DE69927996D1 - Scharfe, orientierte presskontaktspitze - Google Patents

Scharfe, orientierte presskontaktspitze

Info

Publication number
DE69927996D1
DE69927996D1 DE69927996T DE69927996T DE69927996D1 DE 69927996 D1 DE69927996 D1 DE 69927996D1 DE 69927996 T DE69927996 T DE 69927996T DE 69927996 T DE69927996 T DE 69927996T DE 69927996 D1 DE69927996 D1 DE 69927996D1
Authority
DE
Germany
Prior art keywords
sharp
contact point
press contact
oriented press
oriented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69927996T
Other languages
English (en)
Other versions
DE69927996T2 (de
Inventor
N Eldridge
W Grube
Y Khandros
Alec Madsen
L Mathieu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22698665&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69927996(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by FormFactor Inc filed Critical FormFactor Inc
Application granted granted Critical
Publication of DE69927996D1 publication Critical patent/DE69927996D1/de
Publication of DE69927996T2 publication Critical patent/DE69927996T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
DE69927996T 1998-11-10 1999-11-10 Scharfe, orientierte druckkontaktspitze Expired - Lifetime DE69927996T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US189761 1998-11-10
US09/189,761 US6441315B1 (en) 1998-11-10 1998-11-10 Contact structures with blades having a wiping motion
PCT/US1999/026787 WO2000028625A1 (en) 1998-11-10 1999-11-10 Sharpened, oriented contact tip structures

Publications (2)

Publication Number Publication Date
DE69927996D1 true DE69927996D1 (de) 2005-12-01
DE69927996T2 DE69927996T2 (de) 2006-07-27

Family

ID=22698665

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69927996T Expired - Lifetime DE69927996T2 (de) 1998-11-10 1999-11-10 Scharfe, orientierte druckkontaktspitze

Country Status (9)

Country Link
US (4) US6441315B1 (de)
EP (2) EP1129510B1 (de)
JP (3) JP3902729B2 (de)
KR (1) KR100370720B1 (de)
CN (2) CN1127781C (de)
AU (1) AU1913000A (de)
DE (1) DE69927996T2 (de)
TW (1) TW588483B (de)
WO (1) WO2000028625A1 (de)

Families Citing this family (123)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US7063541B2 (en) * 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6441315B1 (en) * 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
US6933738B2 (en) * 2001-07-16 2005-08-23 Formfactor, Inc. Fiducial alignment marks on microelectronic spring contacts
US7182672B2 (en) * 2001-08-02 2007-02-27 Sv Probe Pte. Ltd. Method of probe tip shaping and cleaning
WO2003052435A1 (en) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Membrane probing system
US7010854B2 (en) * 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US20060006888A1 (en) * 2003-02-04 2006-01-12 Microfabrica Inc. Electrochemically fabricated microprobes
US7531077B2 (en) 2003-02-04 2009-05-12 Microfabrica Inc. Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US20060238209A1 (en) * 2002-05-07 2006-10-26 Microfabrica Inc. Vertical microprobes for contacting electronic components and method for making such probes
US20060051948A1 (en) * 2003-02-04 2006-03-09 Microfabrica Inc. Microprobe tips and methods for making
US20060053625A1 (en) * 2002-05-07 2006-03-16 Microfabrica Inc. Microprobe tips and methods for making
US7412767B2 (en) * 2003-02-04 2008-08-19 Microfabrica, Inc. Microprobe tips and methods for making
US20050184748A1 (en) * 2003-02-04 2005-08-25 Microfabrica Inc. Pin-type probes for contacting electronic circuits and methods for making such probes
US7363705B2 (en) * 2003-02-04 2008-04-29 Microfabrica, Inc. Method of making a contact
US7640651B2 (en) * 2003-12-31 2010-01-05 Microfabrica Inc. Fabrication process for co-fabricating multilayer probe array and a space transformer
US20050104609A1 (en) * 2003-02-04 2005-05-19 Microfabrica Inc. Microprobe tips and methods for making
US7273812B2 (en) * 2002-05-07 2007-09-25 Microfabrica Inc. Microprobe tips and methods for making
US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
US6992399B2 (en) * 2002-05-24 2006-01-31 Northrop Grumman Corporation Die connected with integrated circuit component for electrical signal passing therebetween
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US9244101B2 (en) * 2003-02-04 2016-01-26 University Of Southern California Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
US8613846B2 (en) * 2003-02-04 2013-12-24 Microfabrica Inc. Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US20080157793A1 (en) * 2003-02-04 2008-07-03 Microfabrica Inc. Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes
US20080211524A1 (en) * 2003-02-04 2008-09-04 Microfabrica Inc. Electrochemically Fabricated Microprobes
EP1609206B1 (de) 2003-03-04 2010-07-28 Rohm and Haas Electronic Materials, L.L.C. Koaxiale wellenleitermikrostrukturen und verfahern zu ihrer bildung
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
DE10318223A1 (de) * 2003-04-22 2004-12-02 Louis Renner Gmbh Kontaktstück aus Wolfram mit einer korrosionshemmenden Schicht aus Unedelmetall
US6965245B2 (en) 2003-05-01 2005-11-15 K&S Interconnect, Inc. Prefabricated and attached interconnect structure
US9671429B2 (en) 2003-05-07 2017-06-06 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP2007517231A (ja) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド アクティブ・ウェハプローブ
US10641792B2 (en) 2003-12-31 2020-05-05 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US20080108221A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Microprobe Tips and Methods for Making
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US7733101B2 (en) * 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US7172431B2 (en) * 2004-08-27 2007-02-06 International Business Machines Corporation Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof
DE202005021435U1 (de) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7161346B2 (en) * 2005-05-23 2007-01-09 Electro Scientific Industries, Inc. Method of holding an electronic component in a controlled orientation during parametric testing
US7245135B2 (en) * 2005-08-01 2007-07-17 Touchdown Technologies, Inc. Post and tip design for a probe contact
US7877866B1 (en) 2005-10-26 2011-02-01 Second Sight Medical Products, Inc. Flexible circuit electrode array and method of manufacturing the same
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US7528618B2 (en) * 2006-05-02 2009-05-05 Formfactor, Inc. Extended probe tips
US7444253B2 (en) * 2006-05-09 2008-10-28 Formfactor, Inc. Air bridge structures and methods of making and using air bridge structures
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7836587B2 (en) * 2006-09-21 2010-11-23 Formfactor, Inc. Method of repairing a contactor apparatus
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US7656256B2 (en) 2006-12-30 2010-02-02 Nuvotronics, PLLC Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof
JP5123533B2 (ja) * 2007-02-01 2013-01-23 株式会社日本マイクロニクス 通電試験用プローブおよびその製造方法
KR101593686B1 (ko) 2007-03-20 2016-02-12 누보트로닉스, 엘.엘.씨 일체화된 전자 요소들 및 이들의 형성 방법
EP1973189B1 (de) 2007-03-20 2012-12-05 Nuvotronics, LLC Mikrostrukturen einer koaxialen Übertragungsleitung und Herstellungsverfahren dafür
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
WO2009084770A1 (en) 2007-12-28 2009-07-09 Phicom Corporation Contact tip structure of a connecting element
KR200452208Y1 (ko) * 2008-05-02 2011-02-14 임송재 헤어밴드
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US8282428B2 (en) * 2008-06-12 2012-10-09 Multitest Elektronische Systeme Gmbh Contact base
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP2010212091A (ja) * 2009-03-10 2010-09-24 Alps Electric Co Ltd 弾性接触子
JP5333029B2 (ja) * 2009-08-10 2013-11-06 Ｊｓｒ株式会社 電気接続部材および電気接続部材の製造方法
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
TWI534432B (zh) 2010-09-07 2016-05-21 瓊斯科技國際公司 用於微電路測試器之電氣傳導針腳
CN102013617B (zh) * 2010-10-21 2015-10-07 昆山德力康电子科技有限公司 一种连接器插针切尖角机
JP5798315B2 (ja) 2010-11-19 2015-10-21 株式会社神戸製鋼所 コンタクトプローブピン
DE102011016294B4 (de) 2011-04-07 2013-09-12 Kathrein-Werke Kg Dachantenne, insbesondere Kraftfahrzeug-Dachantenne mit zugehöriger Steckverbindungseinrichtung
US9244099B2 (en) 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
CN102353480B (zh) * 2011-07-12 2013-05-08 北京邮电大学 一种法向压力施加装置
EP2731783A4 (de) 2011-07-13 2016-03-09 Nuvotronics Llc Verfahren zur herstellung von elektronischen und mechanischen strukturen
JP2013101043A (ja) * 2011-11-08 2013-05-23 Renesas Electronics Corp 半導体装置の製造方法
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
EP3066480B1 (de) * 2013-11-07 2018-02-28 Heraeus Deutschland GmbH & Co. KG Prüfnadel und verfahren zur herstellung einer prüfnadel
US9726691B2 (en) 2014-01-07 2017-08-08 International Business Machines Corporation 3D chip testing through micro-C4 interface
US10310009B2 (en) * 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
US9252138B2 (en) * 2014-05-27 2016-02-02 General Electric Company Interconnect devices for electronic packaging assemblies
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
WO2016094129A1 (en) 2014-12-03 2016-06-16 Nuvotronics, Inc. Systems and methods for manufacturing stacked circuits and transmission lines
US10068181B1 (en) 2015-04-27 2018-09-04 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafer and methods for making the same
EP3322667A4 (de) 2015-07-14 2019-03-27 Georgia Tech Research Corporation Mechanisch flexible verbindungen, verfahren zur herstellung davon und verfahren zur verwendung
US10114042B2 (en) 2016-02-05 2018-10-30 Texas Instruments Incorporated Vertical probe card
US10336958B2 (en) * 2016-08-30 2019-07-02 Resinate Materials Group, Inc. Sustainable base oils for lubricants
WO2018060922A1 (en) * 2016-09-29 2018-04-05 3M Innovative Properties Company Connector assembly for solderless mounting to a circuit board
US11262384B2 (en) 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
WO2018131321A1 (ja) * 2017-01-13 2018-07-19 アルプス電気株式会社 圧接コネクタ
DE102017002150A1 (de) * 2017-03-06 2018-09-06 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Kontaktelement
US11121301B1 (en) 2017-06-19 2021-09-14 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafers and their methods of manufacture
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
US10775414B2 (en) 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) * 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape

Family Cites Families (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3781681A (en) * 1971-12-17 1973-12-25 Ibm Test probe apparatus
US3881799A (en) * 1972-09-11 1975-05-06 George H Elliott Resilient multi-micro point metallic junction
US3806801A (en) * 1972-12-26 1974-04-23 Ibm Probe contactor having buckling beam probes
US3851249A (en) 1973-06-04 1974-11-26 Electroglass Inc Microcircuit test device with multi-axes probe control and probe stop means
JPS6010298B2 (ja) 1974-07-24 1985-03-16 キヤノン株式会社 無孔ロ−ルフイルム使用の電動式フイルム送りカメラの作動装置
US4295184A (en) * 1978-08-21 1981-10-13 Advanced Circuit Technology Circuit board with self-locking terminals
US4251772A (en) 1978-12-26 1981-02-17 Pacific Western Systems Inc. Probe head for an automatic semiconductive wafer prober
JPS55111970A (en) 1979-02-21 1980-08-29 Ricoh Co Ltd Developing method
US4329642A (en) * 1979-03-09 1982-05-11 Siliconix, Incorporated Carrier and test socket for leadless integrated circuit
US4220383A (en) * 1979-04-06 1980-09-02 Amp Incorporated Surface to surface connector
JPS6010298Y2 (ja) * 1982-05-07 1985-04-09 株式会社日立製作所 印刷配線板用電気コネクタの雌コンタクト
JPS5988860A (ja) 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd 金属リ−ドへの金属突起物形成方法
JPS6010298A (ja) 1983-06-29 1985-01-19 富士通株式会社 音声メツセ−ジ長予測方式
US4553192A (en) 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US4618821A (en) 1983-09-19 1986-10-21 Lenz Seymour S Test probe assembly for microelectronic circuits
JPS60109272U (ja) * 1983-12-27 1985-07-24 山一電機工業株式会社 ピン端子用接触子
US4636722A (en) 1984-05-21 1987-01-13 Probe-Rite, Inc. High density probe-head with isolated and shielded transmission lines
JPS6119770A (ja) 1984-07-04 1986-01-28 Nippon Steel Corp 溶射被膜製造方法
JPS6149432A (ja) * 1984-08-18 1986-03-11 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
FR2587549B1 (fr) 1985-09-13 1988-03-04 Radiotechnique Systeme d'interconnexion
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4647392A (en) 1985-12-27 1987-03-03 Texaco Inc. Monobasic-dibasic acid/salt antifreeze corrosion inhibitor
JPS62160373A (ja) 1986-01-09 1987-07-16 三菱重工業株式会社 廃船利用式屋内工場形成方法
JPH0411346Y2 (de) * 1986-03-28 1992-03-19
JPS6348063A (ja) 1986-08-15 1988-02-29 Tokyo Electric Co Ltd フアクシミリ装置
JP2784570B2 (ja) 1987-06-09 1998-08-06 日本テキサス・インスツルメンツ 株式会社 ソケツト
US5225771A (en) * 1988-05-16 1993-07-06 Dri Technology Corp. Making and testing an integrated circuit using high density probe points
US5103557A (en) 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
US4937653A (en) * 1988-07-21 1990-06-26 American Telephone And Telegraph Company Semiconductor integrated circuit chip-to-chip interconnection scheme
DE3838413A1 (de) 1988-11-12 1990-05-17 Mania Gmbh Adapter fuer elektronische pruefvorrichtungen fuer leiterplatten und dergl.
US5075621A (en) 1988-12-19 1991-12-24 International Business Machines Corporation Capacitor power probe
US4916002A (en) * 1989-01-13 1990-04-10 The Board Of Trustees Of The Leland Jr. University Microcasting of microminiature tips
DE4012839B4 (de) 1989-04-26 2004-02-26 Atg Test Systems Gmbh & Co.Kg Verfahren und Prüfvorrichtung zum Prüfen von elektrischen oder elektronischen Prüflingen
US4980638A (en) 1989-05-26 1990-12-25 Dermon John A Microcircuit probe and method for manufacturing same
US5580827A (en) 1989-10-10 1996-12-03 The Board Of Trustees Of The Leland Stanford Junior University Casting sharpened microminiature tips
US4965865A (en) * 1989-10-11 1990-10-23 General Signal Corporation Probe card for integrated circuit chip
US5070297A (en) * 1990-06-04 1991-12-03 Texas Instruments Incorporated Full wafer integrated circuit testing device
JP2928592B2 (ja) 1990-06-20 1999-08-03 株式会社日立製作所 半導体ｌｓｉ検査装置用プローブヘッドの製造方法および検査装置
US5090118A (en) 1990-07-31 1992-02-25 Texas Instruments Incorporated High performance test head and method of making
US6037785A (en) 1990-09-20 2000-03-14 Higgins; H. Dan Probe card apparatus
US5521518A (en) * 1990-09-20 1996-05-28 Higgins; H. Dan Probe card apparatus
US5148103A (en) 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
JPH04214650A (ja) 1990-12-12 1992-08-05 Nec Kyushu Ltd オートハンドラ用接触子
US5092782A (en) 1991-02-01 1992-03-03 Beaman Brian S Integral elastomeric card edge connector
US5172050A (en) 1991-02-15 1992-12-15 Motorola, Inc. Micromachined semiconductor probe card
US5092783A (en) * 1991-05-16 1992-03-03 Motorola, Inc. RF interconnect
US6340894B1 (en) * 1991-06-04 2002-01-22 Micron Technology, Inc. Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect
DE4118312C2 (de) * 1991-06-04 1995-03-09 Amphenol Tuchel Elect Kontaktsatz für eine Kontaktzonen aufweisende Karte
US6219908B1 (en) 1991-06-04 2001-04-24 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
KR940001809B1 (ko) * 1991-07-18 1994-03-09 금성일렉트론 주식회사 반도체 칩의 테스터
US5177438A (en) 1991-08-02 1993-01-05 Motorola, Inc. Low resistance probe for semiconductor
US5152695A (en) * 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
US5230632A (en) 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
US5228861A (en) 1992-06-12 1993-07-20 Amp Incorporated High density electrical connector system
JPH0618555A (ja) 1992-06-30 1994-01-25 Meisei Denshi Kogyo Kk マイクロスプリングコンタクト、マイクロスプリングコンタクトの集合体、該マイクロスプリングコンタクトの集合体からなる電気的接続用端子及びマイクロスプリングコンタクトの製造方法
JP3218414B2 (ja) 1992-07-15 2001-10-15 キヤノン株式会社 微小ティップ及びその製造方法、並びに該微小ティップを用いたプローブユニット及び情報処理装置
US5599194A (en) 1992-08-18 1997-02-04 Enplas Corporation IC socket and its contact pin
JPH06119770A (ja) 1992-08-18 1994-04-28 Sony Corp 防振機構
US5259769A (en) 1992-09-29 1993-11-09 Molex Incorporated Electrical connector with preloaded spring-like terminal with improved wiping action
US5297967A (en) * 1992-10-13 1994-03-29 International Business Machines Corporation Electrical interconnector with helical contacting portion and assembly using same
EP0615131A1 (de) 1993-03-10 1994-09-14 Co-Operative Facility For Aging Tester Development Sonde für Halbleiterscheiben mit integrierten Schaltelementen
DE4310349C2 (de) 1993-03-30 2000-11-16 Inst Mikrotechnik Mainz Gmbh Sensorkopf und Verfahren zu seiner Herstellung
US5395253A (en) * 1993-04-29 1995-03-07 Hughes Aircraft Company Membrane connector with stretch induced micro scrub
US5412866A (en) * 1993-07-01 1995-05-09 Hughes Aircraft Company Method of making a cast elastomer/membrane test probe assembly
US5326428A (en) * 1993-09-03 1994-07-05 Micron Semiconductor, Inc. Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
JPH0794252A (ja) * 1993-09-20 1995-04-07 Texas Instr Japan Ltd ソケット
US5806181A (en) * 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US5974662A (en) 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US5583445A (en) * 1994-02-04 1996-12-10 Hughes Aircraft Company Opto-electronic membrane probe
US5462440A (en) 1994-03-11 1995-10-31 Rothenberger; Richard E. Micro-power connector
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
JPH07333232A (ja) 1994-06-13 1995-12-22 Canon Inc 探針を有するカンチレバーの形成方法
US5506515A (en) * 1994-07-20 1996-04-09 Cascade Microtech, Inc. High-frequency probe tip assembly
US5476818A (en) 1994-08-19 1995-12-19 Motorola, Inc. Semiconductor structure and method of manufacture
JPH0878110A (ja) 1994-08-29 1996-03-22 Whitaker Corp:The 電気コネクタ
EP0707214A3 (de) * 1994-10-14 1997-04-16 Hughes Aircraft Co Multiport-Membranfühler zum Testen vollständiger Wafer
US5611696A (en) * 1994-12-14 1997-03-18 International Business Machines Corporation High density and high current capacity pad-to-pad connector comprising of spring connector elements (SCE)
US5773986A (en) * 1995-04-03 1998-06-30 Motorola, Inc Semiconductor wafer contact system and method for contacting a semiconductor wafer
EP0742682B1 (de) * 1995-05-12 2005-02-23 STMicroelectronics, Inc. IC-Packungsfassungssystem mit niedrigem Profil
US6002266A (en) * 1995-05-23 1999-12-14 Digital Equipment Corporation Socket including centrally distributed test tips for testing unpackaged singulated die
KR100252457B1 (ko) 1995-05-26 2000-04-15 이고르 와이. 칸드로스 캔틸레버 요소및 희생기층을 사용하는 상호 접속요소의 제작방법
US5506499A (en) * 1995-06-05 1996-04-09 Neomagic Corp. Multiple probing of an auxilary test pad which allows for reliable bonding to a primary bonding pad
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
JP3611637B2 (ja) 1995-07-07 2005-01-19 ヒューレット・パッカード・カンパニー 回路部材の電気接続構造
US5642054A (en) * 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
US5573435A (en) 1995-08-31 1996-11-12 The Whitaker Corporation Tandem loop contact for an electrical connector
US5655913A (en) * 1995-09-26 1997-08-12 Motorola, Inc. Electrical interconnect contact
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5883519A (en) * 1996-02-23 1999-03-16 Kinetic Probe, Llc Deflection device
US5869974A (en) * 1996-04-01 1999-02-09 Micron Technology, Inc. Micromachined probe card having compliant contact members for testing semiconductor wafers
JP3022312B2 (ja) 1996-04-15 2000-03-21 日本電気株式会社 プローブカードの製造方法
US5838161A (en) * 1996-05-01 1998-11-17 Micron Technology, Inc. Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect
WO1997043654A1 (en) 1996-05-17 1997-11-20 Formfactor, Inc. Microelectronic spring contact elements
EP0839322B1 (de) 1996-05-17 2005-08-10 Formfactor, Inc. Mikroelektronische kontaktstruktur und herstellungsverfahren dazu
TW341747B (en) 1996-05-17 1998-10-01 Formfactor Inc Techniques of fabricating interconnection elements and tip structures for same using sacrificial substrates
JP3233195B2 (ja) * 1996-07-02 2001-11-26 信越ポリマー株式会社 半導体素子検査用ソケット
US5764486A (en) * 1996-10-10 1998-06-09 Hewlett Packard Company Cost effective structure and method for interconnecting a flip chip with a substrate
US6037786A (en) * 1996-12-13 2000-03-14 International Business Machines Corporation Testing integrated circuit chips
US5952840A (en) * 1996-12-31 1999-09-14 Micron Technology, Inc. Apparatus for testing semiconductor wafers
US5861759A (en) 1997-01-29 1999-01-19 Tokyo Electron Limited Automatic probe card planarization system
US6060891A (en) * 1997-02-11 2000-05-09 Micron Technology, Inc. Probe card for semiconductor wafers and method and system for testing wafers
US5894161A (en) * 1997-02-24 1999-04-13 Micron Technology, Inc. Interconnect with pressure sensing mechanism for testing semiconductor wafers
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US5962921A (en) * 1997-03-31 1999-10-05 Micron Technology, Inc. Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps
KR100577131B1 (ko) 1997-05-15 2006-05-10 폼팩터, 인크. 초소형 전자 요소 접촉 구조물과 그 제조 및 사용 방법
US6040702A (en) * 1997-07-03 2000-03-21 Micron Technology, Inc. Carrier and system for testing bumped semiconductor components
JPH1138041A (ja) * 1997-07-24 1999-02-12 Mitsubishi Electric Corp プローブカード用片持ち型プローブ針とその製造方法ならびに制御方法
US6059982A (en) 1997-09-30 2000-05-09 International Business Machines Corporation Micro probe assembly and method of fabrication
US5859128A (en) * 1997-10-30 1999-01-12 E. I. Du Pont De Nemours And Company Modified cationic starch composition for removing particles from aqueous dispersions
US6028436A (en) * 1997-12-02 2000-02-22 Micron Technology, Inc. Method for forming coaxial silicon interconnects
US6114221A (en) * 1998-03-16 2000-09-05 International Business Machines Corporation Method and apparatus for interconnecting multiple circuit chips
US6008982A (en) * 1998-05-20 1999-12-28 General Motors Corporation Low profile electrical distribution center and method of making a bus subassembly therefor
US6256882B1 (en) * 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6031282A (en) 1998-08-27 2000-02-29 Advantest Corp. High performance integrated circuit chip package
US6184576B1 (en) * 1998-09-21 2001-02-06 Advantest Corp. Packaging and interconnection of contact structure
US6441315B1 (en) 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6759858B2 (en) * 1999-10-20 2004-07-06 Intel Corporation Integrated circuit test probe having ridge contact
JP2003520454A (ja) * 2000-01-20 2003-07-02 グリフィクス インコーポレーティッド フレキシブルなコンプライアンス相互連結アセンブリ
JP4214650B2 (ja) 2000-02-08 2009-01-28 トヨタ車体株式会社 車両用回転シート
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
JP2002082130A (ja) * 2000-09-06 2002-03-22 Hitachi Ltd 半導体素子検査装置及びその製造方法
JP2002343478A (ja) * 2001-05-16 2002-11-29 Tyco Electronics Amp Kk 電気コンタクトおよびそれを用いた電気接続部材
USRE43503E1 (en) * 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US20060038576A1 (en) * 2004-08-19 2006-02-23 Pooya Tadayon Sort interface unit having probe capacitors

Also Published As

Publication number Publication date
US20100323551A1 (en) 2010-12-23
US20030015347A1 (en) 2003-01-23
CN1127781C (zh) 2003-11-12
CN100470946C (zh) 2009-03-18
US6825422B2 (en) 2004-11-30
EP1129510B1 (de) 2005-10-26
EP1641082A2 (de) 2006-03-29
JP2004139992A (ja) 2004-05-13
WO2000028625A1 (en) 2000-05-18
DE69927996T2 (de) 2006-07-27
US9030222B2 (en) 2015-05-12
AU1913000A (en) 2000-05-29
TW588483B (en) 2004-05-21
EP1129510A1 (de) 2001-09-05
US20040177499A1 (en) 2004-09-16
EP1641082A3 (de) 2008-12-31
KR20010090835A (ko) 2001-10-19
CN1325553A (zh) 2001-12-05
JP2010073698A (ja) 2010-04-02
US6441315B1 (en) 2002-08-27
KR100370720B1 (ko) 2003-02-05
JP3902729B2 (ja) 2007-04-11
JP4493317B2 (ja) 2010-06-30
CN1497794A (zh) 2004-05-19
JP2002529903A (ja) 2002-09-10

Similar Documents

Publication Publication Date Title
DE69927996D1 (de) Scharfe, orientierte presskontaktspitze
DE69902758T2 (de) 2-(purin-9-yl)-tetrahydrofuran-3,4-diol-derivative
IT1307994B1 (it) Dispositivo risponditore.
ID28874A (id) Inhibitor fosfodiesterase 4 turunan ftalazina.
NL1010854C2 (nl) Bedieningscilinder.
DE69906149D1 (de) 4,5-azolo-oxindole
BR0100407B1 (pt) eixo embreÁvel, de baixa inÉrcia, para transmissÕes.
DE29811048U1 (de) Pressenanordnung
BR9805877B1 (pt) contato elétrico.
ES1047158Y (es) Dispositivo para encofrar, mejorado.
BR9916607B1 (pt) eletrodo para dispositivo emissor de elÉtrons.
ES1040701Y (es) Prensa emboladora cepilladora.
ES1039765Y (es) Prensa neumatica perfeccionada.
ES1042648Y (es) Portarrollos perfeccionado.
ES1042814Y (es) Prensa.
ES1047441Y (es) Prensa neumatica perfeccionada.
ES1040504Y (es) Dispositivo para la sujecion de prendas.
IT1288132B1 (it) Sonda intraoperatoria, in particolare per le osservazioni per contatto diretto.
ITBO980193A0 (it) Erogatore termico operante per contatto epidermico.
DE29814794U1 (de) Prägepresse
IT245460Y1 (it) Orecchino per ornamento personale a doppia faccia, mediantecapovolgimento nella sua applicazione.
IT245087Y1 (it) Passalaccio perfezionato, particolarmente per calzature.
ITBO990138A0 (it) Pressa .
ES1040017Y (es) Llana perfeccionada.
ES1041804Y (es) Camilla articulada para masajes, mejorada.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition