DE69701142T2 - Speicherkarte und verfahren zu ihrer herstellung - Google Patents
Speicherkarte und verfahren zu ihrer herstellungInfo
- Publication number
- DE69701142T2 DE69701142T2 DE69701142T DE69701142T DE69701142T2 DE 69701142 T2 DE69701142 T2 DE 69701142T2 DE 69701142 T DE69701142 T DE 69701142T DE 69701142 T DE69701142 T DE 69701142T DE 69701142 T2 DE69701142 T2 DE 69701142T2
- Authority
- DE
- Germany
- Prior art keywords
- production
- memory card
- card
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01084—Polonium [Po]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9607091A FR2749687B1 (fr) | 1996-06-07 | 1996-06-07 | Carte a memoire et procede de fabrication d'une telle carte |
PCT/FR1997/000995 WO1997048074A1 (fr) | 1996-06-07 | 1997-06-05 | Carte a memoire et procede de fabrication d'une telle carte |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69701142D1 DE69701142D1 (de) | 2000-02-17 |
DE69701142T2 true DE69701142T2 (de) | 2000-09-21 |
Family
ID=9492831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69701142T Expired - Fee Related DE69701142T2 (de) | 1996-06-07 | 1997-06-05 | Speicherkarte und verfahren zu ihrer herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6202931B1 (de) |
EP (1) | EP0902927B1 (de) |
JP (1) | JP2000511669A (de) |
DE (1) | DE69701142T2 (de) |
ES (1) | ES2143313T3 (de) |
FR (1) | FR2749687B1 (de) |
WO (1) | WO1997048074A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005038132A1 (de) * | 2005-08-11 | 2007-02-22 | Infineon Technologies Ag | Chipmodul und Chipkarte |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040213789A1 (en) * | 1997-09-02 | 2004-10-28 | Oron Yacoby-Zeevi | Heparanase activity neutralizing anti-heparanase monoclonal antibody and other anti-heparanase antibodies |
JP2007011836A (ja) * | 2005-07-01 | 2007-01-18 | Nec Tokin Corp | 接触端子付きicカード |
US8067253B2 (en) * | 2005-12-21 | 2011-11-29 | Avery Dennison Corporation | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
US8695207B2 (en) * | 2008-06-02 | 2014-04-15 | Nxp B.V. | Method for manufacturing an electronic device |
WO2009147547A1 (en) * | 2008-06-02 | 2009-12-10 | Nxp B.V. | Electronic device and method of manufacturing an electronic device |
FR2951866B1 (fr) * | 2009-10-27 | 2011-11-25 | Arjowiggins Security | Procede de fabrication d'un support integrant un dispositif electronique |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US10032099B2 (en) | 2012-07-20 | 2018-07-24 | CPI Card Group—Colorado, Inc. | Weighted transaction card |
US8857722B2 (en) | 2012-07-20 | 2014-10-14 | CPI Card Group—Colorado, Inc. | Weighted transaction card |
US9070053B2 (en) | 2013-10-25 | 2015-06-30 | CPI Card Group—Colorado, Inc. | Multi-metal layered card |
US10089568B2 (en) | 2016-06-01 | 2018-10-02 | CPI Card Group—Colorado, Inc. | IC chip card with integrated biometric sensor pads |
EP3582973B1 (de) | 2017-02-14 | 2023-06-28 | CPI Card Group - Colorado, Inc. | Rand-zu-rand-metallkarte und herstellungsverfahren |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2505091A1 (fr) * | 1981-04-30 | 1982-11-05 | Cii Honeywell Bull | Dispositif de protection des circuits electroniques tels que des circuits integres a l'encontre des charges electrostatiques |
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
EP0128822B1 (de) * | 1983-06-09 | 1987-09-09 | Flonic S.A. | Verfahren zur Herstellung von Speicherkarten und hierdurch hergestellte Karten |
JPS6195486A (ja) * | 1984-10-17 | 1986-05-14 | Hitachi Ltd | Icカ−ド |
CH661808A5 (fr) * | 1985-01-21 | 1987-08-14 | Lupa Finances | Carte munie d'un microprocesseur et/ou d'au moins une memoire electronique. |
JPS62214998A (ja) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | 薄型半導体カ−ド |
JPH02598A (ja) * | 1987-10-09 | 1990-01-05 | De La Rue Co Plc:The | 集積回路カード |
US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
EP0339763A3 (de) * | 1988-04-28 | 1990-04-25 | Citizen Watch Co. Ltd. | IC-Karte |
DE9422424U1 (de) * | 1994-02-04 | 2002-02-21 | Giesecke & Devrient Gmbh | Chipkarte mit einem elektronischen Modul |
US5514862A (en) * | 1994-05-20 | 1996-05-07 | At&T Corp. | Portable data carrier |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
-
1996
- 1996-06-07 FR FR9607091A patent/FR2749687B1/fr not_active Expired - Fee Related
-
1997
- 1997-06-05 WO PCT/FR1997/000995 patent/WO1997048074A1/fr active IP Right Grant
- 1997-06-05 ES ES97927240T patent/ES2143313T3/es not_active Expired - Lifetime
- 1997-06-05 EP EP97927240A patent/EP0902927B1/de not_active Expired - Lifetime
- 1997-06-05 DE DE69701142T patent/DE69701142T2/de not_active Expired - Fee Related
- 1997-06-05 JP JP10500961A patent/JP2000511669A/ja active Pending
- 1997-06-05 US US09/194,766 patent/US6202931B1/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005038132A1 (de) * | 2005-08-11 | 2007-02-22 | Infineon Technologies Ag | Chipmodul und Chipkarte |
DE102005038132B4 (de) * | 2005-08-11 | 2008-04-03 | Infineon Technologies Ag | Chipmodul und Chipkarte |
US7605453B2 (en) | 2005-08-11 | 2009-10-20 | Infineon Technologies Ag | Chip module and chip card |
Also Published As
Publication number | Publication date |
---|---|
WO1997048074A1 (fr) | 1997-12-18 |
EP0902927B1 (de) | 2000-01-12 |
DE69701142D1 (de) | 2000-02-17 |
ES2143313T3 (es) | 2000-05-01 |
EP0902927A1 (de) | 1999-03-24 |
FR2749687A1 (fr) | 1997-12-12 |
US6202931B1 (en) | 2001-03-20 |
JP2000511669A (ja) | 2000-09-05 |
FR2749687B1 (fr) | 1998-07-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |