US20040244952A1 - Integrated heat spreader with mechanical interlock designs - Google Patents
Integrated heat spreader with mechanical interlock designs Download PDFInfo
- Publication number
- US20040244952A1 US20040244952A1 US10/883,493 US88349304A US2004244952A1 US 20040244952 A1 US20040244952 A1 US 20040244952A1 US 88349304 A US88349304 A US 88349304A US 2004244952 A1 US2004244952 A1 US 2004244952A1
- Authority
- US
- United States
- Prior art keywords
- heat spreader
- sealant
- integrated heat
- integrated
- lip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Abstract
An integrated heat spreader is presented. The heat spreader is constructed and arranged to be adhesively affixed, with a sealant, to at least a portion of a component, such as a substrate. The heat spreader includes a body portion, a lip portion substantially vertically oriented and integrally formed with the body portion, and a step portion integrally formed with the lip portion. As such, adhesion of the heat spreader to the sealant is increased, and failure due to shear stresses at the heat spreader bonding surface is prevented.
Description
- 1. Field
- This invention relates generally to packaging for integrated circuits. More specifically, this invention relates to a novel integrated heat spreader.
- 2. Background and Related Art
- Integrated circuits generate heat to varying degrees. In typical applications, such radiated heat must be dissipated to ensure that thermal effects do not impair the performance of, or even damage, integrated circuits. With increasing demands in computing speeds and memory, heat removal has become a critical focus area in packaging. Various techniques have been employed to dissipate radiated heat effectively, including the attachment of integrated heat spreaders (heatsinks) or fans to integrated circuits.
- FIG. 1 (Prior Art) illustrates portions of an
electronic package 100.Package 100 includes a die 110, asubstrate 120, andpins 130. An integratedheat spreader 101 is adhesively attached tosubstrate 120 via a sealant.Heat spreader 101 absorbs heat radiated by die 110 andsubstrate 120. - FIG. 2 (Prior Art) illustrates a portion of another
electronic package 200.Package 200 includes a die 210, asubstrate 220, andpins 130.Heat spreader 201 is attached tosubstrate 220 via anadhesive bond 240.Heat spreader 201 is in contact with die 210 to absorb radiated heat of die 210.Heat spreader 201 includeslips 250 that extend from the heat spreader and adhere, viaadhesive bond 240, tosubstrate 220. Inpackage 200, one face of eachlip 250 is in contact withadhesive bond 240. - The splitting or separating of a laminate into layers is known as delamination. In particular, heat spreader-to-sealant delamination in electronic packages may lead to the popping off of heat spreaders from the integrated circuits to which they are attached. For instance,
heat spreader 201 may pop off ofsubstrate 220, causingpackage 200 to fail. Moreover, high combined shear and tensional stress distributions are often exhibited by packages with off-center dies. Because of severe shear stress (torsional) distributions, heat spreader-to-sealant interfacial delamination may occur. Heat spreader-to-sealant adhesion may be unable to withstand the high shear stresses generated at the heat spreader-to-sealant interface. - Therefore, what is needed is an improved integrated heat spreader.
- FIG. 1 (Prior Art) illustrates portions of an electronic package.
- FIG. 2 (Prior Art) illustrates portions of an electronic package.
- FIGS. 3A and 3B are plan and side views, respectively, of an integrated heat spreader according to an embodiment of the present invention.
- FIGS. 4A and 4B are plan and side views, respectively, of an integrated heat spreader according to an embodiment of the present invention.
- FIGS. 5A and 5B are plan and side views, respectively, of an integrated heat spreader according to an embodiment of the present invention.
- FIGS. 6A and 6B are plan and side views, respectively, of an integrated heat spreader according to an embodiment of the present invention.
- An integrated heat spreader, as presented herein, is constructed and arranged to be adhesively affixed, with a sealant, to at least a portion of a component, such as a substrate. The heat spreader includes a body portion, a lip portion substantially vertically oriented and integrally formed with the body portion, and a step portion integrally formed with the lip portion. As such, adhesion of the heat spreader to the sealant is increased, and failure due to shear stresses at the heat spreader bonding surface is prevented.
- FIGS. 3A and 3B are plan and side views, respectively, of an integrated
heat spreader 300 according to an embodiment of the present invention.Heat spreader 300 includes aheat spreader element 301.Heat spreader element 301 may be shaped to suit a particular application. For instance,heat spreader element 301 may be rectangular or square.Lips 310 extend substantially vertically fromheat spreader element 301. Astep 320 extends from eachlip 310 and may be regularly or irregularly shaped. In the embodiment of FIGS. 3A and 3B,steps 320 are rectangular and extend laterally fromlips 310 in a substantially perpendicular manner. -
Heat spreader element 301,lips 310, andsteps 320 may be respectively formed of the same materials or different materials. Exemplary materials include copper, copper with a nickel or other coating, aluminum, a carbon/carbon composite, or a carbon/metal composite. Exemplary carbon/metal composites include carbon/copper and matrix fiber reinforced composites.Heat spreader 300 may be selectively plated or plated over its entire surface area. Exemplary electrolytic plating materials include gold, silver, tin, nickel, and metal composites. - A thermal interface material (TIM) may be placed between the die and the heat spreader cavity interfaces. A TIM can be a solder, a polymer/solder composite, or a polymer.
- A sealant may be employed to affix
heat spreader 300 to other objects, such as package components, including a substrate (not shown). In exemplary implementations, silicone- or epoxy-based sealants may be employed. - Sealant flows over each
step 320 to form a mechanical link.Sealant flow 370 is identified in FIG. 3B. In various embodiments, thickness of sealant at the heat spreader surface ranges from 1.5 mm to 3 mm, and extendedlips 310 are 2 mm wide. - According to embodiments of the present invention, an extension to
lip 310, such asstep 320, increases the surface area of eachlip 310 ofheat spreader 300. Thus, sealant coverage overheat spreader 300 increases, and the sealant may better gripheat spreader 300. More specifically, shear stress is distributed above and belowlips 310, providing greater area in which to absorb and dissipate stresses. The strength of the sealant in the areas of mechanical linkage, coupled with the adhesive bonding energy, increases the bonding strength and may prevent failure due to shear stresses at the heat spreader-to-sealant interface. - In sum, embodiments of the present invention, which include mechanical links at the heat spreader-to-sealant interface, increase adhesion of the sealant to the heat spreader and to a package component, such as a substrate. As such, a sealant is more likely to fail at the substrate interface or cohesively within the sealant than to fail adhesively at the head spreader bonding surface.
- FIGS. 4A and 4B are plan and side views, respectively, of an
integrated heat spreader 400 according to an embodiment of the present invention.Heat spreader 400 includes aheat spreader element 401 andlips 410 extending therefrom. Astep 420 extends from eachlip 410. As shown in FIG. 4A, eachstep 420 includesholes 430.Holes 430 may comprise, for example, circular holes or slots. Sealant may flow through eachhole 430 and over eachstep 420, forming a mechanical link.Sealant 470 is depicted in FIG. 4B. - FIGS. 5A and 5B are plan and side views, respectively, of an
integrated heat spreader 500 according to an embodiment of the present invention.Heat spreader 500 includesheat spreader element 501.Lips 510 extend fromheat spreader element 501. Astep 520 extends from eachlip 510. Eachstep 520 includescutouts 540. In some embodiments, edges ofcutouts 540 may be rounded. Sealant may flow throughcutouts 540 and up overstep 520 to form a mechanical link.Sealant 570 is shown in FIG. 5B. - FIGS. 6A and 6B are plan and side views, respectively, of an
integrated heat spreader 600 according to an embodiment of the present invention.Heat spreader 600 includes an integratedheat spreader element 601.Lips 610 extend fromheat spreader element 601. Eachlip 610 includes achannel 650, which may be concave. During the process of attachingheat spreader 600 to a substrate or other component, sealant may flow intochannel 650 to form a mechanical link. Deeper and sharper channels may achieve greater reductions in delamination, increasing the ability of the sealant to adhere to heatspreader 600 under higher stresses. One or more channels of the same or different dimension can be utilized. - The integrated heat spreader structures described above may be fabricated in various ways. For instance, extensions, holes, slots, cutouts, and channels may be stamped during a stamping operation associated with an integrated heat spreader. Alternatively, structures may be formed by grinding or laser etching after a stamping operation associated with an integrated heat spreader.
- The foregoing description of the preferred embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments are possible, and the generic principles presented herein may be applied to other embodiments as well. As such, the present invention is not intended to be limited to the embodiments shown above but rather is to be accorded the widest scope consistent with the principles and novel features disclosed in any fashion herein. In particular, variations and combinations of embodiments presented above may be incorporated into integrated heat spreaders. For instance, cutouts may be irregularly spaced, and a step or lip may have a channel, multiple channels, or notch in a lateral face.
Claims (6)
1-17. (Canceled)
18. An integrated heat spreader constructed and arranged to be adhesively affixed, with a sealant, to at least a portion of a component, the sealant to act as an adhesive interface between the integrated heat spreader and the component, comprising:
a body portion; and
a lip portion vertically oriented relative to the body portion, the lip portion being constructed and arranged to define a channel in a face thereof.
19. The integrated heat spreader of claim 18 , wherein the channel is substantially concave.
20-23. (Canceled)
24. A method of making an integrated heat spreader, comprising:
forming a body portion; and
forming a lip portion vertically oriented relative to the body portion, wherein the lip portion defines a channel in a face thereof.
25. The method of claim 24 , wherein the channel is substantially concave.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/883,493 US20040244952A1 (en) | 2002-01-11 | 2004-07-01 | Integrated heat spreader with mechanical interlock designs |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/042,182 US20030131975A1 (en) | 2002-01-11 | 2002-01-11 | Integrated heat spreader with mechanical interlock designs |
US10/883,493 US20040244952A1 (en) | 2002-01-11 | 2004-07-01 | Integrated heat spreader with mechanical interlock designs |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/042,182 Division US20030131975A1 (en) | 2002-01-11 | 2002-01-11 | Integrated heat spreader with mechanical interlock designs |
Publications (1)
Publication Number | Publication Date |
---|---|
US20040244952A1 true US20040244952A1 (en) | 2004-12-09 |
Family
ID=21920490
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/042,182 Abandoned US20030131975A1 (en) | 2002-01-11 | 2002-01-11 | Integrated heat spreader with mechanical interlock designs |
US10/883,493 Abandoned US20040244952A1 (en) | 2002-01-11 | 2004-07-01 | Integrated heat spreader with mechanical interlock designs |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/042,182 Abandoned US20030131975A1 (en) | 2002-01-11 | 2002-01-11 | Integrated heat spreader with mechanical interlock designs |
Country Status (1)
Country | Link |
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US (2) | US20030131975A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080305584A1 (en) * | 2007-06-08 | 2008-12-11 | Chee Seng Foong | Heat spreader for center gate molding |
US20110012257A1 (en) * | 2009-07-14 | 2011-01-20 | Freescale Semiconductor, Inc | Heat spreader for semiconductor package |
TWI393717B (en) * | 2005-09-22 | 2013-04-21 | Abbott Lab | Benzothiazole cyclobutyl amine derivatives |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI278975B (en) * | 2003-03-04 | 2007-04-11 | Siliconware Precision Industries Co Ltd | Semiconductor package with heatsink |
US7327025B2 (en) * | 2004-04-30 | 2008-02-05 | St Assembly Test Services Ltd. | Heat spreader for thermally enhanced semiconductor package |
US20070215997A1 (en) * | 2006-03-17 | 2007-09-20 | Martin Standing | Chip-scale package |
US20070295482A1 (en) * | 2006-06-23 | 2007-12-27 | Fitzgerald Thomas J | Heat spreader for use in conjunction with a semiconducting device and method of manufacturing same |
US9536851B2 (en) * | 2014-09-05 | 2017-01-03 | Infineon Technologies Ag | Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
US4953173A (en) * | 1987-08-08 | 1990-08-28 | Kabushiki Kaisha Toshiba | Semiconductor device |
US5276586A (en) * | 1991-04-25 | 1994-01-04 | Hitachi, Ltd. | Bonding structure of thermal conductive members for a multi-chip module |
US5504652A (en) * | 1994-09-16 | 1996-04-02 | Apple Computer, Inc. | Unitary heat sink for integrated circuits |
US5587882A (en) * | 1995-08-30 | 1996-12-24 | Hewlett-Packard Company | Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate |
US5931222A (en) * | 1995-11-30 | 1999-08-03 | International Business Machines Coporation | Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same |
US5990418A (en) * | 1997-07-29 | 1999-11-23 | International Business Machines Corporation | Hermetic CBGA/CCGA structure with thermal paste cooling |
US6188578B1 (en) * | 1999-06-11 | 2001-02-13 | Industrial Technology Research Institute | Integrated circuit package with multiple heat dissipation paths |
US6188130B1 (en) * | 1999-06-14 | 2001-02-13 | Advanced Technology Interconnect Incorporated | Exposed heat spreader with seal ring |
US6222264B1 (en) * | 1999-10-15 | 2001-04-24 | Dell Usa, L.P. | Cooling apparatus for an electronic package |
US6232558B1 (en) * | 1997-04-30 | 2001-05-15 | Ibiden Co., Ltd. | Electronic component mounting base board having heat slug with slits and projections |
US6271058B1 (en) * | 1998-01-06 | 2001-08-07 | Nec Corporation | Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board |
US6294408B1 (en) * | 1999-01-06 | 2001-09-25 | International Business Machines Corporation | Method for controlling thermal interface gap distance |
US6376907B1 (en) * | 1997-12-01 | 2002-04-23 | Kabushiki Kaisha Toshiba | Ball grid array type package for semiconductor device |
US6469381B1 (en) * | 2000-09-29 | 2002-10-22 | Intel Corporation | Carbon-carbon and/or metal-carbon fiber composite heat spreader |
US6472762B1 (en) * | 2001-08-31 | 2002-10-29 | Lsi Logic Corporation | Enhanced laminate flipchip package using a high CTE heatspreader |
US6538320B1 (en) * | 2000-06-28 | 2003-03-25 | Advanced Micro Devices, Inc. | Heat spreader having holes for rivet-like adhesive connections |
US6577504B1 (en) * | 2000-08-30 | 2003-06-10 | Intel Corporation | Integrated heat sink for different size components with EMI suppression features |
-
2002
- 2002-01-11 US US10/042,182 patent/US20030131975A1/en not_active Abandoned
-
2004
- 2004-07-01 US US10/883,493 patent/US20040244952A1/en not_active Abandoned
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4953173A (en) * | 1987-08-08 | 1990-08-28 | Kabushiki Kaisha Toshiba | Semiconductor device |
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
US5276586A (en) * | 1991-04-25 | 1994-01-04 | Hitachi, Ltd. | Bonding structure of thermal conductive members for a multi-chip module |
US5504652A (en) * | 1994-09-16 | 1996-04-02 | Apple Computer, Inc. | Unitary heat sink for integrated circuits |
US5587882A (en) * | 1995-08-30 | 1996-12-24 | Hewlett-Packard Company | Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate |
US5931222A (en) * | 1995-11-30 | 1999-08-03 | International Business Machines Coporation | Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same |
US6232558B1 (en) * | 1997-04-30 | 2001-05-15 | Ibiden Co., Ltd. | Electronic component mounting base board having heat slug with slits and projections |
US5990418A (en) * | 1997-07-29 | 1999-11-23 | International Business Machines Corporation | Hermetic CBGA/CCGA structure with thermal paste cooling |
US6376907B1 (en) * | 1997-12-01 | 2002-04-23 | Kabushiki Kaisha Toshiba | Ball grid array type package for semiconductor device |
US6271058B1 (en) * | 1998-01-06 | 2001-08-07 | Nec Corporation | Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board |
US6294408B1 (en) * | 1999-01-06 | 2001-09-25 | International Business Machines Corporation | Method for controlling thermal interface gap distance |
US6188578B1 (en) * | 1999-06-11 | 2001-02-13 | Industrial Technology Research Institute | Integrated circuit package with multiple heat dissipation paths |
US6188130B1 (en) * | 1999-06-14 | 2001-02-13 | Advanced Technology Interconnect Incorporated | Exposed heat spreader with seal ring |
US6222264B1 (en) * | 1999-10-15 | 2001-04-24 | Dell Usa, L.P. | Cooling apparatus for an electronic package |
US6538320B1 (en) * | 2000-06-28 | 2003-03-25 | Advanced Micro Devices, Inc. | Heat spreader having holes for rivet-like adhesive connections |
US6577504B1 (en) * | 2000-08-30 | 2003-06-10 | Intel Corporation | Integrated heat sink for different size components with EMI suppression features |
US6469381B1 (en) * | 2000-09-29 | 2002-10-22 | Intel Corporation | Carbon-carbon and/or metal-carbon fiber composite heat spreader |
US6472762B1 (en) * | 2001-08-31 | 2002-10-29 | Lsi Logic Corporation | Enhanced laminate flipchip package using a high CTE heatspreader |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI393717B (en) * | 2005-09-22 | 2013-04-21 | Abbott Lab | Benzothiazole cyclobutyl amine derivatives |
US20080305584A1 (en) * | 2007-06-08 | 2008-12-11 | Chee Seng Foong | Heat spreader for center gate molding |
US8643172B2 (en) * | 2007-06-08 | 2014-02-04 | Freescale Semiconductor, Inc. | Heat spreader for center gate molding |
US20110012257A1 (en) * | 2009-07-14 | 2011-01-20 | Freescale Semiconductor, Inc | Heat spreader for semiconductor package |
Also Published As
Publication number | Publication date |
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US20030131975A1 (en) | 2003-07-17 |
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Legal Events
Date | Code | Title | Description |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |