DE69527406D1 - Suspension zum Gemisch-mechanisch Polieren von Metallschichten - Google Patents

Suspension zum Gemisch-mechanisch Polieren von Metallschichten

Info

Publication number
DE69527406D1
DE69527406D1 DE69527406T DE69527406T DE69527406D1 DE 69527406 D1 DE69527406 D1 DE 69527406D1 DE 69527406 T DE69527406 T DE 69527406T DE 69527406 T DE69527406 T DE 69527406T DE 69527406 D1 DE69527406 D1 DE 69527406D1
Authority
DE
Germany
Prior art keywords
mechanical polishing
suspension
mixture
metal layers
slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69527406T
Other languages
English (en)
Other versions
DE69527406T2 (de
Inventor
David J Fluch
Cheng-Hung Hung
Michael A Lucarelli
Matthew Neville
Debra Lynn Scherber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23241322&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69527406(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of DE69527406D1 publication Critical patent/DE69527406D1/de
Publication of DE69527406T2 publication Critical patent/DE69527406T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00Brightening metals by chemical means
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1436Composite particles, e.g. coated particles
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/32115Planarisation
    • H01L21/3212Planarisation by chemical mechanical polishing [CMP]
DE69527406T 1994-10-06 1995-10-03 Suspension zum Gemisch-mechanisch Polieren von Metallschichten Expired - Lifetime DE69527406T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/319,213 US5527423A (en) 1994-10-06 1994-10-06 Chemical mechanical polishing slurry for metal layers

Publications (2)

Publication Number Publication Date
DE69527406D1 true DE69527406D1 (de) 2002-08-22
DE69527406T2 DE69527406T2 (de) 2003-03-13

Family

ID=23241322

Family Applications (2)

Application Number Title Priority Date Filing Date
DE0708160T Pending DE708160T1 (de) 1994-10-06 1995-10-03 Suspension zum Gemisch-mechanisch Polieren von Metallschichten
DE69527406T Expired - Lifetime DE69527406T2 (de) 1994-10-06 1995-10-03 Suspension zum Gemisch-mechanisch Polieren von Metallschichten

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE0708160T Pending DE708160T1 (de) 1994-10-06 1995-10-03 Suspension zum Gemisch-mechanisch Polieren von Metallschichten

Country Status (13)

Country Link
US (1) US5527423A (de)
EP (1) EP0708160B1 (de)
JP (1) JP3377892B2 (de)
KR (1) KR100362141B1 (de)
CN (1) CN1074035C (de)
AT (1) ATE220711T1 (de)
AU (1) AU3549495A (de)
DE (2) DE708160T1 (de)
ES (1) ES2159495T3 (de)
HK (1) HK1004666A1 (de)
IL (1) IL115454A (de)
MY (1) MY112735A (de)
WO (1) WO1996011082A1 (de)

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* Cited by examiner, † Cited by third party
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ATE220711T1 (de) 2002-08-15
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AU3549495A (en) 1996-05-02
DE708160T1 (de) 2001-10-11
WO1996011082A1 (en) 1996-04-18
EP0708160A3 (de) 1997-06-11
KR100362141B1 (ko) 2003-02-11
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HK1004666A1 (en) 1998-12-04
EP0708160B1 (de) 2002-07-17
ES2159495T1 (es) 2001-10-16
CN1166805A (zh) 1997-12-03
JPH08197414A (ja) 1996-08-06
EP0708160A2 (de) 1996-04-24
JP3377892B2 (ja) 2003-02-17
ES2159495T3 (es) 2003-03-16

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