DE69708374T2 - Schleifsystem zum Schleifen von Wafern - Google Patents

Schleifsystem zum Schleifen von Wafern

Info

Publication number
DE69708374T2
DE69708374T2 DE69708374T DE69708374T DE69708374T2 DE 69708374 T2 DE69708374 T2 DE 69708374T2 DE 69708374 T DE69708374 T DE 69708374T DE 69708374 T DE69708374 T DE 69708374T DE 69708374 T2 DE69708374 T2 DE 69708374T2
Authority
DE
Germany
Prior art keywords
grinding
wafers
grinding system
grinding wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69708374T
Other languages
English (en)
Other versions
DE69708374D1 (de
Inventor
Makoto Nakajima
Yoshio Nakamura
Yasuhide Denda
Toshihisa Yanagisawa
Toshiaki Seki
Satoru Arakawa
Masahiro Takeuchi
Mitsue Ogawa
Masanori Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Kikai Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Kikai Kogyo KK filed Critical Fujikoshi Kikai Kogyo KK
Application granted granted Critical
Publication of DE69708374D1 publication Critical patent/DE69708374D1/de
Publication of DE69708374T2 publication Critical patent/DE69708374T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q41/00—Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24
    • B23Q41/04—Features relating to relative arrangements of machines
DE69708374T 1996-04-23 1997-04-16 Schleifsystem zum Schleifen von Wafern Expired - Lifetime DE69708374T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10080096A JP3696690B2 (ja) 1996-04-23 1996-04-23 ウェーハの研磨装置システム

Publications (2)

Publication Number Publication Date
DE69708374D1 DE69708374D1 (de) 2002-01-03
DE69708374T2 true DE69708374T2 (de) 2002-07-11

Family

ID=14283484

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69708374T Expired - Lifetime DE69708374T2 (de) 1996-04-23 1997-04-16 Schleifsystem zum Schleifen von Wafern

Country Status (4)

Country Link
US (1) US5908347A (de)
EP (1) EP0803328B1 (de)
JP (1) JP3696690B2 (de)
DE (1) DE69708374T2 (de)

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US6116994A (en) * 1997-04-11 2000-09-12 Ebara Corporation Polishing apparatus
DE29713515U1 (de) * 1997-07-29 1998-12-03 Mechanik Center Erlangen Gmbh Bestückeinrichtung für eine Bearbeitungsmaschine
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6332835B1 (en) * 1997-11-20 2001-12-25 Canon Kabushiki Kaisha Polishing apparatus with transfer arm for moving polished object without drying it
JPH11207610A (ja) * 1998-01-26 1999-08-03 Speedfam Co Ltd 研磨量制御システム及びその方法
US6045299A (en) * 1998-04-13 2000-04-04 International Business Machines Corp. Unidirectional gate between interconnecting fluid transport regions
JP3045233B2 (ja) * 1998-10-16 2000-05-29 株式会社東京精密 ウェーハ研磨装置
DE19853060A1 (de) * 1998-11-17 2000-08-03 Siemens Ag Schleifvorrichtung
US6309279B1 (en) 1999-02-19 2001-10-30 Speedfam-Ipec Corporation Arrangements for wafer polishing
US6227950B1 (en) * 1999-03-08 2001-05-08 Speedfam-Ipec Corporation Dual purpose handoff station for workpiece polishing machine
DE10081456B9 (de) * 1999-05-17 2016-11-03 Kashiwara Machine Mfg. Co., Ltd. Vorrichtung zum doppelseitigen Polieren
JP2001038615A (ja) * 1999-07-26 2001-02-13 Ebara Corp ポリッシング装置
US6234870B1 (en) * 1999-08-24 2001-05-22 International Business Machines Corporation Serial intelligent electro-chemical-mechanical wafer processor
EP1080840A3 (de) * 1999-08-30 2004-01-02 Mitsubishi Materials Corporation Polierverfahren und Vorrichtung und Verfahren zum Abrichten eines Polierkissen
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
DE10009656B4 (de) * 2000-02-24 2005-12-08 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
US6416391B1 (en) 2000-02-28 2002-07-09 Seh America, Inc. Method of demounting silicon wafers after polishing
DE10012840C2 (de) * 2000-03-16 2001-08-02 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Vielzahl von polierten Halbleiterscheiben
JP3556148B2 (ja) * 2000-03-23 2004-08-18 株式会社東京精密 ウェハ研磨装置
US6435941B1 (en) * 2000-05-12 2002-08-20 Appllied Materials, Inc. Apparatus and method for chemical mechanical planarization
US6358126B1 (en) * 2000-05-23 2002-03-19 Ebara Corporation Polishing apparatus
KR20040013371A (ko) * 2002-08-06 2004-02-14 (주) 디씨엠 연마장치의 소재 운반용기 순환장치
KR20050094468A (ko) * 2003-01-27 2005-09-27 정인권 하나 이상의 피봇할 수 있는 로드/언로드 컵을 사용하여반도체 웨이퍼를 연마하기 위한 장치 및 방법
KR20060017591A (ko) * 2003-04-21 2006-02-24 이노플라 아엔씨 하나 이상의 연마면들을 사용하여 반도체 웨이퍼들을연마하기 위한 장치 및 방법
JP4086722B2 (ja) * 2003-06-24 2008-05-14 株式会社荏原製作所 基板保持装置及び研磨装置
DE10350598B3 (de) * 2003-10-30 2005-02-10 Siltronic Ag Einteilige Platte aus verschleißfestem Material zum Ersatz einer nicht mit Werkstücken belegten Trägerplatte bei der gleichzeitigen einseitigen Politur mehrerer scheibenförmiger Werkstücke und Verfahren zur gleichzeitigen Politur mehrerer scheibenförmiger Werkstücke
KR100543469B1 (ko) * 2003-12-23 2006-01-20 삼성전자주식회사 웨이퍼 홀더 및 웨이퍼 홀더가 구비된 웨이퍼 운반 장치
JP4520327B2 (ja) * 2004-03-31 2010-08-04 不二越機械工業株式会社 吸水方法及び吸水装置
JP2006324416A (ja) * 2005-05-18 2006-11-30 Sumco Corp ウェーハ研磨装置及びウェーハ研磨方法
DE102009052744B4 (de) * 2009-11-11 2013-08-29 Siltronic Ag Verfahren zur Politur einer Halbleiterscheibe
US9950404B1 (en) 2012-03-29 2018-04-24 Alta Devices, Inc. High throughput polishing system for workpieces
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置
CA2857213C (en) * 2013-08-10 2016-11-22 Taizhou Federal Robot Technology Co., Ltd. A surface processing system for a work piece
CN104015230B (zh) * 2014-06-23 2015-12-30 台州联帮机器人科技有限公司 一种工件表面的加工系统及加工方法
JP6454599B2 (ja) * 2015-05-14 2019-01-16 株式会社ディスコ 研磨装置
KR102493014B1 (ko) * 2018-07-03 2023-01-31 주식회사 케이씨텍 기판 연마 시스템
CN112992740A (zh) * 2021-03-01 2021-06-18 李军平 一种切割晶圆用的清洗设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2518689C3 (de) * 1975-04-26 1981-07-09 Friedrich Wilhelm 8900 Augsburg Ortmann Werkstücktransporteinrichtung für im Grundriß viereckige Transferstraßen
JPS58223561A (ja) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd ポリツシングマシン
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US4653231A (en) * 1985-11-01 1987-03-31 Motorola, Inc. Polishing system with underwater Bernoulli pickup
JPH0738370B2 (ja) * 1986-04-23 1995-04-26 株式会社日立製作所 半導体装置の製造方法
JPS63207559A (ja) * 1987-02-19 1988-08-26 Disco Abrasive Syst Ltd ウエ−ハ自動研削装置
JPH084105B2 (ja) * 1987-06-19 1996-01-17 株式会社エンヤシステム ウェハ接着方法
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
JP3340151B2 (ja) * 1992-05-21 2002-11-05 不二越機械工業株式会社 ウエハー載置装置
TW276353B (de) * 1993-07-15 1996-05-21 Hitachi Seisakusyo Kk
KR100390293B1 (ko) * 1993-09-21 2003-09-02 가부시끼가이샤 도시바 폴리싱장치
US5605487A (en) * 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
JPH08148451A (ja) * 1994-11-18 1996-06-07 Komatsu Electron Metals Co Ltd 半導体ウェーハ自動剥し装置
US5653622A (en) * 1995-07-25 1997-08-05 Vlsi Technology, Inc. Chemical mechanical polishing system and method for optimization and control of film removal uniformity

Also Published As

Publication number Publication date
EP0803328A1 (de) 1997-10-29
US5908347A (en) 1999-06-01
JP3696690B2 (ja) 2005-09-21
DE69708374D1 (de) 2002-01-03
EP0803328B1 (de) 2001-11-21
JPH09285958A (ja) 1997-11-04

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Legal Events

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