | 2003-10-28 | Delphi Technologies, Inc. | Automotive electronics heat exchanger |
US6799628B1 (en) * | 2000-07-20 | 2004-10-05 | Honeywell International Inc. | Heat exchanger having silicon nitride substrate for mounting high power electronic components |
US6819561B2 (en) * | 2002-02-22 | 2004-11-16 | Satcon Technology Corporation | Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1514477C3 (en) * | 1965-06-10 | 1975-06-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Semiconductor arrangement with a number of semiconductor components |
DE1914790A1 (en) * | 1969-03-22 | 1970-10-01 | Siemens Ag | Liquid-cooled assembly with disc cells |
US3650321A (en) * | 1969-11-21 | 1972-03-21 | Tranter Mfg Inc | Sheet metal radiator assembly |
DE3133485A1 (en) * | 1980-09-15 | 1982-05-06 | Peter 2563 Ipsach Herren | LIQUID-COOLED ELECTRICAL ASSEMBLY |
SE441047B (en) * | 1983-10-06 | 1985-09-02 | Asea Ab | Semi-conductor valve for high voltage with voltage divider sections including resistance |
US4559580A (en) * | 1983-11-04 | 1985-12-17 | Sundstrand Corporation | Semiconductor package with internal heat exchanger |
US4815532A (en) * | 1986-02-28 | 1989-03-28 | Showa Aluminum Kabushiki Kaisha | Stack type heat exchanger |
JPS63128793A (en) | 1986-11-19 | 1988-06-01 | 石川島播磨重工業株式会社 | Method of improving heat absorption capability of cold plate |
JPH0694386A (en) | 1992-09-14 | 1994-04-05 | Sanden Corp | Heat exchanger |
JP3010602U (en) | 1994-10-26 | 1995-05-02 | 東洋ラジエーター株式会社 | Electronic component cooler |
JPH08313183A (en) | 1995-05-16 | 1996-11-29 | Nippondenso Co Ltd | Heat exchanger and manufacture of corrugated fin therefor |
JPH10298686A (en) | 1997-04-18 | 1998-11-10 | Sumitomo Light Metal Ind Ltd | Aluminum alloy multilayer brazing sheet excellent in corrosion resistance and its production |
US6070428A (en) * | 1997-05-30 | 2000-06-06 | Showa Aluminum Corporation | Stack type evaporator |
JP2000161883A (en) | 1998-11-20 | 2000-06-16 | Calsonic Corp | Production of heat exchanging medium tube |
JP4081883B2 (en) | 1998-09-29 | 2008-04-30 | 株式会社デンソー | Heat exchanger |
JP4423746B2 (en) | 2000-05-10 | 2010-03-03 | 株式会社デンソー | Refrigerant cooling type double-sided cooling semiconductor device |
JP4774581B2 (en) | 2000-06-30 | 2011-09-14 | 株式会社デンソー | Cooling fluid cooling type semiconductor device |
EP1191302B1 (en) * | 2000-09-22 | 2005-12-07 | Mitsubishi Heavy Industries, Ltd. | Heat exchanger |
JP2003007944A (en) | 2001-06-18 | 2003-01-10 | Showa Denko Kk | Cooling device for heating part |
JP2003019555A (en) | 2001-07-06 | 2003-01-21 | Denso Corp | Heat exchanger manufacturing method |
JP4089595B2 (en) * | 2002-12-16 | 2008-05-28 | 株式会社デンソー | Refrigerant cooling type double-sided cooling semiconductor device |
US7191824B2 (en) * | 2003-11-21 | 2007-03-20 | Dana Canada Corporation | Tubular charge air cooler |
-
2004
- 2004-12-13 DE DE102004059963A patent/DE102004059963A1/en not_active Withdrawn
- 2004-12-15 US US11/013,140 patent/US20050133210A1/en not_active Abandoned
-
2008
- 2008-06-13 US US12/157,975 patent/US8151868B2/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5099912A (en) * | 1990-07-30 | 1992-03-31 | Calsonic Corporation | Housingless oil cooler |
US5053856A (en) * | 1990-09-04 | 1991-10-01 | Sun Microsystems, Inc. | Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices |
US20020003161A1 (en) * | 1998-07-29 | 2002-01-10 | Makoto Kouno | Method and apparatus for applying flux for use in brazing aluminum material |
US6412174B1 (en) * | 1998-08-25 | 2002-07-02 | Calsonic Kansei Corporation | Method of manufacturing heat exchange tube |
US20020078566A1 (en) * | 1999-05-28 | 2002-06-27 | Eiichi Torigoe | Heat exchanger made of aluminum alloy |
US6449979B1 (en) * | 1999-07-02 | 2002-09-17 | Denso Corporation | Refrigerant evaporator with refrigerant distribution |
US20010010262A1 (en) * | 1999-08-06 | 2001-08-02 | Shuji Komoda | Heat exchanger |
US20010033477A1 (en) * | 2000-04-19 | 2001-10-25 | Seiji Inoue | Coolant cooled type semiconductor device |
US20020007935A1 (en) * | 2000-04-19 | 2002-01-24 | Thermal Form & Function Llc | Cold plate utilizing fin with evaporating refrigerant |
US6799628B1 (en) * | 2000-07-20 | 2004-10-05 | Honeywell International Inc. | Heat exchanger having silicon nitride substrate for mounting high power electronic components |
US6563709B2 (en) * | 2000-07-21 | 2003-05-13 | Mitsubishi Materials Corporation | Liquid-cooled heat sink and manufacturing method thereof |
US6819561B2 (en) * | 2002-02-22 | 2004-11-16 | Satcon Technology Corporation | Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same |
US6639798B1 (en) * | 2002-06-24 | 2003-10-28 | Delphi Technologies, Inc. | Automotive electronics heat exchanger |
Cited By (85)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090146293A1 (en) * | 2004-11-24 | 2009-06-11 | Danfoss Silicon Power Gmbh | Flow distribution module and a stack of flow distribution modules |
US7835151B2 (en) | 2004-11-24 | 2010-11-16 | Danfoss Silicon Power Gmbh | Flow distribution module and a stack of flow distribution modules |
US8733427B2 (en) | 2005-05-24 | 2014-05-27 | Dana Canada Corporation | Multifluid heat exchanger |
US20060266501A1 (en) * | 2005-05-24 | 2006-11-30 | So Allan K | Multifluid heat exchanger |
US20110180241A1 (en) * | 2005-05-24 | 2011-07-28 | So Allan K | Multifluid Heat Exchanger |
US7946339B2 (en) | 2005-05-24 | 2011-05-24 | Dana Canada Corporation | Multifluid heat exchanger |
US20070039717A1 (en) * | 2005-08-19 | 2007-02-22 | Denso Corporation | Heat exchanger unit and method of manufacturing the same |
US7940526B2 (en) * | 2005-10-07 | 2011-05-10 | Curamik Electronics Gmbh | Electrical module |
US20090213547A1 (en) * | 2005-10-07 | 2009-08-27 | Jurgen Schulz-Harder | Electrical Module |
US8726508B2 (en) * | 2006-01-19 | 2014-05-20 | Modine Manufacturing Company | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090019694A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090056927A1 (en) * | 2006-01-19 | 2009-03-05 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US8683690B2 (en) * | 2006-01-19 | 2014-04-01 | Modine Manufacturing Company | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090020277A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090019695A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090218085A1 (en) * | 2006-01-19 | 2009-09-03 | Charles James Rogers | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090014165A1 (en) * | 2006-01-19 | 2009-01-15 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US8438728B2 (en) | 2006-01-19 | 2013-05-14 | Modine Manufacturing Company | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20100243225A1 (en) * | 2006-01-19 | 2010-09-30 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US8434227B2 (en) | 2006-01-19 | 2013-05-07 | Modine Manufacturing Company | Method of forming heat exchanger tubes |
US8091621B2 (en) | 2006-01-19 | 2012-01-10 | Modine Manufacturing Company | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20100288481A1 (en) * | 2006-01-19 | 2010-11-18 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090014164A1 (en) * | 2006-01-19 | 2009-01-15 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090019689A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US7921559B2 (en) | 2006-01-19 | 2011-04-12 | Modine Manufacturing Company | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US8281489B2 (en) | 2006-01-19 | 2012-10-09 | Modine Manufacturing Company | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090019696A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20090020278A1 (en) * | 2006-01-19 | 2009-01-22 | Werner Zobel | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US8191258B2 (en) | 2006-01-19 | 2012-06-05 | Modine Manufacturing Company | Flat tube, flat tube heat exchanger, and method of manufacturing same |
US20080121382A1 (en) * | 2006-11-24 | 2008-05-29 | Dana Canada Corporation | Multifluid two-dimensional heat exchanger |
US7703505B2 (en) * | 2006-11-24 | 2010-04-27 | Dana Canada Corporation | Multifluid two-dimensional heat exchanger |
US8561451B2 (en) | 2007-02-01 | 2013-10-22 | Modine Manufacturing Company | Tubes and method and apparatus for producing tubes |
US8081462B2 (en) * | 2007-09-13 | 2011-12-20 | Rockwell Automation Technologies, Inc. | Modular liquid cooling system |
US9099237B2 (en) | 2007-09-13 | 2015-08-04 | Rockwell Automation Technologies, Inc. | Modular liquid cooling system |
US20090073658A1 (en) * | 2007-09-13 | 2009-03-19 | Balcerak John A | Modular Liquid Cooling System |
EP2228615A3 (en) * | 2009-03-12 | 2011-06-01 | Behr GmbH & Co. KG | Plate heat exchanger, in particular for heat recovery from exhaust gases of a motor vehicle |
US9618271B2 (en) | 2009-03-12 | 2017-04-11 | Mahle International Gmbh | Device for the exchange of heat and motor vehicle |
US20100282452A1 (en) * | 2009-03-12 | 2010-11-11 | Behr Gmbh & Co. Kg | Device for the exchange of heat and motor vehicle |
EP2228615A2 (en) * | 2009-03-12 | 2010-09-15 | Behr GmbH & Co. KG | Plate heat exchanger, in particular for heat recovery from exhaust gases of a motor vehicle |
FR2945614A1 (en) * | 2009-05-13 | 2010-11-19 | Valeo Systemes Thermiques | TUBE PLATE FOR A HEAT EXCHANGER. |
EP2253917A1 (en) * | 2009-05-13 | 2010-11-24 | Valeo Systèmes Thermiques | Tube plate for a heat exchanger |
WO2011051163A3 (en) * | 2009-10-27 | 2011-07-07 | Behr Gmbh & Co. Kg | Exhaust gas evaporator |
WO2011051163A2 (en) * | 2009-10-27 | 2011-05-05 | Behr Gmbh & Co. Kg | Exhaust gas evaporator |
US9038267B2 (en) | 2010-06-10 | 2015-05-26 | Modine Manufacturing Company | Method of separating heat exchanger tubes and an apparatus for same |
US20130062337A1 (en) * | 2010-09-06 | 2013-03-14 | Mitsubishi Heavy Industries, Ltd. | Heat medium heating device and vehicle air conditioning apparatus provided with the same |
EP2642234A4 (en) * | 2010-11-17 | 2016-09-07 | Mitsubishi Heavy Ind Automotive Thermal Sys Co Ltd | Laminated heat exchanger, heat medium heating apparatus using the laminated heat exchanger, and in-vehicle air-conditioning apparatus using the laminated heat exchanger |
US10352631B2 (en) * | 2010-11-17 | 2019-07-16 | Mitsubishi Heavy Industries Thermal Systems, Ltd. | Layered heat exchanger and heat medium heating apparatus |
US20130220987A1 (en) * | 2010-11-17 | 2013-08-29 | Mitsubishi Heavy Industries Automotive Thermal... | Layered heat exchanger, heat medium heating apparatus and vehicle air-conditioning apparatus using the same |
EP2660531A4 (en) * | 2010-12-28 | 2017-08-23 | Mitsubishi Heavy Industries Automotive Thermal Systems Co., Ltd. | Method for manufacturing hot-water heater, and hot-water heater manufactured thereby |
US9041194B2 (en) | 2011-03-17 | 2015-05-26 | Nhk Spring Co., Ltd. | Pressure unit |
US20160223264A9 (en) * | 2012-07-19 | 2016-08-04 | Gränges Ab | Compact aluminium heat exchanger with welded tubes for power electronics and battery cooling |
US20140140118A1 (en) * | 2012-11-19 | 2014-05-22 | Denso Corporation | Connection structure and inverter |
US9565792B2 (en) * | 2012-11-19 | 2017-02-07 | Toyota Jidosha Kabushiki Kaisha | Connection structure and inverter |
EP2947412A4 (en) * | 2013-01-18 | 2017-05-24 | Taisei Plas Co., Ltd. | Heat exchanger and method for manufacturing same |
US20160114646A1 (en) * | 2013-06-03 | 2016-04-28 | Denso Corporation | Cold storage heat exchanger |
CN105518855A (en) * | 2013-08-30 | 2016-04-20 | 株式会社电装 | Stacked cooler |
US10147668B2 (en) | 2013-08-30 | 2018-12-04 | Denso Corporation | Stacked cooler |
EP2865960A1 (en) * | 2013-10-24 | 2015-04-29 | JTC Energie Sarl | Heat exchange device |
US10178805B2 (en) * | 2014-05-23 | 2019-01-08 | Tesla, Inc. | Heatsink with internal cavity for liquid cooling |
US20150342092A1 (en) * | 2014-05-23 | 2015-11-26 | Tesla Motors, Inc. | Heatsink with internal cavity for liquid cooling |
US10064310B2 (en) | 2014-06-25 | 2018-08-28 | Hitachi, Ltd. | Power-module device, power conversion device, and method for manufacturing power-module device |
US10147667B2 (en) | 2014-09-23 | 2018-12-04 | Denso Corporation | Cooler module, and method for manufacturing cooler module |
US11051434B2 (en) * | 2015-04-15 | 2021-06-29 | Ford Global Technologies, Llc | Power-module assembly |
US10123465B2 (en) * | 2015-04-15 | 2018-11-06 | Ford Global Technologies, Llc | Power-module assembly |
US20160309622A1 (en) * | 2015-04-15 | 2016-10-20 | Ford Global Technologies, Llc | Power-Module Assembly |
CN108141989A (en) * | 2015-12-30 | 2018-06-08 | 翰昂汽车零部件有限公司 | For cooling down the heat exchanger of electric device |
US10962309B2 (en) * | 2016-11-21 | 2021-03-30 | Denso Corporation | Stacked heat exchanger |
DE112017005880B4 (en) | 2016-11-21 | 2022-08-11 | Denso Corporation | Stacked heat exchanger |
US20190264984A1 (en) * | 2016-11-21 | 2019-08-29 | Denso Corporation | Stacked heat exchanger |
US10928141B2 (en) | 2017-03-06 | 2021-02-23 | Dana Canada Corporation | Heat exchanger for cooling multiple layers of electronic modules |
CN108541182A (en) * | 2017-03-06 | 2018-09-14 | 达纳加拿大公司 | Multiple layers of the heat exchanger for cooling down electronic module |
US20200196484A1 (en) * | 2017-05-31 | 2020-06-18 | Hanon Systems | Heat exchanger for cooling electrical device |
US11439040B2 (en) * | 2017-05-31 | 2022-09-06 | Hanon Systems | Heat exchanger for cooling electrical device |
CN107339900A (en) * | 2017-08-22 | 2017-11-10 | 无锡马山永红换热器有限公司 | New strip-fin oil cooler |
US11268769B2 (en) * | 2017-12-08 | 2022-03-08 | Denso Corporation | Heat exchanger |
KR20190093277A (en) * | 2018-02-01 | 2019-08-09 | 한온시스템 주식회사 | Electronic unit cooler and method for making the same electronic unit cooler |
KR102512004B1 (en) | 2018-02-01 | 2023-03-21 | 한온시스템 주식회사 | Electronic unit cooler and method for making the same electronic unit cooler |
US11961784B2 (en) | 2018-11-19 | 2024-04-16 | Mitsubishi Electric Corporation | Semiconductor device |
US11300369B2 (en) * | 2018-11-22 | 2022-04-12 | Hyundai Motor Company | Water cooling apparatus and water cooling type power module assembly including the same |
US11071233B1 (en) | 2020-03-10 | 2021-07-20 | Borgwarner, Inc. | Auxiliary-cooled electronics assembly with extruded cooling cavity |
US11502349B2 (en) | 2020-08-31 | 2022-11-15 | Borgwarner, Inc. | Cooling manifold assembly |
CN113594112A (en) * | 2021-08-02 | 2021-11-02 | 毫厘机电(苏州)有限公司 | Laminated liquid cooling heat dissipation module structure with double-sided chip |
EP4343252A1 (en) * | 2022-09-20 | 2024-03-27 | Alfa Laval Corporate AB | A plate heat exchanger |
WO2024061817A1 (en) * | 2022-09-20 | 2024-03-28 | Alfa Laval Corporate Ab | A plate heat exchanger |
CN116487771A (en) * | 2023-06-20 | 2023-07-25 | 江铃汽车股份有限公司 | Power battery, cooling device and assembly method thereof and electric automobile |
Also Published As
Publication number | Publication date |
---|---|
DE102004059963A1 (en) | 2005-08-11 |
US8151868B2 (en) | 2012-04-10 |
US20090008061A1 (en) | 2009-01-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8151868B2 (en) | Easily assembled cooler | |
JP4552805B2 (en) | Laminated heat exchanger and manufacturing method thereof | |
US7571759B2 (en) | Stacked type cooler | |
JP4107267B2 (en) | Stacked cooler | |
US6305465B1 (en) | Double heat exchanger having condenser core and radiator core | |
US6540015B1 (en) | Heat exchanger and method for manufacturing the same | |
JP4445566B2 (en) | Heat exchanger | |
US6883600B2 (en) | Heat exchanger with dual heat-exchanging portions | |
US20040194931A1 (en) | Heat exchanger | |
JP2000283689A (en) | Heat exchanger | |
WO2014014407A2 (en) | Compact aluminium heat exchanger with welded tubes for power electronics and battery cooling | |
WO2017064940A1 (en) | Heat exchanger | |
US7036561B2 (en) | Heat exchanger module | |
WO2015029446A1 (en) | Stacked cooler | |
US20020179297A1 (en) | Heat exchanger | |
JP2005191527A (en) | Stacked cooler | |
JP2001124486A (en) | Heat exchanger | |
US5894886A (en) | Heat exchanger with fluid control means for controlling a flow of a heat exchange medium and method of manufacturing the same | |
US6354002B1 (en) | Method of making a thick, low cost liquid heat transfer plate with vertically aligned fluid channels | |
US20200111725A1 (en) | Stacked heat exchanger and method for producing stacked heat exchanger | |
US20060048930A1 (en) | Heat exchanger | |
JP4265510B2 (en) | Cooler | |
JP2007278557A (en) | Heat exchanger | |
KR102089630B1 (en) | Method of manufacturing heat exchanger for cooling electric element | |
CN112514533A (en) | Water heater and method of manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: DENSO CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:INAGAKI, MITSUHARU;SHIRAI, MOTOHIRO;REEL/FRAME:016104/0801 Effective date: 20041201 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |