EP1139353A3 - Production method of thin film resistance element formed on printed circuit board, and thin film resistance element employing the method - Google Patents

Production method of thin film resistance element formed on printed circuit board, and thin film resistance element employing the method Download PDF

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Publication number
EP1139353A3
EP1139353A3 EP01301805A EP01301805A EP1139353A3 EP 1139353 A3 EP1139353 A3 EP 1139353A3 EP 01301805 A EP01301805 A EP 01301805A EP 01301805 A EP01301805 A EP 01301805A EP 1139353 A3 EP1139353 A3 EP 1139353A3
Authority
EP
European Patent Office
Prior art keywords
thin film
film resistance
resistance element
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01301805A
Other languages
German (de)
French (fr)
Other versions
EP1139353A2 (en
Inventor
Motoshi Shindoh
Keiji Segawa
Mitsuru Otsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Publication of EP1139353A2 publication Critical patent/EP1139353A2/en
Publication of EP1139353A3 publication Critical patent/EP1139353A3/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making

Abstract

The invention provides a production method capable of forming a thin film resistance element having a thickness and a shape controlled in a high accuracy in a printed circuit board (core material). The production method of a thin film resistance element formed on a printed circuit board, has the steps of forming a thin film resistance layer having a predetermined thickness on the printed circuit board through an insulation layer by a dry process used in producing a semiconductor, forming an electrically conductive layer on the thin resistance layer, and etching the electrically conductive layer selectively so as to make, at least, a pair of electrically conductive pads, resulting in the thin film resistance element having a predetermined value of resistivity between the pair of electrically conductive pads. Thereby, it is possible to form the thin film resistance element having a thickness and a shape controlled in a high accuracy on the printed circuit board (core material).
Figure 00000001
Figure 00000002
EP01301805A 2000-03-30 2001-02-28 Production method of thin film resistance element formed on printed circuit board, and thin film resistance element employing the method Withdrawn EP1139353A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000095497 2000-03-30
JP2000095497 2000-03-30

Publications (2)

Publication Number Publication Date
EP1139353A2 EP1139353A2 (en) 2001-10-04
EP1139353A3 true EP1139353A3 (en) 2004-01-21

Family

ID=18610394

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01301805A Withdrawn EP1139353A3 (en) 2000-03-30 2001-02-28 Production method of thin film resistance element formed on printed circuit board, and thin film resistance element employing the method

Country Status (3)

Country Link
US (1) US6411194B2 (en)
EP (1) EP1139353A3 (en)
CN (1) CN1315822A (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6873028B2 (en) * 2001-11-15 2005-03-29 Vishay Intertechnology, Inc. Surge current chip resistor
JP4217778B2 (en) * 2003-04-11 2009-02-04 古河電気工業株式会社 Conductive substrate with resistance layer, circuit board with resistance layer, and resistance circuit wiring board
US7333346B2 (en) * 2003-08-27 2008-02-19 Denso Corporation Circuit board having test coupon and method for evaluating the circuit board
KR100554844B1 (en) * 2003-12-10 2006-03-03 주식회사 하이닉스반도체 Refresh oscillator
US7276777B2 (en) * 2005-07-29 2007-10-02 Triquint Semiconductor, Inc. Thin film resistor and method of making the same
KR101089840B1 (en) * 2009-04-01 2011-12-05 삼성전기주식회사 Circuit board module and manufacturing method for the same
CN101998770B (en) * 2009-08-17 2012-07-25 健鼎（无锡）电子有限公司 Method for manufacturing etched film resistance circuit board
US9704944B2 (en) * 2013-02-28 2017-07-11 Texas Instruments Deutschland Gmbh Three precision resistors of different sheet resistance at same level
US9763333B2 (en) * 2015-03-09 2017-09-12 Cooper Technologies Company Shared resistor pad bypass
CN106356607A (en) * 2016-08-26 2017-01-25 周峰 Fabrication method of composite structure radio frequency device and composite structure RF material
TWI638592B (en) * 2016-10-17 2018-10-11 先豐通訊股份有限公司 Circuit board structure and manufacturing method thereof
CN108826065A (en) * 2018-07-31 2018-11-16 江门黑氪光电科技有限公司 A kind of manufacturing method using film resistance LED light strip
CN108709107A (en) * 2018-07-31 2018-10-26 江门黑氪光电科技有限公司 A kind of LED light strip using film resistance
KR102127807B1 (en) * 2018-09-17 2020-06-29 삼성전기주식회사 An electronic component and manufacturing method thereof
CN111417256A (en) * 2020-03-18 2020-07-14 浙江万正电子科技有限公司 Etching process of planar resistive film of embedded planar resistive circuit board
CN111918480B (en) * 2020-08-17 2021-07-06 景旺电子科技(珠海)有限公司 Manufacturing method of resistor in printed circuit board and printed circuit board
CN112839438B (en) * 2021-01-05 2022-02-11 深圳瑞湖科技有限公司 Pressure-sensitive film and manufacturing method thereof

Citations (7)

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Publication number Priority date Publication date Assignee Title
US5325265A (en) * 1988-11-10 1994-06-28 Mcnc High performance integrated circuit chip package
GB2277832A (en) * 1993-04-27 1994-11-09 British Aerospace Thin film multi-layer interconnect
US5475254A (en) * 1993-10-14 1995-12-12 Nec Corporation Semiconductor device with thin film resistor
US5503878A (en) * 1991-09-30 1996-04-02 Nippondenso Co., Ltd. Method of preparing thin film resistors
JPH0982857A (en) * 1995-09-18 1997-03-28 Nec Corp Multi-chip package structure
US5849623A (en) * 1994-12-05 1998-12-15 General Electric Company Method of forming thin film resistors on organic surfaces
JPH11126870A (en) * 1997-10-21 1999-05-11 Denso Corp Heat sink with integrated fin and production thereof

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EP0909986A1 (en) * 1990-09-26 1999-04-21 Canon Kabushiki Kaisha Photolithographic processing method and apparatus
US5285099A (en) * 1992-12-15 1994-02-08 International Business Machines Corporation SiCr microfuses
US6194990B1 (en) * 1999-03-16 2001-02-27 Motorola, Inc. Printed circuit board with a multilayer integral thin-film metal resistor and method therefor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5325265A (en) * 1988-11-10 1994-06-28 Mcnc High performance integrated circuit chip package
US5503878A (en) * 1991-09-30 1996-04-02 Nippondenso Co., Ltd. Method of preparing thin film resistors
GB2277832A (en) * 1993-04-27 1994-11-09 British Aerospace Thin film multi-layer interconnect
US5475254A (en) * 1993-10-14 1995-12-12 Nec Corporation Semiconductor device with thin film resistor
US5849623A (en) * 1994-12-05 1998-12-15 General Electric Company Method of forming thin film resistors on organic surfaces
JPH0982857A (en) * 1995-09-18 1997-03-28 Nec Corp Multi-chip package structure
JPH11126870A (en) * 1997-10-21 1999-05-11 Denso Corp Heat sink with integrated fin and production thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 10 31 August 1999 (1999-08-31) *

Also Published As

Publication number Publication date
US20010026211A1 (en) 2001-10-04
EP1139353A2 (en) 2001-10-04
US6411194B2 (en) 2002-06-25
CN1315822A (en) 2001-10-03

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