EP0412270A1 - Micromechanical compressor cascade and method of increasing the pressure at extremely low operating pressure - Google Patents
Micromechanical compressor cascade and method of increasing the pressure at extremely low operating pressure Download PDFInfo
- Publication number
- EP0412270A1 EP0412270A1 EP90111971A EP90111971A EP0412270A1 EP 0412270 A1 EP0412270 A1 EP 0412270A1 EP 90111971 A EP90111971 A EP 90111971A EP 90111971 A EP90111971 A EP 90111971A EP 0412270 A1 EP0412270 A1 EP 0412270A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- compressor
- membrane
- cascade
- pump
- compressor cascade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
- F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
- F04B45/041—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms double acting plate-like flexible pumping member
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
- F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
- F04B45/047—Pumps having electric drive
Definitions
- the invention relates to a micromechanical compressor cascade and a method of increasing the pressure at extremely low operating pressure.
- the micromechanical compressor cascade may be used to cool semiconductor devices and for pneumatic controls or be employed in actuators and sensors.
- compressors In addition to the heat exchanger and the expansion nozzle or engine, compressors, for example, belong to the major components of a cooling system.
- the cooling effect is obtained by rapid expansion of the operating medium through the expansion nozzle or by slow expansion in the case of an expansion engine.
- Compressors for cooling small components must meet stringent requirements with regard to their geometric dimensions and compactness.
- the compressors are advantageously integrated in the chip substrate or the module. High operating pressures in micromechanical cooling systems reduce their reliability, rendering the control of the individual membrane pumps extremely elaborate.
- the invention utilizes the higher pump efficiency obtained from the cascade effect combined with a lower power consumption obtained by tandem-connecting a plurality of micromechanical membrane pumps.
- the latter are arranged such that their compression effect is controllable.
- the arrangement and design of the membrane pumps are such that compression may be effected at a low operating pressure, that all membranes may be simultaneously energized to resonance oscillations and both stroke chambers of a membrane pump are used for the actual compression process.
- the compressor cascade described in the invention may be integrated in electronic components, such as semiconductor chips. It may be michromechanically produced with other components, such as heat exchanger and expansion nozzle and be integrated in a very compact miniature cooling system.
- the micromechanical production process of silicon technology permits a considerable miniaturization of the compressor cascade, thus affording a high complexity combined with a high pump speed.
- the compressor cascade element of Figs. 1a and b consists of three tandem-connected micromechanical membrane pumps P1, P2 and P3. They belong to a compressor cascade which may comprise hundreds of such membrane pumps P1...Pn.
- Each membrane pump has two identically sized stroke chambers P1-A and P1-B, P2-A and P2-B, P3-A and P3-B.
- the stroke chambers are fabricated in two opposed plates A and B by standard etch techniques used to produce integrated circuits, such as reactive ion etching, reactive ion beam etching, isotropic etching, etc. These etch techniques are described inter alia by K. Petersen in "Techniques and Applications of Silicon Integrated Micromechanics" in RJ3047 (37942) 2/4/81.
- the plate material may be various conductive and semiconductive materials, such as silicon, which are micromechanically processable.
- the opposed stroke chambers belonging to a pump are separated from each other by a thin membrane M1, M2, M3.
- the individual membrane pumps are connected by input/out-put channels D21-A, D31-A, D41-A, D21-B, D31-B, C11-A, C21-A, C11-B, C21-B and C31-B containing valves V11-B, V21-A, V31-B, V11-A, V21-B.
- the membranes.and valves may consists of a thin foil, resting on plate A or plate B, or of a foil arranged between plates A and B.
- the membranes and valves may be produced by using the coating, lithography and etch methods known from the production of electronic circuits, such as evaporation, different methods of chemical vapor deposition (CVD), high-resolution optical or X-ray lithography methods, as well as isotropic and anisotropic etch techniques.
- An electric voltage UM is applied to the membrane.
- Suitable foil materials are metals, such as aluminum or copper, metallically coated synthetic foils or metallically coated silicon dioxide.
- a process cycle for producing the membranes is described, for example, by K.E. Petersen in "IBM Technical Disclosure Bulletin", Vol. 21, No. 9, February 1979, pp. 3768-3769 for the production of electrostatically controlled micromechanical storage elements of amorphous films.
- the valves prevent the pump medium from flowing back and open in the flow direction of the pump medium. They may be shaped as cantilever beams which are only opened by the mechanical pressure of the pump medium, or as electrostatically controlled switches, as described by K.E. Petersen in "IEEE Transactions On Electronic Devices” 25 (1978) 215. The cantilever beams close automatically in response to the bias of their material.
- Fig. 2a is a plan view of the stroke chambers P1-A and P2-A in the area of the A-plate and Fig. 2c of the stroke chambers P1-B and P2-B in the area of the B-plate of the membrane pumps P1 and P2. All stroke chambers have the same width W, but their length L1 and L2 differs.
- the membrane pumps are positioned such that the length and thus the volume decrease in the flow direction of the medium of the respective next membrane pump.
- the long sides of the stroke chambers are fitted with input/output channels D21-A to D24-A, D21-B to D24-B and C11-A to C14-A, C11-B to C14-B.
- a plurality of input/output channels may be arranged in the long sides. This increases the channel cross-section, leading to a high throughput of the pump medium.
- the width W of the stroke chambers is 20 ⁇ m, the length L1 of the membrane pump P1 100 ⁇ m and the height of the membrane pumps Pn 3 ⁇ m.
- Fig. 2b shows a plan view of the membranes M1 and M2 and on their long sides the valves V11-A to B14-A and V11-B to V14-B of the two membrane pumps P1 and P2.
- Figs. 2a - c show the planes S1 and S2 of the cross-sectional views of Figs. 1a and 1b.
- the potential UM+ is applied to the membranes, with membranes M1, M2, M3 being deflected in the direction of the B-plate.
- the membrane deflections cause the pump medium in the stroke chambers of the B-plate P1-B, P2-B, P3-B of the membrane pumps P1, P2, P3 to be moved to the stroke chambers of the A-plate P2-A, P3-A, P4-A of the respective next membrane pumps P2, P3, P4, the flow pressure opening the valves V11-B, V21-B, V31-B arranged between the outlet channels C11-B, C21-B, C31-B and the inlet channels D21-A, D31-A, D41-A. Valves V11-A, V21-A, V31-A remain closed, preventing a flow back of the pump medium. This proceeds substantially synchronously in all membrane pumps Pn of the compressor cascade.
- a gaseous or liquid pump medium is compressed as the volume of the stroke chambers Pn-A and Pn-B decreases, and the pressure in the stroke chamber rises according to the volume reduction within the compressor cascade.
- the volume reduction may proceed continuously or in steps, e.g. by connecting several compression zones.
- a possible kind of volume reduction of the stroke chambers is shown in Fig. 3 illustrating a cutaway portion of the compressor cascade.
- the compression ratio totals 4 : 1 which is obtained by tandem-connecting two compression stages with one or two compression zones each having a compression ratio of 2 : 1 per compression stage.
- the length L of the stroke chambers is also reduced at a 2 : 1 ratio.
- the pressure increase between two adjacent membrane pumps Pn and Pn+1 corresponds to the operating pressure ⁇ p built up by the membranes Mn.
- the volume reduction may take place in arbitrarily small steps, so that this compression method at an extremely low operating pressure and a corresponding number of pumps Pn yields a high pressure increase at the end of the compressor cascade.
- the pressure difference between two opposed stroke chambers Pn-A and Pn-B is ⁇ p during the compression process in the entire compressor cascade.
- the thin membranes Mn and the valves Vnm-A, Vnm-B are only subjected to the low operating pressure ⁇ p of 0.001 bar compared with the relatively high gas pressure of about 70 bar in the above-mentioned Joule-Thomson system by W.A. Little.
- FIGs. 4 and 5 show one of a number of conceivable applications for the compressor cascade described in the invention.
- Fig. 4a is a plan view of a miniature cooling element which, in addition to the compressor cascade, comprises further components, such as heat exchanger and expansion chamber.
- the compressor area and the heat exchanger as well as the heat exchanger and the expansion chamber are thermally insulated from each other by recesses preventing a heat transfer between those elements.
- Fig. 4b shows the compact design of the compressor. In four silicon wafers positioned on top of each other, three compressor planes are arranged. This allows a considerable increase in the power density of the compressor.
- FIG. 5 several miniature cooling systems are installed in a cooling system housing which is thermally insulated and provided with a low-temperature heat absorber.
- the cooling system housing is air-cooled.
- the invention is not limited to the above-described example but may be used in a multitude of miniature cooling systems, sensors, actuators and pneumatic controls.
Abstract
Description
- The invention relates to a micromechanical compressor cascade and a method of increasing the pressure at extremely low operating pressure. The micromechanical compressor cascade may be used to cool semiconductor devices and for pneumatic controls or be employed in actuators and sensors.
- In addition to the heat exchanger and the expansion nozzle or engine, compressors, for example, belong to the major components of a cooling system. The cooling effect is obtained by rapid expansion of the operating medium through the expansion nozzle or by slow expansion in the case of an expansion engine.
- A survey of different cooling systems is contained in "Cryocoolers", Part 1: Fundamentals, by G. Walker, Plenum Press; an example of a highly compact conventional cooling system, the "Small Integral Stirling Cooling Engine", being shown in Fig. 1.2 of that citation. The essential elements of a cooling system are integrated in a component measuring only a few cubic centimeters.
- A micromechanical cooling system is presented by W.A. Little in "Design and construction of microminiature cryogenic refrigerators", AIP Proceedings of Future Trends in Superconductive Electronics, Charlottesville, University of Virginia, 1987. In the "Joule-Thomson Minirefrigeration System", the different elements, such as heat exchanger, expansion nozzle, gas inlet/outlet regions and liquid collector, are produced micromechanically in one piece of silicon. The flow channels of the heat exchanger have a diameter of 100 µm at a total channel length of about 25 cm and must be capable of withstanding a gas pressure of about 70 bar. The temperature difference between gas inlet and expansion nozzle is limited by the high thermal conductivity of the silicon.
- "Sensors and Actuators", 15 (1988) 153-167, by H.T.G. van Lintel et al., describes a micropump realized by micromachining a silicon wafer of about 5 cm diameter. The micropump has a glass-silicon-glass sandwich structure comprising 1 or 2 pump chambers and 2 to 3 valves. The operating pressure is built up by applying a voltage to the piezoelectric double-layer pump membrane.
- The cascade effect is used by Keesom in his "Cascade Air Liquefier" (Fig. 2.7 in "Cryogenic Engineering" by Russel B. Scott, D. van Nostrand Company, Inc.) for air liquefication by four series-connected evaporator systems for liquids of progressively lower boiling points.
- DE 32 02 324 A1 describes a heat pump comprising a condenser consisting of several parallel-connected identical compressors, the membrane centers of which are pressed together by mechanical forces during the operating cycle, compressing gas and transferring it to heat exchangers.
- Compressors for cooling small components, such as microelectronic chips, must meet stringent requirements with regard to their geometric dimensions and compactness. The compressors are advantageously integrated in the chip substrate or the module. High operating pressures in micromechanical cooling systems reduce their reliability, rendering the control of the individual membrane pumps extremely elaborate.
- The above-described problem is solved by the features of the claims. For this purpose, the invention utilizes the higher pump efficiency obtained from the cascade effect combined with a lower power consumption obtained by tandem-connecting a plurality of micromechanical membrane pumps. The latter are arranged such that their compression effect is controllable. The arrangement and design of the membrane pumps are such that compression may be effected at a low operating pressure, that all membranes may be simultaneously energized to resonance oscillations and both stroke chambers of a membrane pump are used for the actual compression process. The compressor cascade described in the invention may be integrated in electronic components, such as semiconductor chips. It may be michromechanically produced with other components, such as heat exchanger and expansion nozzle and be integrated in a very compact miniature cooling system. The micromechanical production process of silicon technology permits a considerable miniaturization of the compressor cascade, thus affording a high complexity combined with a high pump speed.
- One way of carrying out the invention is described in detail below with reference to drawings which illustrate only one specific embodiment, in which
- Figs. 1a and 1b each show a cross-sectional view of a compressor cascade element with three membrane pumps along planes S1 and S2;
- Fig. 2 is a sectional plan view of a compressor cascade element with two membrane pumps,
Fig. 2a showing the area of the A-plate,
Fig. 2b the membrane and the valve plane, and
Fig. 2c the area of the B-plate; - Fig. 3 is a schematic of the tandem-connected membrane pumps in the compressor cascade;
- Fig. 4 is a miniature cooling element with the compressor cascade according to the invention and further components required for the cooling elements,
Fig. 4a being a plan view and
Fig. 4b being a cross-sectional view; - Fig. 5 is a cooling system housing accommodating several miniature cooling elements illustrated in Fig. 4.
- The compressor cascade element of Figs. 1a and b consists of three tandem-connected micromechanical membrane pumps P1, P2 and P3. They belong to a compressor cascade which may comprise hundreds of such membrane pumps P1...Pn. Each membrane pump has two identically sized stroke chambers P1-A and P1-B, P2-A and P2-B, P3-A and P3-B. The stroke chambers are fabricated in two opposed plates A and B by standard etch techniques used to produce integrated circuits, such as reactive ion etching, reactive ion beam etching, isotropic etching, etc. These etch techniques are described inter alia by K. Petersen in "Techniques and Applications of Silicon Integrated Micromechanics" in RJ3047 (37942) 2/4/81. The plate material may be various conductive and semiconductive materials, such as silicon, which are micromechanically processable.
- The opposed stroke chambers belonging to a pump are separated from each other by a thin membrane M1, M2, M3. The individual membrane pumps are connected by input/out-put channels D21-A, D31-A, D41-A, D21-B, D31-B, C11-A, C21-A, C11-B, C21-B and C31-B containing valves V11-B, V21-A, V31-B, V11-A, V21-B.
- The membranes.and valves may consists of a thin foil, resting on plate A or plate B, or of a foil arranged between plates A and B. The membranes and valves may be produced by using the coating, lithography and etch methods known from the production of electronic circuits, such as evaporation, different methods of chemical vapor deposition (CVD), high-resolution optical or X-ray lithography methods, as well as isotropic and anisotropic etch techniques. An electric voltage UM is applied to the membrane. Suitable foil materials are metals, such as aluminum or copper, metallically coated synthetic foils or metallically coated silicon dioxide. A process cycle for producing the membranes is described, for example, by K.E. Petersen in "IBM Technical Disclosure Bulletin", Vol. 21, No. 9, February 1979, pp. 3768-3769 for the production of electrostatically controlled micromechanical storage elements of amorphous films.
- The valves prevent the pump medium from flowing back and open in the flow direction of the pump medium. They may be shaped as cantilever beams which are only opened by the mechanical pressure of the pump medium, or as electrostatically controlled switches, as described by K.E. Petersen in "IEEE Transactions On Electronic Devices" 25 (1978) 215. The cantilever beams close automatically in response to the bias of their material.
- Fig. 2a is a plan view of the stroke chambers P1-A and P2-A in the area of the A-plate and Fig. 2c of the stroke chambers P1-B and P2-B in the area of the B-plate of the membrane pumps P1 and P2. All stroke chambers have the same width W, but their length L1 and L2 differs. The membrane pumps are positioned such that the length and thus the volume decrease in the flow direction of the medium of the respective next membrane pump. The long sides of the stroke chambers are fitted with input/output channels D21-A to D24-A, D21-B to D24-B and C11-A to C14-A, C11-B to C14-B. With an elongated shape of the pump chambers, a plurality of input/output channels may be arranged in the long sides. This increases the channel cross-section, leading to a high throughput of the pump medium.
- For a special embodiment, the width W of the stroke chambers is 20 µm, the length L1 of the membrane pump P1 100 µm and the height of the membrane pumps
Pn 3 µm. - Fig. 2b shows a plan view of the membranes M1 and M2 and on their long sides the valves V11-A to B14-A and V11-B to V14-B of the two membrane pumps P1 and P2.
- Figs. 2a - c show the planes S1 and S2 of the cross-sectional views of Figs. 1a and 1b.
- Identical fixed potentials of opposite signs UA= +, UB= - are applied to plates A and B, whereas the sign of the potential UM= +/- applied to membranes M1...Mn changes constantly, reloading the membranes. By electrostatic attraction forces, the membranes are pulled towards plate A or B and made to oscillate. The membranes Mn behave like mechanical oscillators which oscillate substantially synchronously in the same direction of deflection at the resonance frequency defined by the width W. By the microstructures, high resonance frequencies may be obtained. The useful operating pressure Δp for the compression process is identical for all membrane pumps Pn. It is obtained from the electrostatic attraction force acting on membranes Mn and thus on the pump medium.
- During the time shown in Figs. 1a and b, the potential UM+ is applied to the membranes, with membranes M1, M2, M3 being deflected in the direction of the B-plate. The membrane deflections cause the pump medium in the stroke chambers of the B-plate P1-B, P2-B, P3-B of the membrane pumps P1, P2, P3 to be moved to the stroke chambers of the A-plate P2-A, P3-A, P4-A of the respective next membrane pumps P2, P3, P4, the flow pressure opening the valves V11-B, V21-B, V31-B arranged between the outlet channels C11-B, C21-B, C31-B and the inlet channels D21-A, D31-A, D41-A. Valves V11-A, V21-A, V31-A remain closed, preventing a flow back of the pump medium. This proceeds substantially synchronously in all membrane pumps Pn of the compressor cascade.
- The reloading of the membranes Mn produced by changing the potential of UM+ to UM- occurs at the time of maximum membrane deflection. In response, the membranes Mn are pulled towards the A-plate, deflecting in the direction of the latter. Accordingly, the pump medium in the stroke chambers of the A-plate of pumps P1, P2, P3 is moved to the stroke chambers of the B-plate of the respective next pumps P2, P3, P4. The valves V11-A, V21-A, V31-A are opened at that stage, whereas valves V11-B, V21-B, V31-B are closed. This also proceeds substantially synchronously in all membrane pumps Pn.
- During its movement through the various membrane pumps Pn of the compressor cascade, a gaseous or liquid pump medium is compressed as the volume of the stroke chambers Pn-A and Pn-B decreases, and the pressure in the stroke chamber rises according to the volume reduction within the compressor cascade. The volume reduction may proceed continuously or in steps, e.g. by connecting several compression zones. A possible kind of volume reduction of the stroke chambers is shown in Fig. 3 illustrating a cutaway portion of the compressor cascade. In this portion, the compression ratio totals 4 : 1, which is obtained by tandem-connecting two compression stages with one or two compression zones each having a compression ratio of 2 : 1 per compression stage. In one compression zone of the compressor portion the length L of the stroke chambers is also reduced at a 2 : 1 ratio.
- The pressure increase between two adjacent membrane pumps Pn and Pn+1 corresponds to the operating pressure Δp built up by the membranes Mn. The volume reduction may take place in arbitrarily small steps, so that this compression method at an extremely low operating pressure and a corresponding number of pumps Pn yields a high pressure increase at the end of the compressor cascade. The pressure difference between two opposed stroke chambers Pn-A and Pn-B is Δp during the compression process in the entire compressor cascade. Thus, the thin membranes Mn and the valves Vnm-A, Vnm-B are only subjected to the low operating pressure Δp of 0.001 bar compared with the relatively high gas pressure of about 70 bar in the above-mentioned Joule-Thomson system by W.A. Little.
- Figs. 4 and 5 show one of a number of conceivable applications for the compressor cascade described in the invention.
- Fig. 4a is a plan view of a miniature cooling element which, in addition to the compressor cascade, comprises further components, such as heat exchanger and expansion chamber. The compressor area and the heat exchanger as well as the heat exchanger and the expansion chamber are thermally insulated from each other by recesses preventing a heat transfer between those elements. Fig. 4b shows the compact design of the compressor. In four silicon wafers positioned on top of each other, three compressor planes are arranged. This allows a considerable increase in the power density of the compressor.
- In Fig. 5, several miniature cooling systems are installed in a cooling system housing which is thermally insulated and provided with a low-temperature heat absorber. In this particular embodiment, the cooling system housing is air-cooled. The invention is not limited to the above-described example but may be used in a multitude of miniature cooling systems, sensors, actuators and pneumatic controls.
Claims (16)
- several tandem-connected micromechanical membrane pumps (P1...Pn) with a volume of the stroke chambers (P1-A, P1-B...Pn-A, Pn-B) decreasing in the flow direction of the pump medium for progressively compressing the pump medium
- one or several parallel-connected input/output channels (D11-A...Dnm-A, D11-B...Dnm-B, C11-A...Cnm-A, C11-B...Cnm-B) on the long sides of said stroke chambers (Pn-A, Pn-B) for inter-connecting the individual membrane pumps (Pn)
- valves (V11-A...Vnm-A, V11-B...Vnm-B), accommodated in said input/output channels (Dnm-A, Dnm-B, Cnm-A, Cnm-B), preventing the pump medium from flowing back.
- which consist of several tandem-connected micromechanical membrane pumps (Pn) with the volume of the stroke chambers (Pn-A, Pn-B) decreasing in the flow direction of the pump medium,
- which are connected in fan fashion to form a compression stage comprising a number of compression zones decreasing from one compression stage to the other,
- the compression ratio of which makes up the total compression of the compressor cascade.
- building up the same operating pressure (Δp) substantially synchronously in all membrane pumps (P1...Pn)
- moving the pump medium from the stroke chamber (P1-B) of one membrane pump (P1) to the stroke chamber (P2-A) of smaller volume of the respective next membrane pump (P2) in the flow direction of the pump medium through the input/output channels (D1m-B, D1m-A, C1m-B, C1m-A)
- compressing the pump medium by synchronously moving it through the various membrane pumps (Pn) of the compressor cascade
- increasing the pressure at the end of the compressor cascade by continuously reducing the volume in the successive stroke chambers (P1-A...Pn-A, P1-B...Pn-B).
- a compressor consisting of one or several micromechanical compressor cascades as described in any one of the preceding claims 1 to 12,
- a heat exchanger and an expansion chamber, wherein the compressor, the heat exchanger and the expansion chamber are thermally insulated from each other.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3926066 | 1989-08-07 | ||
DE3926066A DE3926066A1 (en) | 1989-08-07 | 1989-08-07 | MICROMECHANICAL COMPRESSOR CASCADE AND METHOD FOR INCREASING PRINTER AT EXTREMELY LOW WORKING PRESSURE |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0412270A1 true EP0412270A1 (en) | 1991-02-13 |
EP0412270B1 EP0412270B1 (en) | 1993-10-06 |
Family
ID=6386653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90111971A Expired - Lifetime EP0412270B1 (en) | 1989-08-07 | 1990-06-23 | Micromechanical compressor cascade and method of increasing the pressure at extremely low operating pressure |
Country Status (4)
Country | Link |
---|---|
US (1) | US5078581A (en) |
EP (1) | EP0412270B1 (en) |
JP (1) | JP2663994B2 (en) |
DE (2) | DE3926066A1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0518524A2 (en) * | 1991-05-30 | 1992-12-16 | Hitachi, Ltd. | Valve and semiconductor fabricating equipment using the same |
EP0556622A1 (en) * | 1992-01-30 | 1993-08-25 | Terumo Kabushiki Kaisha | Micro-pump and method for production thereof |
EP0779436A2 (en) * | 1995-12-13 | 1997-06-18 | Frank T. Hartley | Micromachined peristaltic pump |
WO1997029538A1 (en) * | 1996-02-10 | 1997-08-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bistable microactuator with coupled membranes |
WO1998014707A1 (en) * | 1996-10-03 | 1998-04-09 | Westonbridge International Limited | Micro-machined device for fluids and method of manufacture |
WO1998051929A1 (en) * | 1997-05-12 | 1998-11-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Micromembrane pump |
WO2000023753A1 (en) | 1998-10-19 | 2000-04-27 | The Board Of Trustees Of The University Of Illinois | Active compressor vapor compression cycle integrated heat transfer device |
WO2000028215A1 (en) * | 1998-11-06 | 2000-05-18 | Honeywell Inc. | Electrostatically actuated pumping array |
ES2152763A1 (en) * | 1997-02-28 | 2001-02-01 | Consejo Superior Investigacion | Analysis system integrated state sensing tube consists of a holder of ISFET sensors made of micro machined silicon and glass and glass |
CN101520035B (en) * | 2008-02-26 | 2013-03-20 | 研能科技股份有限公司 | Fluid conveying device |
US10563642B2 (en) | 2016-06-20 | 2020-02-18 | The Regents Of The University Of Michigan | Modular stacked variable-compression micropump and method of making same |
Families Citing this family (89)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4402119C2 (en) * | 1994-01-25 | 1998-07-23 | Karlsruhe Forschzent | Process for the production of micromembrane pumps |
US5611214A (en) * | 1994-07-29 | 1997-03-18 | Battelle Memorial Institute | Microcomponent sheet architecture |
DE19637928C2 (en) * | 1996-02-10 | 1999-01-14 | Fraunhofer Ges Forschung | Bistable membrane activation device and membrane |
US5961298A (en) * | 1996-06-25 | 1999-10-05 | California Institute Of Technology | Traveling wave pump employing electroactive actuators |
US5836750A (en) * | 1997-10-09 | 1998-11-17 | Honeywell Inc. | Electrostatically actuated mesopump having a plurality of elementary cells |
US6106245A (en) * | 1997-10-09 | 2000-08-22 | Honeywell | Low cost, high pumping rate electrostatically actuated mesopump |
US7215425B2 (en) * | 2000-08-02 | 2007-05-08 | Honeywell International Inc. | Optical alignment for flow cytometry |
US8071051B2 (en) * | 2004-05-14 | 2011-12-06 | Honeywell International Inc. | Portable sample analyzer cartridge |
US7553453B2 (en) * | 2000-06-02 | 2009-06-30 | Honeywell International Inc. | Assay implementation in a microfluidic format |
US7130046B2 (en) * | 2004-09-27 | 2006-10-31 | Honeywell International Inc. | Data frame selection for cytometer analysis |
US6568286B1 (en) * | 2000-06-02 | 2003-05-27 | Honeywell International Inc. | 3D array of integrated cells for the sampling and detection of air bound chemical and biological species |
US6837476B2 (en) * | 2002-06-19 | 2005-01-04 | Honeywell International Inc. | Electrostatically actuated valve |
US8329118B2 (en) * | 2004-09-02 | 2012-12-11 | Honeywell International Inc. | Method and apparatus for determining one or more operating parameters for a microfluidic circuit |
US7420659B1 (en) * | 2000-06-02 | 2008-09-02 | Honeywell Interantional Inc. | Flow control system of a cartridge |
US7283223B2 (en) * | 2002-08-21 | 2007-10-16 | Honeywell International Inc. | Cytometer having telecentric optics |
US7630063B2 (en) * | 2000-08-02 | 2009-12-08 | Honeywell International Inc. | Miniaturized cytometer for detecting multiple species in a sample |
US7978329B2 (en) * | 2000-08-02 | 2011-07-12 | Honeywell International Inc. | Portable scattering and fluorescence cytometer |
US7641856B2 (en) * | 2004-05-14 | 2010-01-05 | Honeywell International Inc. | Portable sample analyzer with removable cartridge |
US7471394B2 (en) * | 2000-08-02 | 2008-12-30 | Honeywell International Inc. | Optical detection system with polarizing beamsplitter |
US7242474B2 (en) * | 2004-07-27 | 2007-07-10 | Cox James A | Cytometer having fluid core stream position control |
US7016022B2 (en) * | 2000-08-02 | 2006-03-21 | Honeywell International Inc. | Dual use detectors for flow cytometry |
US20060263888A1 (en) * | 2000-06-02 | 2006-11-23 | Honeywell International Inc. | Differential white blood count on a disposable card |
US7262838B2 (en) * | 2001-06-29 | 2007-08-28 | Honeywell International Inc. | Optical detection system for flow cytometry |
US8383043B2 (en) * | 2004-05-14 | 2013-02-26 | Honeywell International Inc. | Analyzer system |
US6970245B2 (en) * | 2000-08-02 | 2005-11-29 | Honeywell International Inc. | Optical alignment detection system |
US7000330B2 (en) * | 2002-08-21 | 2006-02-21 | Honeywell International Inc. | Method and apparatus for receiving a removable media member |
US7277166B2 (en) * | 2000-08-02 | 2007-10-02 | Honeywell International Inc. | Cytometer analysis cartridge optical configuration |
US6382228B1 (en) | 2000-08-02 | 2002-05-07 | Honeywell International Inc. | Fluid driving system for flow cytometry |
US7061595B2 (en) * | 2000-08-02 | 2006-06-13 | Honeywell International Inc. | Miniaturized flow controller with closed loop regulation |
US6729856B2 (en) | 2001-10-09 | 2004-05-04 | Honeywell International Inc. | Electrostatically actuated pump with elastic restoring forces |
US7094040B2 (en) * | 2002-03-27 | 2006-08-22 | Minolta Co., Ltd. | Fluid transferring system and micropump suitable therefor |
US7008193B2 (en) * | 2002-05-13 | 2006-03-07 | The Regents Of The University Of Michigan | Micropump assembly for a microgas chromatograph and the like |
DE10360709A1 (en) * | 2003-12-19 | 2005-10-06 | Bartels Mikrotechnik Gmbh | Micropump and glue-free process for bonding two substrates |
US8828320B2 (en) * | 2004-05-14 | 2014-09-09 | Honeywell International Inc. | Portable sample analyzer cartridge |
US7612871B2 (en) * | 2004-09-01 | 2009-11-03 | Honeywell International Inc | Frequency-multiplexed detection of multiple wavelength light for flow cytometry |
US7630075B2 (en) * | 2004-09-27 | 2009-12-08 | Honeywell International Inc. | Circular polarization illumination based analyzer system |
US20060134510A1 (en) * | 2004-12-21 | 2006-06-22 | Cleopatra Cabuz | Air cell air flow control system and method |
US7222639B2 (en) * | 2004-12-29 | 2007-05-29 | Honeywell International Inc. | Electrostatically actuated gas valve |
US7328882B2 (en) * | 2005-01-06 | 2008-02-12 | Honeywell International Inc. | Microfluidic modulating valve |
US7445017B2 (en) * | 2005-01-28 | 2008-11-04 | Honeywell International Inc. | Mesovalve modulator |
CN101438143B (en) | 2005-04-29 | 2013-06-12 | 霍尼韦尔国际公司 | Cytometer cell counting and size measurement method |
US7320338B2 (en) * | 2005-06-03 | 2008-01-22 | Honeywell International Inc. | Microvalve package assembly |
US8273294B2 (en) * | 2005-07-01 | 2012-09-25 | Honeywell International Inc. | Molded cartridge with 3-D hydrodynamic focusing |
US8034296B2 (en) * | 2005-07-01 | 2011-10-11 | Honeywell International Inc. | Microfluidic card for RBC analysis |
WO2007005974A2 (en) * | 2005-07-01 | 2007-01-11 | Honeywell International, Inc. | A flow metered analyzer |
US7517201B2 (en) * | 2005-07-14 | 2009-04-14 | Honeywell International Inc. | Asymmetric dual diaphragm pump |
US7843563B2 (en) * | 2005-08-16 | 2010-11-30 | Honeywell International Inc. | Light scattering and imaging optical system |
US20070051415A1 (en) * | 2005-09-07 | 2007-03-08 | Honeywell International Inc. | Microvalve switching array |
US7624755B2 (en) * | 2005-12-09 | 2009-12-01 | Honeywell International Inc. | Gas valve with overtravel |
JP5175213B2 (en) * | 2005-12-22 | 2013-04-03 | ハネウェル・インターナショナル・インコーポレーテッド | Portable sample analysis system |
US7523762B2 (en) | 2006-03-22 | 2009-04-28 | Honeywell International Inc. | Modulating gas valves and systems |
US8007704B2 (en) * | 2006-07-20 | 2011-08-30 | Honeywell International Inc. | Insert molded actuator components |
US20080099082A1 (en) * | 2006-10-27 | 2008-05-01 | Honeywell International Inc. | Gas valve shutoff seal |
DE602006009405D1 (en) * | 2006-10-28 | 2009-11-05 | Sensirion Holding Ag | More cell pump |
US7644731B2 (en) * | 2006-11-30 | 2010-01-12 | Honeywell International Inc. | Gas valve with resilient seat |
CN101550925B (en) * | 2008-03-31 | 2014-08-27 | 研能科技股份有限公司 | Fluid transporting device with a plurality of dual-cavity actuating structures |
US20100034704A1 (en) * | 2008-08-06 | 2010-02-11 | Honeywell International Inc. | Microfluidic cartridge channel with reduced bubble formation |
US8037354B2 (en) | 2008-09-18 | 2011-10-11 | Honeywell International Inc. | Apparatus and method for operating a computing platform without a battery pack |
US9557059B2 (en) | 2011-12-15 | 2017-01-31 | Honeywell International Inc | Gas valve with communication link |
US9851103B2 (en) | 2011-12-15 | 2017-12-26 | Honeywell International Inc. | Gas valve with overpressure diagnostics |
US8899264B2 (en) | 2011-12-15 | 2014-12-02 | Honeywell International Inc. | Gas valve with electronic proof of closure system |
US9995486B2 (en) | 2011-12-15 | 2018-06-12 | Honeywell International Inc. | Gas valve with high/low gas pressure detection |
US9074770B2 (en) | 2011-12-15 | 2015-07-07 | Honeywell International Inc. | Gas valve with electronic valve proving system |
US8905063B2 (en) | 2011-12-15 | 2014-12-09 | Honeywell International Inc. | Gas valve with fuel rate monitor |
US9835265B2 (en) | 2011-12-15 | 2017-12-05 | Honeywell International Inc. | Valve with actuator diagnostics |
US9846440B2 (en) | 2011-12-15 | 2017-12-19 | Honeywell International Inc. | Valve controller configured to estimate fuel comsumption |
US8839815B2 (en) | 2011-12-15 | 2014-09-23 | Honeywell International Inc. | Gas valve with electronic cycle counter |
US8947242B2 (en) | 2011-12-15 | 2015-02-03 | Honeywell International Inc. | Gas valve with valve leakage test |
US8741234B2 (en) | 2011-12-27 | 2014-06-03 | Honeywell International Inc. | Disposable cartridge for fluid analysis |
US8741235B2 (en) | 2011-12-27 | 2014-06-03 | Honeywell International Inc. | Two step sample loading of a fluid analysis cartridge |
US8663583B2 (en) | 2011-12-27 | 2014-03-04 | Honeywell International Inc. | Disposable cartridge for fluid analysis |
US8741233B2 (en) | 2011-12-27 | 2014-06-03 | Honeywell International Inc. | Disposable cartridge for fluid analysis |
US10422531B2 (en) | 2012-09-15 | 2019-09-24 | Honeywell International Inc. | System and approach for controlling a combustion chamber |
US9234661B2 (en) | 2012-09-15 | 2016-01-12 | Honeywell International Inc. | Burner control system |
EP2868970B1 (en) | 2013-10-29 | 2020-04-22 | Honeywell Technologies Sarl | Regulating device |
DE102013222283B3 (en) | 2013-11-04 | 2015-01-15 | Robert Bosch Gmbh | Apparatus and method for handling reagents |
US10024439B2 (en) | 2013-12-16 | 2018-07-17 | Honeywell International Inc. | Valve over-travel mechanism |
US20150316047A1 (en) * | 2014-04-30 | 2015-11-05 | Texas Instruments Incorporated | Fluid pump having material displaceable responsive to electrical energy |
CN103925187B (en) * | 2014-05-04 | 2016-03-30 | 吉林大学 | A kind of many oscillator piezoelectric pumps |
US9841122B2 (en) | 2014-09-09 | 2017-12-12 | Honeywell International Inc. | Gas valve with electronic valve proving system |
US9645584B2 (en) | 2014-09-17 | 2017-05-09 | Honeywell International Inc. | Gas valve with electronic health monitoring |
US10503181B2 (en) | 2016-01-13 | 2019-12-10 | Honeywell International Inc. | Pressure regulator |
US10564062B2 (en) | 2016-10-19 | 2020-02-18 | Honeywell International Inc. | Human-machine interface for gas valve |
CN107339228A (en) * | 2017-06-26 | 2017-11-10 | 歌尔股份有限公司 | Miniflow pumping configuration, system and preparation method |
TWI640961B (en) * | 2017-07-10 | 2018-11-11 | 研能科技股份有限公司 | Actuating sensor module |
US11073281B2 (en) | 2017-12-29 | 2021-07-27 | Honeywell International Inc. | Closed-loop programming and control of a combustion appliance |
US10697815B2 (en) | 2018-06-09 | 2020-06-30 | Honeywell International Inc. | System and methods for mitigating condensation in a sensor module |
DE102019004450B4 (en) * | 2019-06-26 | 2024-03-14 | Drägerwerk AG & Co. KGaA | Micropump system and method for guiding a compressible fluid |
TWI806671B (en) * | 2022-06-21 | 2023-06-21 | 中原大學 | Micro blower |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3202324A1 (en) * | 1981-03-12 | 1983-08-04 | Paavo Veikko Dr.Med. 5465 Erpel Klami | Cooled latent heat accumulator for space heating and cooling by means of direct solar energy or indirect solar energy held in the water |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4940010U (en) * | 1972-07-11 | 1974-04-09 | ||
JPS5493205A (en) * | 1977-12-30 | 1979-07-24 | Matsushita Electric Works Ltd | Electrostatic diaphragm pump |
JPS55148989A (en) * | 1979-05-10 | 1980-11-19 | Tsuneo Aoki | Booster |
US4515534A (en) * | 1982-09-30 | 1985-05-07 | Lawless William N | Miniature solid-state gas compressor |
NL8302860A (en) * | 1983-08-15 | 1985-03-01 | Stichting Ct Voor Micro Elektr | PIEZO ELECTRIC MICRO PUMP. |
US4911616A (en) * | 1988-01-19 | 1990-03-27 | Laumann Jr Carl W | Micro miniature implantable pump |
US4938742A (en) * | 1988-02-04 | 1990-07-03 | Smits Johannes G | Piezoelectric micropump with microvalves |
SE8801299L (en) * | 1988-04-08 | 1989-10-09 | Bertil Hoeoek | MICROMECHANICAL ONE-WAY VALVE |
US4923000A (en) * | 1989-03-03 | 1990-05-08 | Microelectronics And Computer Technology Corporation | Heat exchanger having piezoelectric fan means |
-
1989
- 1989-08-07 DE DE3926066A patent/DE3926066A1/en active Granted
-
1990
- 1990-06-23 DE DE90111971T patent/DE69003770T2/en not_active Expired - Lifetime
- 1990-06-23 EP EP90111971A patent/EP0412270B1/en not_active Expired - Lifetime
- 1990-08-03 JP JP2205327A patent/JP2663994B2/en not_active Expired - Fee Related
- 1990-08-03 US US07/562,302 patent/US5078581A/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3202324A1 (en) * | 1981-03-12 | 1983-08-04 | Paavo Veikko Dr.Med. 5465 Erpel Klami | Cooled latent heat accumulator for space heating and cooling by means of direct solar energy or indirect solar energy held in the water |
Non-Patent Citations (2)
Title |
---|
RUSSELL B. SCOTT: "CRYOGENIC ENGENEERING" no. 2055, 1960, D. VAN NOSTRAND COMPANY, INC., PRINCETON, NEW JERSEY, USA * |
SENSOR AND ACTUATORS. vol. 15, no. 2, October 1988, LAUSANNE CH & CO: "A PIEZOELECTRIC MICROPUMP BASED ON MICROMACHINING OF SILICON" * |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0518524A3 (en) * | 1991-05-30 | 1994-07-13 | Hitachi Ltd | Valve and semiconductor fabricating equipment using the same |
EP0518524A2 (en) * | 1991-05-30 | 1992-12-16 | Hitachi, Ltd. | Valve and semiconductor fabricating equipment using the same |
EP0556622A1 (en) * | 1992-01-30 | 1993-08-25 | Terumo Kabushiki Kaisha | Micro-pump and method for production thereof |
US5362213A (en) * | 1992-01-30 | 1994-11-08 | Terumo Kabushiki Kaisha | Micro-pump and method for production thereof |
EP0779436A3 (en) * | 1995-12-13 | 1999-07-28 | Frank T. Hartley | Micromachined peristaltic pump |
EP0779436A2 (en) * | 1995-12-13 | 1997-06-18 | Frank T. Hartley | Micromachined peristaltic pump |
WO1997029538A1 (en) * | 1996-02-10 | 1997-08-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bistable microactuator with coupled membranes |
WO1998014707A1 (en) * | 1996-10-03 | 1998-04-09 | Westonbridge International Limited | Micro-machined device for fluids and method of manufacture |
AU717626B2 (en) * | 1996-10-03 | 2000-03-30 | Debiotech S.A. | Micro-machined device for fluids and method of manufacture |
US6237619B1 (en) | 1996-10-03 | 2001-05-29 | Westonbridge International Limited | Micro-machined device for fluids and method of manufacture |
ES2152763A1 (en) * | 1997-02-28 | 2001-02-01 | Consejo Superior Investigacion | Analysis system integrated state sensing tube consists of a holder of ISFET sensors made of micro machined silicon and glass and glass |
WO1998051929A1 (en) * | 1997-05-12 | 1998-11-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Micromembrane pump |
US6261066B1 (en) | 1997-05-12 | 2001-07-17 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Micromembrane pump |
WO2000023753A1 (en) | 1998-10-19 | 2000-04-27 | The Board Of Trustees Of The University Of Illinois | Active compressor vapor compression cycle integrated heat transfer device |
EP1131587A1 (en) * | 1998-10-19 | 2001-09-12 | Board Of Trustees Of The University Of Illinois | Active compressor vapor compression cycle integrated heat transfer device |
EP1131587A4 (en) * | 1998-10-19 | 2006-08-02 | Univ Illinois | Active compressor vapor compression cycle integrated heat transfer device |
WO2000028215A1 (en) * | 1998-11-06 | 2000-05-18 | Honeywell Inc. | Electrostatically actuated pumping array |
CN1327132C (en) * | 1998-11-06 | 2007-07-18 | 霍尼韦尔有限公司 | Electrostatically actuated pumping array |
CN101520035B (en) * | 2008-02-26 | 2013-03-20 | 研能科技股份有限公司 | Fluid conveying device |
US10563642B2 (en) | 2016-06-20 | 2020-02-18 | The Regents Of The University Of Michigan | Modular stacked variable-compression micropump and method of making same |
Also Published As
Publication number | Publication date |
---|---|
JP2663994B2 (en) | 1997-10-15 |
DE69003770D1 (en) | 1993-11-11 |
DE3926066C2 (en) | 1991-08-22 |
DE69003770T2 (en) | 1994-05-05 |
US5078581A (en) | 1992-01-07 |
EP0412270B1 (en) | 1993-10-06 |
JPH0370884A (en) | 1991-03-26 |
DE3926066A1 (en) | 1991-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0412270B1 (en) | Micromechanical compressor cascade and method of increasing the pressure at extremely low operating pressure | |
US6595006B2 (en) | Miniature reciprocating heat pumps and engines | |
US5749226A (en) | Microminiature stirling cycle cryocoolers and engines | |
US4392362A (en) | Micro miniature refrigerators | |
US5457956A (en) | Microminiature stirling cycle cryocoolers and engines | |
US5367878A (en) | Transient energy release microdevices and methods | |
US20060059921A1 (en) | Miniature thermoacoustic cooler | |
US5186001A (en) | Transient energy release microdevices and methods | |
US20020050148A1 (en) | Thermal management device | |
US6883337B2 (en) | Thermal management device | |
US6385973B1 (en) | Micro-scalable thermal control device | |
EP1653167A2 (en) | Pulse tube cooler with internal mems flow controller | |
CA1170851A (en) | Refrigerators | |
Lerou et al. | Progress in Micro Joule-Thomson Cooling at Twente University | |
Burger et al. | Microcooling: study on the application of micromechanical techniques | |
Nieczkoski et al. | Development of a Novel Brayton‐Cycle Cryocooler and Key Component Technologies | |
Hao et al. | Miniature thermoacoustic cryocooler driven by a vertical comb-drive | |
AU712752B2 (en) | Method for constructing regenerative displacers | |
Thiesen et al. | Miniature reciprocating heat pumps and engines | |
GB2045910A (en) | Miniature cryogenic refrigerator and device and method of making same | |
WO2000007735A2 (en) | Micromachined acoustic ejectors and applications | |
Heiden | Miniature refrigerators for cryoelectronic sensors | |
Hartley | Micromachined peristaltic pump | |
MXPA98002775A (en) | Cycling motors stirling microminiat |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19901213 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB |
|
17Q | First examination report despatched |
Effective date: 19920714 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB |
|
REF | Corresponds to: |
Ref document number: 69003770 Country of ref document: DE Date of ref document: 19931111 |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19950606 Year of fee payment: 6 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Effective date: 19970228 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: IF02 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20030602 Year of fee payment: 14 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040623 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20040623 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20090629 Year of fee payment: 20 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20100623 |