DE69738688D1 - Aktivmatrizenanzeige und deren herstellungsverfahren - Google Patents
Aktivmatrizenanzeige und deren herstellungsverfahrenInfo
- Publication number
- DE69738688D1 DE69738688D1 DE69738688T DE69738688T DE69738688D1 DE 69738688 D1 DE69738688 D1 DE 69738688D1 DE 69738688 T DE69738688 T DE 69738688T DE 69738688 T DE69738688 T DE 69738688T DE 69738688 D1 DE69738688 D1 DE 69738688D1
- Authority
- DE
- Germany
- Prior art keywords
- gate
- matrix
- multilayer
- transistors
- aluminum layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011159 matrix material Substances 0.000 abstract 5
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- OFIYHXOOOISSDN-UHFFFAOYSA-N tellanylidenegallium Chemical compound [Te]=[Ga] OFIYHXOOOISSDN-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78636—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with supplementary region or layer for improving the flatness of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/13629—Multilayer wirings
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/618,597 US5731216A (en) | 1996-03-27 | 1996-03-27 | Method of making an active matrix display incorporating an improved TFT |
PCT/US1997/004899 WO1997036324A1 (en) | 1996-03-27 | 1997-03-26 | Active matrix displays and method of making |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69738688D1 true DE69738688D1 (de) | 2008-06-26 |
Family
ID=24478344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69738688T Expired - Fee Related DE69738688D1 (de) | 1996-03-27 | 1997-03-26 | Aktivmatrizenanzeige und deren herstellungsverfahren |
Country Status (9)
Country | Link |
---|---|
US (2) | US5731216A (de) |
EP (1) | EP0898785B1 (de) |
JP (1) | JP3360831B2 (de) |
CN (1) | CN1117393C (de) |
AT (1) | ATE395718T1 (de) |
AU (1) | AU2547897A (de) |
DE (1) | DE69738688D1 (de) |
TW (1) | TW299503B (de) |
WO (1) | WO1997036324A1 (de) |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05341315A (ja) * | 1992-06-08 | 1993-12-24 | Hitachi Ltd | 薄膜トランジスタ基板、液晶表示パネルおよび液晶表示装置 |
KR0166894B1 (ko) * | 1995-02-20 | 1999-03-30 | 구자홍 | 액정표시장치 |
US5731216A (en) * | 1996-03-27 | 1998-03-24 | Image Quest Technologies, Inc. | Method of making an active matrix display incorporating an improved TFT |
KR100234376B1 (ko) * | 1996-04-09 | 1999-12-15 | 윤종용 | 박막 트랜지스터의 제조방법 및 이를 이용한 액정 표시장치의 제조방법 |
KR100223153B1 (ko) * | 1996-05-23 | 1999-10-15 | 구자홍 | 액티브 매트릭스 액정표시장치의 제조방법 및 액티브매트릭스액정표시장치 |
JPH1022457A (ja) * | 1996-07-03 | 1998-01-23 | Mitsubishi Electric Corp | 容量装置及び半導体装置並びにそれらの製造方法 |
KR100232679B1 (ko) * | 1996-11-27 | 1999-12-01 | 구본준 | 액정표시장치의 제조방법 및 그 구조 |
JPH10163501A (ja) * | 1996-11-29 | 1998-06-19 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型トランジスタ |
US6037609A (en) * | 1997-01-17 | 2000-03-14 | General Electric Company | Corrosion resistant imager |
KR100248123B1 (ko) | 1997-03-04 | 2000-03-15 | 구본준 | 박막트랜지스터및그의제조방법 |
JPH10268794A (ja) * | 1997-03-26 | 1998-10-09 | Sharp Corp | 表示パネル |
JP3270361B2 (ja) * | 1997-06-09 | 2002-04-02 | 日本電気株式会社 | 薄膜トランジスタアレイ及びその製造方法 |
US6149792A (en) * | 1997-09-30 | 2000-11-21 | Candescent Technologies Corporation | Row electrode anodization |
US6369410B1 (en) * | 1997-12-15 | 2002-04-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the semiconductor device |
US6103095A (en) * | 1998-02-27 | 2000-08-15 | Candescent Technologies Corporation | Non-hazardous wet etching method |
KR100495807B1 (ko) * | 1998-05-15 | 2005-10-12 | 삼성전자주식회사 | 배선용조성물,이조성물을이용한금속배선및그제조방법,이배선을이용한표시장치및그제조방법 |
KR100269326B1 (ko) * | 1998-06-08 | 2000-10-16 | 윤종용 | 전기 도금으로 형성된 전극을 갖춘 커패시터및 그 제조방법 |
US6215130B1 (en) * | 1998-08-20 | 2001-04-10 | Lucent Technologies Inc. | Thin film transistors |
CN1139837C (zh) * | 1998-10-01 | 2004-02-25 | 三星电子株式会社 | 液晶显示器用薄膜晶体管阵列基板及其制造方法 |
US6617644B1 (en) * | 1998-11-09 | 2003-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP2001053283A (ja) | 1999-08-12 | 2001-02-23 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
US6599788B1 (en) * | 1999-08-18 | 2003-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
KR100660813B1 (ko) * | 1999-12-31 | 2006-12-26 | 엘지.필립스 엘시디 주식회사 | 엑스레이 디텍터용 어레이기판 제조방법 |
TW495854B (en) * | 2000-03-06 | 2002-07-21 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
TW513753B (en) * | 2000-03-27 | 2002-12-11 | Semiconductor Energy Lab | Semiconductor display device and manufacturing method thereof |
US6562668B2 (en) * | 2000-08-12 | 2003-05-13 | Jin Jang | Method of fabricating thin film transistor using buffer layer and the thin film transistor |
DE10141301B4 (de) * | 2000-08-23 | 2005-03-24 | Samsung Electronics Co., Ltd., Suwon | Halbleitervorrichtung mit einer Self-Aligned-Kontaktstruktur, die Dual-Abstandshalter verwendet, und Herstellungsverfahren dafür |
KR100685914B1 (ko) * | 2000-09-05 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | 멀티 도메인 액정표시소자 및 그 제조방법 |
US6930732B2 (en) * | 2000-10-11 | 2005-08-16 | Lg.Philips Lcd Co., Ltd. | Array substrate for a liquid crystal display |
US6486530B1 (en) * | 2000-10-16 | 2002-11-26 | Intarsia Corporation | Integration of anodized metal capacitors and high temperature deposition capacitors |
KR100379824B1 (ko) * | 2000-12-20 | 2003-04-11 | 엘지.필립스 엘시디 주식회사 | 식각용액 및 식각용액으로 패턴된 구리배선을 가지는전자기기용 어레이기판 |
GB0100733D0 (en) * | 2001-01-11 | 2001-02-21 | Koninkl Philips Electronics Nv | A method of manufacturing an active matrix substrate |
US6624501B2 (en) * | 2001-01-26 | 2003-09-23 | Fujitsu Limited | Capacitor and semiconductor device |
TW474023B (en) * | 2001-02-27 | 2002-01-21 | Hannstar Display Corp | Thin film transistor process of liquid crystal display |
SG160191A1 (en) | 2001-02-28 | 2010-04-29 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
KR100799464B1 (ko) * | 2001-03-21 | 2008-02-01 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 및 그 제조방법 |
US6586325B2 (en) * | 2001-06-26 | 2003-07-01 | Cosmos Vacuum Technology Corporation | Process for making an electronic device having a multilevel structure |
JP3953330B2 (ja) * | 2002-01-25 | 2007-08-08 | 三洋電機株式会社 | 表示装置 |
JP3723507B2 (ja) | 2002-01-29 | 2005-12-07 | 三洋電機株式会社 | 駆動回路 |
JP2003308030A (ja) | 2002-02-18 | 2003-10-31 | Sanyo Electric Co Ltd | 表示装置 |
JP2003332058A (ja) | 2002-03-05 | 2003-11-21 | Sanyo Electric Co Ltd | エレクトロルミネッセンスパネルおよびその製造方法 |
CN100517422C (zh) | 2002-03-07 | 2009-07-22 | 三洋电机株式会社 | 配线结构、其制造方法、以及光学设备 |
JP3837344B2 (ja) | 2002-03-11 | 2006-10-25 | 三洋電機株式会社 | 光学素子およびその製造方法 |
US7365408B2 (en) * | 2002-04-30 | 2008-04-29 | International Business Machines Corporation | Structure for photolithographic applications using a multi-layer anti-reflection coating |
TWI232991B (en) * | 2002-11-15 | 2005-05-21 | Nec Lcd Technologies Ltd | Method for manufacturing an LCD device |
KR100652214B1 (ko) * | 2003-04-03 | 2006-11-30 | 엘지.필립스 엘시디 주식회사 | 액정표시장치의 제조방법 |
US8263983B2 (en) | 2003-10-28 | 2012-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Wiring substrate and semiconductor device |
KR100982122B1 (ko) * | 2003-12-30 | 2010-09-14 | 엘지디스플레이 주식회사 | 수평 전계 인가형 박막 트랜지스터 기판의 불량 화소암점화 방법 |
US20060003485A1 (en) * | 2004-06-30 | 2006-01-05 | Hoffman Randy L | Devices and methods of making the same |
KR100593943B1 (ko) * | 2005-04-30 | 2006-06-30 | 삼성전기주식회사 | 발광 다이오드 패키지의 제조 방법 |
US8754416B2 (en) * | 2005-11-25 | 2014-06-17 | The Hong Hong University of Science and Technology | Method for fabrication of active-matrix display panels |
KR100735310B1 (ko) * | 2006-04-21 | 2007-07-04 | 삼성전기주식회사 | 다층 반사 면 구조를 갖는 엘이디 패키지 및 그 제조방법 |
TWI316297B (en) * | 2006-11-10 | 2009-10-21 | Innolux Display Corp | Thin film transistor substrate |
WO2008136270A1 (ja) * | 2007-04-26 | 2008-11-13 | Nec Corporation | 表示素子及び電界効果型トランジスタ |
KR101432716B1 (ko) * | 2008-02-25 | 2014-08-21 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 박막 트랜지스터를 포함하는 표시 장치및 그 제조 방법 |
KR101234382B1 (ko) | 2008-05-23 | 2013-02-18 | 엘지디스플레이 주식회사 | 플렉서블 표시장치 및 그 제조 방법 |
WO2011010541A1 (en) * | 2009-07-18 | 2011-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
WO2011010542A1 (en) * | 2009-07-23 | 2011-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR101267277B1 (ko) * | 2011-05-19 | 2013-05-24 | 한국기계연구원 | 유연기판의 금속배선 형성방법 |
CN102629575B (zh) * | 2011-08-23 | 2014-09-24 | 京东方科技集团股份有限公司 | 一种阵列基板及其制造方法 |
CN103400802B (zh) * | 2013-07-30 | 2016-04-13 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法和显示装置 |
KR20150034947A (ko) * | 2013-09-27 | 2015-04-06 | 삼성디스플레이 주식회사 | 표시 장치의 금속 배선, 박막 트랜지스터 기판 및 박막 트랜지스터 기판의 제조 방법 |
KR102188690B1 (ko) | 2014-01-20 | 2020-12-09 | 삼성디스플레이 주식회사 | 박막트랜지스터, 그의 제조방법 및 박막트랜지스터를 구비하는 평판 표시장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5153754A (en) * | 1989-06-30 | 1992-10-06 | General Electric Company | Multi-layer address lines for amorphous silicon liquid crystal display devices |
US5498573A (en) * | 1989-11-29 | 1996-03-12 | General Electric Company | Method of making multi-layer address lines for amorphous silicon liquid crystal display devices |
WO1992006490A1 (en) * | 1990-10-05 | 1992-04-16 | General Electric Company | Device self-alignment by propagation of a reference structure's topography |
GB2255443B (en) * | 1991-04-30 | 1995-09-13 | Samsung Electronics Co Ltd | Fabricating a metal electrode of a semiconductor device |
KR970004885B1 (ko) * | 1993-05-12 | 1997-04-08 | 삼성전자 주식회사 | 평판표시장치 및 그 제조방법 |
US5518805A (en) * | 1994-04-28 | 1996-05-21 | Xerox Corporation | Hillock-free multilayer metal lines for high performance thin film structures |
US5737041A (en) * | 1995-07-31 | 1998-04-07 | Image Quest Technologies, Inc. | TFT, method of making and matrix displays incorporating the TFT |
KR0175409B1 (ko) * | 1995-11-20 | 1999-02-18 | 김광호 | 액정 표시 장치용 박막 트랜지스터 기판의 제조 방법 |
US5731216A (en) * | 1996-03-27 | 1998-03-24 | Image Quest Technologies, Inc. | Method of making an active matrix display incorporating an improved TFT |
-
1996
- 1996-03-27 US US08/618,597 patent/US5731216A/en not_active Expired - Lifetime
- 1996-04-09 TW TW085104147A patent/TW299503B/zh not_active IP Right Cessation
-
1997
- 1997-03-26 EP EP97917014A patent/EP0898785B1/de not_active Expired - Lifetime
- 1997-03-26 AU AU25478/97A patent/AU2547897A/en not_active Abandoned
- 1997-03-26 CN CN97193398A patent/CN1117393C/zh not_active Expired - Fee Related
- 1997-03-26 AT AT97917014T patent/ATE395718T1/de not_active IP Right Cessation
- 1997-03-26 DE DE69738688T patent/DE69738688D1/de not_active Expired - Fee Related
- 1997-03-26 JP JP53460197A patent/JP3360831B2/ja not_active Expired - Fee Related
- 1997-03-26 WO PCT/US1997/004899 patent/WO1997036324A1/en active IP Right Grant
-
1998
- 1998-01-26 US US09/013,501 patent/US6160270A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3360831B2 (ja) | 2003-01-07 |
TW299503B (en) | 1997-03-01 |
US6160270A (en) | 2000-12-12 |
WO1997036324A1 (en) | 1997-10-02 |
JP2000505602A (ja) | 2000-05-09 |
CN1117393C (zh) | 2003-08-06 |
EP0898785A4 (de) | 2002-03-13 |
AU2547897A (en) | 1997-10-17 |
CN1214799A (zh) | 1999-04-21 |
EP0898785B1 (de) | 2008-05-14 |
ATE395718T1 (de) | 2008-05-15 |
EP0898785A1 (de) | 1999-03-03 |
US5731216A (en) | 1998-03-24 |
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