DE69635602D1 - Stützbehälter für dünne Scheiben - Google Patents

Stützbehälter für dünne Scheiben

Info

Publication number
DE69635602D1
DE69635602D1 DE69635602T DE69635602T DE69635602D1 DE 69635602 D1 DE69635602 D1 DE 69635602D1 DE 69635602 T DE69635602 T DE 69635602T DE 69635602 T DE69635602 T DE 69635602T DE 69635602 D1 DE69635602 D1 DE 69635602D1
Authority
DE
Germany
Prior art keywords
thin slices
support container
container
support
slices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69635602T
Other languages
English (en)
Other versions
DE69635602T2 (de
Inventor
Takeyoshi Kakizaki
Yukihiro Hyobu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miraial Co Ltd
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP15913695A external-priority patent/JPH098117A/ja
Priority claimed from JP1995006915U external-priority patent/JP3020287U/ja
Priority claimed from JP21055295A external-priority patent/JPH0964161A/ja
Priority claimed from JP21055395A external-priority patent/JPH0964162A/ja
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Publication of DE69635602D1 publication Critical patent/DE69635602D1/de
Application granted granted Critical
Publication of DE69635602T2 publication Critical patent/DE69635602T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1703—Introducing an auxiliary fluid into the mould
    • B29C45/1704—Introducing an auxiliary fluid into the mould the fluid being introduced into the interior of the injected material which is still in a molten state, e.g. for producing hollow articles
DE69635602T 1995-06-26 1996-02-19 Stützbehälter für dünne Scheiben Expired - Lifetime DE69635602T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP15913695A JPH098117A (ja) 1995-06-26 1995-06-26 薄板用支持容器
JP15913695 1995-06-26
JP691595U 1995-07-07
JP1995006915U JP3020287U (ja) 1995-07-07 1995-07-07 薄板用支持容器
JP21055295A JPH0964161A (ja) 1995-08-18 1995-08-18 薄板用支持容器
JP21055395A JPH0964162A (ja) 1995-08-18 1995-08-18 薄板用支持容器
JP21055295 1995-08-18
JP21055395 1995-08-18

Publications (2)

Publication Number Publication Date
DE69635602D1 true DE69635602D1 (de) 2006-01-26
DE69635602T2 DE69635602T2 (de) 2006-07-13

Family

ID=33303980

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69635602T Expired - Lifetime DE69635602T2 (de) 1995-06-26 1996-02-19 Stützbehälter für dünne Scheiben

Country Status (4)

Country Link
US (1) US5782361A (de)
EP (4) EP1480256B1 (de)
DE (1) DE69635602T2 (de)
TW (1) TW296361B (de)

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JP3423512B2 (ja) * 1995-11-27 2003-07-07 信越ポリマー株式会社 精密基板用カセットの製造方法および精密基板用カセット
US5874767A (en) * 1996-05-14 1999-02-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including a lateral power device
US6776289B1 (en) 1996-07-12 2004-08-17 Entegris, Inc. Wafer container with minimal contact
US6214127B1 (en) * 1998-02-04 2001-04-10 Micron Technology, Inc. Methods of processing electronic device workpieces and methods of positioning electronic device workpieces within a workpiece carrier
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier
FR2785270B1 (fr) * 1998-10-30 2001-01-19 St Microelectronics Sa Cassette de transport de plaquettes de semiconducteur
US6455395B1 (en) * 2000-06-30 2002-09-24 Integrated Materials, Inc. Method of fabricating silicon structures including fixtures for supporting wafers
US6386655B1 (en) * 2000-10-04 2002-05-14 Rgt Design, Incorporated Disc storage device with self-aligning slots
JP2003201148A (ja) * 2001-10-31 2003-07-15 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板の化学強化用ホルダー
US7522762B2 (en) * 2003-04-16 2009-04-21 Inverness Medical-Biostar, Inc. Detection, resolution, and identification of arrayed elements
US7017758B2 (en) * 2003-07-09 2006-03-28 Chartered Semiconductor Manufacturing Ltd. Wafer protective cassette
TWI337160B (en) 2003-10-09 2011-02-11 Entegris Inc Shipper with tooth design for improved loading
GB0416744D0 (en) * 2004-07-27 2004-09-01 Clearwater Innovations Ltd Disc cartridge
WO2006011609A1 (en) * 2004-07-30 2006-02-02 Showa Denko K.K. Magnetic disk case
US20060027171A1 (en) * 2004-08-06 2006-02-09 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer boat for reducing wafer warpage
CN102130033B (zh) * 2005-07-08 2014-05-14 交叉自动控制公司 工件支撑结构及其使用设备
TWI316040B (en) * 2006-11-10 2009-10-21 Innolux Display Corp Packing box for glass substrate and a package structure of a glass substrate using the same
JP4745209B2 (ja) * 2006-12-13 2011-08-10 信越ポリマー株式会社 基板用キャリア
TW200845265A (en) * 2007-05-10 2008-11-16 Nanya Technology Corp Wafer supporter
JP2009010119A (ja) * 2007-06-27 2009-01-15 Elpida Memory Inc 基板収容容器
KR101525753B1 (ko) * 2008-01-13 2015-06-09 엔테그리스, 아이엔씨. 큰 지름의 웨이퍼를 취급하는 장치 및 방법
CN105225686A (zh) * 2009-11-18 2016-01-06 恩特格林斯公司 通用磁盘装运器
JP6018075B2 (ja) 2011-11-08 2016-11-02 ミライアル株式会社 ウェーハ収納容器
CN203921653U (zh) * 2014-06-23 2014-11-05 成都京东方光电科技有限公司 显示面板包装箱
CN205770933U (zh) * 2015-07-27 2016-12-07 盟立自动化股份有限公司 用以承载平板构件的卡匣结构
KR20210044849A (ko) * 2018-09-20 2021-04-23 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램
WO2020089986A1 (ja) * 2018-10-29 2020-05-07 ミライアル株式会社 基板収納容器の成形方法、金型、及び、基板収納容器
CN112786500A (zh) * 2019-11-11 2021-05-11 夏泰鑫半导体(青岛)有限公司 晶圆架及具有晶圆架的垂直晶舟
CN111081614B (zh) * 2019-12-27 2022-09-30 上海至纯洁净系统科技股份有限公司 一种晶圆片承载装置

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US1900053A (en) * 1928-11-22 1933-03-07 United Shoe Machinery Corp Rack
US3751629A (en) * 1957-07-24 1973-08-07 P Eisler Surface heating device
US2944696A (en) * 1958-11-24 1960-07-12 Effgen Anton Grid tray
US3573430A (en) * 1966-12-30 1971-04-06 Paul Eisler Surface heating device
US3723823A (en) * 1971-11-30 1973-03-27 Gen Electric Printed circuit board guide
US3733523A (en) * 1972-02-11 1973-05-15 Ampex Electronic circuit card cage
US4043451A (en) * 1976-03-18 1977-08-23 Fluoroware, Inc. Shipping container for silicone semiconductor wafers
US4135625A (en) * 1976-07-12 1979-01-23 Merrill Kenneth V Multi-compartment container for fragile disks
DE2702464C2 (de) * 1977-01-21 1981-10-15 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verpackung von Halbleiterscheiben
CA1049662A (en) * 1977-01-25 1979-02-27 Michael J. E. Gillissie Apparatus and method for transferring semiconductor wafers
US4153164A (en) * 1978-06-13 1979-05-08 Kasper Instruments, Inc. Carrier for semiconductive wafers
JPS57141928A (en) * 1981-01-15 1982-09-02 Fluoroware Inc Wafer treating container
JPS5896749A (ja) * 1981-12-03 1983-06-08 Nec Kyushu Ltd 半導体基板の製造装置
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US4724963A (en) * 1985-02-20 1988-02-16 Empak, Inc. Wafer processing cassette
DE3539887A1 (de) * 1985-11-11 1987-05-21 Didier Werke Ag Halterahmen fuer katalysatorplatten
JPS6380848A (ja) * 1986-09-25 1988-04-11 Nippon Shokubai Kagaku Kogyo Co Ltd 高圧メタン系燃料の燃焼用触媒システムおよびそれを用いた燃焼方法
JPH0788025B2 (ja) * 1987-04-28 1995-09-27 三菱瓦斯化学株式会社 偏肉補強部構造を有する合成樹脂成形品の製造法
JPH0715936B2 (ja) * 1987-05-27 1995-02-22 株式会社日立製作所 ウェハ用キャリヤ
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JP2871701B2 (ja) * 1988-12-14 1999-03-17 日本電気株式会社 半導体ウェーハ用キャリア
JPH02174244A (ja) * 1988-12-27 1990-07-05 Tomuko:Kk ウェハキャリア用治具枠およびウェハ移換装置
JPH02209746A (ja) * 1989-02-09 1990-08-21 Seiko Epson Corp 基板収納箱
JP3057684B2 (ja) * 1989-05-09 2000-07-04 淀川化成株式会社 ガラス基板用カセット
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JPH04179146A (ja) * 1990-11-09 1992-06-25 Toshiba Ceramics Co Ltd 半導体ウェハ収納ケース
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JP2791971B2 (ja) * 1994-06-17 1998-08-27 信越ポリマー株式会社 ウェーハ収納容器におけるウェーハバスケット
JP3423512B2 (ja) * 1995-11-27 2003-07-07 信越ポリマー株式会社 精密基板用カセットの製造方法および精密基板用カセット

Also Published As

Publication number Publication date
EP1494266A1 (de) 2005-01-05
EP0751551B1 (de) 2005-12-21
US5782361A (en) 1998-07-21
EP1480256A2 (de) 2004-11-24
TW296361B (de) 1997-01-21
EP1480256A3 (de) 2004-12-15
EP1480256B1 (de) 2006-09-27
EP1494266B1 (de) 2009-09-23
EP0751551A2 (de) 1997-01-02
EP1480255A3 (de) 2004-12-08
EP0751551A3 (de) 2000-10-11
DE69635602T2 (de) 2006-07-13
EP1480255A2 (de) 2004-11-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition