US20040163441A1 - Stamping tool, casting mold and methods for structuring a surface of a work piece - Google Patents
Stamping tool, casting mold and methods for structuring a surface of a work piece Download PDFInfo
- Publication number
- US20040163441A1 US20040163441A1 US10/778,077 US77807704A US2004163441A1 US 20040163441 A1 US20040163441 A1 US 20040163441A1 US 77807704 A US77807704 A US 77807704A US 2004163441 A1 US2004163441 A1 US 2004163441A1
- Authority
- US
- United States
- Prior art keywords
- hollow chambers
- stamping
- stamping tool
- tool according
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C23/00—Tools; Devices not mentioned before for moulding
- B22C23/02—Devices for coating moulds or cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/06—Permanent moulds for shaped castings
- B22C9/061—Materials which make up the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/22—Moulds for peculiarly-shaped castings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
Abstract
A mold or stamping tool with which a simple, cost-effective stamping or molding in the nanometer range is enabled by a molding or stamping surface layer of the mold or tool being provided with hollow chambers formed by anodic oxidation.
Description
- This application is a division of co-pending U.S. patent application Ser. No. 10/281,376.
- Field of the Invention
- The present invention relates to a stamping tool having a structured stamping surface, a casting mold, a method for producing a stamping tool or a casting mold having a structured stamping surface, and methods for structuring a surface of a workpiece.
- Stamping constitutes a non-cutting manufacturing method for producing a relief-like or structured surface on a workpiece. A stamping tool with a profiled or structured stamping surface is used for this. The stamping surface is pressed with such a stamping force onto the surface to be structured of the workpiece or rolled on this, so that the workpiece becomes plastic and flows into depressions in the stamping tool or the stamping surface. Due to the considerable stamping forces employed, the stamping tool and the stamping surface are usually made of metal.
- Further, molding is known. A casting mold with a structured molding face can be used for producing a cast workpiece with a structured surface by casting.
- In the present invention nanometer range is understood to mean profiling or structuring with structural widths <1000 nm, especially <500 nm. The structural width designates the dimension by which individual structural elements, such as bumps, are repeated, that is, for example the average distance of adjacent bumps from one another or of depressions from one another.
- 2. Description of Related Art
- It is very expensive to manufacture a stamping tool with a very finely structured or profiled stamping surface. To create a so-called “moth eye structure”—evenly arranged, egg carton-like bumps—or fine grooves in the nanometer range, it is known from practice to use a lighting pattern with periodic intensity modulation for illuminating photo-sensitive material via two interfering laser beams. After the illuminated material develops, a periodic surface structure results, which is molded into other materials using various replication methods and finally into nickel, for example, by electroforming. This type of manufacturing is very expensive and is suited only for structuring even surfaces.
- In the nanometer range lithographic methods for structuring a stamping surface of a stamping tool can still only be used in a limited way. It should be noted here that the wavelength of the visible light alone is already 400 to 750 nm. In each case lithographic methods are very costly.
- German Patent DE 197 27 132 C2 discloses the manufacturing of a stamping tool by means of electrolytic machining. During electrolytic machining a metallic stamping surface of the stamping tool is treated electrolytically, wherein, being an anode in a fast-flowing electrolyte, the metal of the stamping surface is located at a minimal distance opposite a cathode and is dissolved in surface terms. The metal or the stamping surface contains the structure determined by the form of the cathode, and the cathode thus forms a recipient vessel that is shaped electrochemically. DE 197 27 132 C2 also provides the use of a cylindrical rotation electrode, whose covering surface presents a negative form of the desired stamping structure. Here, too, there is considerable expense involved and structuring in the nanometer range is at least only partly possible.
- The use of anodically oxidised surface layers made of aluminium or magnesium in casting molds to increase resistance is known from Swiss Patent CH 251 451. However, the forming of hollow chambers by oxidation for structuring a molded article in the nanometer range is not disclosed.
- Forming hollow chambers with anodic oxidation of aluminium is described in published European Patent Application EP 0 931 859 A1, for example.
- However, the related art does not provide a cost-effective solution to produce a workpiece, like a stamped piece, or casting with a surface structered in the nanometer range.
- Consequently, there is a need for a stamping tool, a casting mold, a method for manufacturing a stamping tool or a casting mold, a method for structuring a surface of a workpiece and a method for using a surface layer provided with open hollow chambers, wherein structuring in the nanometer range is enabled in a simple and cost-effective manner.
- Object of the present invention is to provide a stamping tool, a casting mold, a method for manufacturing a stamping tool or a casting mold, a method for structuring a surface of a workpiece and a method for using a surface layer provided with open hollow chambers, wherein structuring in the nanometer range is enabled in a simple and cost-effective manner.
- One aspect of the present invention is to use a porous oxide layer and especially a surface layer, formed via anodic oxidation and provided with open hollow chambers, as stamping surface of a stamping tool. This leads to several advantages.
- First, an oxide layer, especially the preferably provided aluminium oxide, is relatively hard. With respect to the often very high stamping forces this is an advantage for being able to stamp workpieces of various materials and for achieving a long tool life of the stamping tool.
- Second, model-free oxidation is very easy and cost-effective to carry out. In particular, producing hollow chambers is (quasi) independent of the form and configuration of the cathodes employed, so a model or negative form is not required, as in electrolytic machining.
- Third, the provided model-free forming of open hollow chambers via anodic oxidation enables structures to be manufactured in the nanometer range very easily and cost-effectively. In particular, structural widths of 500 nm and less, even 100 nm and less are possible.
- Fourth, depending on choice of procedural conditions the configuration—regular or irregular—and the surface density of the hollow chambers can be varied as required.
- Fifth, by likewise simply varying the procedural conditions—especially by variation of the voltage during anodising—the form of the hollow chambers and thus the structure of the stamping surface can be adjusted and varied.
- Sixth, the anodically oxidised surface layer can be used directly, thus without further molding, as the stamping surface of a stamping tool.
- A further aspect of the present invention is to use a porous oxide layer and especially a surface layer with open hollow chambers, formed by anodic oxidation directly or model-free, thus independent of a cathode form, as molding face or inner face of a casting mold. This has a number of advantages.
- First, an oxide layer, especially the preferably provided aluminium oxide, is relatively hard. With respect to the often very high forces utilised in casting or molding this is an advantage for being able to produce workpieces of various materials and for achieving a long shelf life of the casting mold.
- Second, the model-free oxidation is very easy and cost-effective to carry out. Producing hollow chambers is (quasi) independent on the form and configuration of the cathodes used, and a model or negative form is therefore not required.
- Third, the model-free forming of open hollow chambers as provided via anodic oxidation enables structures to be manufactured in the nanometer range very easily and cost-effectively. In particular, structural widths of 500 nm and less, even 100 nm and less are possible.
- Fourth, depending on choice of procedural conditions the configuration—regular or irregular—and the surface density of the hollow chambers can be varied as required.
- Fifth, by likewise simply varying the procedural conditions—especially by variation of the voltage during anodising—the form of the hollow chambers and thus the structure of the surface can be adjusted and varied.
- Sixth, the anodically oxidised surface layer can be used directly, thus without further molding, as the surface of a casting mold.
- Further advantages, properties, features and goals of the present invention will emerge from the following description of preferred embodiments with reference to the drawings.
- FIG. 1 shows a very schematic sectional elevation of a proposed stamping tool and a workpiece structured therewith according to a first embodiment; and
- FIG. 2 shows a very schematic sectional elevation of a proposed casting mold and a workpiece structured therewith according to an second embodiment.
- In a highly simplified sectional elevation, FIG. 1 shows a proposed
stamping tool 1 with a structured, i.e. profiled or relief-like stamping surface 2. Thestamping surface 2 is formed by a flat side of asurface layer 3, which is provided with openhollow chambers 4 produced by anodic oxidation. - In the illustrative example, the surface layer is applied to a
support 5 of thestamping tool 1. For example, thesurface layer 3 is applied to thesupport 5 by plasma coating. But thesurface layer 3 can also be formed directly by thesupport 5, and thus be a surface area of thesupport 5. - It is understood that the
surface layer 3 can also be deposited on thesupport 5 using other methods. - In the illustrative example the
surface layer 3 preferably consists of aluminium which is applied to thesupport 5 especially via plasma coating and adheres well to thesupport 5 preferably made of metal, especially iron or steel. - The
surface layer 3 is oxidised anodically at least partially in the illustrative example to the depth of acovering layer 6, whereby thehollow chambers 4 are formed in thesurface layer 3. Thehollow chambers 4 are formed immediately and/or without any model or pattern, i.e. the arrangement, distribution, form and the like of thehollow chambers 4—as opposed to electrolytic machining—is, thus, at least essentially independent of the surface shape and the proximity of the cathode (not shown) used in oxidation. Moreover, according to the invention, the “valve effect”, namely the occurring, independent formation ofhollow chambers 4 during oxidation or anodisation of thesurface layer 3,—at least in particular in the so-called valve metals—is used. This immediate or undefined formation of thehollow chambers 4 does not preclude an additional (before or after) formation or structuring of the stampingsurface 2 or thehollow chambers 4 by means of a negative form. - Depending on how completely or how deeply the
surface layer 3 is oxidised, or whether thesurface layer 3 is formed directly by thesupport 5, thesurface layer 3 can correspond to theoxidised covering layer 6. In this case, for example, theintermediate layer 7, which is comprised of aluminium in the illustrative example and which promotes very good adhesion between the coveringlayer 6 and thesupport 5, can be omitted. - For example, according to an alternative embodiment, the
uncoated support 5 can be oxidised anodically on its surface forming the stampingsurface 2 by formation of a porous oxide layer orhollow chambers 4. This is possible for example for asupport 5 made of iron or steel, especially stainless steel. In this case thesurface layer 3 then corresponds to thecovering layer 6, i.e. the oxidised layer. - Aluminium and iron or steel, especially stainless steel, have already been named as particularly preferred material, used at least substantially for forming the anodically
oxidised surface layer 3 or thecovering layer 6. However, silicon and titanium as well as other valve metals for example can also be used. - In the illustrative example the proportions in size are not presented true to scale.
- The
stamping tool 1 or itsstamping surface 2 preferably has a structural width S in the nanometer range, especially from 30 to 600 nm and preferably from 50 to 200 nm. - The
hollow chambers 4 or their openings have an average diameter D of essentially 10 to 500 nm, preferably 15 to 200 nm and especially 20 to 100 nm. - In the illustrative example the
hollow chambers 4 are designed essentially lengthwise, wherein their depth T is preferably at least approximately 0.5 times the above-mentioned, average diameter D and especially approximately 1.0 to 10 times the diameter D. - The
hollow chambers 4 are designed here at least substantially similarly in shape. In particular, thehollow chambers 4 are designed substantially cylindrically. But thehollow chambers 4 can also present a form deviating therefrom, for example they can be designed substantially conically. - In general, the
hollow chambers 4 can also have a cross-section varying in its depth T in form and/or diameter. In addition to this, thehollow chambers 4 can be designed substantially conically as a rough structure for example, and provided along their walls with many fine depressions (small hollow chambers) to form a fine structure in each case. - The
hollow chambers 4 are preferably distributed at least substantially uniformly over the surface of thesurface layer 3 or over the stampingsurface 2. However, uneven distribution is also feasible. - The hollow chambers or their openings are preferably distributed over the stamping
surface 2 with a surface density of 109 to 1011/cm2. In the illustrative example the surface density is substantially constant over the stampingsurface 2. But the surface density can also vary partially on the stampingsurface 2 as required. - The area of the openings of the
hollow chambers 4 is, at the most, preferably 50% of the extension area of the stampingsurface 2. A sufficiently high stability or carrying capacity of the stampingsurface 2 or thesurface layer 3/covering layer 6 is hereby achieved with respect to the high stresses arising during the stamping. - In general, the form, configuration, surface density and the like of the
hollow chambers 4 can be controlled by corresponding choice of the procedural conditions during anodic oxidation. For example, with oxidation of aluminium under potentiostatic conditions—with at least substantially constant voltage—an at least substantially even cross-section of thehollow chambers 4 is achieved over their depth T, i.e. an at least substantially cylindrical form. Accordingly, the form of thehollow chambers 4 can be influenced by varying the voltage. For example, galvanostatic oxidation—i.e. at an at least substantially constant current—leads to a somewhat conical or hill-like form of thehollow chambers 4, so that a type of “moth eye structure” or the like can be formed in this way. The surface density of thehollow chambers 4, i.e., the number ofhollow chambers 4 per surface unit the stampingsurface 2, depends inter alia on the voltage and the current during anodising. - As required, the
hollow chambers 4 can vary in their form, depth and/or surface density over the stampingsurface 2, especially partially, and/or be designed only partly on the stampingsurface 2. - And, if required, the stamping
surface 2 can also be modified before and/or after oxidation—creation of thehollow chambers 4—for example via a lithographic process, etching and/or other, preferably material-stripping methods, for example to create a rough structure in the form of paths, ridges, areas with or withouthollow chambers 4, large-surface bumps or depressions and the like on the stampingsurface 2. - Chemical sizing, especially by partial etching of oxide material, can also be carried out to modify the stamping
surface 2 or thehollow chambers 4. In this way the surface ratio of the opening surfaces of thehollow chambers 4 to the extension area of the stampingsurface 2 can be varied or increased. It is understood that other modifications of the stampingsurface 2 or of thehollow chambers 4 can also be made, depending on reaction time and intensity. - A particular advantage of the proposed solution is that the stamping
surface 2 can also be designed in a curved manner—for example cylindrically—or bulged—for example lenticular or hemispherical. In particular the stampingsurface 2 can have practically any shape at all. Compared to the prior art it is thus not necessary that the stampingsurface 2 or the surface of thesurface layer 3/covering layer 6 is at least substantially even. - The figure also shows a
workpiece 8, likewise in a highly simplified, not true-to-scale sectional diagram, in the already stamped state, i.e. with a surface 9 already structured by thestamping tool 1. Stamping takes places especially by thestamping tool 1 being pressed with a corresponding stamping force onto the surface 9 of theworkpiece 8 to be structured, so that the material of theworkpiece 8 flows at least partially into thehollow chambers 4. Here it is not necessary that theworkpiece 8, as illustrated diagrammatically in the figure, is designed in a monoblock manner. Instead, theworkpiece 8 can also present another type of surface layer or surface coating or the like, not illustrated here, which forms the surface 9 and is structured or designed in a relief-like manner by means of thestamping tool 1. - Instead of the stamp-like embossing the
stamping tool 1 can be unrolled with corresponding shaping/form of the stampingsurface 2 and/or the surface 9 to be structured. By way of example the stampingsurface 2 and/or the surface 9 to be structured can be designed in a curved manner—for example cylindrically—or in a bulged manner to enable reciprocal unrolling for structuring the surface 9. - Both a die stamping process and also a rolling stamp process can be realized with the proposed solution.
- Furthermore, the proposed solution can be used for embossing as well as closed-die coining or coining. A corresponding abutment for the
workpiece 8 or a corresponding countertool is not illustrated for clarification purposes. - The proposed
stamping tool 1 allows very fine structuring of theworkpiece 8 or its surface 9. If needed theworkpiece 8 or the surface 9 can also be profiled or structured repeatedly, first with a rough structured stamping tool—optionally manufactured also in customary fashion—and then with the finer structured proposedstamping tool 1. A lower stamping force is employed, especially during the second stamping procedure using thefiner stamping tool 1 and/or, in an intermediate step, the surface 9 is hardened in order not to fully neutralise the rough structure produced at first stamping, but to achieve superposition from the rough structure and the fine structure of both stamping tools. Thus, it is possible, for example, to create on the surface 9 relatively large bumps of the order of 0.1 to 50 μm each with several, relatively small protrusions, for example of the order of 10 to 400 nm, on the surface 9 of theworkpiece 8. - The proposed solution very easily and cost-effectively enables very fine structuring of the surface9. Accordingly, there is a very broad area of application. For example, such especially very fine structuring can be utilised in anti-reflex layers, for altering radiation emission of structured surfaces, in sensory analysis, in catalysis, in self-cleaning surfaces, in improving surface wetability and the like. In particular, the proposed solution also extends to the use of
workpieces 8 with structured surfaces 9 that have been structured by use of the proposedstamping tool 1 for the purposes mentioned hereinabove. - In particular the proposed solution is suited for stamping synthetic materials—for example PMMA (polymethyl methacrylates), Teflon or the like, metals—for example gold, silver, platinum, lead, idium, cadmium, zinc or the like, polymer coatings—for example paints, dyes or the like, and inorganic coating systems etc.
- Expressed in general terms, an essential aspect of the present invention according to the first embodiment is using a surface layer with hollow chambers formed by anodic oxidation as bottom die or upper die, to enable surface structuring in the nanometer range.
- Now, the second embodiment of the present invention is discussed with reference to FIG. 2.
- In a highly simplified partial sectional elevation, FIG. 2 shows a proposed
casting mold 11 with an at least partially structured, thus profiled or relief-like inner face ormolding face 12. Theface 12 is formed by a top or flat side of asurface layer 13 that is provided with openhollow chambers 14 produced by anodic oxidation. - In the illustrative example, the
surface layer 13 is applied to asupport 15 of the castingmold 11. For example, thesurface layer 13 is applied to thesupport 15 by plasma coating. But thesurface layer 13 can also be formed directly by thesupport 15, and thus be a surface area of thesupport 15. - It is understood that the
surface layer 13 can also be deposited on thesupport 15 using other methods. - In the illustrative example, the
surface layer 13 preferably comprises aluminium, which is applied to thesupport 15 especially via plasma coating and adheres well to thesupport 15 preferably made of metal, especially iron or steel. - The
surface layer 13 is oxidised anodically at least partially, in the illustrative example to the depth of a covering layer 16, by means of which thehollow chambers 14 are formed in thesurface layer 13 or covering layer 16. Thehollow chambers 14 are formed directly or model-free, that is, the configuration, distribution, form and the like of thehollow chambers 14 is, compared to electrolytic machining, therefore at least substantially dependent on the surface shape and proximity of the cathodes (not illustrated here) used during oxidation. Rather, the ‘valve effect’ is made use of here, as per the invention, namely the automatic development of thehollow chambers 14 occurring during oxidation or anodising of thesurface layer 13, at least especially with so-called valve metals. Such direct and model-free production of thehollow chambers 14 does not exclude additional (prior or subsequent) forming or structuring of theface 12 or of thehollow chambers 14 - completely or how deeply the
surface layer 13 is oxidised, or whether thesurface layer 13 is formed directly by thesupport 15, thesurface layer 13 can correspond to the oxidised covering layer 16. In the illustrative example in this case, for example, theintermediate layer 17, which is comprised of aluminium and which promotes very good adhesion between the covering layer 16 and thesupport 15, can be omitted. - For example, according to a design alternative the
uncoated support 15 can be oxidised anodically on its surface forming theface 12 by formation of a porous oxide layer orhollow chambers 14. This is possible for example for asupport 15 made of iron or steel, especially stainless steel. In this case thesurface layer 13 then corresponds to the covering layer 16, i.e., the oxidised layer. - Aluminium and iron or steel, especially stainless steel, have already been named as particularly preferred material, used at least substantially for forming the anodically
oxidised surface layer 13 or the covering layer 16. However, silicon and titanium as well as other valve metals for example can also be used. - In the illustrative example the proportions in size are not presented true to scale.
- The
face 12 preferably has a structural width S in the nanometer range, especially of 130 to 600 nm and preferably of 50 to 200 nm. - The
hollow chambers 14 or their openings have an average diameter D of essentially 10 to 500 nm, preferably 15 to 200 nm and especially 20 to 100 nm. - In the illustrative example, the
hollow chambers 14 are designed essentially lengthwise, wherein their depth T is preferably at least approximately 0.5 times the above-mentioned, average diameter D and especially approximately 1.0 to 10 times the diameter D. - The
hollow chambers 14 are designed here at least substantially identically. In particular thehollow chambers 14 are designed substantially cylindrically. But thehollow chambers 14 can also present a form deviating therefrom, for example they can be designed substantially conically. - In general the
hollow chambers 14 can also have a cross-section varying in its depth T in form and/or diameter. In addition to this, thehollow chambers 14 can be designed substantially conically as a rough structure for example, and provided along their walls with many fine depressions (small hollow chambers) to form a fine structure in each case. - The
hollow chambers 14 are preferably distributed at least substantially uniformly over the surface of thesurface layer 13 or over theface 12. However, uneven distribution is also feasible. - The hollow chambers or their openings are preferably distributed with a surface density of 109 to 1011/cm. In the illustrative example the surface density is substantially constant over the
face 12. But the surface density can also vary selectively on thesurface 12 as required. - The area of the openings of the
hollow chambers 14 is at the most preferably 50% of the extension area of theface 12. A sufficiently high stability or carrying capacity of theface 12 or thesurface layer 13/covering layer 16 is hereby achieved with respect to the high stresses arising partially from molding or casting. - In general the form, configuration, surface density and the like of the
hollow chambers 14 can be controlled by corresponding choice of the procedural conditions during anodic oxidation. For example, with oxidation of aluminium under potentiostatic conditions—i.e., at at least a substantially constant voltage—an at least substantially uniform cross-section of thehollow chambers 14 is achieved over their depth T, i.e., an at least substantially cylindrical form. Accordingly, the form of thehollow chambers 14 can be influenced by varying the voltage. For example, galvanostatic oxidation, i.e. at an at least substantially constant current, leads to a somewhat conical or hill-like form of thehollow chambers 14, so that a type of “moth eye structure” or the like can be formed in this way. The area density of thehollow chambers 14, i.e., the number ofhollow chambers 14 per area unit on theface 2, depends inter alia on the voltage and the current during anodising. - As required, the
hollow chambers 14 can vary in their form, depth and/or surface density over theface 2, especially partially, and/or be designed only partially on theface 12. - And, if required, the
face 12 can also be modified before and/or after oxidation—thus creation of thehollow chambers 14—for example, via a lithographic process, etching and/or other, preferably material-stripping methods, for example to create a rough structure in the form of paths, ridges, areas with or withouthollow chambers 14, large-surface bumps or depressions and the like on theface 12. - Mechanical processing and/or chemical sizing, especially by partial etching of oxide material, can also be carried out to modify the
face 12 or thehollow chambers 14. In this way, the area ratio of the opening areas of thehollow chambers 14 to the extension area of theface 12 can be varied or increased. It is understood that other modifications of theface 12 or of thehollow chambers 14 can also be made, depending on reaction time and intensity. - A particular advantage of the proposed solution is that the
face 12 can also be designed in practically any shape at all. - The figure also shows a molded article or
workpiece 18, likewise in a highly simplified, not true-to-scale, sectional diagram, in the already finished state, i.e., with asurface 19 already structured by the castingmold 11 after casting. - The proposed
casting mold 11 allows very fine structuring of theworkpiece 18 or itssurface 19. It is possible, for example, to create relatively large bumps of the order of 0.1 to 50 μm each with several, relatively small projections on thesurface 19, for example of the order of 10 to 400 nm, on thesurface 19 of theworkpiece 18. - The proposed solution very easily and cost-effectively enables very fine structuring of the
surface 19. Accordingly, there is a very broad area of application. For example, such especially very fine structuring can be utilised in anti-reflex layers, for altering radiation emission of structured surfaces, in sensory analysis, in catalysis, in self-cleaning surfaces, in improving surface wettability and the like. - Expressed in general terms, an essential aspect of the present invention is casting or molding a surface layer with hollow chambers formed directly or model-free by anodic oxidation, to enable surface structuring in the nanometer range.
- The present invention is especially not limited to a casting
mold 11 in the narrower sense. Rather, thesurface layer 13 or covering layer 16 is to be understood as model for a general structuring of a surface, a tool, a workpiece or the like in the nanometer range. In particular, the model may be molded in any way at all. And in particular, no reshaping is required when molding. For example, with theworkpiece 18 to be manufactured having a structuredsurface 19, this can be a cast article, wherein thesurface 19 is structured by casting or decanting or any molding of themold 11. - In general, the present invention enables a simple, cost-effective stamping or molding in the nanometer range by a surface layer with hollow chambers formed by anodic oxidation being used as matrix or as casting mold.
- Technical Applicability
- The proposed solution very easily and cost-effectively enables very fine structuring of the surface. Accordingly, there is a very broad area of application. For example, such especially very fine structuring can be utilised in anti-reflex layers, for altering radiation emission of structured surfaces, in sensory analysis, in catalysis, in self-cleaning surfaces, in improving surface wetability and the like. In particular, the proposed solution also extends to the use of workpieces with structured surfaces that have been structured by use of the proposed stamping tool for the purposes mentioned hereinabove. Further, the proposed solution can be used for casting with practically any material, since aluminium oxide especially is highly resistant mechanically, thermally and/or chemically.
Claims (19)
1. Stamping tool with a structured stamping surface, wherein the stamping surface is formed by an anodically oxidised surface layer or covering layer with open hollow chambers created model-free by the anodic oxidation, wherein the stamping surface is structured at least partially in the nanometer range by the hollow chambers.
2. Stamping tool according to claim 1 , wherein the structural width of the stamping surface is 30 to 600 nm.
3. Stamping tool according to claim 1 , wherein the hollow chambers have opening areas with an average diameter of 10 to 500 nm
4. Stamping tool according to claim 1 , wherein the hollow chambers have opening areas with an average, at least essentially uniform diameter of 15 to 200 nm.
5. Stamping tool according to claim 1 , wherein the hollow chambers have a depth, which greater than the average diameter of the hollow chambers.
6. Stamping tool according to claim 1 , wherein the hollow chambers are conically shaped.
7. Stamping tool according to claim 1 , wherein the hollow chambers vary at least in one of form, depth, and surface density.
8. Stamping tool according to claim 1 , wherein the stamping surface comprises both a fine and rough structure.
9. Stamping tool according to claim 1 , wherein the stamping surface is curved.
10. Stamping tool according to claim 1 , wherein the surface layer or the covering layer with the hollow chambers is formed at least substantially of a material from the group consisting of aluminium oxide, silicon oxide, iron oxide, oxidised steel and titanium oxide.
11. Mold with a molding face formed of an anodally oxidized surface or covering layer with open hollow chambers created model-free by the anodic oxidation, wherein the molding face has a structure formed at least partially by the hollow chambers which have diameters in a nanometer range.
12. Mold according to claim I 1, wherein the structural width of the molding face is essentially 30 to 600 nm.
13. Mold according to claim I 1, wherein the hollow chambers have opening areas with an average diameter of 10 to 500 nm.
14. Mold according to claim 11 , wherein the hollow chambers have opening areas with an average, at least essentially uniform diameter of 15 to 200 nm.
15. Mold according to claim 11 , wherein the hollow chambers have a depth, which greater than the average diameter of the hollow chambers.
16. Mold according to claim 11 , wherein the hollow chambers are designed conically.
17. Mold according to claim 11 , wherein the hollow chambers vary at least in one of form, depth, and surface density.
18. Mold according to claim 11 , wherein the molding face surface comprises both a fine and rough structure.
19. Mold according to claim 11 , wherein the surface layer or the covering layer with the hollow chambers is formed at least substantially of a material from the group consisting of aluminium oxide, silicon oxide, iron oxide, oxidised steel and titanium oxide.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/778,077 US20040163441A1 (en) | 2000-04-28 | 2004-02-17 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10020877A DE10020877C1 (en) | 2000-04-28 | 2000-04-28 | Stamping tool has a structured stamping surface with an anodically oxidized surface layer or a covering layer having open hollow chambers produced by anodic oxidation |
DE10020877.0 | 2000-04-28 | ||
DE10131513.9 | 2001-07-02 | ||
DE10131513 | 2001-07-02 | ||
DE10154756A DE10154756C1 (en) | 2001-07-02 | 2001-11-09 | Use of a surface layer or covering layer provided with open hollow chambers by anodic oxidation for structuring a surface of a cast part and/or workpiece |
DE10154756.0 | 2001-11-09 | ||
US10/281,376 US7066234B2 (en) | 2001-04-25 | 2002-10-28 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US10/778,077 US20040163441A1 (en) | 2000-04-28 | 2004-02-17 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/281,376 Division US7066234B2 (en) | 2000-04-28 | 2002-10-28 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
Publications (1)
Publication Number | Publication Date |
---|---|
US20040163441A1 true US20040163441A1 (en) | 2004-08-26 |
Family
ID=32872816
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/281,376 Ceased US7066234B2 (en) | 2000-04-28 | 2002-10-28 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US10/778,077 Abandoned US20040163441A1 (en) | 2000-04-28 | 2004-02-17 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US12/213,990 Expired - Lifetime USRE43694E1 (en) | 2000-04-28 | 2008-06-26 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US12/662,682 Expired - Lifetime USRE44830E1 (en) | 2000-04-28 | 2010-04-28 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US12/662,683 Expired - Lifetime USRE46606E1 (en) | 2000-04-28 | 2010-04-28 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/281,376 Ceased US7066234B2 (en) | 2000-04-28 | 2002-10-28 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/213,990 Expired - Lifetime USRE43694E1 (en) | 2000-04-28 | 2008-06-26 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US12/662,682 Expired - Lifetime USRE44830E1 (en) | 2000-04-28 | 2010-04-28 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US12/662,683 Expired - Lifetime USRE46606E1 (en) | 2000-04-28 | 2010-04-28 | Stamping tool, casting mold and methods for structuring a surface of a work piece |
Country Status (1)
Country | Link |
---|---|
US (5) | US7066234B2 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070159698A1 (en) * | 2004-12-03 | 2007-07-12 | Sharp Kabushiki Kaisha | Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper |
US20070235342A1 (en) * | 2004-10-01 | 2007-10-11 | Canon Kabushiki Kaisha | Method for manufacturing nanostructure |
WO2007144826A3 (en) * | 2006-06-13 | 2008-07-17 | Suisse Electronique Microtech | Pharmaceutical tablets with diffractive microstructure and compression tools for producing such tablets |
US20080257861A1 (en) * | 2003-04-21 | 2008-10-23 | Samsung Electronics Co., Ltd. | Method of manufacturing self-ordered nanochannel-array and method of manufacturing nanodot using the nanochannel-array |
US20100119782A1 (en) * | 2008-11-07 | 2010-05-13 | Canon Kabushiki Kaisha | Optical element molding die and method for molding optical element |
US20100258978A1 (en) * | 2008-02-27 | 2010-10-14 | Nobuaki Yamada | Roller nanoimprint apparatus, mold roller for use in roller nanoimprint apparatus, fixing roller for use in roller nanoimprint apparatus, and production method of nanoimprint sheet |
US20100284087A1 (en) * | 2008-03-04 | 2010-11-11 | Sharp Kabushiki Kaisha | Optical element, roller type nanoprinting apparatus, and process for producing die roll |
US20100290118A1 (en) * | 2008-12-25 | 2010-11-18 | Nobuaki Yamada | Liquid tank, viewing device for under-liquid observation, and optical film |
USRE43694E1 (en) | 2000-04-28 | 2012-10-02 | Sharp Kabushiki Kaisha | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US8384998B2 (en) | 2009-06-12 | 2013-02-26 | Sharp Kabushiki Kaisha | Antireflection film, display device and light transmissive member |
DE102007026958B4 (en) * | 2006-06-13 | 2014-10-09 | Csem Centre Suisse D'electronique Et De Microtechnique S.A. | Press tool with diffractive microstructure and method for producing such a tool and tableting press |
US9025250B2 (en) | 2009-04-24 | 2015-05-05 | Sharp Kabushiki Kaisha | Antireflection film, method for manufacturing antireflection film, and display apparatus |
US9108351B2 (en) | 2010-03-09 | 2015-08-18 | Sharp Kabushiki Kaisha | Method for forming anodized layer, method for producing mold and method for producing antireflective film |
US9366785B2 (en) | 2009-10-28 | 2016-06-14 | Sharp Kabushiki Kaisha | Mold, method for manufacturing a mold, and antireflective film |
CN107219722A (en) * | 2017-05-19 | 2017-09-29 | 湖北知本信息科技有限公司 | The preparation method of high anti-reflection surface micro-structure and the micro-structural of preparation |
Families Citing this family (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7713297B2 (en) | 1998-04-11 | 2010-05-11 | Boston Scientific Scimed, Inc. | Drug-releasing stent with ceramic-containing layer |
US20070116934A1 (en) * | 2005-11-22 | 2007-05-24 | Miller Scott M | Antireflective surfaces, methods of manufacture thereof and articles comprising the same |
US20070224235A1 (en) | 2006-03-24 | 2007-09-27 | Barron Tenney | Medical devices having nanoporous coatings for controlled therapeutic agent delivery |
US8187620B2 (en) | 2006-03-27 | 2012-05-29 | Boston Scientific Scimed, Inc. | Medical devices comprising a porous metal oxide or metal material and a polymer coating for delivering therapeutic agents |
US7713768B2 (en) | 2006-06-14 | 2010-05-11 | Kanagawa Academy Of Science And Technology | Anti-reflective film and production method thereof, and stamper for producing anti-reflective film and production method thereof |
US8815275B2 (en) | 2006-06-28 | 2014-08-26 | Boston Scientific Scimed, Inc. | Coatings for medical devices comprising a therapeutic agent and a metallic material |
WO2008002778A2 (en) | 2006-06-29 | 2008-01-03 | Boston Scientific Limited | Medical devices with selective coating |
WO2008033711A2 (en) | 2006-09-14 | 2008-03-20 | Boston Scientific Limited | Medical devices with drug-eluting coating |
US7981150B2 (en) | 2006-11-09 | 2011-07-19 | Boston Scientific Scimed, Inc. | Endoprosthesis with coatings |
WO2008082421A1 (en) * | 2007-01-05 | 2008-07-10 | Sabic Innovative Plastics Ip B.V. | Antireflective surfaces, methods of manufacture thereof and articles comprising the same |
US8070797B2 (en) | 2007-03-01 | 2011-12-06 | Boston Scientific Scimed, Inc. | Medical device with a porous surface for delivery of a therapeutic agent |
US8431149B2 (en) | 2007-03-01 | 2013-04-30 | Boston Scientific Scimed, Inc. | Coated medical devices for abluminal drug delivery |
US8067054B2 (en) | 2007-04-05 | 2011-11-29 | Boston Scientific Scimed, Inc. | Stents with ceramic drug reservoir layer and methods of making and using the same |
US7976915B2 (en) | 2007-05-23 | 2011-07-12 | Boston Scientific Scimed, Inc. | Endoprosthesis with select ceramic morphology |
US8002823B2 (en) | 2007-07-11 | 2011-08-23 | Boston Scientific Scimed, Inc. | Endoprosthesis coating |
US7942926B2 (en) | 2007-07-11 | 2011-05-17 | Boston Scientific Scimed, Inc. | Endoprosthesis coating |
JP2010533563A (en) | 2007-07-19 | 2010-10-28 | ボストン サイエンティフィック リミテッド | Endoprosthesis with adsorption inhibiting surface |
US7931683B2 (en) | 2007-07-27 | 2011-04-26 | Boston Scientific Scimed, Inc. | Articles having ceramic coated surfaces |
US8815273B2 (en) | 2007-07-27 | 2014-08-26 | Boston Scientific Scimed, Inc. | Drug eluting medical devices having porous layers |
US8221822B2 (en) | 2007-07-31 | 2012-07-17 | Boston Scientific Scimed, Inc. | Medical device coating by laser cladding |
JP2010535541A (en) | 2007-08-03 | 2010-11-25 | ボストン サイエンティフィック リミテッド | Coating for medical devices with large surface area |
US20090048659A1 (en) * | 2007-08-17 | 2009-02-19 | Boston Scientific Scimed, Inc. | Medical devices having sol-gel derived ceramic regions with molded submicron surface features |
US8216632B2 (en) | 2007-11-02 | 2012-07-10 | Boston Scientific Scimed, Inc. | Endoprosthesis coating |
US8029554B2 (en) | 2007-11-02 | 2011-10-04 | Boston Scientific Scimed, Inc. | Stent with embedded material |
US7938855B2 (en) | 2007-11-02 | 2011-05-10 | Boston Scientific Scimed, Inc. | Deformable underlayer for stent |
EP2249330A1 (en) * | 2008-02-22 | 2010-11-10 | Sharp Kabushiki Kaisha | Display device |
JP5581311B2 (en) | 2008-04-22 | 2014-08-27 | ボストン サイエンティフィック サイムド,インコーポレイテッド | MEDICAL DEVICE HAVING INORGANIC MATERIAL COATING AND MANUFACTURING METHOD THEREOF |
WO2009132176A2 (en) | 2008-04-24 | 2009-10-29 | Boston Scientific Scimed, Inc. | Medical devices having inorganic particle layers |
CN102016651B (en) * | 2008-06-06 | 2013-05-22 | 夏普株式会社 | Antireflection film, optical element comprising antireflection film, stamper, process for producing stamper, and process for producing antireflection film |
WO2009155328A2 (en) | 2008-06-18 | 2009-12-23 | Boston Scientific Scimed, Inc. | Endoprosthesis coating |
US8231980B2 (en) | 2008-12-03 | 2012-07-31 | Boston Scientific Scimed, Inc. | Medical implants including iridium oxide |
JP4531131B1 (en) * | 2008-12-26 | 2010-08-25 | シャープ株式会社 | Method for manufacturing mold and method for manufacturing antireflection film using mold |
US20110278770A1 (en) | 2009-01-30 | 2011-11-17 | Akinobu Isurugi | Mold, mold manufacturing method and method for manufacturing anti-reflection film using the mold |
US8071156B2 (en) | 2009-03-04 | 2011-12-06 | Boston Scientific Scimed, Inc. | Endoprostheses |
EP2405036B1 (en) | 2009-03-05 | 2017-11-08 | Sharp Kabushiki Kaisha | Mold manufacturing method and electrode structure for use therein |
US8580135B2 (en) * | 2009-04-09 | 2013-11-12 | Sharp Kabushiki Kaisha | Die and method of manufacturing same |
US8287937B2 (en) | 2009-04-24 | 2012-10-16 | Boston Scientific Scimed, Inc. | Endoprosthese |
US8545708B2 (en) | 2009-04-30 | 2013-10-01 | Sharp Kabushiki Kaisha | Mold and manufacturing method therefor |
WO2011027746A1 (en) | 2009-09-04 | 2011-03-10 | シャープ株式会社 | Method for forming anodized layer, method for producing mold, method for producing antireflective film, and mold and antireflective film |
US9127371B2 (en) | 2009-10-09 | 2015-09-08 | Sharp Kabushiki Kaisha | Mold and production method for same, and anti-reflection film |
EP2489764B1 (en) | 2009-10-14 | 2022-11-30 | Sharp Kabushiki Kaisha | Die and method for manufacturing die, and anti-reflection coating |
CN102639307B (en) | 2009-11-27 | 2014-08-06 | 夏普株式会社 | Method for producing die and moth-eye structure |
TWI412459B (en) * | 2009-12-08 | 2013-10-21 | Univ Nat Taiwan | The method of forming a roller for embossing |
US9193096B2 (en) | 2010-02-24 | 2015-11-24 | Sharp Kabushiki Kaisha | Die, die production method, and production of antireflection film |
US8889220B2 (en) | 2010-03-08 | 2014-11-18 | Sharp Kabushiki Kaisha | Mold release treatment method, mold, method for producing anti-reflective film, mold release treatment device, and washing/drying device for mold |
JP5027346B2 (en) * | 2010-03-31 | 2012-09-19 | シャープ株式会社 | Mold, mold manufacturing method, and antireflection film manufacturing method |
JP5027347B2 (en) | 2010-04-28 | 2012-09-19 | シャープ株式会社 | Mold and mold manufacturing method |
WO2011136229A1 (en) | 2010-04-28 | 2011-11-03 | シャープ株式会社 | Method for forming anodized layer |
WO2011145625A1 (en) | 2010-05-19 | 2011-11-24 | シャープ株式会社 | Die inspection method |
CN106842394A (en) * | 2010-06-25 | 2017-06-13 | 安德鲁·理查德·帕克 | Optical effect structure |
US8524134B2 (en) * | 2010-07-12 | 2013-09-03 | Graham J. Hubbard | Method of molding polymeric materials to impart a desired texture thereto |
WO2012029570A1 (en) | 2010-08-30 | 2012-03-08 | シャープ株式会社 | Method for forming anodized layer and mold production method |
JP5595511B2 (en) | 2010-10-08 | 2014-09-24 | シャープ株式会社 | Method for producing anodized film |
US9128220B2 (en) | 2010-11-29 | 2015-09-08 | Sharp Kabushiki Kaisha | Light guide body with continuously variable refractive index, and devices using such body |
WO2012073820A1 (en) | 2010-11-30 | 2012-06-07 | シャープ株式会社 | Electrode structure, substrate holder, and method for forming anodic oxidation layer |
WO2012137664A1 (en) | 2011-04-01 | 2012-10-11 | シャープ株式会社 | Mold production method |
JP5856286B2 (en) | 2012-03-26 | 2016-02-09 | シャープ株式会社 | Mold release processing method and manufacturing method of antireflection film |
US20130256143A1 (en) * | 2012-03-30 | 2013-10-03 | GM Global Technology Operations LLC | Anodized inserts for coulomb damping or frictional damping |
SG11201408156PA (en) | 2012-06-06 | 2015-03-30 | Sharp Kk | Mold base material, production method for mold base material, mold production method, and mold |
US20150241603A1 (en) * | 2012-06-22 | 2015-08-27 | Sharp Kabushiki Kaisha | Anti-reflection structure, imprint mold, method for producing anti-reflection structure, method for producing imprint mold, and display device |
US9442222B2 (en) | 2012-07-31 | 2016-09-13 | Dai Nippon Printing Co., Ltd. | Antireflective article, image display device, and production mold for antireflective article |
WO2014021376A1 (en) | 2012-07-31 | 2014-02-06 | 大日本印刷株式会社 | Antireflective article, image display device, production mold for antireflective article, and production method for antireflective article production mold |
US9652566B2 (en) * | 2013-08-13 | 2017-05-16 | Gm Global Technology Operations, Llc | Methods for simulating oxides in aluminum castings |
CN104511529A (en) * | 2013-09-30 | 2015-04-15 | 国立高雄第一科技大学 | Bending die with surface micro-structure and bending punch thereof |
US10549458B2 (en) | 2014-04-14 | 2020-02-04 | Sharp Kabushiki Kaisha | Mold, method for producing mold, anti-reflection film and method for producing anti-reflection film |
CN108990977B (en) | 2014-04-22 | 2022-03-08 | 夏普株式会社 | Film, laminate, sterilization method, and method for reactivating surface of film |
CN106456817B (en) | 2014-04-28 | 2019-06-18 | 夏普株式会社 | Filter and container with bactericidal effect |
CN106662415B (en) | 2014-08-07 | 2018-11-30 | 夏普株式会社 | Heat exchanger, metal component, electric heater, beverage supply device and cover of the lunch box |
CN107148335B (en) | 2014-11-06 | 2019-04-30 | 夏普株式会社 | The manufacturing method of mold and the manufacturing method of antireflection film |
US10675788B2 (en) | 2014-11-12 | 2020-06-09 | Sharp Kabushiki Kaisha | Method for producing mold |
WO2016080245A1 (en) | 2014-11-20 | 2016-05-26 | シャープ株式会社 | Synthetic polymer film having surface provided with bactericidal activity |
JP6401298B2 (en) | 2014-12-25 | 2018-10-10 | シャープ株式会社 | Method for preserving food, food film, food container and food handling method |
CN107709419B (en) | 2015-06-23 | 2020-09-08 | 夏普株式会社 | Synthetic polymer film having surface with bactericidal action |
US10375953B2 (en) | 2015-07-17 | 2019-08-13 | Sharp Kabushiki Kaisha | Synthetic polymer film having surface that is provided with bactericidal action, and film comprising same |
WO2017047344A1 (en) | 2015-09-17 | 2017-03-23 | シャープ株式会社 | Synthetic polymer film provided with surface having sterilizing effect, method for manufacturing synthetic polymer film and sterilization method using surface of synthetic polymer film |
JP6552645B2 (en) | 2015-12-28 | 2019-07-31 | シャープ株式会社 | Printing intaglio, method of producing printing intaglio, method of producing printed matter, and printed matter |
TWI602690B (en) * | 2016-12-07 | 2017-10-21 | 財團法人金屬工業研究發展中心 | Failure detection device for stamping mold |
US11335831B2 (en) | 2017-03-29 | 2022-05-17 | Sharp Kabushiki Kaisha | Optical device case and optical device |
EP3459353B1 (en) | 2017-09-26 | 2022-04-20 | Sharp Kabushiki Kaisha | Synthetic polymer film whose surface has microbicidal activity, photocurable resin composition, manufacturing method of synthetic polymer film, and sterilization method with use of surface of synthetic polymer film |
JP6751731B2 (en) | 2018-02-21 | 2020-09-09 | シャープ株式会社 | Synthetic polymer membrane and method for manufacturing synthetic polymer membrane |
JP6761437B2 (en) | 2018-03-15 | 2020-09-23 | シャープ株式会社 | Synthetic polymer membranes with a bactericidal surface, plastic products with synthetic polymer membranes, sterilization methods using the surface of synthetic polymer membranes, photocurable resin compositions, and methods for producing synthetic polymer membranes. |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4085792A (en) * | 1975-10-02 | 1978-04-25 | General Battery Corporation | Method of casting lead alloy automotive battery parts |
US4148204A (en) * | 1971-05-07 | 1979-04-10 | Siemens Aktiengesellschaft | Process of mechanically shaping metal articles |
US4581913A (en) * | 1983-07-27 | 1986-04-15 | Luster Finish, Inc. | Method for improving the release and finish characteristics of metal stamping dies |
US5318091A (en) * | 1991-11-22 | 1994-06-07 | Borgo-Nova Spa | Die coating |
US5415219A (en) * | 1992-07-21 | 1995-05-16 | Hagen Batterie Ag | Grid casting mold for the casting of lead grids for accumulators and methods for its manufacture |
US5693208A (en) * | 1995-03-16 | 1997-12-02 | Alusuisse Technology & Management Ltd. | Process for continuously anodizing strips or wires of aluminum |
US5693210A (en) * | 1995-08-31 | 1997-12-02 | President Of Tohoku University | Method of manufacturing porous alumina tube |
US6139713A (en) * | 1996-08-26 | 2000-10-31 | Nippon Telegraph And Telephone Corporation | Method of manufacturing porous anodized alumina film |
US6354358B1 (en) * | 1999-11-26 | 2002-03-12 | Nomura Plating Co., Ltd. | Continuous casting mold with tungsten alloy plating and method of producing the same |
US6476409B2 (en) * | 1999-04-27 | 2002-11-05 | Canon Kabushiki Kaisha | Nano-structures, process for preparing nano-structures and devices |
US6874262B2 (en) * | 1999-06-01 | 2005-04-05 | Nikon Corporation | Method for manufacturing master substrate used for manufacturing grooved molding substrate, method for manufacturing stamper for manufacturing grooved molding substrate, method for manufacturing grooved molding substrate, grooved molding substrate, memory medium, memory device, and computer |
Family Cites Families (160)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH251451A (en) | 1940-07-01 | 1947-10-31 | Parlanti Conrad Anthony | Process for obtaining molded metal objects. |
US2331743A (en) | 1942-05-23 | 1943-10-12 | Marathon Paper Mills Co | Roll spindle |
BE514705A (en) | 1951-06-25 | |||
US2849192A (en) | 1955-10-20 | 1958-08-26 | Us Shaft Company | Core engaging shaft |
FR1471384A (en) | 1966-03-09 | 1967-03-03 | Dornbusch & Co | Stamping cylinder for the treatment of webs, in particular webs of thermoplastic material |
US4240257A (en) | 1973-02-22 | 1980-12-23 | The Singer Company | Heat pipe turbo generator |
JPS53103754U (en) | 1977-01-26 | 1978-08-21 | ||
US4190321A (en) | 1977-02-18 | 1980-02-26 | Minnesota Mining And Manufacturing Company | Microstructured transmission and reflectance modifying coating |
US4114983A (en) | 1977-02-18 | 1978-09-19 | Minnesota Mining And Manufacturing Company | Polymeric optical element having antireflecting surface |
IN151147B (en) | 1978-01-17 | 1983-02-26 | Alcan Res & Dev | |
JPS60103308A (en) | 1983-11-11 | 1985-06-07 | Pioneer Electronic Corp | Manufacture of micro fresnel lens |
JPS60146607A (en) | 1983-12-29 | 1985-08-02 | Nippon Steel Corp | Method of cutting weld bead on inner surface of steel pipe and device therefor |
JPS60163423A (en) | 1984-02-03 | 1985-08-26 | 昭和アルミニウム株式会社 | Method of etching aluminum foil for electrolytic condenser electrode |
JPS6144607A (en) | 1984-08-10 | 1986-03-04 | Toyoda Gosei Co Ltd | Embossed product and manufacture thereof |
JPS6144607Y2 (en) | 1985-02-01 | 1986-12-16 | ||
JPH084087B2 (en) | 1987-03-30 | 1996-01-17 | 工業技術院長 | InSb element manufacturing method |
JPS63303714A (en) | 1987-06-05 | 1988-12-12 | Sanko Raito Kogyo Kk | Aluminum mold and injection molding |
JPH0516228Y2 (en) | 1987-09-12 | 1993-04-28 | ||
JPH0516230Y2 (en) | 1987-10-30 | 1993-04-28 | ||
JPH02254192A (en) | 1989-03-27 | 1990-10-12 | Hideki Masuda | Production of porous material |
JPH021691A (en) | 1989-04-20 | 1990-01-05 | Victor Co Of Japan Ltd | Video camera |
US5249949A (en) | 1989-09-11 | 1993-10-05 | Eastman Kodak Company | Apparatus for texturizing toner image bearing receiving sheets |
JPH07104272B2 (en) | 1989-12-26 | 1995-11-13 | 株式会社フジクラ | Optical fiber sensor |
JPH0636132B2 (en) | 1989-12-29 | 1994-05-11 | キヤノン株式会社 | Liquid crystal display |
US5150231A (en) | 1989-12-29 | 1992-09-22 | Canon Kabushiki Kaisha | Impact resistant ferroelectric liquid crystal apparatus |
JPH075693Y2 (en) | 1990-04-07 | 1995-02-08 | ティーディーケイ株式会社 | Circularly polarized antenna device |
DE4025712C1 (en) | 1990-08-14 | 1991-09-12 | Walter Steinhausen Ch Mathis | |
EP0481753B1 (en) | 1990-10-19 | 1996-07-10 | Canon Kabushiki Kaisha | Molding roll, method for manufacturing it, and apparatus for forming substrate sheet for optical recording medium |
JPH0516230A (en) | 1990-10-19 | 1993-01-26 | Canon Inc | Forming roll, manufacture thereof and apparatus for manufacturing substrate sheet for optical recording medium |
JPH0825026B2 (en) | 1990-11-22 | 1996-03-13 | ミサワホーム株式会社 | Temporary attachment method of reinforcing member |
JPH0671763B2 (en) | 1991-02-21 | 1994-09-14 | 筒中プラスチック工業株式会社 | Thermoforming method for polycarbonate resin sheet |
JPH0516228A (en) | 1991-04-15 | 1993-01-26 | Dainippon Printing Co Ltd | Gloss-mat type shaped film |
FR2690762B1 (en) | 1992-04-30 | 1995-02-17 | Samsung Electronic Devices | Optical phase delay compensation film. |
JP2793076B2 (en) | 1992-05-20 | 1998-09-03 | シャープ株式会社 | Reflective liquid crystal display device and method of manufacturing the same |
JP3004127B2 (en) | 1992-07-15 | 2000-01-31 | エヌ・イーケムキャット株式会社 | Method for producing porous metal oxide |
CA2088936C (en) | 1993-02-08 | 2000-01-25 | Udo Horst Mohaupt | Capacitance weighing mat with substantially rigid separators |
DE69405451T2 (en) | 1993-03-16 | 1998-03-12 | Koninkl Philips Electronics Nv | Method and device for producing a structured relief image from cross-linked photoresist on a flat substrate surface |
JP2898860B2 (en) | 1993-09-29 | 1999-06-02 | 凸版印刷株式会社 | Reflective liquid crystal display |
TW298574B (en) | 1994-03-08 | 1997-02-21 | Syfal Srl | |
KR960703469A (en) | 1994-05-02 | 1996-08-17 | 프레데릭 얀 스미트 | Optical transmissive component with anti-reflection gratings |
JPH07306408A (en) | 1994-05-11 | 1995-11-21 | Casio Comput Co Ltd | Liquid crystal display device |
JPH0825026A (en) | 1994-07-11 | 1996-01-30 | Nibetsukusu Kk | Flow regulating material for aluminum casting and flow regulator using the same |
JP3085628B2 (en) | 1994-07-12 | 2000-09-11 | シャープ株式会社 | Method for manufacturing switching element |
JPH0885117A (en) | 1994-09-16 | 1996-04-02 | Ricoh Co Ltd | Molding die and production thereof |
KR100473691B1 (en) | 1994-11-16 | 2005-04-14 | 가부시키가이샤 고베 세이코쇼 | Vacuum chamber made of aluminum or its alloy |
US5811137A (en) | 1995-02-17 | 1998-09-22 | Casa Herrera, Inc. | Dough Sheeter having independant internally-driven self-powered rollers |
US5808707A (en) | 1995-03-01 | 1998-09-15 | Canon Kabushiki Kaisha | Display apparatus |
JP3198044B2 (en) | 1995-03-01 | 2001-08-13 | キヤノン株式会社 | Display device |
US6380997B1 (en) | 1995-04-07 | 2002-04-30 | Colorlink, Inc. | Achromatic polarization inverters for displaying inverse frames in DC balanced liquid crystal displays |
JPH08321381A (en) | 1995-05-26 | 1996-12-03 | Chisso Corp | Organic electroluminescent element |
JP2768313B2 (en) | 1995-06-13 | 1998-06-25 | 日本電気株式会社 | Reflective liquid crystal display |
DE19536194A1 (en) | 1995-09-28 | 1997-04-03 | Glasbau Gmbh As | Aquarium or paludarium with fish etc and plants |
US6309580B1 (en) | 1995-11-15 | 2001-10-30 | Regents Of The University Of Minnesota | Release surfaces, particularly for use in nanoimprint lithography |
JPH09155972A (en) | 1995-12-12 | 1997-06-17 | Ykk Corp | Water repellant film and its manufacture |
US5600360A (en) | 1996-04-30 | 1997-02-04 | Automated Packaging Systems, Inc. | Thermal imprinter and method |
JPH09322674A (en) | 1996-05-31 | 1997-12-16 | Matsushita Electric Ind Co Ltd | Film for lining interior of water tank, water tank using the same and coating material composition for coating inner surface of water tank containing antimicrobial agent therein and water tank using the same |
CA2208784A1 (en) | 1996-06-26 | 1997-12-26 | Atsushi Fujii | Method of emboss pattern process, emboss pattern processing apparatus, and embossed sheet |
JPH1016008A (en) | 1996-07-02 | 1998-01-20 | Sharp Corp | Mold for molding plastics and injection molding device using this mold |
JPH1046382A (en) | 1996-07-26 | 1998-02-17 | Mitsubishi Materials Corp | Production of fine metallic fiber and conductive paint using the fiber |
JP3714507B2 (en) | 1996-08-26 | 2005-11-09 | 日本電信電話株式会社 | Method for producing porous anodized alumina film |
JPH1068816A (en) | 1996-08-29 | 1998-03-10 | Sharp Corp | Phase difference plate and circularly polarizing plate |
US6020945A (en) | 1996-11-11 | 2000-02-01 | Dowa Mining Co., Ltd. | Display device with a transparent optical filter |
DE19701568C1 (en) | 1997-01-17 | 1998-07-23 | Karlsruhe Forschzent | Structured layer formation for micro-engineered functional system |
DE19708776C1 (en) | 1997-03-04 | 1998-06-18 | Fraunhofer Ges Forschung | Anti-reflection coating for glass or plastics panels used in windows, display screens etc. |
JP3202649B2 (en) | 1997-04-17 | 2001-08-27 | 日本電気株式会社 | Material for forming antireflection film and method for manufacturing semiconductor device using the same |
FR2762862B1 (en) | 1997-04-30 | 1999-07-16 | Guial | METHOD FOR MANUFACTURING A CALENDERING CYLINDER AND SHEETS OF THERMOPLASTIC FILMS OBTAINED BY ROLLING A THERMOPLASTIC RESIN USING SUCH A CYLINDER |
DE19727132C2 (en) | 1997-06-26 | 2000-02-03 | Hueck Engraving Gmbh | Method and device for producing an embossed structure on an embossing tool used for the surface shaping of press laminates |
JP4101339B2 (en) | 1997-09-25 | 2008-06-18 | 大日本印刷株式会社 | Light diffusing film, manufacturing method thereof, polarizing plate with diffusing layer, and liquid crystal display device |
JP3886082B2 (en) | 1997-11-12 | 2007-02-28 | キヤノン株式会社 | Nanostructure and manufacturing method thereof |
DE29722268U1 (en) | 1997-12-17 | 1998-03-05 | Unicor Rohrsysteme Gmbh | Mold jaws made of aluminum or aluminum alloy |
US6287673B1 (en) | 1998-03-03 | 2001-09-11 | Acktar Ltd. | Method for producing high surface area foil electrodes |
US6096247A (en) | 1998-07-31 | 2000-08-01 | 3M Innovative Properties Company | Embossed optical polymer films |
JP2000071290A (en) | 1998-08-28 | 2000-03-07 | Teijin Ltd | Manufacture of antireflection article |
US6348960B1 (en) | 1998-11-06 | 2002-02-19 | Kimotot Co., Ltd. | Front scattering film |
JP3781591B2 (en) | 1998-11-06 | 2006-05-31 | 株式会社きもと | Forward scattering film |
JP4532634B2 (en) | 1998-12-25 | 2010-08-25 | キヤノン株式会社 | Method for producing pores |
US6175442B1 (en) | 1999-05-25 | 2001-01-16 | Intel Corporation | Anti-reflection layer in spatial light modulators |
JP2001066626A (en) | 1999-08-27 | 2001-03-16 | Optrex Corp | Liquid crystal display device |
JP2001074919A (en) | 1999-09-03 | 2001-03-23 | Fuji Photo Film Co Ltd | Light diffusing body and its production |
JP4484330B2 (en) | 1999-09-21 | 2010-06-16 | ダイセル化学工業株式会社 | Anisotropic light scattering film |
JP4502445B2 (en) | 2000-03-16 | 2010-07-14 | 大日本印刷株式会社 | Method for producing antireflection film |
US6778240B2 (en) | 2000-03-28 | 2004-08-17 | Fuji Photo Film Co., Ltd. | Anti-glare and anti-reflection film, polarizing plate, and image display device |
US7066234B2 (en) | 2001-04-25 | 2006-06-27 | Alcove Surfaces Gmbh | Stamping tool, casting mold and methods for structuring a surface of a work piece |
DE10020877C1 (en) | 2000-04-28 | 2001-10-25 | Alcove Surfaces Gmbh | Stamping tool has a structured stamping surface with an anodically oxidized surface layer or a covering layer having open hollow chambers produced by anodic oxidation |
JP4050859B2 (en) | 2000-05-12 | 2008-02-20 | パイオニア株式会社 | Stamper manufacturing method and optical disk manufacturing method |
JP2002079535A (en) | 2000-06-28 | 2002-03-19 | Ricoh Co Ltd | Cylindrical molding mold, its production method, and method for producing cylindrical film |
TW522259B (en) | 2000-07-21 | 2003-03-01 | Sumitomo Chemical Co | Anisotropic scattering film and liquid crystal display |
JP2002169025A (en) | 2000-07-21 | 2002-06-14 | Sumitomo Chem Co Ltd | Anisotropic scattering film and liquid crystal display device using the same |
US20020044351A1 (en) | 2000-08-15 | 2002-04-18 | Reflexite Corporation | Light polarizer |
JP2002079523A (en) | 2000-09-04 | 2002-03-19 | Seiko Epson Corp | Method for producing spectacle lens |
JP2002107714A (en) | 2000-10-02 | 2002-04-10 | Sharp Corp | Liquid crystal display device |
JP2002182199A (en) | 2000-12-11 | 2002-06-26 | Casio Comput Co Ltd | Back light device |
JP2002318383A (en) | 2001-04-20 | 2002-10-31 | Kyocera Corp | Reflective liquid crystal display device |
JP2002031721A (en) | 2001-05-25 | 2002-01-31 | Sumitomo Chem Co Ltd | Composite polarizing plate |
JP2003004904A (en) | 2001-06-25 | 2003-01-08 | Dainippon Printing Co Ltd | Antireflection film having antidazzle layer with high refractive index and low reflective display device |
JP2003043203A (en) | 2001-08-01 | 2003-02-13 | Hitachi Maxell Ltd | Antireflection film, method for manufacturing the same, stamper for manufacture of antireflection film, method for manufacturing the stamper, casting mold for manufacture of stamper and method for manufacturing the casting mold |
JP4054581B2 (en) | 2001-08-28 | 2008-02-27 | 富士フイルム株式会社 | Light diffusing film, antiglare film, polarizing plate and liquid crystal display device |
JP2003114325A (en) | 2001-10-03 | 2003-04-18 | Nitto Denko Corp | Laminated quarter-wave plate, circularly polarizing plate and liquid crystal display device using the same, and method for manufacturing the same |
JP2003248122A (en) | 2001-12-18 | 2003-09-05 | Fuji Photo Film Co Ltd | Elliptical polarizing plate and liquid crystal display using the same |
AU2003208584A1 (en) | 2002-02-15 | 2003-09-04 | Elop Electro-Optics Industries Ltd. | Device and method for varying the reflectance or transmittance of light |
JP4197100B2 (en) | 2002-02-20 | 2008-12-17 | 大日本印刷株式会社 | Anti-reflective article |
DE60335351D1 (en) | 2002-02-27 | 2011-01-27 | Innovative Solutions And Support Inc | IMPROVED FLAT DISPLAY WITH LOW REFLECTION CAPACITY |
JP2003302532A (en) | 2002-04-12 | 2003-10-24 | Mitsubishi Chemicals Corp | Polarizing plate and method for manufacturing the same |
JP2003322712A (en) | 2002-04-30 | 2003-11-14 | Omron Corp | Reflection plate and method of manufacturing the same and reflective liquid crystal display device |
JP2003319733A (en) | 2002-05-07 | 2003-11-11 | Konica Minolta Holdings Inc | Aquarium for appreciation |
EP1376038A1 (en) | 2002-06-24 | 2004-01-02 | Abb Research Ltd. | Heat exchanger |
JP4506070B2 (en) | 2002-11-01 | 2010-07-21 | コニカミノルタホールディングス株式会社 | Method for forming antiglare layer, method for producing antiglare film, and ink jet device for forming antiglare layer |
JP2004205990A (en) | 2002-12-26 | 2004-07-22 | Dainippon Printing Co Ltd | Manufacturing method of fine rugged pattern having antireflection performance and antireflection article |
JP2004223724A (en) | 2003-01-20 | 2004-08-12 | Dainippon Printing Co Ltd | Embossing roll made of glass |
JP2004223836A (en) | 2003-01-22 | 2004-08-12 | Fuji Photo Film Co Ltd | Method and apparatus for manufacturing pattern roll and method for making optical sheet |
US6837096B2 (en) | 2003-01-23 | 2005-01-04 | Midwest Research Institute, Inc. | Low-power gas chromatograph |
US20040159977A1 (en) | 2003-02-18 | 2004-08-19 | Perfetto Robert S. | Method and apparatus for applying a decorative pattern to a surface |
JP2004272059A (en) | 2003-03-11 | 2004-09-30 | Ge Toshiba Silicones Co Ltd | Liquid crystal display and portable electronic apparatus equipped with same |
US6888676B2 (en) | 2003-03-20 | 2005-05-03 | Nokia Corporation | Method of making polarizer and antireflection microstructure for mobile phone display and window |
JP2004294616A (en) | 2003-03-26 | 2004-10-21 | Fuji Photo Film Co Ltd | Method and apparatus for manufacturing antidazzle antireflective film, and the same film |
US7070406B2 (en) | 2003-04-29 | 2006-07-04 | Hewlett-Packard Development Company, L.P. | Apparatus for embossing a flexible substrate with a pattern carried by an optically transparent compliant media |
TW570290U (en) | 2003-05-02 | 2004-01-01 | Ind Tech Res Inst | Uniform pressing device for nanometer transfer-print |
JP2007500873A (en) | 2003-05-22 | 2007-01-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Liquid crystal display device having birefringence corrector type |
JP4565816B2 (en) | 2003-06-30 | 2010-10-20 | 三洋電機株式会社 | Display device |
JP4438355B2 (en) | 2003-09-01 | 2010-03-24 | オムロン株式会社 | Manufacturing method of optical element provided with resin thin film having micro uneven pattern |
EP1679532A1 (en) | 2003-10-29 | 2006-07-12 | Matsushita Electric Industrial Co., Ltd. | Optical element having antireflection structure, and method for producing optical element having antireflection structure |
JP2005132660A (en) | 2003-10-29 | 2005-05-26 | Matsushita Electric Ind Co Ltd | Manufacturing method of optical element having non-reflective structure and optical element having non-reflective structure manufactured through the method |
US20050104253A1 (en) | 2003-11-11 | 2005-05-19 | Ryuichi Katsumoto | Production method and production apparatus of pattern-indented sheet |
JP2005144698A (en) | 2003-11-11 | 2005-06-09 | Fuji Photo Film Co Ltd | Method and apparatus for manufacturing embossed sheet |
JP2007515667A (en) | 2003-11-14 | 2007-06-14 | アプリリス インコーポレーテッド | Holographic data storage medium with structured surface |
JP4406553B2 (en) | 2003-11-21 | 2010-01-27 | 財団法人神奈川科学技術アカデミー | Method for manufacturing antireflection film |
JP4329122B2 (en) | 2003-11-28 | 2009-09-09 | 富士フイルム株式会社 | Method and apparatus for manufacturing uneven sheet |
JP2005181740A (en) | 2003-12-19 | 2005-07-07 | Matsushita Electric Ind Co Ltd | Reflection prevention structure |
JP4740603B2 (en) | 2004-01-23 | 2011-08-03 | 富士フイルム株式会社 | Method for producing antireflection film |
US8088475B2 (en) | 2004-03-03 | 2012-01-03 | Hitachi, Ltd. | Anti-reflecting membrane, and display apparatus, optical storage medium and solar energy converting device having the same, and production method of the membrane |
JP4352934B2 (en) | 2004-03-03 | 2009-10-28 | 株式会社日立製作所 | Antireflection film, image display device having the same, optical recording medium, solar power generation module, and antireflection film forming method |
JP4223992B2 (en) | 2004-05-25 | 2009-02-12 | 株式会社 日立ディスプレイズ | Liquid crystal display |
JP2006039450A (en) | 2004-07-30 | 2006-02-09 | Seiko Epson Corp | Method for forming antireflection film, apparatus for forming antireflection film, antireflection film and optical component |
JP2006062240A (en) | 2004-08-27 | 2006-03-09 | Fuji Photo Film Co Ltd | Manufacturing method of non-glare reflection-preventive film and non-glare reflection-preventive film |
JP2006098623A (en) | 2004-09-29 | 2006-04-13 | Hitachi Displays Ltd | Liquid crystal display device |
KR20070072877A (en) | 2004-10-22 | 2007-07-06 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | Roller micro-contact printer with pressure control |
JP4830290B2 (en) | 2004-11-30 | 2011-12-07 | 信越半導体株式会社 | Manufacturing method of directly bonded wafer |
JP4368384B2 (en) | 2004-12-03 | 2009-11-18 | シャープ株式会社 | Antireflection material, optical element, display device, stamper manufacturing method, and antireflection material manufacturing method using stamper |
JP2006208726A (en) | 2005-01-27 | 2006-08-10 | Dainippon Printing Co Ltd | Optical functional sheet |
US20070014886A1 (en) | 2005-02-02 | 2007-01-18 | Michael Hennessey | Method and apparatus for forming microstructures on polymeric substrates |
TW200705541A (en) | 2005-07-25 | 2007-02-01 | Li Bing Huan | Manufacturing method of nano-sticker |
JP2007073696A (en) | 2005-09-06 | 2007-03-22 | Meisho Kiko Kk | Pattern forming method, pattern forming apparatus and pattern-formed film |
JP4848161B2 (en) | 2005-09-21 | 2011-12-28 | 財団法人神奈川科学技術アカデミー | Antireflection film manufacturing method and antireflection film manufacturing stamper manufacturing method |
JPWO2007040023A1 (en) | 2005-10-03 | 2009-04-16 | コニカミノルタオプト株式会社 | Method and apparatus for producing uneven pattern film |
JP4747769B2 (en) | 2005-10-04 | 2011-08-17 | コニカミノルタオプト株式会社 | Method for producing uneven pattern film |
WO2007052565A1 (en) | 2005-11-04 | 2007-05-10 | Sharp Kabushiki Kaisha | Liquid crystal display device |
EP1785748A1 (en) | 2005-11-10 | 2007-05-16 | C.R.F. Società Consortile per Azioni | Anti-reflection nano-metric structure based on anodised porous alumina and method for production thereof |
JP2007156145A (en) | 2005-12-06 | 2007-06-21 | Konica Minolta Opto Inc | Antireflection film, method of manufacturing same and image display device |
JP2007199522A (en) | 2006-01-27 | 2007-08-09 | Nippon Zeon Co Ltd | Method of manufacturing optical laminated body |
JP2007203576A (en) | 2006-02-01 | 2007-08-16 | Oji Paper Co Ltd | Manufacturing process of double width nanoimprint roll for roll type imprint apparatus |
JP4792323B2 (en) | 2006-04-04 | 2011-10-12 | 明昌機工株式会社 | Nanoimprint apparatus and nanoimprint method |
WO2008069162A1 (en) | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Anti-reflection film and display device |
WO2008082421A1 (en) | 2007-01-05 | 2008-07-10 | Sabic Innovative Plastics Ip B.V. | Antireflective surfaces, methods of manufacture thereof and articles comprising the same |
DE102007009512A1 (en) | 2007-02-27 | 2008-08-28 | Friedrich-Schiller-Universität Jena | Optical element with anti-fogging polymer layer, for use e.g. as spectacle lenses or display covers, has a reflection-reducing nano-structure formed on the surface of the polymer layer |
JP2008209867A (en) | 2007-02-28 | 2008-09-11 | Mitsubishi Rayon Co Ltd | Stamper, glare-proof antireflection article, and its manufacturing method |
US20080229941A1 (en) | 2007-03-19 | 2008-09-25 | Babak Heidari | Nano-imprinting apparatus and method |
JP4875203B2 (en) | 2008-02-27 | 2012-02-15 | シャープ株式会社 | Roller type nanoimprint apparatus and method for producing nanoimprint sheet |
KR101052799B1 (en) | 2008-05-28 | 2011-07-29 | 엘지전자 주식회사 | Optical sheet, backlight unit and liquid crystal display including the same |
CN102016651B (en) | 2008-06-06 | 2013-05-22 | 夏普株式会社 | Antireflection film, optical element comprising antireflection film, stamper, process for producing stamper, and process for producing antireflection film |
JP6032675B2 (en) | 2013-02-08 | 2016-11-30 | 国立研究開発法人産業技術総合研究所 | Light diffusion variable device capable of reversibly changing light diffusion state |
-
2002
- 2002-10-28 US US10/281,376 patent/US7066234B2/en not_active Ceased
-
2004
- 2004-02-17 US US10/778,077 patent/US20040163441A1/en not_active Abandoned
-
2008
- 2008-06-26 US US12/213,990 patent/USRE43694E1/en not_active Expired - Lifetime
-
2010
- 2010-04-28 US US12/662,682 patent/USRE44830E1/en not_active Expired - Lifetime
- 2010-04-28 US US12/662,683 patent/USRE46606E1/en not_active Expired - Lifetime
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4148204A (en) * | 1971-05-07 | 1979-04-10 | Siemens Aktiengesellschaft | Process of mechanically shaping metal articles |
US4085792A (en) * | 1975-10-02 | 1978-04-25 | General Battery Corporation | Method of casting lead alloy automotive battery parts |
US4581913A (en) * | 1983-07-27 | 1986-04-15 | Luster Finish, Inc. | Method for improving the release and finish characteristics of metal stamping dies |
US5318091A (en) * | 1991-11-22 | 1994-06-07 | Borgo-Nova Spa | Die coating |
US5415219A (en) * | 1992-07-21 | 1995-05-16 | Hagen Batterie Ag | Grid casting mold for the casting of lead grids for accumulators and methods for its manufacture |
US5693208A (en) * | 1995-03-16 | 1997-12-02 | Alusuisse Technology & Management Ltd. | Process for continuously anodizing strips or wires of aluminum |
US5693210A (en) * | 1995-08-31 | 1997-12-02 | President Of Tohoku University | Method of manufacturing porous alumina tube |
US6139713A (en) * | 1996-08-26 | 2000-10-31 | Nippon Telegraph And Telephone Corporation | Method of manufacturing porous anodized alumina film |
US6476409B2 (en) * | 1999-04-27 | 2002-11-05 | Canon Kabushiki Kaisha | Nano-structures, process for preparing nano-structures and devices |
US6874262B2 (en) * | 1999-06-01 | 2005-04-05 | Nikon Corporation | Method for manufacturing master substrate used for manufacturing grooved molding substrate, method for manufacturing stamper for manufacturing grooved molding substrate, method for manufacturing grooved molding substrate, grooved molding substrate, memory medium, memory device, and computer |
US6354358B1 (en) * | 1999-11-26 | 2002-03-12 | Nomura Plating Co., Ltd. | Continuous casting mold with tungsten alloy plating and method of producing the same |
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE46606E1 (en) | 2000-04-28 | 2017-11-14 | Sharp Kabushiki Kaisha | Stamping tool, casting mold and methods for structuring a surface of a work piece |
USRE43694E1 (en) | 2000-04-28 | 2012-10-02 | Sharp Kabushiki Kaisha | Stamping tool, casting mold and methods for structuring a surface of a work piece |
USRE44830E1 (en) | 2000-04-28 | 2014-04-08 | Sharp Kabushiki Kaisha | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US7901586B2 (en) | 2003-04-21 | 2011-03-08 | Samsung Electronics Co., Ltd. | Method of manufacturing self-ordered nanochannel-array and method of manufacturing nanodot using the nanochannel-array |
US20080257861A1 (en) * | 2003-04-21 | 2008-10-23 | Samsung Electronics Co., Ltd. | Method of manufacturing self-ordered nanochannel-array and method of manufacturing nanodot using the nanochannel-array |
US20070235342A1 (en) * | 2004-10-01 | 2007-10-11 | Canon Kabushiki Kaisha | Method for manufacturing nanostructure |
US9429686B2 (en) | 2004-12-03 | 2016-08-30 | Sharp Kabushiki Kaisha | Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper |
US20070159698A1 (en) * | 2004-12-03 | 2007-07-12 | Sharp Kabushiki Kaisha | Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper |
US20090252825A1 (en) * | 2004-12-03 | 2009-10-08 | Sharp Kabushiki Kaisha | Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper |
US8431004B2 (en) | 2004-12-03 | 2013-04-30 | Sharp Kabushiki Kaisha | Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper |
US20090211912A1 (en) * | 2004-12-03 | 2009-08-27 | Sharp Kabushiki Kaisha | Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper |
US7835080B2 (en) | 2004-12-03 | 2010-11-16 | Sharp Kabushiki Kaisha | Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper |
US8262382B2 (en) * | 2004-12-03 | 2012-09-11 | Sharp Kabushiki Kaisha | Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper |
DE102007026958B4 (en) * | 2006-06-13 | 2014-10-09 | Csem Centre Suisse D'electronique Et De Microtechnique S.A. | Press tool with diffractive microstructure and method for producing such a tool and tableting press |
US20100143467A1 (en) * | 2006-06-13 | 2010-06-10 | Alexander Stuck | Pharmaceutical tablets with diffractive microstructure and compression tools for producing such tablets |
WO2007144826A3 (en) * | 2006-06-13 | 2008-07-17 | Suisse Electronique Microtech | Pharmaceutical tablets with diffractive microstructure and compression tools for producing such tablets |
US9592646B2 (en) | 2006-06-13 | 2017-03-14 | Csem Centre Suisse D'electronique Et De Microtechnique Sa | Pharmaceutical tablets with diffractive microstructure and compression tools for producing such tablets |
US8673193B2 (en) | 2008-02-27 | 2014-03-18 | Sharp Kabushiki Kaisha | Roller nanoimprint apparatus, mold roller for use in roller nanoimprint apparatus, fixing roller for use in roller nanoimprint apparatus, and production method of nanoimprint sheet |
US7938640B2 (en) | 2008-02-27 | 2011-05-10 | Sharp Kabushiki Kaisha | Roller nanoimprint apparatus, mold roller for use in roller nanoimprint apparatus, fixing roller for use in roller nanoimprint apparatus, and production method of nanoimprint sheet |
US20100258978A1 (en) * | 2008-02-27 | 2010-10-14 | Nobuaki Yamada | Roller nanoimprint apparatus, mold roller for use in roller nanoimprint apparatus, fixing roller for use in roller nanoimprint apparatus, and production method of nanoimprint sheet |
US20100272845A1 (en) * | 2008-02-27 | 2010-10-28 | Nobuaki Yamada | Roller nanoimprint apparatus, mold roller for use in roller nanoimprint apparatus, fixing roller for use in roller nanoimprint apparatus, and production method of nanoimprint sheet |
US8597767B2 (en) | 2008-03-04 | 2013-12-03 | Sharp Kabushiki Kaisha | Optical element, roller type nanoimprinting apparatus, and process for producing die roll |
US20100284087A1 (en) * | 2008-03-04 | 2010-11-11 | Sharp Kabushiki Kaisha | Optical element, roller type nanoprinting apparatus, and process for producing die roll |
US20100119782A1 (en) * | 2008-11-07 | 2010-05-13 | Canon Kabushiki Kaisha | Optical element molding die and method for molding optical element |
US8449284B2 (en) * | 2008-11-07 | 2013-05-28 | Canon Kabushiki Kaisha | Optical element molding die and method for molding optical element |
US8465160B2 (en) | 2008-12-25 | 2013-06-18 | Sharp Kabushiki Kaisha | Liquid tank, viewing device for under-liquid observation, and optical film |
US20100290118A1 (en) * | 2008-12-25 | 2010-11-18 | Nobuaki Yamada | Liquid tank, viewing device for under-liquid observation, and optical film |
US9025250B2 (en) | 2009-04-24 | 2015-05-05 | Sharp Kabushiki Kaisha | Antireflection film, method for manufacturing antireflection film, and display apparatus |
US8384998B2 (en) | 2009-06-12 | 2013-02-26 | Sharp Kabushiki Kaisha | Antireflection film, display device and light transmissive member |
US9158038B2 (en) | 2009-06-12 | 2015-10-13 | Sharp Kabushiki Kaisha | Antireflection film, display device and light transmissive member |
US9366785B2 (en) | 2009-10-28 | 2016-06-14 | Sharp Kabushiki Kaisha | Mold, method for manufacturing a mold, and antireflective film |
US9108351B2 (en) | 2010-03-09 | 2015-08-18 | Sharp Kabushiki Kaisha | Method for forming anodized layer, method for producing mold and method for producing antireflective film |
CN107219722A (en) * | 2017-05-19 | 2017-09-29 | 湖北知本信息科技有限公司 | The preparation method of high anti-reflection surface micro-structure and the micro-structural of preparation |
Also Published As
Publication number | Publication date |
---|---|
USRE46606E1 (en) | 2017-11-14 |
US20030205475A1 (en) | 2003-11-06 |
USRE44830E1 (en) | 2014-04-08 |
USRE43694E1 (en) | 2012-10-02 |
US7066234B2 (en) | 2006-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7066234B2 (en) | Stamping tool, casting mold and methods for structuring a surface of a work piece | |
AU2001256323B2 (en) | Stamping tool, method for structuring a surface of a workpiece and use of an anodized surface layer | |
Landolt et al. | Electrochemical micromachining, polishing and surface structuring of metals: fundamental aspects and new developments | |
US6558231B1 (en) | Sequential electromachining and electropolishing of metals and the like using modulated electric fields | |
Klink et al. | Crater morphology evaluation of contemporary advanced EDM generator technology | |
JP3983194B2 (en) | Press mold | |
US10006140B2 (en) | Method for dye-free coloring of one-time anodic aluminum oxide surface | |
DE10154756C1 (en) | Use of a surface layer or covering layer provided with open hollow chambers by anodic oxidation for structuring a surface of a cast part and/or workpiece | |
WO1987006534A2 (en) | Ink transfer roller with oxide layer | |
DD257274B1 (en) | METHOD FOR PRODUCING DECORATIVE SURFACES ON METALS | |
JP2005523172A (en) | Shape processing of metal articles | |
JPH089794B2 (en) | Manufacturing method of rainbow colored products | |
JPH0211782A (en) | Production of ornamental material made of titanium | |
WO2006077743A1 (en) | Decorative material and process for producing the same | |
JPS601956B2 (en) | Method of forming wood grain pattern on aluminum or aluminum alloy material | |
JPH0211787A (en) | Electrodeposited diaphragm and production thereof | |
JPH0674517B2 (en) | Aluminum wood grain pattern forming method | |
TH18983B (en) | A method for producing dies with embossed cavity faces | |
TH30969A (en) | A method for producing dies with embossed cavity faces |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |