DE69519919T2 - Mehrschichtfilm aus aromatischen Polyimid ohne Klebstoff - Google Patents

Mehrschichtfilm aus aromatischen Polyimid ohne Klebstoff

Info

Publication number
DE69519919T2
DE69519919T2 DE1995619919 DE69519919T DE69519919T2 DE 69519919 T2 DE69519919 T2 DE 69519919T2 DE 1995619919 DE1995619919 DE 1995619919 DE 69519919 T DE69519919 T DE 69519919T DE 69519919 T2 DE69519919 T2 DE 69519919T2
Authority
DE
Germany
Prior art keywords
adhesive
film made
layer film
aromatic polyimide
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1995619919
Other languages
English (en)
Other versions
DE69519919D1 (de
Inventor
Eugene Coverdell
V Gumm
Alees E Mc
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69519919D1 publication Critical patent/DE69519919D1/de
Publication of DE69519919T2 publication Critical patent/DE69519919T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y10T428/24975—No layer or component greater than 5 mils thick
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
DE1995619919 1994-12-14 1995-11-24 Mehrschichtfilm aus aromatischen Polyimid ohne Klebstoff Expired - Lifetime DE69519919T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/355,467 US5525405A (en) 1994-12-14 1994-12-14 Adhesiveless aromatic polyimide laminate

Publications (2)

Publication Number Publication Date
DE69519919D1 DE69519919D1 (de) 2001-02-22
DE69519919T2 true DE69519919T2 (de) 2001-06-13

Family

ID=23397525

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1995619919 Expired - Lifetime DE69519919T2 (de) 1994-12-14 1995-11-24 Mehrschichtfilm aus aromatischen Polyimid ohne Klebstoff

Country Status (4)

Country Link
US (1) US5525405A (de)
EP (1) EP0716918B1 (de)
JP (1) JPH08224845A (de)
DE (1) DE69519919T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5932799A (en) * 1997-07-21 1999-08-03 Ysi Incorporated Microfluidic analyzer module
US6293012B1 (en) 1997-07-21 2001-09-25 Ysi Incorporated Method of making a fluid flow module
US6073482A (en) * 1997-07-21 2000-06-13 Ysi Incorporated Fluid flow module
US5939498A (en) * 1998-04-07 1999-08-17 E. I. Du Pont De Nemours And Company High modulus polyimide blend
US6156438A (en) * 1998-04-09 2000-12-05 E. I. Du Pont De Nemours And Company Monolithic polyimide laminate containing encapsulated design and preparation thereof
JP2000289166A (ja) * 1999-04-09 2000-10-17 E I Du Pont De Nemours & Co 封入された構造を含む一体式ポリイミド積層体および該積層体の製造方法
US6627034B1 (en) 1999-07-27 2003-09-30 North Carolina State University Pattern release film between two laminated surfaces
EP1453758A2 (de) * 2001-12-06 2004-09-08 Nanostream, Inc. Klebefreie herstellung von mikrofluidischen bauelementen
US6814859B2 (en) * 2002-02-13 2004-11-09 Nanostream, Inc. Frit material and bonding method for microfluidic separation devices
AU2003287449A1 (en) * 2002-10-31 2004-05-25 Nanostream, Inc. Parallel detection chromatography systems
US20040179972A1 (en) * 2003-03-14 2004-09-16 Nanostream, Inc. Systems and methods for detecting manufacturing defects in microfluidic devices
JP2005026417A (ja) * 2003-07-01 2005-01-27 Sharp Corp 補強板の貼付方法
GB2445738A (en) * 2007-01-16 2008-07-23 Lab901 Ltd Microfluidic device
GB2445739A (en) * 2007-01-16 2008-07-23 Lab901 Ltd Polymeric laminates containing heat seals
US20090074615A1 (en) * 2007-09-17 2009-03-19 Ysi Incorporated Microfluidic module including an adhesiveless self-bonding rebondable polyimide
JP2011167905A (ja) * 2010-02-18 2011-09-01 Du Pont-Toray Co Ltd ポリイミドシート
JP2011167906A (ja) * 2010-02-18 2011-09-01 Du Pont-Toray Co Ltd ポリイミドシート
JP2011167903A (ja) * 2010-02-18 2011-09-01 Du Pont-Toray Co Ltd ポリイミドシート
WO2021120116A1 (zh) * 2019-12-19 2021-06-24 瑞声声学科技(深圳)有限公司 易弯曲的聚酰亚胺板
GB2609163B (en) 2020-05-08 2023-08-23 Cummins Emission Solutions Inc Configurable aftertreatment systems including a housing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179634A (en) 1962-01-26 1965-04-20 Du Pont Aromatic polyimides and the process for preparing them
US3179630A (en) 1962-01-26 1965-04-20 Du Pont Process for preparing polyimides by treating polyamide-acids with lower fatty monocarboxylic acid anhydrides
US3410826A (en) 1967-04-10 1968-11-12 Du Pont Process for preparing shaped articles from polyamide acids before converting to insoluble polyimides
US3821054A (en) * 1971-10-19 1974-06-28 E Trostyanskaya Method of chemical bonding of polyimide polymers
JPS61111359A (ja) 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
JPS61297123A (ja) * 1985-06-27 1986-12-27 Agency Of Ind Science & Technol ポリイミド積層品の製法
JPS62140822A (ja) * 1985-12-17 1987-06-24 Ube Ind Ltd ポリイミド積層シ−トおよびその製造法
US5178964A (en) * 1989-08-31 1993-01-12 United Technologies Corporation Fabricating crosslinked polyimide high temperature composites and resins
US5227244A (en) * 1990-09-21 1993-07-13 E. I. Du Pont De Nemours And Company Polyimide film with metal salt coating resulting in improved adhesion
EP0479018A3 (en) * 1990-09-21 1992-10-21 E.I. Du Pont De Nemours And Company Polyimid film with metal salt coating
US5218034A (en) * 1990-09-21 1993-06-08 E. I. Du Pont De Nemours And Company Polyimide film with tin or tin salt incorporation resulting in improved adhesion
US5272194A (en) * 1992-01-17 1993-12-21 E. I. Du Pont De Nemours And Company Process for preparing a strengthened polyimide film containing organometallic compounds for improving adhesion
US5358782A (en) * 1992-12-15 1994-10-25 E. I. Du Pont De Nemours And Company Coextruded multi-layered, electrically conductive polyimide film

Also Published As

Publication number Publication date
EP0716918B1 (de) 2001-01-17
EP0716918A2 (de) 1996-06-19
US5525405A (en) 1996-06-11
EP0716918A3 (de) 1997-10-08
DE69519919D1 (de) 2001-02-22
JPH08224845A (ja) 1996-09-03

Similar Documents

Publication Publication Date Title
DE69519919T2 (de) Mehrschichtfilm aus aromatischen Polyimid ohne Klebstoff
DE69735799D1 (de) Zwischenschichtklebefilm für mehrschichtige gedruckte Leiterplatte und mehrschichtige gedruckte Leiterplatte unter Verwendung desselben
DE69704293T2 (de) Verbinder für Leiterplatte mit Schaltung aus flexiblem Film.
DE69606811T2 (de) Mehrschichtfolie
DE59410009D1 (de) Mehrlagige Beschichtung
DE69740139D1 (de) Mehrlagige Leiterplatte
DE69535391D1 (de) Mehrlagenschaltungssubstrat
DE69737317D1 (de) Mehrschichtige gedruckte Leiterplatte
DE69608924T2 (de) Mehrschichtfilm auf Polyolefinbasis
DE69637655D1 (de) Aufgebaute mehrschichtige Leiterplatte
DE69625554D1 (de) Eine Haftvermittlerschicht enthaltende mehrschichtige Strukturen
DE69503151D1 (de) Polyimid
DE69627430D1 (de) Poröser Film aus para-orientiertem aromatischem Polyamid
DK1044106T3 (da) Lamineret cook-in film
DE69733045D1 (de) Antistatischer aromatischer Polyimid-Film
DE59804789D1 (de) Mehrlagiges Klebeband
DE69509185D1 (de) Mehrschichtiger Verpackungsfilm
DE69610452D1 (de) Mehrschichtfolie
IT1276653B1 (it) Componente multistrato
DE59803050D1 (de) Mehrlagiges Klebeband
DE69637558D1 (de) Mehrlagen gedruckte Schaltungsplatte
DE69208319D1 (de) Polyimide aus substituierten Benzidinen
DE69630634D1 (de) Mehrschichtiger Verbundfilm
DE9415235U1 (de) Brettstapelelement
KR970005628A (ko) 적층 폴리아미드 필름

Legal Events

Date Code Title Description
8364 No opposition during term of opposition