EP1063056A3 - Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process - Google Patents

Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process Download PDF

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Publication number
EP1063056A3
EP1063056A3 EP00305242A EP00305242A EP1063056A3 EP 1063056 A3 EP1063056 A3 EP 1063056A3 EP 00305242 A EP00305242 A EP 00305242A EP 00305242 A EP00305242 A EP 00305242A EP 1063056 A3 EP1063056 A3 EP 1063056A3
Authority
EP
European Patent Office
Prior art keywords
pad
closed loop
loop control
measuring
conditioning process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00305242A
Other languages
German (de)
French (fr)
Other versions
EP1063056A2 (en
Inventor
Charles C. Garretson
Dominic Benvegnu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP1063056A2 publication Critical patent/EP1063056A2/en
Publication of EP1063056A3 publication Critical patent/EP1063056A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Abstract

A method and apparatus for enhancing the process performance over the life of a polishing pad (120) in a chemical-mechanical polishing apparatus (80) employs closed loop control of polishing pad wear. A contactless displacement sensor (175), such as a laser displacement sensor, provides feedback that is used to generate a pad profile of the polishing pad. Conditioning apparatus (130) is then controlled in response to the feedback from the laser displacement sensor in a closed loop control to modify the conditioning process and control the pad wear uniformity.
Figure 00000001
EP00305242A 1999-06-22 2000-06-21 Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process Withdrawn EP1063056A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33835799A 1999-06-22 1999-06-22
US338357 1999-06-22

Publications (2)

Publication Number Publication Date
EP1063056A2 EP1063056A2 (en) 2000-12-27
EP1063056A3 true EP1063056A3 (en) 2003-03-26

Family

ID=23324499

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00305242A Withdrawn EP1063056A3 (en) 1999-06-22 2000-06-21 Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process

Country Status (3)

Country Link
EP (1) EP1063056A3 (en)
JP (1) JP2001129754A (en)
TW (1) TW466153B (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1270148A1 (en) * 2001-06-22 2003-01-02 Infineon Technologies SC300 GmbH & Co. KG Arrangement and method for conditioning a polishing pad
TW574085B (en) 2001-12-27 2004-02-01 Vanguard Int Semiconduct Corp Device and method for measuring and monitoring polishing pad
US7160173B2 (en) 2002-04-03 2007-01-09 3M Innovative Properties Company Abrasive articles and methods for the manufacture and use of same
US7165927B2 (en) 2002-06-19 2007-01-23 Brooks Automation, Inc. Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists
WO2004012249A1 (en) * 2002-07-26 2004-02-05 Nikon Corporation Polishing device
AU2003284051A1 (en) 2002-10-11 2004-05-04 Brooks Automation, Inc. Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
US7089081B2 (en) 2003-01-31 2006-08-08 3M Innovative Properties Company Modeling an abrasive process to achieve controlled material removal
US7008296B2 (en) 2003-06-18 2006-03-07 Applied Materials, Inc. Data processing for monitoring chemical mechanical polishing
JP2005347568A (en) * 2004-06-03 2005-12-15 Ebara Corp Method and apparatus for polishing substrate
JP4206318B2 (en) * 2003-09-17 2009-01-07 三洋電機株式会社 Polishing pad dressing method and manufacturing apparatus
US7101138B2 (en) 2003-12-03 2006-09-05 Brooks Automation, Inc. Extractor/buffer
WO2005072910A1 (en) * 2004-01-28 2005-08-11 Nikon Corporation Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, cmp polisher, and method of manufacturing semiconductor device
JP2005288685A (en) * 2004-03-10 2005-10-20 Read Co Ltd Dresser for polishing cloth, and manufacturing method thereof
KR100642640B1 (en) 2004-10-28 2006-11-10 삼성전자주식회사 Pad conditioner test apparatus and test method thereof
US7163435B2 (en) 2005-01-31 2007-01-16 Tech Semiconductor Singapore Pte. Ltd. Real time monitoring of CMP pad conditioning process
US8412370B2 (en) 2005-04-01 2013-04-02 Nikon Corporation Polishing apparatus with dressing position setting means
JP2013525126A (en) * 2010-04-20 2013-06-20 アプライド マテリアルズ インコーポレイテッド Closed loop control for improved polishing pad profile
JP5716612B2 (en) * 2011-09-01 2015-05-13 信越半導体株式会社 Silicon wafer polishing method and polishing apparatus
JP5889760B2 (en) * 2012-09-24 2016-03-22 株式会社荏原製作所 Substrate polishing abnormality detection method and polishing apparatus
WO2016048043A1 (en) * 2014-09-23 2016-03-31 영창케미칼 주식회사 Device for measuring groove of polishing pad for chemical and mechanical polishing and chemical and mechanical polishing device comprising same
TWI789385B (en) 2017-04-21 2023-01-11 美商應用材料股份有限公司 Polishing apparatus using neural network for monitoring
TWI825075B (en) 2018-04-03 2023-12-11 美商應用材料股份有限公司 Polishing apparatus, polishing system, method, and computer storage medium using machine learning and compensation for pad thickness
TWI828706B (en) 2018-06-20 2024-01-11 美商應用材料股份有限公司 Method, computer program product, and polishing system for compensation for substrate doping for in-situ electromagnetic inductive monitoring
TWI820308B (en) 2019-03-21 2023-11-01 美商應用材料股份有限公司 Monitoring of polishing pad texture in chemical mechanical polishing
CN115135450A (en) 2020-05-14 2022-09-30 应用材料公司 Technique for training neural networks for in-situ monitoring during polishing and polishing system
CN113263436B (en) * 2020-05-29 2022-08-30 台湾积体电路制造股份有限公司 Chemical mechanical polishing system and method of use
CN117900999A (en) 2020-06-24 2024-04-19 应用材料公司 Substrate layer thickness determination using polishing pad wear compensation
US11794302B2 (en) 2020-12-15 2023-10-24 Applied Materials, Inc. Compensation for slurry composition in in-situ electromagnetic inductive monitoring

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5655951A (en) * 1995-09-29 1997-08-12 Micron Technology, Inc. Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5681212A (en) * 1995-04-14 1997-10-28 Sony Corporation Polishing device and correcting method therefor
EP0823309A1 (en) * 1996-08-09 1998-02-11 MEMC Electronic Materials, Inc. Method and apparatus for controlling flatness of polished semiconductor wafers
EP0829327A1 (en) * 1996-09-11 1998-03-18 Speedfam Co., Ltd. Polishing pad control method and apparatus
US5875559A (en) * 1995-10-27 1999-03-02 Applied Materials, Inc. Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5681212A (en) * 1995-04-14 1997-10-28 Sony Corporation Polishing device and correcting method therefor
US5655951A (en) * 1995-09-29 1997-08-12 Micron Technology, Inc. Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5875559A (en) * 1995-10-27 1999-03-02 Applied Materials, Inc. Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system
EP0823309A1 (en) * 1996-08-09 1998-02-11 MEMC Electronic Materials, Inc. Method and apparatus for controlling flatness of polished semiconductor wafers
EP0829327A1 (en) * 1996-09-11 1998-03-18 Speedfam Co., Ltd. Polishing pad control method and apparatus

Also Published As

Publication number Publication date
JP2001129754A (en) 2001-05-15
TW466153B (en) 2001-12-01
EP1063056A2 (en) 2000-12-27

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