DE69819027D1 - 3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist - Google Patents

3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist

Info

Publication number
DE69819027D1
DE69819027D1 DE69819027T DE69819027T DE69819027D1 DE 69819027 D1 DE69819027 D1 DE 69819027D1 DE 69819027 T DE69819027 T DE 69819027T DE 69819027 T DE69819027 T DE 69819027T DE 69819027 D1 DE69819027 D1 DE 69819027D1
Authority
DE
Germany
Prior art keywords
inspection
optical element
marker plate
transparent marker
electronic pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69819027T
Other languages
English (en)
Other versions
DE69819027T2 (de
Inventor
M Beaty
P Mork
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE69819027D1 publication Critical patent/DE69819027D1/de
Application granted granted Critical
Publication of DE69819027T2 publication Critical patent/DE69819027T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
DE69819027T 1997-05-05 1998-05-04 3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist Expired - Fee Related DE69819027T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US850473 1997-05-05
US08/850,473 US6055054A (en) 1997-05-05 1997-05-05 Three dimensional inspection system
PCT/US1998/008950 WO1998050757A2 (en) 1997-05-05 1998-05-04 Three dimensional inspection system

Publications (2)

Publication Number Publication Date
DE69819027D1 true DE69819027D1 (de) 2003-11-20
DE69819027T2 DE69819027T2 (de) 2004-05-19

Family

ID=25308209

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69819027T Expired - Fee Related DE69819027T2 (de) 1997-05-05 1998-05-04 3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist

Country Status (6)

Country Link
US (1) US6055054A (de)
EP (1) EP1017962B1 (de)
JP (2) JP2002515124A (de)
KR (1) KR20010012293A (de)
DE (1) DE69819027T2 (de)
WO (1) WO1998050757A2 (de)

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DE60027175D1 (de) * 1999-07-13 2006-05-18 Beaty Elwin M Verfahren und apparat für die dreidimensionale inspektion von elektronischen komponenten
US6445518B1 (en) * 2000-11-28 2002-09-03 Semiconductor Technologies & Instruments, Inc. Three dimensional lead inspection system
US6547409B2 (en) * 2001-01-12 2003-04-15 Electroglas, Inc. Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer
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US20030072011A1 (en) * 2001-10-09 2003-04-17 Shirley Lyle G. Method and apparatus for combining views in three-dimensional surface profiling
US20060051086A1 (en) * 2002-11-23 2006-03-09 Michael Schroter Method for photographically recording a cylindrical, especially plate-shaped object
US7340085B2 (en) * 2003-09-03 2008-03-04 Microview Technologies Pte Ltd. Rotating prism component inspection system
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KR101380653B1 (ko) * 2008-06-12 2014-04-04 한미반도체 주식회사 비전검사장비의 비전검사방법
CN102012607B (zh) * 2010-09-29 2011-12-28 卓盈微电子（昆山）有限公司 对柔性线路板成像的装置
JP5854680B2 (ja) * 2011-07-25 2016-02-09 キヤノン株式会社 撮像装置
FR3004571B1 (fr) * 2013-04-11 2015-04-10 Vit Procede de correction d'une image tridimensionnelle d'un circuit electronique
CN117577551A (zh) * 2015-06-05 2024-02-20 科磊股份有限公司 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品
EP3341712B1 (de) * 2015-08-26 2024-04-03 ABB Schweiz AG Multiperspektivische inspektionsvorrichtung für objekte und verfahren dafür
CN105588841A (zh) * 2016-01-28 2016-05-18 浙江工业大学 基于机器视觉的针脚倾斜缺陷检测装置
JP7194055B2 (ja) * 2019-03-22 2022-12-21 日立Astemo株式会社 接合部の検査方法及び接合部の検査装置
CN112985275B (zh) * 2021-05-14 2021-08-20 苏州鼎纳自动化技术有限公司 一种产品内壁尺寸检测机构

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Also Published As

Publication number Publication date
JP2002515124A (ja) 2002-05-21
WO1998050757A3 (en) 2002-01-03
EP1017962B1 (de) 2003-10-15
US6055054A (en) 2000-04-25
JP2009156877A (ja) 2009-07-16
EP1017962A4 (de) 2000-07-26
EP1017962A2 (de) 2000-07-12
JP4901903B2 (ja) 2012-03-21
DE69819027T2 (de) 2004-05-19
KR20010012293A (ko) 2001-02-15
WO1998050757A2 (en) 1998-11-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee