DE69910848D1 - Adapter kit zur erweiterung eines keilschlosses in einem kartenmodul - Google Patents

Adapter kit zur erweiterung eines keilschlosses in einem kartenmodul

Info

Publication number
DE69910848D1
DE69910848D1 DE69910848T DE69910848T DE69910848D1 DE 69910848 D1 DE69910848 D1 DE 69910848D1 DE 69910848 T DE69910848 T DE 69910848T DE 69910848 T DE69910848 T DE 69910848T DE 69910848 D1 DE69910848 D1 DE 69910848D1
Authority
DE
Germany
Prior art keywords
extensing
card module
wedge lock
adapter kit
adapter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69910848T
Other languages
English (en)
Other versions
DE69910848T2 (de
Inventor
D Habing
A Odegard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Publication of DE69910848D1 publication Critical patent/DE69910848D1/de
Application granted granted Critical
Publication of DE69910848T2 publication Critical patent/DE69910848T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/76—Joints and connections having a cam, wedge, or tapered portion
DE69910848T 1998-12-30 1999-12-20 Adapter kit zur erweiterung eines keilschlosses in einem kartenmodul Expired - Fee Related DE69910848T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US223289 1998-12-30
US09/223,289 US6212075B1 (en) 1998-12-30 1998-12-30 Adapter kit to allow extended width wedgelock for use in a circuit card module
PCT/US1999/030458 WO2000041450A1 (en) 1998-12-30 1999-12-20 Adapter kit to allow extended width wedgelock for use in a circuit card module

Publications (2)

Publication Number Publication Date
DE69910848D1 true DE69910848D1 (de) 2003-10-02
DE69910848T2 DE69910848T2 (de) 2004-07-08

Family

ID=22835869

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69910848T Expired - Fee Related DE69910848T2 (de) 1998-12-30 1999-12-20 Adapter kit zur erweiterung eines keilschlosses in einem kartenmodul

Country Status (7)

Country Link
US (1) US6212075B1 (de)
EP (1) EP1236385B1 (de)
JP (1) JP2003526199A (de)
CA (1) CA2359101A1 (de)
DE (1) DE69910848T2 (de)
IL (1) IL144078A0 (de)
WO (1) WO2000041450A1 (de)

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IL130775A (en) * 1999-07-02 2007-03-08 Elta Systems Ltd Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling
US20030025966A1 (en) * 2001-08-03 2003-02-06 Ross Halgren OSP hardened WDM network
US6795316B2 (en) * 2001-12-21 2004-09-21 Redfern Broadband Networks, Inc. WDM add/drop multiplexer module
WO2003056735A1 (en) * 2001-12-21 2003-07-10 Redfern Broadband Networks, Inc. Improved wdm add/drop multiplexer module
US6873528B2 (en) * 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6721182B1 (en) 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US6768642B2 (en) * 2002-12-16 2004-07-27 Lockheed Martin Corporation VME circuit host card with triple mezzanine configuration
US6678159B1 (en) * 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
US6765798B1 (en) * 2003-06-19 2004-07-20 Curtiss-Wright Controls, Inc. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
US6963490B2 (en) * 2003-11-10 2005-11-08 Honeywell International Inc. Methods and apparatus for conductive cooling of electronic units
US20050213306A1 (en) * 2004-03-25 2005-09-29 Lockheed Martin Corporation Environmental control method and apparatus for electronic device enclosures
US7031167B1 (en) * 2004-11-24 2006-04-18 Elta Systems Ltd. Wedgelock for electronic circuit card module
US7254025B2 (en) * 2005-02-02 2007-08-07 National Instruments Corporation Cooling mechanisms associated with card adapter
US7324336B2 (en) * 2005-09-27 2008-01-29 Lockheed Martin Corporation Flow through cooling assemblies for conduction-cooled circuit modules
US7505251B2 (en) * 2005-10-28 2009-03-17 International Business Machines Corporation Actuation mechanism for mating electronic card interconnect systems
US8703278B2 (en) * 2006-03-28 2014-04-22 Honeywell International Inc. Light weight printed wiring board
US20070253169A1 (en) * 2006-05-01 2007-11-01 Honeywell International Inc. Wedgelock device for increased thermal conductivity of a printed wiring wiring assembly
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis
US7408782B2 (en) * 2007-01-04 2008-08-05 Tellabs Bedford, Inc. Multiple printed circuit board heat transfer guide plates
US20090080163A1 (en) * 2007-05-17 2009-03-26 Lockheed Martin Corporation Printed wiring board assembly
US20090147472A1 (en) * 2007-12-11 2009-06-11 Honeywell International Inc. Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System
US7995346B2 (en) * 2008-03-06 2011-08-09 Northrop Grumman Systems Corporation Ruggedized, self aligning, sliding air seal for removable electronic units
JP4829279B2 (ja) * 2008-08-27 2011-12-07 株式会社東芝 回路ユニットの放熱構造
US7796384B2 (en) * 2008-08-27 2010-09-14 Honeywell International Inc. Hybrid chassis cooling system
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
US8270172B2 (en) * 2010-04-23 2012-09-18 GE Intelligent Platforms Embedded Systems, Inc. Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
US8477500B2 (en) 2010-05-25 2013-07-02 General Electric Company Locking device and method for making the same
JP2012023329A (ja) * 2010-06-14 2012-02-02 Toshiba Corp 基板ユニット及び電子装置
US8233279B2 (en) * 2010-11-04 2012-07-31 Ge Intelligent Platforms, Inc. Wedge lock for use with a single board computer and method of assembling a computer system
US9658000B2 (en) 2012-02-15 2017-05-23 Abaco Systems, Inc. Flexible metallic heat connector
US9417670B2 (en) 2012-08-07 2016-08-16 Lockheed Martin Corporation High power dissipation mezzanine card cooling frame
HUE064183T2 (hu) 2012-10-08 2024-02-28 Bl Technologies Inc Elõre feltöltött teszt szubsztrát LAL-reaktív vegyületek tesztelésére, eljárás azok alkalmazására és eljárás azok elõállítására
GB2529573B (en) 2013-04-29 2017-04-19 Ge Intelligent Platforms Embedded Systems Inc Circuit card assembly with thermal energy removal
US9826662B2 (en) 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
US9426931B2 (en) * 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US10136557B2 (en) 2015-12-04 2018-11-20 General Electric Company Thermal management systems and methods for heat generating electronics
WO2018132079A1 (en) * 2017-01-10 2018-07-19 Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi A cooling system

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GB1326742A (en) 1970-12-31 1973-08-15 Lucas Industries Ltd Mounting arrangement for electrical conductors
GB2103020B (en) 1981-07-30 1985-03-20 Marconi Avionics Clamp arrangements for cooling electrical circuits
JPS59200495A (ja) 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル
US4777561A (en) 1985-03-26 1988-10-11 Hughes Aircraft Company Electronic module with self-activated heat pipe
US4751963A (en) * 1986-07-03 1988-06-21 Hughes Aircraft Company Thermal conductance retainer for electronic printed circuit boards and the like
US4867235A (en) 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
US4879634A (en) * 1987-11-13 1989-11-07 Plessey Overseas Limited Rack mounted circuit board
US4916575A (en) 1988-08-08 1990-04-10 Asten Francis C Van Multiple circuit board module
US4853829A (en) 1988-11-09 1989-08-01 Eaton Corporation Electronic module locking mechanism
JP2760829B2 (ja) 1989-01-13 1998-06-04 株式会社日立製作所 電子基板
US4994937A (en) 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
DE4028003A1 (de) 1990-09-04 1992-03-05 Messerschmitt Boelkow Blohm Klemmelement zur halterung von elektronik-karten
US5253963A (en) 1991-12-11 1993-10-19 Honeywell Inc. Snap together wedgelock
FR2686213B1 (fr) 1992-01-14 1994-05-06 Applications Gles Elect Meca Boitier recepteur de composants electroniques dissipateurs.
US5485353A (en) * 1993-02-26 1996-01-16 Eg&G Birtcher, Inc. Retainer assembly
US5414592A (en) * 1993-03-26 1995-05-09 Honeywell Inc. Heat transforming arrangement for printed wiring boards
US5280411A (en) 1993-05-10 1994-01-18 Southwest Research Institute Packaging for an electronic circuit board
US5482109A (en) 1994-03-15 1996-01-09 E-Systems, Inc. Modular heat exchanger
US5625227A (en) 1995-01-18 1997-04-29 Dell Usa, L.P. Circuit board-mounted IC package cooling apparatus
US5559675A (en) 1995-03-28 1996-09-24 Twinhead International Corp. Computer CPU heat dissipating and protecting device
US5549155A (en) 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
US5892658A (en) * 1998-05-12 1999-04-06 Lockhead Martin Corporation VME eurocard triple printed wiring board single slot module assembly

Also Published As

Publication number Publication date
EP1236385A1 (de) 2002-09-04
CA2359101A1 (en) 2000-07-13
WO2000041450A1 (en) 2000-07-13
IL144078A0 (en) 2002-05-23
DE69910848T2 (de) 2004-07-08
JP2003526199A (ja) 2003-09-02
EP1236385B1 (de) 2003-08-27
US6212075B1 (en) 2001-04-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee