DE69812425T2 - Programmierbare metallisierungsstruktur mit oberflächennaher verfestigung undherstellungsverfahren dafür - Google Patents

Programmierbare metallisierungsstruktur mit oberflächennaher verfestigung undherstellungsverfahren dafür Download PDF

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Publication number
DE69812425T2
DE69812425T2 DE69812425T DE69812425T DE69812425T2 DE 69812425 T2 DE69812425 T2 DE 69812425T2 DE 69812425 T DE69812425 T DE 69812425T DE 69812425 T DE69812425 T DE 69812425T DE 69812425 T2 DE69812425 T2 DE 69812425T2
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DE
Germany
Prior art keywords
dendrite
cathode
voltage
ion conductor
anode
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Expired - Lifetime
Application number
DE69812425T
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English (en)
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DE69812425D1 (de
Inventor
N Kozicki
C West
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Arizona Board of Regents of ASU
Axon Technologies Corp
Arizona State University ASU
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Arizona Board of Regents of ASU
Axon Technologies Corp
Arizona State University ASU
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Publication of DE69812425T2 publication Critical patent/DE69812425T2/de
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Expired - Lifetime legal-status Critical Current

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Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0011RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/24Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
    • H10N70/245Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8822Sulfides, e.g. CuS
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/009Write using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/10Resistive cells; Technology aspects
    • G11C2213/15Current-voltage curve
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/72Array wherein the access device being a diode
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/77Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
DE69812425T 1997-12-04 1998-12-04 Programmierbare metallisierungsstruktur mit oberflächennaher verfestigung undherstellungsverfahren dafür Expired - Lifetime DE69812425T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6750997P 1997-12-04 1997-12-04
PCT/US1998/025830 WO1999028914A2 (en) 1997-12-04 1998-12-04 Programmable sub-surface aggregating metallization structure and method of making same

Publications (2)

Publication Number Publication Date
DE69812425D1 DE69812425D1 (de) 2003-04-24
DE69812425T2 true DE69812425T2 (de) 2004-01-15

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
DE69825923T Expired - Lifetime DE69825923T2 (de) 1997-12-04 1998-12-04 Programmierbare aggregierende Unterflächenmetallisierungsstruktur
DE69812425T Expired - Lifetime DE69812425T2 (de) 1997-12-04 1998-12-04 Programmierbare metallisierungsstruktur mit oberflächennaher verfestigung undherstellungsverfahren dafür

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69825923T Expired - Lifetime DE69825923T2 (de) 1997-12-04 1998-12-04 Programmierbare aggregierende Unterflächenmetallisierungsstruktur

Country Status (11)

Country Link
US (3) US6418049B1 (de)
EP (2) EP1235227B1 (de)
JP (2) JP2001525606A (de)
KR (1) KR100371102B1 (de)
CN (1) CN1260734C (de)
AT (2) ATE274744T1 (de)
AU (1) AU751949C (de)
CA (1) CA2312841C (de)
DE (2) DE69825923T2 (de)
HK (1) HK1032139A1 (de)
WO (1) WO1999028914A2 (de)

Families Citing this family (203)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6147395A (en) * 1996-10-02 2000-11-14 Micron Technology, Inc. Method for fabricating a small area of contact between electrodes
US6635914B2 (en) * 2000-09-08 2003-10-21 Axon Technologies Corp. Microelectronic programmable device and methods of forming and programming the same
CN1175423C (zh) * 1999-02-11 2004-11-10 亚利桑那州立大学董事会 微电子可编程结构及其形成与编程方法
US20030107105A1 (en) * 1999-08-31 2003-06-12 Kozicki Michael N. Programmable chip-to-substrate interconnect structure and device and method of forming same
US7675766B2 (en) * 2000-02-11 2010-03-09 Axon Technologies Corporation Microelectric programmable device and methods of forming and programming the same
US7372065B2 (en) * 2000-02-11 2008-05-13 Axon Technologies Corporation Programmable metallization cell structures including an oxide electrolyte, devices including the structure and method of forming same
US6927411B2 (en) 2000-02-11 2005-08-09 Axon Technologies Corporation Programmable structure, an array including the structure, and methods of forming the same
US8218350B2 (en) * 2000-02-11 2012-07-10 Axon Technologies Corporation Programmable metallization cell structure including an integrated diode, device including the structure, and method of forming same
US7385219B2 (en) * 2000-02-11 2008-06-10 A{umlaut over (x)}on Technologies Corporation Optimized solid electrolyte for programmable metallization cell devices and structures
US6653193B2 (en) 2000-12-08 2003-11-25 Micron Technology, Inc. Resistance variable device
US6638820B2 (en) * 2001-02-08 2003-10-28 Micron Technology, Inc. Method of forming chalcogenide comprising devices, method of precluding diffusion of a metal into adjacent chalcogenide material, and chalcogenide comprising devices
US6727192B2 (en) 2001-03-01 2004-04-27 Micron Technology, Inc. Methods of metal doping a chalcogenide material
US6818481B2 (en) 2001-03-07 2004-11-16 Micron Technology, Inc. Method to manufacture a buried electrode PCRAM cell
US6734455B2 (en) 2001-03-15 2004-05-11 Micron Technology, Inc. Agglomeration elimination for metal sputter deposition of chalcogenides
JP4731794B2 (ja) * 2001-05-07 2011-07-27 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド メモリ効果を有するスイッチ素子及び該素子をスイッチングさせる方法
CN100403450C (zh) * 2001-05-07 2008-07-16 先进微装置公司 具有自组装聚合物薄膜的内存装置及其制造方法
DE60233486D1 (de) 2001-05-07 2009-10-08 Advanced Micro Devices Inc Floating-gate-speicherbaustein, der zusammengesetztes molekularmaterial verwendet
US6781868B2 (en) * 2001-05-07 2004-08-24 Advanced Micro Devices, Inc. Molecular memory device
WO2002091496A2 (en) * 2001-05-07 2002-11-14 Advanced Micro Devices, Inc. Reversible field-programmable electric interconnects
US6873540B2 (en) * 2001-05-07 2005-03-29 Advanced Micro Devices, Inc. Molecular memory cell
US7102150B2 (en) 2001-05-11 2006-09-05 Harshfield Steven T PCRAM memory cell and method of making same
US6858481B2 (en) 2001-08-13 2005-02-22 Advanced Micro Devices, Inc. Memory device with active and passive layers
US6838720B2 (en) * 2001-08-13 2005-01-04 Advanced Micro Devices, Inc. Memory device with active passive layers
US6806526B2 (en) 2001-08-13 2004-10-19 Advanced Micro Devices, Inc. Memory device
CN100419906C (zh) 2001-08-13 2008-09-17 先进微装置公司 存储器单元
US6768157B2 (en) 2001-08-13 2004-07-27 Advanced Micro Devices, Inc. Memory device
US6737312B2 (en) 2001-08-27 2004-05-18 Micron Technology, Inc. Method of fabricating dual PCRAM cells sharing a common electrode
US6881623B2 (en) * 2001-08-29 2005-04-19 Micron Technology, Inc. Method of forming chalcogenide comprising devices, method of forming a programmable memory cell of memory circuitry, and a chalcogenide comprising device
US6784018B2 (en) * 2001-08-29 2004-08-31 Micron Technology, Inc. Method of forming chalcogenide comprising devices and method of forming a programmable memory cell of memory circuitry
US6955940B2 (en) 2001-08-29 2005-10-18 Micron Technology, Inc. Method of forming chalcogenide comprising devices
US6709958B2 (en) * 2001-08-30 2004-03-23 Micron Technology, Inc. Integrated circuit device and fabrication using metal-doped chalcogenide materials
US20030047765A1 (en) * 2001-08-30 2003-03-13 Campbell Kristy A. Stoichiometry for chalcogenide glasses useful for memory devices and method of formation
US6646902B2 (en) 2001-08-30 2003-11-11 Micron Technology, Inc. Method of retaining memory state in a programmable conductor RAM
JP3593582B2 (ja) * 2001-09-19 2004-11-24 彰 土井 銀イオン含有イオン伝導体の電界誘導黒化現象を利用した記憶素子
US7875883B2 (en) * 2001-09-25 2011-01-25 Japan Science And Technology Agency Electric device using solid electrolyte
ATE331303T1 (de) * 2001-10-26 2006-07-15 Univ Arizona Programmierbare oberflächenkontrollbauelemente sowie deren anwendung
US6815818B2 (en) 2001-11-19 2004-11-09 Micron Technology, Inc. Electrode structure for use in an integrated circuit
US6791859B2 (en) 2001-11-20 2004-09-14 Micron Technology, Inc. Complementary bit PCRAM sense amplifier and method of operation
US20030143782A1 (en) 2002-01-31 2003-07-31 Gilton Terry L. Methods of forming germanium selenide comprising devices and methods of forming silver selenide comprising structures
KR100433407B1 (ko) * 2002-02-06 2004-05-31 삼성광주전자 주식회사 업라이트형 진공청소기
US6791885B2 (en) 2002-02-19 2004-09-14 Micron Technology, Inc. Programmable conductor random access memory and method for sensing same
US7151273B2 (en) 2002-02-20 2006-12-19 Micron Technology, Inc. Silver-selenide/chalcogenide glass stack for resistance variable memory
US6847535B2 (en) 2002-02-20 2005-01-25 Micron Technology, Inc. Removable programmable conductor memory card and associated read/write device and method of operation
US7087919B2 (en) * 2002-02-20 2006-08-08 Micron Technology, Inc. Layered resistance variable memory device and method of fabrication
US6809362B2 (en) * 2002-02-20 2004-10-26 Micron Technology, Inc. Multiple data state memory cell
US7398259B2 (en) * 2002-03-12 2008-07-08 Knowmtech, Llc Training of a physical neural network
US7392230B2 (en) * 2002-03-12 2008-06-24 Knowmtech, Llc Physical neural network liquid state machine utilizing nanotechnology
US20040039717A1 (en) * 2002-08-22 2004-02-26 Alex Nugent High-density synapse chip using nanoparticles
US20030236760A1 (en) * 2002-06-05 2003-12-25 Alex Nugent Multi-layer training in a physical neural network formed utilizing nanotechnology
US8156057B2 (en) * 2003-03-27 2012-04-10 Knowm Tech, Llc Adaptive neural network utilizing nanotechnology-based components
US6889216B2 (en) 2002-03-12 2005-05-03 Knowm Tech, Llc Physical neural network design incorporating nanotechnology
US9269043B2 (en) 2002-03-12 2016-02-23 Knowm Tech, Llc Memristive neural processor utilizing anti-hebbian and hebbian technology
US7412428B2 (en) * 2002-03-12 2008-08-12 Knowmtech, Llc. Application of hebbian and anti-hebbian learning to nanotechnology-based physical neural networks
US6849868B2 (en) 2002-03-14 2005-02-01 Micron Technology, Inc. Methods and apparatus for resistance variable material cells
US6751114B2 (en) 2002-03-28 2004-06-15 Micron Technology, Inc. Method for programming a memory cell
US6864500B2 (en) * 2002-04-10 2005-03-08 Micron Technology, Inc. Programmable conductor memory cell structure
CN100334735C (zh) * 2002-04-30 2007-08-29 独立行政法人科学技术振兴机构 固体电解质开关元件及使用其的fpga、存储元件及其制造方法
US6731528B2 (en) * 2002-05-03 2004-05-04 Micron Technology, Inc. Dual write cycle programmable conductor memory system and method of operation
US7752151B2 (en) * 2002-06-05 2010-07-06 Knowmtech, Llc Multilayer training in a physical neural network formed utilizing nanotechnology
US6890790B2 (en) 2002-06-06 2005-05-10 Micron Technology, Inc. Co-sputter deposition of metal-doped chalcogenides
US6825135B2 (en) 2002-06-06 2004-11-30 Micron Technology, Inc. Elimination of dendrite formation during metal/chalcogenide glass deposition
US7015494B2 (en) 2002-07-10 2006-03-21 Micron Technology, Inc. Assemblies displaying differential negative resistance
US7827131B2 (en) * 2002-08-22 2010-11-02 Knowm Tech, Llc High density synapse chip using nanoparticles
US7018863B2 (en) * 2002-08-22 2006-03-28 Micron Technology, Inc. Method of manufacture of a resistance variable memory cell
US6867996B2 (en) * 2002-08-29 2005-03-15 Micron Technology, Inc. Single-polarity programmable resistance-variable memory element
US6856002B2 (en) * 2002-08-29 2005-02-15 Micron Technology, Inc. Graded GexSe100-x concentration in PCRAM
US6864521B2 (en) * 2002-08-29 2005-03-08 Micron Technology, Inc. Method to control silver concentration in a resistance variable memory element
US6831019B1 (en) 2002-08-29 2004-12-14 Micron Technology, Inc. Plasma etching methods and methods of forming memory devices comprising a chalcogenide comprising layer received operably proximate conductive electrodes
US7364644B2 (en) 2002-08-29 2008-04-29 Micron Technology, Inc. Silver selenide film stoichiometry and morphology control in sputter deposition
US7010644B2 (en) * 2002-08-29 2006-03-07 Micron Technology, Inc. Software refreshed memory device and method
US7012276B2 (en) * 2002-09-17 2006-03-14 Advanced Micro Devices, Inc. Organic thin film Zener diodes
US6807079B2 (en) * 2002-11-01 2004-10-19 Hewlett-Packard Development Company, L.P. Device having a state dependent upon the state of particles dispersed in a carrier
US6903394B2 (en) * 2002-11-27 2005-06-07 Micron Technology, Inc. CMOS imager with improved color response
DE10256486A1 (de) * 2002-12-03 2004-07-15 Infineon Technologies Ag Verfahren zum Herstellen einer Speicherzelle, Speicherzelle und Speicherzellen-Anordnung
US7337160B2 (en) * 2002-12-31 2008-02-26 Bae Systems Information And Electronic Systems Integration Inc. Use of radiation-hardened chalcogenide technology for spaceborne reconfigurable digital processing systems
US6813178B2 (en) * 2003-03-12 2004-11-02 Micron Technology, Inc. Chalcogenide glass constant current device, and its method of fabrication and operation
US7022579B2 (en) 2003-03-14 2006-04-04 Micron Technology, Inc. Method for filling via with metal
US7778062B2 (en) * 2003-03-18 2010-08-17 Kabushiki Kaisha Toshiba Resistance change memory device
CN1759450B (zh) 2003-03-18 2012-02-29 株式会社东芝 可编程阻抗存储器器件
US7400522B2 (en) * 2003-03-18 2008-07-15 Kabushiki Kaisha Toshiba Resistance change memory device having a variable resistance element formed of a first and second composite compound for storing a cation
US7394680B2 (en) * 2003-03-18 2008-07-01 Kabushiki Kaisha Toshiba Resistance change memory device having a variable resistance element with a recording layer electrode served as a cation source in a write or erase mode
JP5110414B2 (ja) * 2003-03-19 2012-12-26 大日本印刷株式会社 有機双安定性素子、これを用いた有機双安定性メモリ装置、およびそれらの駆動方法
US7050327B2 (en) 2003-04-10 2006-05-23 Micron Technology, Inc. Differential negative resistance memory
CN1720621A (zh) * 2003-04-11 2006-01-11 国际商业机器公司 可编程半导体器件
US20050041467A1 (en) * 2003-06-18 2005-02-24 Macronix International Co., Ltd. Chalcogenide memory
US6961277B2 (en) 2003-07-08 2005-11-01 Micron Technology, Inc. Method of refreshing a PCRAM memory device
US7426501B2 (en) * 2003-07-18 2008-09-16 Knowntech, Llc Nanotechnology neural network methods and systems
DE10340405B3 (de) * 2003-09-02 2004-12-23 Infineon Technologies Ag Integrierter Halbleiterspeicher
US6903361B2 (en) * 2003-09-17 2005-06-07 Micron Technology, Inc. Non-volatile memory structure
JP4792714B2 (ja) * 2003-11-28 2011-10-12 ソニー株式会社 記憶素子及び記憶装置
US7050319B2 (en) 2003-12-03 2006-05-23 Micron Technology, Inc. Memory architecture and method of manufacture and operation thereof
JP4608875B2 (ja) * 2003-12-03 2011-01-12 ソニー株式会社 記憶装置
TW200529414A (en) * 2004-02-06 2005-09-01 Renesas Tech Corp Storage
DE102004010243A1 (de) * 2004-03-03 2005-05-19 Infineon Technologies Ag Statische Speicherzelle mit einem PMC-Widerstandsbauelement
US7583551B2 (en) 2004-03-10 2009-09-01 Micron Technology, Inc. Power management control and controlling memory refresh operations
DE102004024610B3 (de) * 2004-05-18 2005-12-29 Infineon Technologies Ag Festkörperelektrolytschaltelement
DE102004029436B4 (de) * 2004-06-18 2009-03-05 Qimonda Ag Verfahren zum Herstellen eines Festkörperelektrolytmaterialbereichs
US7326950B2 (en) 2004-07-19 2008-02-05 Micron Technology, Inc. Memory device with switching glass layer
US7354793B2 (en) 2004-08-12 2008-04-08 Micron Technology, Inc. Method of forming a PCRAM device incorporating a resistance-variable chalocogenide element
DE102004037450B4 (de) * 2004-08-02 2009-04-16 Qimonda Ag Verfahren zum Betrieb eines Schalt-Bauelements
US7365411B2 (en) 2004-08-12 2008-04-29 Micron Technology, Inc. Resistance variable memory with temperature tolerant materials
US7224598B2 (en) * 2004-09-02 2007-05-29 Hewlett-Packard Development Company, L.P. Programming of programmable resistive memory devices
JP4529654B2 (ja) * 2004-11-15 2010-08-25 ソニー株式会社 記憶素子及び記憶装置
US7374174B2 (en) 2004-12-22 2008-05-20 Micron Technology, Inc. Small electrode for resistance variable devices
US20060131555A1 (en) * 2004-12-22 2006-06-22 Micron Technology, Inc. Resistance variable devices with controllable channels
FR2880177B1 (fr) * 2004-12-23 2007-05-18 Commissariat Energie Atomique Memoire pmc ayant un temps de retention et une vitesse d'ecriture ameliores
WO2006070693A1 (ja) * 2004-12-27 2006-07-06 Nec Corporation スイッチング素子、スイッチング素子の駆動方法および製造方法、書き換え可能な論理集積回路、メモリ素子
WO2006070698A1 (ja) * 2004-12-27 2006-07-06 Nec Corporation スイッチング素子、スイッチング素子の駆動方法及び製造方法、集積回路装置並びにメモリ素子
JP5135797B2 (ja) * 2004-12-28 2013-02-06 日本電気株式会社 スイッチング素子、スイッチング素子の製造方法、書き換え可能な論理集積回路、およびメモリ素子
WO2006070681A1 (ja) * 2004-12-28 2006-07-06 Nec Corporation スイッチング素子、および書き換え可能な論理集積回路
JP4815804B2 (ja) * 2005-01-11 2011-11-16 ソニー株式会社 記憶素子及び記憶装置
JP5211483B2 (ja) 2005-01-17 2013-06-12 日本電気株式会社 固体電解質スイッチング素子およびその製造方法ならびに集積回路
DE102006003933A1 (de) * 2005-01-26 2006-08-03 Infineon Technologies Ag Integrierte Speichereinrichtung und Verfahren zum Betreiben einer integrierten Speichereinrichtung
DE102005004107A1 (de) 2005-01-28 2006-08-17 Infineon Technologies Ag Integrierter Halbleiterspeicher mit einer Anordnung nichtflüchtiger Speicherzellen und Verfahren
US7409375B2 (en) * 2005-05-23 2008-08-05 Knowmtech, Llc Plasticity-induced self organizing nanotechnology for the extraction of independent components from a data stream
US7502769B2 (en) * 2005-01-31 2009-03-10 Knowmtech, Llc Fractal memory and computational methods and systems based on nanotechnology
DE102005005325B4 (de) * 2005-02-04 2011-12-15 Adesto Technology Corp., Inc. Verfahren zur Herstellung einer resistiv schaltenden nicht-flüchtigen Speicherzelle
US7317200B2 (en) 2005-02-23 2008-01-08 Micron Technology, Inc. SnSe-based limited reprogrammable cell
US7749805B2 (en) * 2005-03-10 2010-07-06 Qimonda Ag Method for manufacturing an integrated circuit including an electrolyte material layer
US7709289B2 (en) 2005-04-22 2010-05-04 Micron Technology, Inc. Memory elements having patterned electrodes and method of forming the same
US7427770B2 (en) 2005-04-22 2008-09-23 Micron Technology, Inc. Memory array for increased bit density
US7420396B2 (en) * 2005-06-17 2008-09-02 Knowmtech, Llc Universal logic gate utilizing nanotechnology
US7599895B2 (en) 2005-07-07 2009-10-06 Knowm Tech, Llc Methodology for the configuration and repair of unreliable switching elements
JP4635759B2 (ja) * 2005-07-19 2011-02-23 ソニー株式会社 記憶素子及び記憶装置
US7274034B2 (en) 2005-08-01 2007-09-25 Micron Technology, Inc. Resistance variable memory device with sputtered metal-chalcogenide region and method of fabrication
US7332735B2 (en) 2005-08-02 2008-02-19 Micron Technology, Inc. Phase change memory cell and method of formation
US7579615B2 (en) 2005-08-09 2009-08-25 Micron Technology, Inc. Access transistor for memory device
US7251154B2 (en) 2005-08-15 2007-07-31 Micron Technology, Inc. Method and apparatus providing a cross-point memory array using a variable resistance memory cell and capacitance
KR101100427B1 (ko) * 2005-08-24 2011-12-30 삼성전자주식회사 이온 전도층을 포함하는 불휘발성 반도체 메모리 장치와 그제조 및 동작 방법
JP4919146B2 (ja) 2005-09-27 2012-04-18 独立行政法人産業技術総合研究所 スイッチング素子
US7254073B2 (en) * 2005-09-29 2007-08-07 Infineon Technologies Ag Memory device having an array of resistive memory cells
DE602005013964D1 (de) * 2005-09-29 2009-05-28 Qimonda Ag Speicher mit Widerstandspeicherzellenmatrix und Bitleitungsaufladung
US20090289371A1 (en) * 2005-12-15 2009-11-26 Nec Corporation Switching element and method of manufacturing the same
CN101336490B (zh) * 2006-02-09 2011-08-17 株式会社日立制作所 半导体器件及其制造方法
JP5417709B2 (ja) * 2006-02-09 2014-02-19 日本電気株式会社 スイッチング素子、書き換え可能な論理集積回路、およびメモリ素子
US8492810B2 (en) * 2006-02-28 2013-07-23 Qimonda Ag Method of fabricating an integrated electronic circuit with programmable resistance cells
US8558211B2 (en) 2006-03-30 2013-10-15 Nec Corporation Switching element and method for manufacturing switching element
US7515454B2 (en) * 2006-08-02 2009-04-07 Infineon Technologies Ag CBRAM cell and CBRAM array, and method of operating thereof
US20080037324A1 (en) * 2006-08-14 2008-02-14 Geoffrey Wen-Tai Shuy Electrical thin film memory
US7560723B2 (en) 2006-08-29 2009-07-14 Micron Technology, Inc. Enhanced memory density resistance variable memory cells, arrays, devices and systems including the same, and methods of fabrication
WO2008029334A1 (en) * 2006-09-04 2008-03-13 Nxp B.V. Fabrication of self-assembled nanowire-type interconnects on a semiconductor device
TWI328871B (en) * 2006-09-04 2010-08-11 Ind Tech Res Inst Resistance type memory device
JP4869006B2 (ja) * 2006-09-27 2012-02-01 株式会社東芝 半導体記憶装置の制御方法
US7583527B2 (en) * 2006-09-29 2009-09-01 Infineon Technologies Ag Tunable resistor and method for operating a tunable resistor
US8766224B2 (en) 2006-10-03 2014-07-01 Hewlett-Packard Development Company, L.P. Electrically actuated switch
US7551470B2 (en) * 2006-10-19 2009-06-23 International Business Machines Corporation Non volatile memory RAD-hard (NVM-rh) system
US20100038615A1 (en) * 2006-11-22 2010-02-18 Takashi Nakagawa Nonvolatile storage device
US7930257B2 (en) * 2007-01-05 2011-04-19 Knowm Tech, Llc Hierarchical temporal memory utilizing nanotechnology
JP4446054B2 (ja) 2007-03-23 2010-04-07 独立行政法人産業技術総合研究所 不揮発性記憶素子
US7719886B2 (en) * 2007-05-03 2010-05-18 Qimonda North America Corp. Multi-level resistive memory cell using different crystallization speeds
US7859883B2 (en) * 2007-05-14 2010-12-28 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Recordable electrical memory
US7859893B2 (en) * 2007-05-31 2010-12-28 Micron Technology, Inc. Phase change memory structure with multiple resistance states and methods of programming and sensing same
US7692951B2 (en) * 2007-06-12 2010-04-06 Kabushiki Kaisha Toshiba Resistance change memory device with a variable resistance element formed of a first and a second composite compound
US7646254B2 (en) * 2007-08-30 2010-01-12 Honeywell International Inc. Radiation hard oscillator and differential circuit design
US8064243B2 (en) * 2007-11-13 2011-11-22 Qimonda Ag Method and apparatus for an integrated circuit with programmable memory cells, data system
US8189365B2 (en) 2007-11-21 2012-05-29 Nec Corporation Semiconductor device configuration method
US20090140232A1 (en) * 2007-11-30 2009-06-04 Klaus-Dieter Ufert Resistive Memory Element
JP4466738B2 (ja) * 2008-01-09 2010-05-26 ソニー株式会社 記憶素子および記憶装置
US7961506B2 (en) * 2008-02-05 2011-06-14 Micron Technology, Inc. Multiple memory cells with rectifying device
US20090200535A1 (en) * 2008-02-12 2009-08-13 Klaus-Dieter Ufert Non-Volatile Memory Element with Improved Temperature Stability
KR20090090563A (ko) * 2008-02-21 2009-08-26 삼성전자주식회사 저항 기억 요소를 포함하는 반도체 소자
KR101480292B1 (ko) * 2008-03-17 2015-01-12 삼성전자주식회사 상변화막을 포함하는 반도체 소자의 형성 방법
US8097902B2 (en) * 2008-07-10 2012-01-17 Seagate Technology Llc Programmable metallization memory cells via selective channel forming
US8467236B2 (en) 2008-08-01 2013-06-18 Boise State University Continuously variable resistor
US7923715B2 (en) * 2008-12-06 2011-04-12 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration Chalcogenide nanoionic-based radio frequency switch
US8742531B2 (en) 2008-12-08 2014-06-03 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Electrical devices including dendritic metal electrodes
US7929345B2 (en) * 2008-12-23 2011-04-19 Actel Corporation Push-pull memory cell configured for simultaneous programming of n-channel and p-channel non-volatile transistors
US8455855B2 (en) 2009-01-12 2013-06-04 Micron Technology, Inc. Memory cell having dielectric memory element
US8907455B2 (en) * 2009-01-28 2014-12-09 Hewlett-Packard Development Company, L.P. Voltage-controlled switches
US8120955B2 (en) * 2009-02-13 2012-02-21 Actel Corporation Array and control method for flash based FPGA cell
US8426839B1 (en) 2009-04-24 2013-04-23 Adesto Technologies Corporation Conducting bridge random access memory (CBRAM) device structures
US8320178B2 (en) 2009-07-02 2012-11-27 Actel Corporation Push-pull programmable logic device cell
US8279665B2 (en) * 2009-11-23 2012-10-02 International Business Machines Corporation Memory cell and select element
US8687403B1 (en) 2010-06-10 2014-04-01 Adesto Technologies Corporation Circuits having programmable impedance elements
TWI431762B (zh) * 2010-09-16 2014-03-21 Univ Nat Sun Yat Sen 電阻式記憶體元件及其製作方法
US8829482B1 (en) 2010-09-23 2014-09-09 Adesto Technologies Corporation Variable impedance memory device structure and method of manufacture including programmable impedance memory cells and methods of forming the same
JP5348108B2 (ja) * 2010-10-18 2013-11-20 ソニー株式会社 記憶素子
WO2012065083A1 (en) 2010-11-14 2012-05-18 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And Dendritic metal structures, methods for making dendritic metal structures, and devices including them
CN102714210B (zh) 2010-11-19 2015-08-12 松下电器产业株式会社 非易失性存储元件以及非易失性存储元件的制造方法
US20120188819A1 (en) * 2011-01-21 2012-07-26 Baolab Microsystems Sl Methods and systems for mems cmos programmable memories and related devices
US8642460B2 (en) 2011-06-08 2014-02-04 International Business Machines Corporation Semiconductor switching device and method of making the same
US9099633B2 (en) 2012-03-26 2015-08-04 Adesto Technologies Corporation Solid electrolyte memory elements with electrode interface for improved performance
US8847191B1 (en) 2012-03-27 2014-09-30 Adesto Technologies Corporation Programmable impedance memory elements, methods of manufacture, and memory devices containing the same
US8730752B1 (en) 2012-04-02 2014-05-20 Adesto Technologies Corporation Circuits and methods for placing programmable impedance memory elements in high impedance states
JP5698714B2 (ja) * 2012-08-29 2015-04-08 株式会社東芝 不揮発性記憶装置
US9208870B2 (en) 2012-09-13 2015-12-08 Adesto Technologies Corporation Multi-port memory devices and methods having programmable impedance elements
EP3007155B1 (de) 2013-03-12 2018-10-24 Arizona Board of Regents, a Body Corporate of the State of Arizona acting for and on behalf of Arizona State University Fälschungssicherung von etiketten mittels bildverarbeitung von dendritischen strukturen als physikalisch nicht klonbare funktion
JP6517184B2 (ja) 2013-03-15 2019-05-22 アデスト テクノロジー コーポレーション 半金属及び/又は半導体の電極を備える不揮発性メモリ
US9391270B1 (en) 2014-10-31 2016-07-12 Adesto Technologies Corporation Memory cells with vertically integrated tunnel access device and programmable impedance element
WO2016073910A1 (en) 2014-11-07 2016-05-12 Arizona Board Of Regents On Behalf Of Arizona State University Information coding in dendritic structures and tags
US10475998B2 (en) * 2015-01-30 2019-11-12 Taiwan Semiconductor Manufacturing Co., Ltd Resistive random access memory structure
US10710070B2 (en) 2015-11-24 2020-07-14 Arizona Board Of Regents On Behalf Of Arizona State University Low-voltage microfluidic valve device and system for regulating the flow of fluid
US10270451B2 (en) 2015-12-17 2019-04-23 Microsemi SoC Corporation Low leakage ReRAM FPGA configuration cell
US10147485B2 (en) 2016-09-29 2018-12-04 Microsemi Soc Corp. Circuits and methods for preventing over-programming of ReRAM-based memory cells
WO2018106450A1 (en) 2016-12-09 2018-06-14 Microsemi Soc Corp. Resistive random access memory cell
US11127694B2 (en) 2017-03-23 2021-09-21 Arizona Board Of Regents On Behalf Of Arizona State University Physical unclonable functions with copper-silicon oxide programmable metallization cells
US10466969B2 (en) 2017-05-08 2019-11-05 Arizona Board Of Regents On Behalf Of Arizona State University Tunable true random number generator using programmable metallization cell(s)
US11430233B2 (en) 2017-06-16 2022-08-30 Arizona Board Of Regents On Behalf Of Arizona State University Polarized scanning of dendritic identifiers
DE112018004134T5 (de) 2017-08-11 2020-04-23 Microsemi Soc Corp. Schaltlogik und verfahren zur programmierung von resistiven direktzugriffs-speichervorrichtungen
WO2019210129A1 (en) 2018-04-26 2019-10-31 Kozicki Michael N Fabrication of dendritic structures and tags
US11244722B2 (en) 2019-09-20 2022-02-08 Arizona Board Of Regents On Behalf Of Arizona State University Programmable interposers for electrically connecting integrated circuits
US11935843B2 (en) 2019-12-09 2024-03-19 Arizona Board Of Regents On Behalf Of Arizona State University Physical unclonable functions with silicon-rich dielectric devices
WO2021149780A1 (ja) * 2020-01-24 2021-07-29 パナソニック株式会社 半導体装置及びその駆動方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271591A (en) 1963-09-20 1966-09-06 Energy Conversion Devices Inc Symmetrical current controlling device
US3765956A (en) 1965-09-28 1973-10-16 C Li Solid-state device
US3715634A (en) 1968-07-05 1973-02-06 Energy Conversion Devices Inc Switchable current controlling device with inactive material dispersed in the active semiconductor material
US3530441A (en) 1969-01-15 1970-09-22 Energy Conversion Devices Inc Method and apparatus for storing and retrieving information
US3868651A (en) 1970-08-13 1975-02-25 Energy Conversion Devices Inc Method and apparatus for storing and reading data in a memory having catalytic material to initiate amorphous to crystalline change in memory structure
US3980505A (en) 1973-09-12 1976-09-14 Buckley William D Process of making a filament-type memory semiconductor device
US3886577A (en) 1973-09-12 1975-05-27 Energy Conversion Devices Inc Filament-type memory semiconductor device and method of making the same
US3846767A (en) 1973-10-24 1974-11-05 Energy Conversion Devices Inc Method and means for resetting filament-forming memory semiconductor device
US3875566A (en) 1973-10-29 1975-04-01 Energy Conversion Devices Inc Resetting filament-forming memory semiconductor devices with multiple reset pulses
DE2806464C3 (de) * 1978-02-15 1980-09-11 Garching Instrumente, Gesellschaft Zur Industriellen Nutzung Von Forschungsergebnissen Mbh, 8000 Muenchen Elektrisches Bauelement
US4199692A (en) 1978-05-16 1980-04-22 Harris Corporation Amorphous non-volatile ram
US4312046A (en) * 1979-10-04 1982-01-19 Harris Corporation Vertical fuse and method of fabrication
DE3044132A1 (de) * 1980-11-24 1982-07-15 Siemens AG, 1000 Berlin und 8000 München Dynamische halbleiter-speicherzelle mit wahlfreiem zugriff und verfahren zu ihrer herstellung
JPS6037558B2 (ja) * 1981-07-06 1985-08-27 三菱電機株式会社 プログラマブルリ−ドオンリ−メモリ
US4874711A (en) * 1987-05-26 1989-10-17 Georgia Tech Research Corporation Method for altering characteristics of active semiconductor devices
JPH0770731B2 (ja) * 1990-11-22 1995-07-31 松下電器産業株式会社 電気可塑性素子
US5557136A (en) * 1991-04-26 1996-09-17 Quicklogic Corporation Programmable interconnect structures and programmable integrated circuits
US5177567A (en) 1991-07-19 1993-01-05 Energy Conversion Devices, Inc. Thin-film structure for chalcogenide electrical switching devices and process therefor
US5138481A (en) * 1991-07-23 1992-08-11 Ford Motor Company Electrochromic device with color gradient and method of making the device
JPH0621531A (ja) 1992-07-01 1994-01-28 Rohm Co Ltd ニューロ素子
US5596500A (en) 1993-10-25 1997-01-21 Trimble Navigation Limited Map reading system for indicating a user's position on a published map with a global position system receiver and a database
BE1007902A3 (nl) * 1993-12-23 1995-11-14 Philips Electronics Nv Schakelelement met geheugen voorzien van schottky tunnelbarriere.
US5646629A (en) 1994-05-16 1997-07-08 Trimble Navigation Limited Memory cartridge for a handheld electronic video game
US5500532A (en) 1994-08-18 1996-03-19 Arizona Board Of Regents Personal electronic dosimeter
US5869843A (en) * 1995-06-07 1999-02-09 Micron Technology, Inc. Memory array having a multi-state element and method for forming such array or cells thereof
US5761115A (en) * 1996-05-30 1998-06-02 Axon Technologies Corporation Programmable metallization cell structure and method of making same
US5933365A (en) 1997-06-19 1999-08-03 Energy Conversion Devices, Inc. Memory element with energy control mechanism
US5912839A (en) 1998-06-23 1999-06-15 Energy Conversion Devices, Inc. Universal memory element and method of programming same

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