EP0612118A1 - Method for preventing electrical crosstalk and device for performing this method - Google Patents

Method for preventing electrical crosstalk and device for performing this method Download PDF

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Publication number
EP0612118A1
EP0612118A1 EP94102108A EP94102108A EP0612118A1 EP 0612118 A1 EP0612118 A1 EP 0612118A1 EP 94102108 A EP94102108 A EP 94102108A EP 94102108 A EP94102108 A EP 94102108A EP 0612118 A1 EP0612118 A1 EP 0612118A1
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EP
European Patent Office
Prior art keywords
housing
absorber material
absorber
housing cover
partition walls
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Granted
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EP94102108A
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German (de)
French (fr)
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EP0612118B1 (en
Inventor
Maier Dipl.-Ing. Wolgang
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Airbus Defence and Space GmbH
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Deutsche Aerospace AG
Daimler Benz Aerospace AG
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices

Definitions

  • the invention relates to a method for avoiding electrical crosstalk according to the preamble of patent claim 1 and an arrangement for carrying out the method according to the preamble of patent claim 5.
  • the invention can be used in particular for the high and / or very high frequency range, in particular for the frequency range greater than 1 GHz.
  • Circuit arrangements in this high-frequency (HF) range are often designed as strip lines, for example microstrip lines (microstrip).
  • a substrate such as a ceramic substrate, with the highest possible packing density arranged electrical conductor tracks, for example microstrips, and / or electrically active and / or passive components.
  • FIG. 1 several such substrates arranged side by side in a metallic housing.
  • the substrates are separated by a metallic (housing) partition, which is intended in particular to provide electromagnetic shielding between the substrates.
  • a metallic housing is closed with a metallic housing cover.
  • this In the case of highly qualified circuit and / or device arrangements, this must be mechanically firmly connected to the housing for electrical reasons, e.g. through screw, adhesive or welded connections. The latter are e.g. made by laser welding.
  • Housing cover is also attached to the end faces of the partitions, for example by one of the aforementioned types of fastening screws, gluing or welding.
  • an electromagnetically effective damping material for example on the inside of the housing cover, on a partition and / or on the inside of a housing wall. This prevents the propagation of disturbing electromagnetic waves within a housing part which, for example, surrounds a single circuit arrangement (substrate). Interfering crosstalk (overcoupling) within the circuit arrangement located on the substrate is thereby avoided.
  • damping material often has to be attached to the inside of the housing, for example by an inexpensive adhesive process.
  • Such a procedure also has the disadvantage that there is inadequate temperature and / or aging resistance, particularly for high-quality applications, because such an adhesive connection can be unpredictable Loosen way and cause a disturbing vagabonding of the damping material within the housing.
  • the invention is therefore based on the object of specifying a generic method with which electromagnetic crosstalk is avoided in a cost-effective and reliable manner in a finally closed housing, with which temperature and aging-resistant electromagnetic damping is achieved in a cost-effective and reliable manner and with which a possible subsequent opening of the housing is made possible under inexpensive conditions.
  • the invention is also based on the object of specifying an arrangement for carrying out the method.
  • a first advantage of the invention is that a high RF crosstalk attenuation between adjacent RF circuit arrangements (substrates) is achieved both in test and calibration mode, that is, with removable and not yet permanently attached housing cover, and that this high crosstalk attenuation even after the final Closing the housing remains intact.
  • a second advantage is that the damping material, which is also referred to below as the absorber, is only reproducibly fastened in the housing by means of an inexpensive mechanical clamp connection.
  • a third advantage is that at least some partitions can be formed with a small wall thickness, since no mechanical connection is required between these partitions and the housing cover. This saves material and / or weight.
  • a fourth advantage is that in the case of the housing, at least on the open side of the housing, that is to say the side facing the housing cover, relatively high mechanical manufacturing tolerances are permissible, so that cost-effective production is possible.
  • a fifth advantage is that the housing cover only has to be connected to the housing at its outer edge for electromagnetic reasons, e.g. by a hermetically sealed (laser) welding process, if this is necessary. As a result, if the housing is subsequently opened, it is only necessary to attach these fastenings, e.g. remove a (laser) weld, which is inexpensive.
  • a sixth advantage is that the absorber can be designed mechanically so that it extends to the substrate and / or certain components, so that these can be additionally protected against mechanical shocks. With an absorber designed in this way, additional electromagnetic damping of circuit parts is also possible.
  • a seventh advantage is that the wall thickness of the partition and / or RF channel walls can be made very thin. On the one hand, this results in considerable material and / or weight savings and, on the other hand, a substantial increase in the packing density of the RF components used, while at the same time high crosstalk attenuation.
  • the housing shown there consists, for example, of a material which can be welded by laser welding, for example aluminum, has a height of approximately 20 mm and a base and / or outer wall thickness of approximately 2.5 mm.
  • the housing is divided into several chambers by partitions, which have a wall thickness of approximately 1 mm, for example, in each of which a substrate, for example a ceramic substrate, has a length from a range of approximately 5 mm to approximately 50 mm and a width of approximately 5 mm to 50 mm and a thickness of about 0.5 mm is arranged and fixed, for example by gluing and / or soldering.
  • the height of the partition walls within the housing is now dimensioned such that a distance (air gap) (FIG. 1) of approximately 2 mm remains between the end face of the partition walls and the housing cover, which is initially still removable for testing and / or setting operations.
  • the tolerance of this distance can advantageously be chosen to be very large, for example ⁇ 0.1 mm, so that inexpensive production is possible becomes.
  • Only a plate made of absorber material is placed in the housing and on the partition walls lowered with respect to the outer walls of the housing (FIG. 2). This is also called an absorber plate.
  • the absorber plate has a surface dimension which is matched to that of the inner surface of the housing. At the edges of the absorber plate, a wall distance of approximately 0.1 mm is maintained from the housing walls.
  • the plate-shaped starting material for the absorber plate has, for example, a thickness of approximately 4 mm and consists of an HF absorber material which, for example in the GHz range, consists of an absorbent plastic material.
  • This plate-shaped starting material is now processed, for example preferably by a milling process with an electronically controlled milling machine (CNC milling machine), that the starting material in the area of the partition walls (FIG. 2) has a thickness of only about 2 mm. This thickness is slightly less than the already mentioned distance between the partitions and the housing cover.
  • the milling pattern in the absorber plate corresponds to that of the partitions, which are also produced, for example, by a milling process. Because the milling pattern for the absorber plate corresponds to the negative (complement) of that for the partition walls. Such a negative formation (complement formation) can, however, be carried out particularly inexpensively and quickly with a data processing system which is required to control a CNC milling machine already mentioned. In the event of a change in the arrangement of the partition walls and / or their wall thickness that may be required, this can be done almost automatically the milling pattern for the absorber plate can also be changed.
  • Spacers are arranged between the substantially flat surface of the absorber plate facing the housing cover and the housing cover. These consist e.g. made of a rubber-elastic material and have a thickness of approximately 1 mm. With a closed housing cover (FIG. 2), these spacers generate a mechanical pretension in the absorber plate and therefore bring about their precisely determinable position, which is advantageously retained even when subjected to mechanical shock, so that the electronic damping properties are also retained.
  • FIG. 2 there is a relatively large air gap of approximately 0.1 mm between the absorber plate and the housing and the housing cover. This in itself leads to undesirable electromagnetic crosstalk, particularly in the HF range. This effect surprisingly does not occur in the invention, since the path lying between adjacent substrates is long and strongly attenuated in terms of HF. Despite the high mechanical tolerances mentioned, a high crosstalk attenuation of greater than 60 dB can therefore be achieved between the substrates in the GHz range.
  • the housing cover and the absorber plate can first of all for test and / or adjustment processes in a reproducible manner be removed from the housing. After the testing and / or setting processes, electronic measurements, for example test reports, can then be carried out with the absorber plate inserted and the housing cover temporarily closed. The measurement results obtained do not change even if the housing cover is welded to the housing in the manner described, although a mechanical distortion of the housing cover and / or the housing can occur during this welding process.
  • the otherwise required supporting welds between the housing cover and the partition walls can advantageously be largely dispensed with.
  • the invention is not limited to the exemplary embodiment described, but can be applied analogously to others.
  • partition walls made of absorber and / or insulation material to the absorber plate. These partitions bring about additional HF damping and / or mechanical pressure on the substrates and / or the components fastened thereon, so that they are pressed against the housing base and thus are particularly protected against mechanical shock loads.

Abstract

The invention relates to a method and an arrangement for preventing electrical crosstalk particularly in the case of circuit arrangements (substrates) which are fitted such that they are isolated by partition walls in a housing which can be closed on all sides, and which are suitable for the RF domain, especially the GHz band. In this case, an RF absorber plate, into which the pattern of the partition walls is introduced, is inserted into the housing, between the housing cover and the partition walls. <IMAGE>

Description

Die Erfindung betrifft ein Verfahren zur Vermeidung des elektrischen Übersprechens nach dem Oberbegriff des Patentanspruchs 1 und eine Anordnung zur Durchführung des Verfahrens nach dem Oberbegriff des Patentanspruchs 5.The invention relates to a method for avoiding electrical crosstalk according to the preamble of patent claim 1 and an arrangement for carrying out the method according to the preamble of patent claim 5.

Die Erfindung ist insbesondere für den Hoch- und/oder Höchstfrequenzbereich, insbesondere für den Frequenzbereich größer 1 GHz, verwendbar. Schaltungsanordnungen in diesem Hochfrequenz (HF)-Bereich werden vielfach als Streifenleitungen, z.B. Mikrostreifenleitungen (Microstrip) ausgeführt. Dabei sind auf einem Substrat, z.B. einem Keramiksubstrat, mit möglichst hoher Packungsdichte elektrische Leiterbahnen, z.B. Microstrips, und/oder elektrische aktive und/oder passive Bauelemente angeordnet.The invention can be used in particular for the high and / or very high frequency range, in particular for the frequency range greater than 1 GHz. Circuit arrangements in this high-frequency (HF) range are often designed as strip lines, for example microstrip lines (microstrip). Here are on a substrate, such as a ceramic substrate, with the highest possible packing density arranged electrical conductor tracks, for example microstrips, and / or electrically active and / or passive components.

Oftmals werden gemäß FIG. 1 mehrere solcher Substrate in einem metallischen Gehäuse nebeneinander angeordnet. Dabei sind die Substrate durch eine metallische (Gehäuse-)Trennwand, welche insbesondere eine elektromagnetische Abschirmung zwischen den Substraten bewirken soll, getrennt. Ein derartiges Gehäuse wird mit einem metallischen Gehäusedeckel verschlossen. Dieser muß bei hochqualifizierten Schaltungs- und/oder Geräteanordnungen aus elektrischen Gründen mechanisch fest mit dem Gehäuse verbunden werden, z.B. durch Schraub-, Kleb- oder Schweißverbindungen. Letztere werden z.B. durch Laserschweißen hergestellt.According to FIG. 1 several such substrates arranged side by side in a metallic housing. The substrates are separated by a metallic (housing) partition, which is intended in particular to provide electromagnetic shielding between the substrates. Such a housing is closed with a metallic housing cover. In the case of highly qualified circuit and / or device arrangements, this must be mechanically firmly connected to the housing for electrical reasons, e.g. through screw, adhesive or welded connections. The latter are e.g. made by laser welding.

Es ist nun erforderlich, die in dem Gehäuse angeordneten Schaltungsanordnungen (Substrate) elektrisch zu prüfen und gegebenenfalls abzugleichen. Für diese Vorgänge muß der Gehäusedeckel zunächst abnehmbar sein.It is now necessary to electrically check the circuit arrangements (substrates) arranged in the housing and, if necessary, to adjust them. For these processes, the housing cover must first be removable.

Es hat sich nun herausgestellt, daß nach dem endgültigen Befestigen des Gehäusedeckels ein störendes elektrisches Übersprechen zwischen den Substraten vorhanden ist. Dieses ist, gemäß FIG. 1 auf störende mechanische Toleranzen zurückführbar, welche einen Luftspalt zwischen der Stirnfläche einer oder mehrerer Trennwände und dem Gehäusedeckel bewirken. Dieser Luftspalt wirkt als störender parasitärer Hohlleiter, welcher das Übersprechen bewirkt.It has now been found that there is an annoying electrical crosstalk between the substrates after the final fastening of the housing cover. This is, according to FIG. 1 can be traced back to disturbing mechanical tolerances which cause an air gap between the end face of one or more partition walls and the housing cover. This air gap acts as an interfering parasitic waveguide, which causes crosstalk.

Es ist nun naheliegend, diesen Nachteil dadurch zu vermeiden, daß bei dem endgültigen Verschließen des Gehäuses der Gehäusedeckel zusätzlich auch an den Stirnflächen der Trennwände befestigt wird, z.B. durch eine der erwähnten Befestigungsarten Schrauben, Kleben oder Schweißen.It is now obvious to avoid this disadvantage in that when the housing is finally closed Housing cover is also attached to the end faces of the partitions, for example by one of the aforementioned types of fastening screws, gluing or welding.

Eine solche Vorgehensweise hat jedoch den Nachteil, daß ein einmal endgültig verschlossenes Gehäuse allenfalls unter sehr hohen Kosten und mit einem sehr hohem Zeitaufwand wieder zu öffnen ist. Beispielsweise ist es erforderlich, einen verschweißten Gehäusedeckel durch einen kostenungünstigen Fräsvorgang zu entfernen. Ein solches nachträgliches Öffnen kann z.B. bei einer sehr hochwertigen und daher wertvollen Anordnung und/oder Anlage erforderlich werden, um diese zu reparieren und/oder mit einem weiterentwickelten Substrat nachzurüsten.However, such a procedure has the disadvantage that a housing which has been finally closed can at most be opened again at very high cost and with a very high expenditure of time. For example, it is necessary to remove a welded housing cover by an inexpensive milling process. Such subsequent opening can e.g. with a very high-quality and therefore valuable arrangement and / or system are required to repair it and / or to retrofit it with a further developed substrate.

Für eine zuverlässige Funktion der Schaltungsanordnungen, insbesondere im GHz-Bereich, ist es vielfach erforderlich, daß innerhalb des Gehäuses, z.B. innen an dem Gehäusedeckel, an einer Trennwand und/oder an der Innenseite einer Gehäusewand, ein elektromagnetisch wirksames Dämpfungsmaterial angebracht wird. Dieses verhindert eine Ausbreitung störender elektromagnetischer Wellen innerhalb eines Gehäuseteiles, welcher z.B. eine einzige Schaltungsanordnung (Substrat) umgibt. Dadurch wird ein störendes Übersprechen (Überkoppeln) innerhalb der auf dem Substrat befindlichen Schaltungsanordnung vermieden. Solches Dämpfungsmaterial muß vielfach an der Innenseite des Gehäuses befestigt werden, z.B. durch einen kostenungünstigen Klebevorgang. Eine solche Vorgehensweise hat außerdem noch den Nachteil, daß insbesondere für hochwertige Anwendungsfälle keine ausreichende Temperatur- und/oder Alterungsbeständigkeit vorhanden ist, denn eine solche Klebeverbindung kann sich in unvorhersehbarer Weise lösen und ein störendes Vagabundieren des Dämpfungsmateriales innerhalb des Gehäuses bewirken.For reliable functioning of the circuit arrangements, in particular in the GHz range, it is often necessary for an electromagnetically effective damping material to be fitted inside the housing, for example on the inside of the housing cover, on a partition and / or on the inside of a housing wall. This prevents the propagation of disturbing electromagnetic waves within a housing part which, for example, surrounds a single circuit arrangement (substrate). Interfering crosstalk (overcoupling) within the circuit arrangement located on the substrate is thereby avoided. Such damping material often has to be attached to the inside of the housing, for example by an inexpensive adhesive process. Such a procedure also has the disadvantage that there is inadequate temperature and / or aging resistance, particularly for high-quality applications, because such an adhesive connection can be unpredictable Loosen way and cause a disturbing vagabonding of the damping material within the housing.

Der Erfindung liegt daher die Aufgabe zugrunde, ein gattungsgemäßes Verfahren anzugeben, mit dem in kostengünstiger und zuverlässiger Weise bei einem endgültig geschlossenen Gehäuse ein elektromagnetisches Übersprechen vermieden wird, mit dem in kostengünstiger und zuverlässiger Weise eine temperatur- und alterungsbeständige elektromagnetische Dämpfung erreicht wird und mit dem unter kostengünstigen Bedingungen ein eventuelles nachträgliches Öffnen des Gehäuses ermöglicht wird. Der Erfindung liegt außerdem die Aufgabe zugrunde, eine Anordnung zur Durchführung des Verfahrens anzugeben.The invention is therefore based on the object of specifying a generic method with which electromagnetic crosstalk is avoided in a cost-effective and reliable manner in a finally closed housing, with which temperature and aging-resistant electromagnetic damping is achieved in a cost-effective and reliable manner and with which a possible subsequent opening of the housing is made possible under inexpensive conditions. The invention is also based on the object of specifying an arrangement for carrying out the method.

Diese Aufgabe wird gelöst durch die in den kennzeichnenden Teilen der Patentansprüche 1 und 5 angegebenen Merkmale. Vorteilhafte Ausgestaltungen und/oder Weiterbildungen sind den Unteransprüchen entnehmbar.This object is achieved by the features specified in the characterizing parts of claims 1 and 5. Advantageous refinements and / or further developments can be found in the subclaims.

Ein erster Vorteil der Erfindung besteht darin, daß sowohl im Prüf- und Abgleichbetrieb, daß heißt bei abnehmbarem und noch nicht endgültig befestigtem Gehäusedeckel eine hohe HF-Übersprechdämpfung zwischen benachbarten HF-Schaltungsanordnungen (Substraten) erreicht wird und daß diese hohe Übersprechdämpfung auch nach dem endgültigen Verschließen des Gehäuses erhalten bleibt.A first advantage of the invention is that a high RF crosstalk attenuation between adjacent RF circuit arrangements (substrates) is achieved both in test and calibration mode, that is, with removable and not yet permanently attached housing cover, and that this high crosstalk attenuation even after the final Closing the housing remains intact.

Ein zweiter Vorteil besteht darin, daß das Dämpfungsmaterial, das im folgenden auch Absorber genannt wird, lediglich in reproduzierbarer Weise durch eine kostengünstige mechanische Klemmverbindung in dem Gehäuse befestigt wird.A second advantage is that the damping material, which is also referred to below as the absorber, is only reproducibly fastened in the housing by means of an inexpensive mechanical clamp connection.

Dadurch wird eine hohe Temperatur- und Alterungsbeständigkeit erreicht.This ensures high temperature and aging resistance.

Ein dritter Vorteil besteht darin, daß zumindest einige Trennwände mit einer geringen Wandstärke ausgebildet werden können, da zwischen diesen Trennwänden und dem Gehäusedeckel keine mechanische Verbindung erforderlich ist. Dadurch wird eine Material- und/oder Gewichtseinsparung erreicht.A third advantage is that at least some partitions can be formed with a small wall thickness, since no mechanical connection is required between these partitions and the housing cover. This saves material and / or weight.

Ein vierter Vorteil besteht darin, daß bei dem Gehäuse, zumindest an der offenen Gehäuseseite, das heißt der dem Gehäusedeckel zugewandten Seite, relativ hohe mechanische Fertigungstoleranze zulässig sind, so daß eine kostengünstige Fertigung möglich wird.A fourth advantage is that in the case of the housing, at least on the open side of the housing, that is to say the side facing the housing cover, relatively high mechanical manufacturing tolerances are permissible, so that cost-effective production is possible.

Ein fünfter Vorteil besteht darin, daß der Gehäusedeckel aus elektromagnetischen Gründen lediglich an seinem Außenrand mit dem Gehäuse verbunden werden muß, z.B. durch einen hermetisch dichten (Laser-)Schweißvorgang, sofern dieses erforderlich ist. Dadurch ist es bei einem eventuellen nachträglichen Öffnen des Gehäuses lediglich erforderlich, diese Befestigungen, z.B. eine (Laser-)Schweißnaht, zu entfernen, was kostengünstig ist.A fifth advantage is that the housing cover only has to be connected to the housing at its outer edge for electromagnetic reasons, e.g. by a hermetically sealed (laser) welding process, if this is necessary. As a result, if the housing is subsequently opened, it is only necessary to attach these fastenings, e.g. remove a (laser) weld, which is inexpensive.

Ein sechster Vorteil besteht darin, daß der Absorber mechanisch so ausgebildet werden kann, daß dieser bis auf das Substrat und/oder bestimmte Bauelemente reicht, so daß diese zusätzlich gegen mechanische Erschütterungen geschützt werden können. Mit einem derart ausgebildeten Absorber ist außerdem eine zusätzliche elektromagnetische Dämpfung von Schaltungsteilen möglich.A sixth advantage is that the absorber can be designed mechanically so that it extends to the substrate and / or certain components, so that these can be additionally protected against mechanical shocks. With an absorber designed in this way, additional electromagnetic damping of circuit parts is also possible.

Ein siebter Vorteil besteht darin, daß die Wandstärke der Trenn- und/oder HF-Kanalwände sehr dünn ausgeführt werden kann. Dadurch ergibt sich einerseits eine erhebliche Material- und/oder Gewichtseinsparung und andererseits eine wesentliche Erhöhung der Packungsdichte der verwendeten HF-Komponenten bei einer gleichzeitig hohen Übersprechdämpfung.A seventh advantage is that the wall thickness of the partition and / or RF channel walls can be made very thin. On the one hand, this results in considerable material and / or weight savings and, on the other hand, a substantial increase in the packing density of the RF components used, while at the same time high crosstalk attenuation.

Weitere Vorteile ergeben sich aus der folgenden Beschreibung eines Ausführungsbeispieles, das anhand der FIG. 2 näher erläutert wird. Das dort gezeigte Gehäuse besteht z.B. aus einem durch Laserschweißen verschweißbarem Material, z.B. Aluminium, hat eine Höhe von ungefähr 20 mm sowie eine Boden- und/oder Außenwandstärke von ungefähr 2,5 mm. Das Gehäuse ist durch Trennwände, die z.B. eine Wandstärke von ungefähr 1 mm besitzen, in mehrere Kammern aufgeteilt, in denen jeweils ein Substrat, z.B. ein Keramiksubstrat mit einer Länge aus einem Bereich von ungefähr 5 mm bis ungefähr 50 mm, einer Breite von ungefähr 5 mm bis 50 mm sowie einer Dicke von ungefähr 0,5 mm angeordnet und befestigt wird, z.B. durch Kleben und/oder Löten. Auf mindestens einem Substrat wird eine Schaltungsanordnung in Planartechnik, z.B. Mikrostreifentechnik (Microstrip), für den HF-Bereich, z.B. den GHz-Bereich, angeordnet. Die Höhe der Trennwände innerhalb des Gehäuses wird nun so bemessen, daß zwischen der Stirnfläche der Trennwände und dem zunächst noch für Prüf- und/oder Einstellvorgänge abnehmbaren Gehäusedeckel ein Abstand (Luftspalt) (FIG. 1) von ungefähr 2 mm bleibt. Die Toleranz dieses Abstandes kann vorteilhafterweise sehr groß gewählt werden, z.B. ± 0,1 mm, so daß eine kostengünstige Herstellung möglich wird. In das Gehäuse und auf die bezüglich der Außenwände des Gehäuses abgesenkten Trennwände wird nur eine Platte aus Absorbermaterial gelegt (FIG. 2). Diese wird auch Absorberplate genannt. Die Absorberplate hat eine Flächenabmessung, die an diejenige der Innenfläche des Gehäuses angepaßt ist. An den Rändern der Absorberplate wird zu den Gehäusewänden ein Wandabstand von ungefähr 0,1 mm eingehalten. Das plattenförmige Ausgangsmaterial für die Absorberplate hat z.B. eine Dicke von ungefähr 4 mm und besteht aus einem HF-Absorbermaterial, das z.B. im GHz-Bereich aus einem absorbierenden Kunststoffmaterial besteht. Dieses plattenförmige Ausgangsmaterial wird nun derart bearbeitet, z.B. vorzugsweise durch einen Fräsvorgang mit einer elektronisch gesteuerten Fräsmaschine (CNC-Fräsmaschine), daß das Ausgangsmaterial im Bereich der Trennwände (FIG. 2) lediglich eine Dicke von ungefähr 2 mm besitzt. Diese Dicke ist geringfügig kleiner als der bereits erwähnte Abstand zwischen den Trennwänden und dem Gehäusedeckel. Auch bei der Wahl der Dicke ist eine relativ große mechanische Toleranz von ungefähr ± 0,1 mm zulässig, so daß die Absorberplate sehr kostengünstig hergestellt werden kann. Besonders vorteilhaft ist, daß das Fräsmuster in der Absorberplate demjenigen der Trennwände, die z.B. ebenfalls durch einen Fräsvorgang hergestellt werden, entspricht. Denn das Fräsmuster für die Absorberplate entspricht dem Negativ (Komplement) desjenigen für die Trennwände. Eine solche Negativbildung (Komplementbildung) ist jedoch mit einer Datenverarbeitungsanlage, die zur Ansteuerung einer bereits erwähnten CNC-Fräsmaschine benötigt wird, besonders kostengünstig und schnell durchführbar. Bei einer eventuell erforderlichen Änderung der Anordnung der Trennwände und/oder deren Wandstärke kann somit nahezu automatisch auch das Fräsmuster für die Absorberplate geändert werden.Further advantages result from the following description of an exemplary embodiment, which is based on FIG. 2 is explained in more detail. The housing shown there consists, for example, of a material which can be welded by laser welding, for example aluminum, has a height of approximately 20 mm and a base and / or outer wall thickness of approximately 2.5 mm. The housing is divided into several chambers by partitions, which have a wall thickness of approximately 1 mm, for example, in each of which a substrate, for example a ceramic substrate, has a length from a range of approximately 5 mm to approximately 50 mm and a width of approximately 5 mm to 50 mm and a thickness of about 0.5 mm is arranged and fixed, for example by gluing and / or soldering. A circuit arrangement in planar technology, for example microstrip technology, for the HF range, for example the GHz range, is arranged on at least one substrate. The height of the partition walls within the housing is now dimensioned such that a distance (air gap) (FIG. 1) of approximately 2 mm remains between the end face of the partition walls and the housing cover, which is initially still removable for testing and / or setting operations. The tolerance of this distance can advantageously be chosen to be very large, for example ± 0.1 mm, so that inexpensive production is possible becomes. Only a plate made of absorber material is placed in the housing and on the partition walls lowered with respect to the outer walls of the housing (FIG. 2). This is also called an absorber plate. The absorber plate has a surface dimension which is matched to that of the inner surface of the housing. At the edges of the absorber plate, a wall distance of approximately 0.1 mm is maintained from the housing walls. The plate-shaped starting material for the absorber plate has, for example, a thickness of approximately 4 mm and consists of an HF absorber material which, for example in the GHz range, consists of an absorbent plastic material. This plate-shaped starting material is now processed, for example preferably by a milling process with an electronically controlled milling machine (CNC milling machine), that the starting material in the area of the partition walls (FIG. 2) has a thickness of only about 2 mm. This thickness is slightly less than the already mentioned distance between the partitions and the housing cover. When choosing the thickness, a relatively large mechanical tolerance of approximately ± 0.1 mm is permissible, so that the absorber plate can be produced very inexpensively. It is particularly advantageous that the milling pattern in the absorber plate corresponds to that of the partitions, which are also produced, for example, by a milling process. Because the milling pattern for the absorber plate corresponds to the negative (complement) of that for the partition walls. Such a negative formation (complement formation) can, however, be carried out particularly inexpensively and quickly with a data processing system which is required to control a CNC milling machine already mentioned. In the event of a change in the arrangement of the partition walls and / or their wall thickness that may be required, this can be done almost automatically the milling pattern for the absorber plate can also be changed.

Zwischen der dem Gehäusedeckel zugewandten, im wesentlichen ebenen Fläche der Absorberplate und dem Gehäusedeckel sind Abstandshalter (Gasket) angeordnet. Diese bestehen z.B. aus einem gummielastischem Material und besitzen eine Dicke von ungefähr 1 mm. Diese Abstandshalter erzeugen bei einem geschlossenen Gehäusedeckel (FIG. 2) eine mechanische Vorspannung in der Absorberplate und bewirken daher deren genau bestimmbare Lage, die vorteilhafterweise auch bei einer mechanischen Schockbeanspruchung erhalten bleibt, so daß auch dabei die elektronischen Dämpfungseigenschaften erhalten bleiben.Spacers (gasket) are arranged between the substantially flat surface of the absorber plate facing the housing cover and the housing cover. These consist e.g. made of a rubber-elastic material and have a thickness of approximately 1 mm. With a closed housing cover (FIG. 2), these spacers generate a mechanical pretension in the absorber plate and therefore bring about their precisely determinable position, which is advantageously retained even when subjected to mechanical shock, so that the electronic damping properties are also retained.

Gemäß FIG. 2 ist zwar zwischen der Absorberplate und dem Gehäuse sowie dem Gehäusedeckel ein relativ großer Luftspalt von ungefähr 0,1 mm vorhanden. Dieser führt an sich zu einem unerwünschten elektromagnetischen Übersprechen insbesondere im HF-Bereich. Dieser Effekt tritt jedoch bei der Erfindung in überraschender Weise nicht ein, da der zwischen benachbarten Substraten liegende Weg lang und HF-mäßig stark gedämpft ist. Trotz der erwähnten hohen mechanischen Toleranzen ist daher zwischen den Substraten im GHz-Bereich eine hohe Übersprechdämpfung von größer 60 dB erreichbar.According to FIG. 2 there is a relatively large air gap of approximately 0.1 mm between the absorber plate and the housing and the housing cover. This in itself leads to undesirable electromagnetic crosstalk, particularly in the HF range. This effect surprisingly does not occur in the invention, since the path lying between adjacent substrates is long and strongly attenuated in terms of HF. Despite the high mechanical tolerances mentioned, a high crosstalk attenuation of greater than 60 dB can therefore be achieved between the substrates in the GHz range.

Es ist ersichtlich, daß diese hohe Übersprechdämpfung weitgehendst unabhängig ist von der Art der Befestigung des Gehäusedeckel an dem Gehäuse. Daher kann der Gehäusedeckel sowie die Absorberplate zunächst für Prüf- und/oder Einstellvorgänge mehrmals in reproduzierbarer Weise von dem Gehäuse entfernt werden. Nach den Prüf- und/oder Einstellvorgängen können dann bei eingelegter Absorberplate und vorläufig geschlossenem Gehäusedeckel elektronische Messungen, z.B. Prüfprotokolle, durchgeführt werden. Die dabei gewonnenen Meßergebnisse ändern sich auch dann nicht, wenn der Gehäusedeckel in der beschriebenen Weise mit dem Gehäuse verschweißt wird, obwohl bei diesem Schweißvorgang ein mechanischer Verzug des Gehäusedeckels und/oder des Gehäuses auftreten kann. Auf die ansonsten erforderlichen Stützschweißungen zwischen dem Gehäusedeckel und den Trennwänden kann bei der Erfindung in vorteilhafter Weise weitestgehend verzichtet werden.It can be seen that this high crosstalk attenuation is largely independent of the type of fastening of the housing cover to the housing. Therefore, the housing cover and the absorber plate can first of all for test and / or adjustment processes in a reproducible manner be removed from the housing. After the testing and / or setting processes, electronic measurements, for example test reports, can then be carried out with the absorber plate inserted and the housing cover temporarily closed. The measurement results obtained do not change even if the housing cover is welded to the housing in the manner described, although a mechanical distortion of the housing cover and / or the housing can occur during this welding process. In the invention, the otherwise required supporting welds between the housing cover and the partition walls can advantageously be largely dispensed with.

Die Erfindung ist nicht auf das beschriebene Ausführungsbeispiel beschränkt, sondern sinngemäß auf weitere anwendbar. Beispielsweise ist es möglich, an der Absorberplate Trennwände aus Absorber- und/oder Isolationsmaterial anzubringen. Diese Trennwände bewirken eine zusätzliche HF-Dämpfung und/oder einen mechanischen Druck auf die Substrate und/oder die darauf befestigten Bauelemente, so daß diese gegen den Gehäuseboden gedrückt und damit gegen eine mechanische Schockbeanspruchung besonders geschützt werden.The invention is not limited to the exemplary embodiment described, but can be applied analogously to others. For example, it is possible to attach partition walls made of absorber and / or insulation material to the absorber plate. These partitions bring about additional HF damping and / or mechanical pressure on the substrates and / or the components fastened thereon, so that they are pressed against the housing base and thus are particularly protected against mechanical shock loads.

Claims (7)

Verfahren zur Vermeidung des elektrischen Übersprechens zwischen mehreren Schaltungsanordnungen, insbesondere für Schaltungen der Hochfrequenztechnologie, wobei die Schaltungsanordnungen in einem gemeinsamen durch einen Gehäusedeckel allseits verschließbarem Gehäuse durch mindestens eine Trennwand voneinander getrennt angeordnet werden, dadurch gekennzeichnet, - daß zumindest in dem elektrisch zu bedämpfendem Bereich des Gehäuses die Höhe der Trennwände verringert wird, so daß zwischen diesen und dem metallischen Gehäusedeckel ein vorgebbarer Abstand entsteht, - daß der Bereich ganzflächig durch plattenförmiges HF-Absorbermaterial (Absorberplate) abgedeckt wird, dessen Dicke an sich größer ist als der Abstand zwischen den Trennwänden und dem Gehäusedeckel, - daß in das HF-Absorbermaterial ein Vertiefungsmuster entsprechend demjenigen der Trennwände eingearbeitet wird, - daß das HF-Absorbermaterial an den Vertiefungen eine Dicke besitzt, die kleiner gleich dem Abstand ist, und - daß das HF-Absorbermaterial bezüglich des Gehäuses und/oder des Deckels gegen mechanische Verschiebungen gesichert wird.. Method for avoiding electrical crosstalk between a plurality of circuit arrangements, in particular for circuits of high-frequency technology, the circuit arrangements being arranged in a common housing which can be closed on all sides by a housing cover and separated from one another by at least one partition, characterized in that that the height of the partition walls is reduced, at least in the region of the housing which is to be electrically damped, so that a predeterminable distance arises between the latter and the metallic housing cover, - That the area over the entire area by plate-shaped HF absorber material (absorber plate) is covered, the thickness of which is greater than the distance between the partition walls and the housing cover, a recess pattern corresponding to that of the partition walls is worked into the HF absorber material, - That the RF absorber material at the wells has a thickness which is less than or equal to the distance, and - That the HF absorber material is secured against mechanical displacement with respect to the housing and / or the cover. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Vertiefungsmuster mit einer elektronisch gesteuerten Fräsmaschine erzeugt wird.Method according to claim 1, characterized in that the indentation pattern is generated with an electronically controlled milling machine. Verfahren nach Anspruch 1 oder Anspruch 2, dadurch gekennzeichnet, daß das Vertiefungsmuster als Komplement (Negativ) zu dem Muster der Trennwände ausgebildet wird.Method according to claim 1 or claim 2, characterized in that the indentation pattern is designed as a complement (negative) to the pattern of the partition walls. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß zwischen dem HF-Absorbermaterial und dem Gehäuse und/oder dem Gehäusedeckel ein Abstand kleiner als 0,2 λ eingehalten wird, wobei λ die Wellenlänge der zu dämpfenden Frequenz bedeutet.Method according to one of the preceding claims, characterized in that a distance of less than 0.2 λ is maintained between the HF absorber material and the housing and / or the housing cover, where λ is the wavelength of the frequency to be damped. Anordnung zur Durchfürhung des Verfahrens nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß ein HF-Absorbermaterial gewählt ist, das für die zu bedämpfende Frequenz aus einem mechanisch bearbeitbarem gefülltem Kunststoffmaterial (Absorberrezeptur) besteht.Arrangement for carrying out the method according to one of the preceding claims, characterized in that an HF absorber material is selected which, for the frequency to be damped, consists of a mechanically editable filled plastic material (absorber formulation). Anordnung nach Anspruch 5, dadurch gekennzeichnet, daß in dem HF-Absorbermaterial Vertiefungen, welche dem Muster der Trennwände entsprechen, angebracht sind und daß an dem HF-Absorbermaterial zusätzliche aus Absorbermaterial und/oder Isolationsmaterial bestehende Trenn- und/oder Stützwände angebracht werden.Arrangement according to claim 5, characterized in that recesses which correspond to the pattern of the dividing walls are provided in the HF absorber material and that additional dividing and / or supporting walls consisting of absorber material and / or insulation material are attached to the HF absorber material. Anrodnung nach Anspruch 5 oder Anspruch 6, dadurch gekennzeichnet, daß zur mechanischen Sicherung des HF-Absorbermaterials zwischen diesem und dem Gehäusedeckel mindestens ein gummielastischer Abstandshalter eingefügt ist.Arranging according to Claim 5 or Claim 6, characterized in that at least one rubber-elastic spacer is inserted between the latter and the housing cover in order to mechanically secure the HF absorber material.
EP94102108A 1993-02-16 1994-02-11 Method for preventing electrical crosstalk and device for performing this method Expired - Lifetime EP0612118B1 (en)

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DE4304656A DE4304656A1 (en) 1993-02-16 1993-02-16 Method for avoiding electrical crosstalk and arrangement for carrying out the method
DE4304656 1993-02-16

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EP0612118B1 EP0612118B1 (en) 1998-05-27

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US5725928A (en) * 1995-02-17 1998-03-10 Velcro Industries B.V. Touch fastener with magnetic attractant
EP0890988A2 (en) * 1997-07-11 1999-01-13 Alcatel Electrical circuit assembly mounted in a housing
DE10213710A1 (en) * 2002-03-27 2003-10-16 Tesat Spacecom Gmbh & Co Kg Absorber insert for a metal casing housing high-frequency (HF) wiring muffles HF wiring with a compound of material particles for absorbing electromagnetic fields.
RU2456719C1 (en) * 2011-06-07 2012-07-20 Открытое акционерное общество "Федеральный научно-производственный центр "Нижегородский научно-исследовательский институт радиотехники" Selective protection device on reciprocal rods

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DE19609718C1 (en) * 1996-03-13 1997-06-26 Bosch Gmbh Robert Electromagnetic HF screening between chambers of microwave circuit housing
RU2470418C1 (en) * 2011-12-08 2012-12-20 Федеральное Государственное Автономное Образовательное Учреждение Высшего Профессионального Образования "Сибирский Федеральный Университет" Miniature strip-line resonator
CN109862734A (en) * 2018-12-27 2019-06-07 中国电子科技集团公司第十三研究所 Electronic device package structure

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DE1441114A1 (en) * 1962-09-28 1969-05-22 Siemens Ag Electrical device with shield
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US5150282A (en) * 1990-12-14 1992-09-22 Fujitsu Limited Electromagnetic shielding structure of high-frequency circuit arrangements

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5725928A (en) * 1995-02-17 1998-03-10 Velcro Industries B.V. Touch fastener with magnetic attractant
EP0890988A2 (en) * 1997-07-11 1999-01-13 Alcatel Electrical circuit assembly mounted in a housing
EP0890988A3 (en) * 1997-07-11 1999-12-08 Alcatel Electrical circuit assembly mounted in a housing
US6157544A (en) * 1997-07-11 2000-12-05 Alcatel Electrical circuit configuration arranged in a casing
DE10213710A1 (en) * 2002-03-27 2003-10-16 Tesat Spacecom Gmbh & Co Kg Absorber insert for a metal casing housing high-frequency (HF) wiring muffles HF wiring with a compound of material particles for absorbing electromagnetic fields.
RU2456719C1 (en) * 2011-06-07 2012-07-20 Открытое акционерное общество "Федеральный научно-производственный центр "Нижегородский научно-исследовательский институт радиотехники" Selective protection device on reciprocal rods

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ES2117979T3 (en) 1998-09-01
EP0612118B1 (en) 1998-05-27
DE4304656A1 (en) 1994-08-18
DE59406061D1 (en) 1998-07-02

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