DE69633841D1 - Methode und Apparat zur lokalen Temperaturmessung für hochauflösende in-situ Messung - Google Patents

Methode und Apparat zur lokalen Temperaturmessung für hochauflösende in-situ Messung

Info

Publication number
DE69633841D1
DE69633841D1 DE69633841T DE69633841T DE69633841D1 DE 69633841 D1 DE69633841 D1 DE 69633841D1 DE 69633841 T DE69633841 T DE 69633841T DE 69633841 T DE69633841 T DE 69633841T DE 69633841 D1 DE69633841 D1 DE 69633841D1
Authority
DE
Germany
Prior art keywords
measurement
resolution
local temperature
measured
parameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69633841T
Other languages
English (en)
Other versions
DE69633841T2 (de
Inventor
Ceuninck Ward De
Jean Roggen
Lambert Stals
Schepper Luc De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LIMBURGS UNI CT DIEPENBEEK
Hasselt Universiteit
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
LIMBURGS UNI CT DIEPENBEEK
Hasselt Universiteit
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LIMBURGS UNI CT DIEPENBEEK, Hasselt Universiteit, Interuniversitair Microelektronica Centrum vzw IMEC filed Critical LIMBURGS UNI CT DIEPENBEEK
Application granted granted Critical
Publication of DE69633841D1 publication Critical patent/DE69633841D1/de
Publication of DE69633841T2 publication Critical patent/DE69633841T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/32—Compensating for temperature change
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G01R31/013—Testing passive components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
DE69633841T 1995-03-24 1996-03-25 Methode und Apparat zur lokalen Temperaturmessung für hochauflösende in-situ Messung Expired - Lifetime DE69633841T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95200747 1995-03-24
EP95200747 1995-03-24

Publications (2)

Publication Number Publication Date
DE69633841D1 true DE69633841D1 (de) 2004-12-23
DE69633841T2 DE69633841T2 (de) 2005-11-24

Family

ID=8220126

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69633841T Expired - Lifetime DE69633841T2 (de) 1995-03-24 1996-03-25 Methode und Apparat zur lokalen Temperaturmessung für hochauflösende in-situ Messung

Country Status (3)

Country Link
US (2) US5833365A (de)
AT (1) ATE282833T1 (de)
DE (1) DE69633841T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6360621B1 (en) * 1999-06-25 2002-03-26 Venturedyne, Ltd. Environmental testing chamber
US6636062B2 (en) * 2001-04-10 2003-10-21 Delta Design, Inc. Temperature control device for an electronic component
US7066038B2 (en) * 2002-04-15 2006-06-27 Amebis Intellectual Properties Limited Material stability test system
US7137544B2 (en) * 2002-12-13 2006-11-21 General Electric Company Apparatus and method for performing welding at elevated temperature
US8237386B2 (en) 2003-08-15 2012-08-07 Apple Inc. Methods and apparatuses for operating a data processing system
US7562234B2 (en) 2005-08-25 2009-07-14 Apple Inc. Methods and apparatuses for dynamic power control
US8374730B2 (en) * 2005-08-25 2013-02-12 Apple Inc. Methods and apparatuses for dynamic thermal control
CN1978060A (zh) * 2005-12-02 2007-06-13 鸿富锦精密工业（深圳）有限公司 环测实验装置
DE102006052746A1 (de) * 2006-08-16 2008-02-21 Rohde & Schwarz Gmbh & Co. Kg Verfahren zur Analyse von Auswirkungen äußerer Einflüsse auf elektrische Schaltungen und Analysevorrichtung
JP5050241B2 (ja) * 2007-01-29 2012-10-17 株式会社Ｋｅｌｋ 流体温調装置
US7949889B2 (en) * 2008-01-07 2011-05-24 Apple Inc. Forced idle of a data processing system
US7949888B2 (en) * 2008-01-07 2011-05-24 Apple Inc. Forced idle of a data processing system
US8315746B2 (en) 2008-05-30 2012-11-20 Apple Inc. Thermal management techniques in an electronic device
US8306772B2 (en) 2008-10-13 2012-11-06 Apple Inc. Method for estimating temperature at a critical point
FR2964455B1 (fr) * 2010-09-03 2013-07-12 Saint Gobain Rech Procede et dispositif de determination du coefficient de deperdition thermique d'un local
US10551423B1 (en) * 2015-01-13 2020-02-04 The United States Of America As Represented By The Secretary Of The Army System and method for simultaneous testing of radiation, environmental and electrical reliability of multiple semiconductor electrical devices
FR3032529B1 (fr) * 2015-02-06 2019-06-07 Saint-Gobain Isover Determination de la resistance thermique d'une paroi
US10605857B2 (en) * 2017-05-24 2020-03-31 Rohde & Schwarz Gmbh & Co. Kg Anechoic chamber for testing a device under test
CN108459498A (zh) * 2018-02-02 2018-08-28 中国工程物理研究院化工材料研究所 高温高压反应釜宽温域高精度控温系统及控制方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US32625A (en) * 1861-06-25 Ltjdwig august hoffmann
US3530377A (en) * 1968-05-22 1970-09-22 Winslow Tele Tronics Inc Test means for determining the frequency stability of piezoelectric crystals
US3842346A (en) * 1972-12-20 1974-10-15 C Bobbitt Continuity testing of solid state circuitry during temperature cycling
JPS5479085A (en) * 1977-12-05 1979-06-23 Matsushita Electric Ind Co Ltd Temperature measuring apparatus
US4370615A (en) * 1980-10-14 1983-01-25 The Perkin-Elmer Corporation High speed temperature controlled electrometer
DE3212611A1 (de) * 1982-04-05 1983-10-06 Bosch Gmbh Robert Verfahren zur temperaturkompensation eines sensorsignales
CA1272779A (en) * 1985-03-04 1990-08-14 Toshiaki Mizuta Sensor with periodic heating
JP2928526B2 (ja) * 1989-02-10 1999-08-03 株式会社日本自動車部品総合研究所 電源回路及び前記回路を備えるブリッジ型測定器出力補償回路
NL8902891A (nl) * 1989-04-19 1990-11-16 Imec Inter Uni Micro Electr Werkwijze en inrichting voor het versneld bepalen van de veroudering van een of meer elementen met een electromagnetische verouderingsparameter.
US5032727A (en) * 1990-09-14 1991-07-16 Digital Equipment Corporation Product defect detection using thermal ratio analysis
US5336640A (en) * 1991-01-28 1994-08-09 Kawasaki Steel Corporation Method of manufacturing a semiconductor device having an insulating layer composed of a BPSG film and a plasma-CVD silicon nitride film
CA2073899A1 (en) * 1991-07-19 1993-01-20 Tatsuya Hashinaga Burn-in apparatus and method
US5224775C2 (en) * 1992-03-02 2002-04-23 Ta Instr Inc Method and apparatus for modulated differential analysis
GB9503274D0 (en) * 1995-02-21 1995-04-12 Sun Electric Uk Ltd Method and apparatus for machine diagnosis

Also Published As

Publication number Publication date
DE69633841T2 (de) 2005-11-24
ATE282833T1 (de) 2004-12-15
US5833365A (en) 1998-11-10
US5915838A (en) 1999-06-29

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