US20030125077A1 - Multimedia watch - Google Patents

Multimedia watch Download PDF

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Publication number
US20030125077A1
US20030125077A1 US10/033,982 US3398202A US2003125077A1 US 20030125077 A1 US20030125077 A1 US 20030125077A1 US 3398202 A US3398202 A US 3398202A US 2003125077 A1 US2003125077 A1 US 2003125077A1
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United States
Prior art keywords
cpu
watch
multimedia
image
communication interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/033,982
Inventor
Hsi-Che Lee
Tung-Hsing Pan
Mei-Jiuan Chan
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Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US10/033,982 priority Critical patent/US20030125077A1/en
Publication of US20030125077A1 publication Critical patent/US20030125077A1/en
Priority to US10/764,457 priority patent/US6967400B2/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G21/00—Input or output devices integrated in time-pieces
    • G04G21/04—Input or output devices integrated in time-pieces using radio waves
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G9/00—Visual time or date indication means
    • G04G9/0064—Visual time or date indication means in which functions not related to time can be displayed
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/163—Wearable computers, e.g. on a belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Electric Clocks (AREA)

Abstract

A multimedia watch includes CPU, memory, timer, a communication interface, a keyboard, a connector, a display interface, an amplifier, and a driver. The display interface is connected with a flat screen, the amplifier is linked to a speaker and the driver is joined with a vibrator. Image or voice data form computers or PDA is transmitted through the connector, the communication interface to the CPU. By the control of the CPU, the flat screen displays images repetitively. By the voice displayed from the speaker, or the action of the vibrator, users are reminded for the preset events.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a multimedia watch, especially to a watch that displays images continuously, sends voices or activate the vibrator for reminding users the preset events. [0002]
  • 2. Description of the Prior Art [0003]
  • The conventional swatches include a movement arranged inside a case with a cover upside. For integrated design, the wrist strap must match the color or style of the watch face. Although in some new designs, the watch belt connected with the watch face by pivots is interchangeable, such kind of design is still flat and relieved. Young people like fashionable and futuristic design, not only on appearance but also on function. Changing the watch belt only alters part of the outlook. Moreover, there should be hooks or retainers on the bezels for easily changing watch belts. Otherwise people need to use removing tools or driver to get the straps out or in. The most common material with flexibility used for such design is plastic. After a period of time, the acids and proteins in body sweat will corrode the plastic and leave it shiny and brittle. Rough handling of the plastic can break it easily. The watch belt and case made of plastic look not only get cracked easily but also get scratched or shiny. Only changing the belt or strap can not satisfy people's need. [0004]
    • SUMMARY OF THE INVENTION
  • It is therefore a primary object of the present invention to provide a multimedia watch that displays images repetitively, sends voices out or activate the vibrator for reminding users the preset events, not only having attractive watch face but also with various functions.[0005]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The accomplishment of the above-mentioned object of the present invention will become apparent from the following description and its accompanying drawings which disclose illustrative an embodiment of the present invention, and are as follows: [0006]
  • FIG. 1 is a schematic drawing of the present invention; [0007]
  • FIG. 2 is a circuitry diagram of the present invention; [0008]
  • FIG. 3 is a flow chart of the filing application program in accordance with the present invention; [0009]
  • FIG. 4 is a flow chart of the recycling displaying application program in accordance with the present invention; [0010]
  • FIG. 5 is a flow chart of the shut-down program in accordance with the present invention; [0011]
  • FIG. 6 is a flow chart of the program for changing image or voice data in accordance with the present invention. [0012]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Refer to FIGS. 1 & 2, the present invention is composed of the following parts: [0013] CPU 11 for controlling internal circuitry is disposed inside a watch case 1; memory 12 connected with the CPU 11 is used for information storage;
  • a [0014] timer 13 is attached to the CPU 11 for keeping time and output the time-related information to CPU 11;
  • a [0015] communication interface 14 joined with CPU 11 is for transmitting input signals;
  • a [0016] keyboard 15 linked with the communication interface 14 is for inputting control signals;
  • a [0017] connector 16, connected with the communication interface 14, connects the present invention with computer or PDA 2 so that the image or sound data therein is transmitted to the CPU 11;
  • a [0018] display interface 17 is installed between the CPU 11 and a flat screen 171 for transmitting image information form the CPU 11 and displaying through the flat screen 171;
  • an [0019] amplifier 18 with a speaker 181 connected to the CPU 11 thereby the sound data is transmitted from the CPU 11 and to be displayed through the speaker 181;
  • a [0020] driver 19 is connected with the CPU 11 and a vibrator 191. By the control of the CPU 11, the driver 19 makes the vibrator 191 activate or unactivate.
  • In accordance with the structure mentioned above, the present invention is connected with computer or [0021] PDA 2 by the connector 16 on the watch case 1 to download the image and sound data from the computer or PDA 2, through the communication interface 14 into the CPU 11 thereof. By programming, the image can be displayed periodically, the voice is displayed on preset time or the vibrator 19 is activated for reminding users the preset schedule.
  • The procedure of downloading image or sound data from computers or PDA to the present invention is controlled by the filing application program. The workflow of the filing application program is shown in FIG. 3. The image or sound data intended to be displayed on specific or periodic time is input into the [0022] memory 12 and is arranged into a certain time schedule. Afterwards, the duration for displaying each image or sound data is input in order so that the displaying program can display image or sound repeatedly in order time after time.
  • The flow chart of the recycling displaying application program is shown in FIG. 4. After turning on the invention, the image or sound data intended to be displayed is drawn by manual operation and displayed. At the same time, the [0023] timer 13 keeps time. By checking whether the present time matches the preset specific or periodic timing, if it matches, the image or sound data set on specific time is displayed. If not, the program checks whether the present time matches the end point of the duration for each image or sound data. If the answer is no, the pathway returns to check the preset specific or periodic timing. If the answer is yes, the program checks whether the image or sound data displayed now is the last one. If no, the next image or sound data on the preset schedule is displayed in order and the timer records the time simultaneously. If the answer is yes, the image or sound data is displayed from the first one successively according to the preset schedule. Thus the preset image or sound data is displayed time and again.
  • Refer to FIG. 5, the star-up program checks whether the shut-down signal exists or not first after the invention turn on. If yes, the device is shut down. If no, the program checks whether to execute the program for changing image or voice data. If yes, the program for changing image or voice data runs. If no, the program turns back to check the shut-down signal. [0024]
  • The work flow of the program for changing image or voice data is shown in FIG. 6. First stop running the recycling displaying application program, and pick up the image or voice data intended displayed manually. Then the program decides to execute the recycling displaying application program or not. If the response is yes, the recycling displaying application program works and displays the image or voice from the selected one while the program for changing image or voice data is over. If the answer is no, the selected image and voice data is displayed repetitively. Afterwards, the program checks whether to activate the recycling displaying application program or not. If no, the previous-mentioned selected image and voice data is displayed over and over again. If yes, the program shifts to the recycling displaying application program and displays the image or voice from the selected one and the followings in sequence. Due to the changeable images or sounds displayed by the watch, the present invention has novel and appealing appearance for users. [0025]
  • Refer to FIG. 2, the [0026] connector 16 can be replaced by a receiver 16 a for receiving signals according to users' need. A transmitter 16 b is disposed on computers or PDA 2 so as to transmit image or voice data in wireless way. This is another embodiment of the present invention.
  • The [0027] watch case 1 can be designed to a brooch, a necklace or belt buckle.
  • It should be noted that the above description and accompanying drawings are only used to illustrated some embodiments of the present invention, not intended to limit the scope thereof. Any modification of the embodiments should fall within the scope of the present invention. [0028]

Claims (5)

What is claimed is:
1. A multimedia watch comprising
CPU for controlling internal circuitry disposed inside a watch case;
memory connected with said CPU for information storage;
a timer attached to said CPU for keeping time and output the time-related information to said CPU;
a communication interface joined with said CPU for transmitting input signals;
a keyboard linked with said communication interface for inputting control signals;
a connector connected with said communication interface for connecting the multimedia watch with computer or PDA so that the image or sound data therein is transmitted to said CPU;
a display interface, installed between said CPU and a flat screen, for transmitting image information from said CPU to said flat screen and displaying;
an amplifier with a speaker connected to said CPU thereby transmitting the sound data from said CPU to said speaker and displaying;
a driver connected with and controlled by said CPU and joined with a vibrator for making said vibrator activate or unactivate.
2. A multimedia watch as claimed in claim 1, wherein said connector can also be a receiver that receives signals from transmitters on computer or PDA for transmitting data in wireless way.
3. A multimedia watch as claimed in claim 1, wherein said watch case can be designed to a brooch.
4. A multimedia watch as claimed in claim 1, wherein said watch case can be designed to a necklace.
5. A multimedia watch as claimed in claim 1, wherein said watch case can be designed to a belt buckle.
US10/033,982 2001-01-04 2002-01-03 Multimedia watch Abandoned US20030125077A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/033,982 US20030125077A1 (en) 2002-01-03 2002-01-03 Multimedia watch
US10/764,457 US6967400B2 (en) 2001-01-04 2004-01-27 IC chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/033,982 US20030125077A1 (en) 2002-01-03 2002-01-03 Multimedia watch

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US10/764,457 Continuation US6967400B2 (en) 2001-01-04 2004-01-27 IC chip package

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US10/764,457 Expired - Fee Related US6967400B2 (en) 2001-01-04 2004-01-27 IC chip package

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WO2005071500A2 (en) * 2004-01-22 2005-08-04 Ali Baslik Device and method for electronically displaying a time information display representation
USD703069S1 (en) * 2013-08-15 2014-04-22 I.Am.Symbolic, Llc Multi-media wireless watch
USD731898S1 (en) * 2012-03-01 2015-06-16 Movband, Llc Wrist-worn electronic display
USD735587S1 (en) * 2012-03-01 2015-08-04 Movband, Llc Wrist-worn electronic display
US9191482B1 (en) 2015-01-30 2015-11-17 David Sidbury Watch, mobile telephone and video camera system
USD773942S1 (en) * 2015-06-10 2016-12-13 Paul Kweton Watch
US9568891B2 (en) 2013-08-15 2017-02-14 I.Am.Plus, Llc Multi-media wireless watch
CN107621777A (en) * 2014-03-07 2018-01-23 联想(北京)有限公司 Electronic equipment and collection control method
USD825523S1 (en) 2016-01-06 2018-08-14 I.Am.Plus, Llc Set of earbuds
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US20070138586A1 (en) * 2005-12-16 2007-06-21 Hsin Chung H Image sensor module package
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CN105051893A (en) 2013-01-16 2015-11-11 西门子研究中心有限责任公司 Chip package assembly and method for using the assembly
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