EP0071311A3 - Information card with integrated element - Google Patents

Information card with integrated element Download PDF

Info

Publication number: EP0071311A3
Authority: EP; European Patent Office
Prior art keywords: information card; integrated element; integrated; card; information
Prior art date: 1981-07-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP82200936A

Other languages

German (de)

Other versions

EP0071311B1 (en

EP0071311A2 (en

Inventor

Walter Funk

Matheus Adrianus Theresias Wijburg

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Koninklijke Philips NV

Original Assignee

Philips Patentverwaltung GmbH

Philips Gloeilampenfabrieken NV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-07-31

Filing date

1982-07-22

Publication date

1985-12-11

1982-07-22 Application filed by Philips Patentverwaltung GmbH, Philips Gloeilampenfabrieken NV filed Critical Philips Patentverwaltung GmbH

1983-02-09 Publication of EP0071311A2 publication Critical patent/EP0071311A2/en

1985-12-11 Publication of EP0071311A3 publication Critical patent/EP0071311A3/en

1988-09-21 Application granted granted Critical

1988-09-21 Publication of EP0071311B1 publication Critical patent/EP0071311B1/en

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits

EP82200936A 1981-07-31 1982-07-22 Method of producing contact elements mounted on the connection surfaces of an integrated component Expired EP0071311B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE19818122540U DE8122540U1 (en)	1981-07-31	1981-07-31	"INFORMATION CARD WITH INTEGRATED BLOCK"
DE8122540U		1981-07-31

Publications (3)

Publication Number	Publication Date
EP0071311A2 EP0071311A2 (en)	1983-02-09
EP0071311A3 true EP0071311A3 (en)	1985-12-11
EP0071311B1 EP0071311B1 (en)	1988-09-21

Family

ID=6730003

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP82200936A Expired EP0071311B1 (en)	1981-07-31	1982-07-22	Method of producing contact elements mounted on the connection surfaces of an integrated component

Country Status (3)

Country	Link
EP (1)	EP0071311B1 (en)
JP (1)	JPS5831548A (en)
DE (2)	DE8122540U1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
ES8607594A1 (en) *	1983-12-06	1986-05-16	Mars Inc	Tokens and token handling devices.
NL8401619A (en) *	1984-05-21	1985-12-16	Philips Nv	ELECTRONIC MICROCIRCUIT WITH CONTACT INCREASES.
JPS61123990A (en) *	1984-11-05	1986-06-11	Casio Comput Co Ltd	Ic card
JPH074995B2 (en) *	1986-05-20	1995-01-25	株式会社東芝	IC card and method of manufacturing the same
FR2599165A1 (en) *	1986-05-21	1987-11-27	Michot Gerard	OBJECT ASSOCIATED WITH ELECTRONIC ELEMENT AND METHOD OF OBTAINING
JPS62290592A (en) *	1986-06-11	1987-12-17	大日本印刷株式会社	Manufacture of ic module for incorporating card
JPS63131561A (en) *	1986-11-18	1988-06-03	インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン	Electronic package
DE3912893A1 (en) *	1989-04-19	1990-10-25	Siemens Ag	Semiconductor module as micro-pack assembly - has rear contact forming substrate terminal on side from circuit board contacts
US5272596A (en) *	1991-06-24	1993-12-21	At&T Bell Laboratories	Personal data card fabricated from a polymer thick-film circuit
DE9113601U1 (en) *	1991-10-31	1993-03-04	Schneider, Edgar, 8057 Guenzenhausen, De
DE4424396C2 (en) *	1994-07-11	1996-12-12	Ibm	Carrier element for installation in chip cards or other data carrier cards
DE19602821C1 (en)	1996-01-26	1997-06-26	Siemens Ag	Method for producing a data card
DE19708617C2 (en) *	1997-03-03	1999-02-04	Siemens Ag	Chip card module and method for its production as well as this comprehensive chip card
DE19918852C1 (en) *	1999-04-26	2000-09-28	Giesecke & Devrient Gmbh	Chip card with flip-chip has chip mounted on foil, insulated by setting material and with electrically conducting protrusions protruding out of setting material, distance and covering foils

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3702464A (en) *	1971-05-04	1972-11-07	Ibm	Information card
US3719981A (en) *	1971-11-24	1973-03-13	Rca Corp	Method of joining solder balls to solder bumps
DE3042085A1 (en) *	1979-11-12	1981-06-04	Hitachi, Ltd., Tokyo	SEMICONDUCTOR BOARD ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS542662A (en) *	1977-06-08	1979-01-10	Seiko Epson Corp	Semiconductor device

1981
- 1981-07-31 DE DE19818122540U patent/DE8122540U1/en not_active Expired
1982
- 1982-07-22 DE DE8282200936T patent/DE3279060D1/en not_active Expired
- 1982-07-22 EP EP82200936A patent/EP0071311B1/en not_active Expired
- 1982-07-29 JP JP57131325A patent/JPS5831548A/en active Pending

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3702464A (en) *	1971-05-04	1972-11-07	Ibm	Information card
US3719981A (en) *	1971-11-24	1973-03-13	Rca Corp	Method of joining solder balls to solder bumps
DE3042085A1 (en) *	1979-11-12	1981-06-04	Hitachi, Ltd., Tokyo	SEMICONDUCTOR BOARD ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
RCA TECHNICAL NOTES, TN No.: 1175, 16. Februar 1977, Seiten 1-2, Princeton, NJ, US; E. MYKIETYN et al.: "A compressible pillar for flip-chip thermocompression bonding" *

Also Published As

Publication number	Publication date
JPS5831548A (en)	1983-02-24
EP0071311B1 (en)	1988-09-21
EP0071311A2 (en)	1983-02-09
DE8122540U1 (en)	1983-01-13
DE3279060D1 (en)	1988-10-27

Legal Events

Date	Code	Title	Description
1982-12-10	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1983-02-09	17P	Request for examination filed	Effective date: 19820722
1983-02-09	AK	Designated contracting states	Designated state(s): DE FR GB IT NL
1985-10-08	PUAL	Search report despatched	Free format text: ORIGINAL CODE: 0009013
1985-12-11	AK	Designated contracting states	Designated state(s): DE FR GB IT NL
1987-07-08	17Q	First examination report despatched	Effective date: 19870525
1987-09-16	RAP1	Party data changed (applicant data changed or rights of an application transferred)	Owner name: N.V. PHILIPS' GLOEILAMPENFABRIEKEN Owner name: PHILIPS PATENTVERWALTUNG GMBH
1988-08-06	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
1988-09-21	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): DE FR GB IT NL
1988-10-27	REF	Corresponds to:	Ref document number: 3279060 Country of ref document: DE Date of ref document: 19881027
1988-11-09	ITF	It: translation for a ep patent filed	Owner name: ING. C. GREGORJ S.P.A.
1988-12-23	ET	Fr: translation filed
1989-01-25	GBT	Gb: translation of ep patent filed (gb section 77(6)(a)/1977)
1989-07-18	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
1989-07-18	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
1989-09-06	26N	No opposition filed
1990-07-31	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: NL Payment date: 19900731 Year of fee payment: 9
1992-02-01	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: NL Effective date: 19920201
1992-03-16	NLV4	Nl: lapsed or anulled due to non-payment of the annual fee
1993-07-31	ITTA	It: last paid annual fee
1995-04-19	ITPR	It: changes in ownership of a european patent	Owner name: CAMBIO RAGIONE SOCIALE;PHILIPS ELECTRONICS N.V.
1995-06-09	REG	Reference to a national code	Ref country code: FR Ref legal event code: CD
1998-09-18	REG	Reference to a national code	Ref country code: FR Ref legal event code: CD
2001-07-25	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: FR Payment date: 20010725 Year of fee payment: 20
2001-07-31	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: GB Payment date: 20010731 Year of fee payment: 20
2001-09-19	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: DE Payment date: 20010919 Year of fee payment: 20
2002-01-01	REG	Reference to a national code	Ref country code: GB Ref legal event code: IF02
2002-07-21	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GB Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20020721
2002-08-14	REG	Reference to a national code	Ref country code: GB Ref legal event code: PE20 Effective date: 20020721

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GB2095175B (en)	1984-11-21	An identification card having an ic-module
EP0079047A3 (en)	1986-03-26	Identification card
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