DE69521426T2 - Temperaturmanagement für integrierte schaltungen - Google Patents

Temperaturmanagement für integrierte schaltungen

Info

Publication number
DE69521426T2
DE69521426T2 DE69521426T DE69521426T DE69521426T2 DE 69521426 T2 DE69521426 T2 DE 69521426T2 DE 69521426 T DE69521426 T DE 69521426T DE 69521426 T DE69521426 T DE 69521426T DE 69521426 T2 DE69521426 T2 DE 69521426T2
Authority
DE
Germany
Prior art keywords
temperature
clock rate
lowered
integrated circuits
operating voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69521426T
Other languages
English (en)
Other versions
DE69521426D1 (de
Inventor
Dan Kikinis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELONEX TECHNOLOGIES Inc
Original Assignee
ELONEX TECHNOLOGIES Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELONEX TECHNOLOGIES Inc filed Critical ELONEX TECHNOLOGIES Inc
Application granted granted Critical
Publication of DE69521426D1 publication Critical patent/DE69521426D1/de
Publication of DE69521426T2 publication Critical patent/DE69521426T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0207Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • H01L27/0211Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique adapted for requirements of temperature
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/1919Control of temperature characterised by the use of electric means characterised by the type of controller
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/72Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
    • H04M1/725Cordless telephones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M3/00Automatic or semi-automatic exchanges
    • H04M3/42Systems providing special services or facilities to subscribers
    • H04M3/42314Systems providing special services or facilities to subscribers in private branch exchanges
    • H04M3/42323PBX's with CTI arrangements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/0008Connection or combination of a still picture apparatus with another apparatus
    • H04N2201/0034Details of the connection, e.g. connector, interface
    • H04N2201/0048Type of connection
    • H04N2201/0049By wire, cable or the like
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/0008Connection or combination of a still picture apparatus with another apparatus
    • H04N2201/0034Details of the connection, e.g. connector, interface
    • H04N2201/0048Type of connection
    • H04N2201/0051Card-type connector, e.g. PCMCIA card interface
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/0008Connection or combination of a still picture apparatus with another apparatus
    • H04N2201/0034Details of the connection, e.g. connector, interface
    • H04N2201/0048Type of connection
    • H04N2201/0053Optical, e.g. using an infrared link
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management
DE69521426T 1994-04-28 1995-04-21 Temperaturmanagement für integrierte schaltungen Expired - Fee Related DE69521426T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/234,344 US5502838A (en) 1994-04-28 1994-04-28 Temperature management for integrated circuits
PCT/US1995/004919 WO1995030200A1 (en) 1994-04-28 1995-04-21 Temperature management for integrated circuits

Publications (2)

Publication Number Publication Date
DE69521426D1 DE69521426D1 (de) 2001-07-26
DE69521426T2 true DE69521426T2 (de) 2002-05-16

Family

ID=22880978

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69521426T Expired - Fee Related DE69521426T2 (de) 1994-04-28 1995-04-21 Temperaturmanagement für integrierte schaltungen

Country Status (6)

Country Link
US (1) US5502838A (de)
EP (1) EP0757821B1 (de)
JP (1) JP3253969B2 (de)
AT (1) ATE202427T1 (de)
DE (1) DE69521426T2 (de)
WO (1) WO1995030200A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1569056A2 (de) * 2004-02-27 2005-08-31 Endress + Hauser GmbH + Co. KG Verfahren zum Betreiben eines Feldgerätes der Automatisierungstechnik
DE102013004795A1 (de) * 2012-03-21 2013-09-26 Gabriele Trinkel System und Verfahren zum erzeugen von thermische Hot Spot zur Generierung von Zufallszahlen mit thermischen Rauschquellen im Cloud Computing

Families Citing this family (174)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848054B1 (en) * 1989-10-30 2005-01-25 Texas Instruments Incorporated Real-time computer thermal management and power conservation
US6158012A (en) * 1989-10-30 2000-12-05 Texas Instruments Incorporated Real-time power conservation and thermal management for computers
US7194646B1 (en) * 1989-10-30 2007-03-20 Texas Instruments Incorporated Real-time thermal management for computers
US5721837A (en) * 1993-10-28 1998-02-24 Elonex I.P. Holdings, Ltd. Micro-personal digital assistant including a temperature managed CPU
US5586250A (en) * 1993-11-12 1996-12-17 Conner Peripherals, Inc. SCSI-coupled module for monitoring and controlling SCSI-coupled raid bank and bank environment
US7167993B1 (en) 1994-06-20 2007-01-23 Thomas C Douglass Thermal and power management for computer systems
US5752011A (en) * 1994-06-20 1998-05-12 Thomas; C. Douglas Method and system for controlling a processor's clock frequency in accordance with the processor's temperature
WO1996039714A1 (en) * 1995-06-06 1996-12-12 International Business Machines Corporation Method for reducing a transient thermal mismatch
US5713030A (en) * 1995-10-11 1998-01-27 Vlsi Technology, Inc. Thermal management device and method for a computer processor
US7822996B2 (en) * 1995-12-07 2010-10-26 Texas Instruments Incorporated Method for implementing thermal management in a processor and/or apparatus and/or system employing the same
US7266725B2 (en) * 2001-09-03 2007-09-04 Pact Xpp Technologies Ag Method for debugging reconfigurable architectures
US5805403A (en) * 1996-03-28 1998-09-08 3Com Ltd. Integrated circuit temperature monitoring and protection system
US5798918A (en) * 1996-04-29 1998-08-25 International Business Machines Corporation Performance-temperature optimization by modulating the switching factor of a circuit
US5940785A (en) * 1996-04-29 1999-08-17 International Business Machines Corporation Performance-temperature optimization by cooperatively varying the voltage and frequency of a circuit
US6785826B1 (en) * 1996-07-17 2004-08-31 International Business Machines Corporation Self power audit and control circuitry for microprocessor functional units
US6000036A (en) * 1996-07-17 1999-12-07 International Business Machines Corp. Logical steering to avoid hot spots on integrated circuits
US6058012A (en) * 1996-08-26 2000-05-02 Compaq Computer Corporation Apparatus, method and system for thermal management of an electronic system having semiconductor devices
JPH10116133A (ja) 1996-10-11 1998-05-06 Fujitsu Ltd 携帯情報機器
US5940786A (en) * 1996-11-22 1999-08-17 Eaton Corporation Temperature regulated clock rate for microprocessors
DE19654595A1 (de) 1996-12-20 1998-07-02 Pact Inf Tech Gmbh I0- und Speicherbussystem für DFPs sowie Bausteinen mit zwei- oder mehrdimensionaler programmierbaren Zellstrukturen
US5832284A (en) * 1996-12-23 1998-11-03 International Business Machines Corporation Self regulating temperature/performance/voltage scheme for micros (X86)
JP3961028B2 (ja) * 1996-12-27 2007-08-15 ペーアーツェーテー イクスペーペー テクノロジーズ アクチエンゲゼルシャフト データフロープロセッサ(dfp)の自動的なダイナミックアンロード方法並びに2次元または3次元のプログラミング可能なセルストラクチャを有するモジュール(fpga,dpga等)
US6542998B1 (en) 1997-02-08 2003-04-01 Pact Gmbh Method of self-synchronization of configurable elements of a programmable module
US5948106A (en) * 1997-06-25 1999-09-07 Sun Microsystems, Inc. System for thermal overload detection and prevention for an integrated circuit processor
US6928559B1 (en) * 1997-06-27 2005-08-09 Broadcom Corporation Battery powered device with dynamic power and performance management
JPH1139868A (ja) * 1997-07-18 1999-02-12 Matsushita Electric Ind Co Ltd 半導体集積回路システム、半導体集積回路、及び半導体集積回路システムの駆動方法
US9092595B2 (en) 1997-10-08 2015-07-28 Pact Xpp Technologies Ag Multiprocessor having associated RAM units
US8686549B2 (en) * 2001-09-03 2014-04-01 Martin Vorbach Reconfigurable elements
DE19861088A1 (de) 1997-12-22 2000-02-10 Pact Inf Tech Gmbh Verfahren zur Reparatur von integrierten Schaltkreisen
DE19812921A1 (de) * 1998-03-24 1999-09-30 Siemens Ag VLSI-Schaltung mit Temperaturüberwachung
US6141762A (en) * 1998-08-03 2000-10-31 Nicol; Christopher J. Power reduction in a multiprocessor digital signal processor based on processor load
US6408334B1 (en) 1999-01-13 2002-06-18 Dell Usa, L.P. Communications system for multiple computer system management circuits
US6272643B1 (en) 1999-01-25 2001-08-07 Dell Usa, L.P. Electronic component desired voltage level comparison
US6397343B1 (en) * 1999-03-19 2002-05-28 Microsoft Corporation Method and system for dynamic clock frequency adjustment for a graphics subsystem in a computer
JP3049051B1 (ja) * 1999-03-31 2000-06-05 新潟日本電気株式会社 中央処理装置の温度制御回路
CN1378665A (zh) 1999-06-10 2002-11-06 Pact信息技术有限公司 编程概念
US7100061B2 (en) 2000-01-18 2006-08-29 Transmeta Corporation Adaptive power control
JP2004506261A (ja) 2000-06-13 2004-02-26 ペーアーツェーテー イクスペーペー テクノロジーズ アクチエンゲゼルシャフト パイプラインctプロトコルおよびct通信
US6968469B1 (en) 2000-06-16 2005-11-22 Transmeta Corporation System and method for preserving internal processor context when the processor is powered down and restoring the internal processor context when processor is restored
US6718474B1 (en) * 2000-09-21 2004-04-06 Stratus Technologies Bermuda Ltd. Methods and apparatus for clock management based on environmental conditions
US8058899B2 (en) 2000-10-06 2011-11-15 Martin Vorbach Logic cell array and bus system
US7260731B1 (en) 2000-10-23 2007-08-21 Transmeta Corporation Saving power when in or transitioning to a static mode of a processor
US20020087903A1 (en) * 2000-12-29 2002-07-04 James Hermerding Mechanism for managing power generated in a computer system
US7596709B2 (en) * 2000-12-30 2009-09-29 Intel Corporation CPU power management based on utilization with lowest performance mode at the mid-utilization range
US6895520B1 (en) 2001-03-02 2005-05-17 Advanced Micro Devices, Inc. Performance and power optimization via block oriented performance measurement and control
US20090210653A1 (en) * 2001-03-05 2009-08-20 Pact Xpp Technologies Ag Method and device for treating and processing data
US10331194B2 (en) * 2001-03-05 2019-06-25 Pact Xpp Schweiz Ag Methods and devices for treating and processing data
US9037807B2 (en) 2001-03-05 2015-05-19 Pact Xpp Technologies Ag Processor arrangement on a chip including data processing, memory, and interface elements
US7444531B2 (en) * 2001-03-05 2008-10-28 Pact Xpp Technologies Ag Methods and devices for treating and processing data
US9552047B2 (en) * 2001-03-05 2017-01-24 Pact Xpp Technologies Ag Multiprocessor having runtime adjustable clock and clock dependent power supply
US6836849B2 (en) * 2001-04-05 2004-12-28 International Business Machines Corporation Method and apparatus for controlling power and performance in a multiprocessing system according to customer level operational requirements
US7346048B1 (en) 2001-07-31 2008-03-18 Lsi Logic Corporation Efficient high density voice processor
US6912217B1 (en) 2001-07-31 2005-06-28 Lsi Logic Corporation Protocol stack encapsulation for voice processor
US7996827B2 (en) 2001-08-16 2011-08-09 Martin Vorbach Method for the translation of programs for reconfigurable architectures
US7434191B2 (en) * 2001-09-03 2008-10-07 Pact Xpp Technologies Ag Router
US8686475B2 (en) * 2001-09-19 2014-04-01 Pact Xpp Technologies Ag Reconfigurable elements
US7111178B2 (en) * 2001-09-28 2006-09-19 Intel Corporation Method and apparatus for adjusting the voltage and frequency to minimize power dissipation in a multiprocessor system
US6859886B1 (en) 2001-10-02 2005-02-22 Lsi Logic Corporation IO based embedded processor clock speed control
US6892312B1 (en) * 2001-10-30 2005-05-10 Lsi Logic Corporation Power monitoring and reduction for embedded IO processors
US7003563B2 (en) * 2001-11-02 2006-02-21 Hewlett-Packard Development Company, L.P. Remote management system for multiple servers
US6804632B2 (en) 2001-12-06 2004-10-12 Intel Corporation Distribution of processing activity across processing hardware based on power consumption considerations
US6889332B2 (en) * 2001-12-11 2005-05-03 Advanced Micro Devices, Inc. Variable maximum die temperature based on performance state
EP1470478A2 (de) * 2002-01-18 2004-10-27 PACT XPP Technologies AG Verfahren und gerät zum partitionieren von grossen rechnerprogrammen
WO2003060747A2 (de) 2002-01-19 2003-07-24 Pact Xpp Technologies Ag Reconfigurierbarer prozessor
US7036030B1 (en) * 2002-02-07 2006-04-25 Advanced Micro Devices, Inc. Computer system and method of using temperature measurement readings to detect user activity and to adjust processor performance
US6957352B2 (en) * 2002-03-15 2005-10-18 Intel Corporation Processor temperature control interface
US8914590B2 (en) 2002-08-07 2014-12-16 Pact Xpp Technologies Ag Data processing method and device
US20070011433A1 (en) * 2003-04-04 2007-01-11 Martin Vorbach Method and device for data processing
US20110161977A1 (en) * 2002-03-21 2011-06-30 Martin Vorbach Method and device for data processing
US7336090B1 (en) 2002-04-16 2008-02-26 Transmeta Corporation Frequency specific closed loop feedback control of integrated circuits
US7941675B2 (en) * 2002-12-31 2011-05-10 Burr James B Adaptive power control
US7180322B1 (en) 2002-04-16 2007-02-20 Transmeta Corporation Closed loop feedback control of integrated circuits
US7086058B2 (en) * 2002-06-06 2006-08-01 International Business Machines Corporation Method and apparatus to eliminate processor core hot spots
US6908227B2 (en) * 2002-08-23 2005-06-21 Intel Corporation Apparatus for thermal management of multiple core microprocessors
US6786639B2 (en) * 2002-08-30 2004-09-07 International Business Machines Corporation Device for sensing temperature of an electronic chip
WO2004038599A1 (de) 2002-09-06 2004-05-06 Pact Xpp Technologies Ag Rekonfigurierbare sequenzerstruktur
US7356474B2 (en) * 2002-09-19 2008-04-08 International Business Machines Corporation System and method for remotely enforcing operational protocols
US7013406B2 (en) 2002-10-14 2006-03-14 Intel Corporation Method and apparatus to dynamically change an operating frequency and operating voltage of an electronic device
US7076672B2 (en) * 2002-10-14 2006-07-11 Intel Corporation Method and apparatus for performance effective power throttling
US7882369B1 (en) 2002-11-14 2011-02-01 Nvidia Corporation Processor performance adjustment system and method
US7849332B1 (en) 2002-11-14 2010-12-07 Nvidia Corporation Processor voltage adjustment system and method
US7886164B1 (en) * 2002-11-14 2011-02-08 Nvidia Corporation Processor temperature adjustment system and method
US7219241B2 (en) * 2002-11-30 2007-05-15 Intel Corporation Method for managing virtual and actual performance states of logical processors in a multithreaded processor using system management mode
US7275012B2 (en) * 2002-12-30 2007-09-25 Intel Corporation Automated method and apparatus for processor thermal validation
US7786756B1 (en) 2002-12-31 2010-08-31 Vjekoslav Svilan Method and system for latchup suppression
US7642835B1 (en) 2003-11-12 2010-01-05 Robert Fu System for substrate potential regulation during power-up in integrated circuits
US7228242B2 (en) * 2002-12-31 2007-06-05 Transmeta Corporation Adaptive power control based on pre package characterization of integrated circuits
US7953990B2 (en) * 2002-12-31 2011-05-31 Stewart Thomas E Adaptive power control based on post package characterization of integrated circuits
US7949864B1 (en) 2002-12-31 2011-05-24 Vjekoslav Svilan Balanced adaptive body bias control
US7205758B1 (en) 2004-02-02 2007-04-17 Transmeta Corporation Systems and methods for adjusting threshold voltage
US7657772B2 (en) * 2003-02-13 2010-02-02 International Business Machines Corporation Thermally aware integrated circuit
US7082811B2 (en) * 2003-08-06 2006-08-01 Msp Corporation Cascade impactor with individually driven impactor plates
US7129771B1 (en) 2003-12-23 2006-10-31 Transmeta Corporation Servo loop for well bias voltage source
US7649402B1 (en) 2003-12-23 2010-01-19 Tien-Min Chen Feedback-controlled body-bias voltage source
US7012461B1 (en) 2003-12-23 2006-03-14 Transmeta Corporation Stabilization component for a substrate potential regulation circuit
US7692477B1 (en) 2003-12-23 2010-04-06 Tien-Min Chen Precise control component for a substrate potential regulation circuit
TWI309012B (en) * 2003-12-26 2009-04-21 Hon Hai Prec Ind Co Ltd System and method for measuring and recording temperature of central processing unit
US7859062B1 (en) * 2004-02-02 2010-12-28 Koniaris Kleanthes G Systems and methods for integrated circuits comprising multiple body biasing domains
US7816742B1 (en) 2004-09-30 2010-10-19 Koniaris Kleanthes G Systems and methods for integrated circuits comprising multiple body biasing domains
US7479753B1 (en) 2004-02-24 2009-01-20 Nvidia Corporation Fan speed controller
JP3830491B2 (ja) * 2004-03-29 2006-10-04 株式会社ソニー・コンピュータエンタテインメント プロセッサ、マルチプロセッサシステム、プロセッサシステム、情報処理装置および温度制御方法
US7123995B1 (en) * 2004-05-03 2006-10-17 Sun Microsystems, Inc. Dynamic circuit operation adjustment based on distributed on-chip temperature sensors
US7478253B2 (en) * 2004-05-21 2009-01-13 Intel Corporation Reduction of power consumption in electrical devices
US7730335B2 (en) 2004-06-10 2010-06-01 Marvell World Trade Ltd. Low power computer with main and auxiliary processors
US7330983B2 (en) * 2004-06-14 2008-02-12 Intel Corporation Temperature-aware steering mechanism
US7562233B1 (en) 2004-06-22 2009-07-14 Transmeta Corporation Adaptive control of operating and body bias voltages
US7774625B1 (en) 2004-06-22 2010-08-10 Eric Chien-Li Sheng Adaptive voltage control by accessing information stored within and specific to a microprocessor
US7451333B2 (en) * 2004-09-03 2008-11-11 Intel Corporation Coordinating idle state transitions in multi-core processors
US7966511B2 (en) 2004-07-27 2011-06-21 Intel Corporation Power management coordination in multi-core processors
US7664970B2 (en) 2005-12-30 2010-02-16 Intel Corporation Method and apparatus for a zero voltage processor sleep state
JP4262647B2 (ja) * 2004-07-30 2009-05-13 インターナショナル・ビジネス・マシーンズ・コーポレーション 情報処理装置、制御方法、プログラム、及び記録媒体
JP3914230B2 (ja) * 2004-11-04 2007-05-16 株式会社東芝 プロセッサシステム及びその制御方法
US7793291B2 (en) 2004-12-22 2010-09-07 International Business Machines Corporation Thermal management of a multi-processor computer system
US20060137377A1 (en) * 2004-12-29 2006-06-29 Samson Eric C Method and apparatus for external processor thermal control
US7878016B2 (en) * 2004-12-30 2011-02-01 Intel Corporation Device and method for on-die temperature measurement
US7197419B2 (en) * 2005-02-03 2007-03-27 International Business Machines Corporation System and method for thermal monitoring of IC using sampling periods of invariant duration
US7739531B1 (en) 2005-03-04 2010-06-15 Nvidia Corporation Dynamic voltage scaling
US7246022B2 (en) * 2005-06-20 2007-07-17 Intel Corporation Initiation of differential link retraining upon temperature excursion
JP2007102313A (ja) * 2005-09-30 2007-04-19 Toshiba Corp 制御装置およびマルチプロセッサ制御方法
US7455450B2 (en) * 2005-10-07 2008-11-25 Advanced Micro Devices, Inc. Method and apparatus for temperature sensing in integrated circuits
US8812169B2 (en) * 2005-10-31 2014-08-19 Hewlett-Packard Development Company, L.P. Heat sink verification
US7349762B2 (en) * 2005-11-10 2008-03-25 Kabushiki Kaisha Toshiba Systems and methods for thermal management
US7765825B2 (en) * 2005-12-16 2010-08-03 Intel Corporation Apparatus and method for thermal management of a memory device
DE102005061358B4 (de) * 2005-12-21 2008-08-21 Siemens Ag In ein Halbleitermaterial integrierter Schaltkreis mit Temperaturregelung und Verfahren zur Regelung der Temperatur eines einen integrierten Schaltkreis aufweisenden Halbleitermaterials
US8250503B2 (en) * 2006-01-18 2012-08-21 Martin Vorbach Hardware definition method including determining whether to implement a function as hardware or software
US20080011467A1 (en) * 2006-06-23 2008-01-17 Intel Corporation Method, apparatus and system for thermal management using power density feedback
US8051276B2 (en) * 2006-07-07 2011-11-01 International Business Machines Corporation Operating system thread scheduling for optimal heat dissipation
JP2008026948A (ja) * 2006-07-18 2008-02-07 Renesas Technology Corp 半導体集積回路
US7800879B2 (en) * 2006-07-27 2010-09-21 Agere Systems Inc. On-chip sensor array for temperature management in integrated circuits
US7653824B2 (en) * 2006-08-03 2010-01-26 Dell Products, Lp System and method of managing heat in multiple central processing units
US20080263324A1 (en) 2006-08-10 2008-10-23 Sehat Sutardja Dynamic core switching
US7949887B2 (en) 2006-11-01 2011-05-24 Intel Corporation Independent power control of processing cores
US7992151B2 (en) * 2006-11-30 2011-08-02 Intel Corporation Methods and apparatuses for core allocations
US7761191B1 (en) * 2006-12-12 2010-07-20 Nvidia Corporation Management of operation of an integrated circuit
DE102007025827A1 (de) * 2007-04-26 2008-10-30 Continental Teves Ag & Co. Ohg Integrierte Schaltungsanordnung für sicherheitskritische Regelungssysteme
US9134782B2 (en) 2007-05-07 2015-09-15 Nvidia Corporation Maintaining optimum voltage supply to match performance of an integrated circuit
US7487012B2 (en) * 2007-05-11 2009-02-03 International Business Machines Corporation Methods for thermal management of three-dimensional integrated circuits
EP2171489A2 (de) * 2007-07-19 2010-04-07 Nxp B.V. Semiadaptive spannungsskalierung für ein niedrigenergie-digital-vlsi-konzept
TWI470762B (zh) * 2007-07-27 2015-01-21 尼康股份有限公司 Laminated semiconductor device
US8949635B2 (en) * 2007-09-28 2015-02-03 Intel Corporation Integrated circuit performance improvement across a range of operating conditions and physical constraints
DE112008003643A5 (de) * 2007-11-17 2010-10-28 Krass, Maren Rekonfigurierbare Fliesskomma- und Bit- ebenen Datenverarbeitungseinheit
US20090138220A1 (en) * 2007-11-28 2009-05-28 Bell Jr Robert H Power-aware line intervention for a multiprocessor directory-based coherency protocol
US7870337B2 (en) * 2007-11-28 2011-01-11 International Business Machines Corporation Power-aware line intervention for a multiprocessor snoop coherency protocol
EP2217999A2 (de) * 2007-11-28 2010-08-18 Krass, Maren Compiler für rekonfigurierbare architekturen mit besonderem zwischenformat
US8266337B2 (en) * 2007-12-06 2012-09-11 International Business Machines Corporation Dynamic logical data channel assignment using channel bitmap
US20110119657A1 (en) * 2007-12-07 2011-05-19 Martin Vorbach Using function calls as compiler directives
US8370663B2 (en) 2008-02-11 2013-02-05 Nvidia Corporation Power management with dynamic frequency adjustments
US8064197B2 (en) * 2009-05-22 2011-11-22 Advanced Micro Devices, Inc. Heat management using power management information
US9256265B2 (en) 2009-12-30 2016-02-09 Nvidia Corporation Method and system for artificially and dynamically limiting the framerate of a graphics processing unit
US9830889B2 (en) 2009-12-31 2017-11-28 Nvidia Corporation Methods and system for artifically and dynamically limiting the display resolution of an application
US8810073B2 (en) 2010-05-13 2014-08-19 Blackberry Limited Selecting a power path based on temperature
US8839006B2 (en) 2010-05-28 2014-09-16 Nvidia Corporation Power consumption reduction systems and methods
US8424006B2 (en) * 2010-06-03 2013-04-16 International Business Machines Corporation Task assignment on heterogeneous three-dimensional/stacked microarchitectures
US8489217B2 (en) 2011-01-04 2013-07-16 International Business Machines Corporation Thermal cycling and gradient management in three-dimensional stacked architectures
US9490003B2 (en) * 2011-03-31 2016-11-08 Intel Corporation Induced thermal gradients
US9658678B2 (en) 2011-03-31 2017-05-23 Intel Corporation Induced thermal gradients
US9152517B2 (en) * 2011-04-21 2015-10-06 International Business Machines Corporation Programmable active thermal control
US8566538B2 (en) 2011-08-16 2013-10-22 International Business Machines Corporation Administering thermal distribution among memory modules with call stack frame size management
US9513884B2 (en) 2011-08-16 2016-12-06 International Business Machines Corporation Thermal-aware source code compilation
US8954017B2 (en) 2011-08-17 2015-02-10 Broadcom Corporation Clock signal multiplication to reduce noise coupled onto a transmission communication signal of a communications device
US9164898B2 (en) 2011-09-09 2015-10-20 International Business Machines Corporation Administering thermal distribution among memory modules of a computing system
US8909961B2 (en) 2011-11-29 2014-12-09 Ati Technologies Ulc Method and apparatus for adjusting power consumption level of an integrated circuit
US9304570B2 (en) 2011-12-15 2016-04-05 Intel Corporation Method, apparatus, and system for energy efficiency and energy conservation including power and performance workload-based balancing between multiple processing elements
WO2013095674A1 (en) 2011-12-23 2013-06-27 Intel Corporation Memory operations using system thermal sensor data
US9006000B2 (en) 2012-05-03 2015-04-14 Sandisk Technologies Inc. Tj temperature calibration, measurement and control of semiconductor devices
EP2682715B1 (de) * 2012-07-02 2015-03-11 Sensirion AG Tragbare elektronische Vorrichtung
EP2728327B1 (de) 2012-11-02 2020-02-19 Sensirion AG Tragbare elektronische Vorrichtung
EP2802128B1 (de) 2013-05-06 2018-07-11 Sensirion AG Selbstkalibrierender Temperatursensor in einem mobilen Endgerät
EP2801804B1 (de) 2013-05-06 2018-07-11 Sensirion AG Selbstkalibrierender Temperatursensor in einem mobilen Endgerät
EP2808652B1 (de) 2013-05-31 2016-11-16 Sensirion AG Tragbare elektronische Vorrichtung mit integriertem Temperatursensor welcher durch andere Sensordaten compensiert wird.
EP2910938B1 (de) 2014-02-25 2017-09-06 Sensirion AG Tragbare elektronische Vorrichtung
US10103714B2 (en) 2016-03-01 2018-10-16 Qualcomm Incorporated Adjust voltage for thermal mitigation
KR20200017260A (ko) * 2018-08-08 2020-02-18 삼성전자주식회사 외부 온도에 따라 선택된 프로세서의 클럭 속도를 이용하여 어플리케이션을 실행 시키는 방법 및 이를 포함하는 전자 장치
KR101994819B1 (ko) * 2019-04-16 2019-09-30 아주대학교 산학협력단 플립칩 본딩 패키지 기반의 마이크로 프로세서의 클럭 주파수 할당 장치, 방법 및 이를 이용한 마이크로 프로세서 시스템

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582607B2 (ja) * 1976-03-12 1983-01-18 パイオニア株式会社 温度検知回路
US4625128A (en) * 1985-09-23 1986-11-25 Gte Communication Systems Corp. Integrated circuit temperature sensor
US4918505A (en) * 1988-07-19 1990-04-17 Tektronix, Inc. Method of treating an integrated circuit to provide a temperature sensor that is integral therewith
JP2749925B2 (ja) * 1990-01-09 1998-05-13 株式会社リコー Ic温度センサ
JPH03233731A (ja) * 1990-02-09 1991-10-17 Nec Corp 温度異常処理方式
JPH05324111A (ja) * 1992-05-19 1993-12-07 Hudson Soft Co Ltd 広温度範囲動作システム用電源装置
US5315214A (en) * 1992-06-10 1994-05-24 Metcal, Inc. Dimmable high power factor high-efficiency electronic ballast controller integrated circuit with automatic ambient over-temperature shutdown
JPH06112425A (ja) * 1992-09-25 1994-04-22 Fujitsu Ltd 集積回路装置
US5287292A (en) * 1992-10-16 1994-02-15 Picopower Technology, Inc. Heat regulator for integrated circuits
US5359234A (en) * 1993-02-01 1994-10-25 Codex, Corp. Circuit and method of sensing process and temperature variation in an integrated circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1569056A2 (de) * 2004-02-27 2005-08-31 Endress + Hauser GmbH + Co. KG Verfahren zum Betreiben eines Feldgerätes der Automatisierungstechnik
DE102004010096A1 (de) * 2004-02-27 2005-09-15 Endress + Hauser Gmbh + Co. Kg Verfahren zum Betreiben eines Feldgerätes der Automatisierungstechnik
EP1569056A3 (de) * 2004-02-27 2010-01-27 Endress + Hauser GmbH + Co. KG Verfahren zum Betreiben eines Feldgerätes der Automatisierungstechnik
DE102013004795A1 (de) * 2012-03-21 2013-09-26 Gabriele Trinkel System und Verfahren zum erzeugen von thermische Hot Spot zur Generierung von Zufallszahlen mit thermischen Rauschquellen im Cloud Computing

Also Published As

Publication number Publication date
EP0757821B1 (de) 2001-06-20
WO1995030200A1 (en) 1995-11-09
US5502838A (en) 1996-03-26
ATE202427T1 (de) 2001-07-15
JPH09512654A (ja) 1997-12-16
DE69521426D1 (de) 2001-07-26
EP0757821A1 (de) 1997-02-12
EP0757821A4 (de) 1997-08-13
JP3253969B2 (ja) 2002-02-04

Similar Documents

Publication Publication Date Title
DE69521426D1 (de) Temperaturmanagement für integrierte schaltungen
EP1988443A3 (de) Durch Wechselstromstörung hervorgerufene Schwebe
DE69533762D1 (de) Leistungssteuerungseinheit für Computersystem
KR960009818A (ko) 신뢰성 향상을 위해 전자 칩의 온도를 모니터하고 제어하는 디바이스
IT8467348A1 (it) Dispositivo di inpresso e di controllo ausiliario sensibile al tatto per sistemi di elaboratori elettronici provvisti di unita' di visualizzazione.
ATE528729T1 (de) Verfahren und system zur vermittlung plattformunabhängiger fernsteurervorrichtung und zur überwachung der einrichtungszugriffskontrolle
DE60228928D1 (de) Steuerung der dynamischen Leistungsaufnahme in integrierten Schaltungen
KR970059872A (ko) 마이크로 프로세서칩의 냉각팬 제어장치 및 그 제어방법
DE68910243D1 (de) Messen des Betriebsverhaltens von integrierten Schaltungen in Chipform.
TW431046B (en) Battery state monitoring circuit and battery device
DE69811428T2 (de) Stromerzeugungsdetektionsschaltung, Halbleitervorrichtung, elektronische Vorrichtung, Uhrwerk, Stromerzeugungsdetektions- und Stromverbrauchskontrollverfahren
US20100060449A1 (en) Integrated solution for sensor interface for monitoring the environmental parameters by means of rfid technologies
DE3873927D1 (de) Elektronische steueranordnung.
KR920003760A (ko) 소정의 주파수 범위내에서의 발진기 주파수 유지 장치
KR910012974A (ko) 카드형 반도체 장치
ATE251700T1 (de) Vorrichtung zur entfeuchtung und/oder entsalzung von bauwerken
JPS57185501A (en) Power supply circuit for electronic controller for car
DE69130689D1 (de) Signalprozessor
DE59906113D1 (de) Intelligente steuerung
JPS566022A (en) Engine controlling system
JPS5494136A (en) Heating controller
DE59810705D1 (de) Periphere Steuereinheit für ein Prozessleitsystem
KR890017710A (ko) 반도체 집적회로장치
JPH08329035A (ja) 半導体装置
DE69708845D1 (de) Halbleitervorrichtung mit komplementärem Takt und Schaltung zur Detektion des Eingangssignalzustandes dafür

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee