DE69513782D1 - Dielektrischer Dünnfilm aus Barium und/oder Strontium-Titanat mit Erbium und Herstellungsverfahren - Google Patents

Dielektrischer Dünnfilm aus Barium und/oder Strontium-Titanat mit Erbium und Herstellungsverfahren

Info

Publication number
DE69513782D1
DE69513782D1 DE69513782T DE69513782T DE69513782D1 DE 69513782 D1 DE69513782 D1 DE 69513782D1 DE 69513782 T DE69513782 T DE 69513782T DE 69513782 T DE69513782 T DE 69513782T DE 69513782 D1 DE69513782 D1 DE 69513782D1
Authority
DE
Germany
Prior art keywords
erbium
barium
thin film
manufacturing process
film made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69513782T
Other languages
English (en)
Other versions
DE69513782T2 (de
Inventor
Robert Yung-Hsi Tsu
Bernard M Kulwicki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69513782D1 publication Critical patent/DE69513782D1/de
Publication of DE69513782T2 publication Critical patent/DE69513782T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40Capacitors
    • H01L28/55Capacitors with a dielectric comprising a perovskite structure material
    • H01L28/56Capacitors with a dielectric comprising a perovskite structure material the dielectric comprising two or more layers, e.g. comprising buffer layers, seed layers, gradient layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40Capacitors
    • H01L28/55Capacitors with a dielectric comprising a perovskite structure material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
DE69513782T 1994-09-30 1995-09-25 Dielektrischer Dünnfilm aus Barium und/oder Strontium-Titanat mit Erbium und Herstellungsverfahren Expired - Lifetime DE69513782T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/315,725 US5635741A (en) 1994-09-30 1994-09-30 Barium strontium titanate (BST) thin films by erbium donor doping

Publications (2)

Publication Number Publication Date
DE69513782D1 true DE69513782D1 (de) 2000-01-13
DE69513782T2 DE69513782T2 (de) 2000-06-29

Family

ID=23225775

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69513782T Expired - Lifetime DE69513782T2 (de) 1994-09-30 1995-09-25 Dielektrischer Dünnfilm aus Barium und/oder Strontium-Titanat mit Erbium und Herstellungsverfahren

Country Status (6)

Country Link
US (2) US5635741A (de)
EP (1) EP0709355B1 (de)
JP (1) JPH08198669A (de)
KR (1) KR960012511A (de)
DE (1) DE69513782T2 (de)
TW (1) TW376562B (de)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3012785B2 (ja) * 1995-07-14 2000-02-28 松下電子工業株式会社 容量素子
JP3258899B2 (ja) * 1996-03-19 2002-02-18 シャープ株式会社 強誘電体薄膜素子、それを用いた半導体装置、及び強誘電体薄膜素子の製造方法
JPH09331020A (ja) * 1996-06-07 1997-12-22 Sharp Corp 誘電体薄膜キャパシタ素子及びその製造方法
US6136654A (en) * 1996-06-07 2000-10-24 Texas Instruments Incorporated Method of forming thin silicon nitride or silicon oxynitride gate dielectrics
KR100223939B1 (ko) * 1996-09-07 1999-10-15 구본준 고유전막의 제조방법 및 그를 이용한 캐패시터의 제조방법
US6153519A (en) * 1997-03-31 2000-11-28 Motorola, Inc. Method of forming a barrier layer
US6527865B1 (en) 1997-09-11 2003-03-04 Applied Materials, Inc. Temperature controlled gas feedthrough
US5834353A (en) * 1997-10-20 1998-11-10 Texas Instruments-Acer Incorporated Method of making deep sub-micron meter MOSFET with a high permitivity gate dielectric
US6074885A (en) * 1997-11-25 2000-06-13 Radiant Technologies, Inc Lead titanate isolation layers for use in fabricating PZT-based capacitors and similar structures
TW370723B (en) * 1997-11-27 1999-09-21 United Microelectronics Corp Method for reducing current leakage of high capacitivity materials
WO2000002237A1 (de) * 1998-07-06 2000-01-13 Infineon Technologies Ag Dram-speicherkondensator und verfahren zu dessen herstellung
US6358810B1 (en) * 1998-07-28 2002-03-19 Applied Materials, Inc. Method for superior step coverage and interface control for high K dielectric capacitors and related electrodes
KR100505397B1 (ko) 1998-12-30 2006-05-16 주식회사 하이닉스반도체 반도체메모리소자의캐패시터제조방법
US6194229B1 (en) * 1999-01-08 2001-02-27 Micron Technology, Inc. Method for improving the sidewall stoichiometry of thin film capacitors
US6191479B1 (en) * 1999-02-13 2001-02-20 Advanced Micro Devices, Inc. Decoupling capacitor configuration for integrated circuit chip
AU1887000A (en) * 1999-02-17 2000-09-04 International Business Machines Corporation Microelectronic device for storing information and method thereof
US6258655B1 (en) 1999-03-01 2001-07-10 Micron Technology, Inc. Method for improving the resistance degradation of thin film capacitors
US6160524A (en) * 1999-03-17 2000-12-12 The United States Of America As Represented By The Secretary Of The Army Apparatus and method for reducing the temperature sensitivity of ferroelectric microwave devices
DE19926766A1 (de) * 1999-06-11 2000-12-21 Infineon Technologies Ag Ferroelektrischer Transistor und Verfahren zu dessen Betrieb
US6943392B2 (en) * 1999-08-30 2005-09-13 Micron Technology, Inc. Capacitors having a capacitor dielectric layer comprising a metal oxide having multiple different metals bonded with oxygen
KR100335494B1 (ko) * 1999-10-30 2002-05-08 윤종용 Bst 유전막에 구리를 함유한 커패시터 및 그 제조방법
US6919273B1 (en) * 1999-12-09 2005-07-19 Tokyo Electron Limited Method for forming TiSiN film, diffusion preventive film comprising TiSiN film, semiconductor device and its production method, and apparatus for forming TiSiN film
KR100376987B1 (ko) * 1999-12-28 2003-03-26 주식회사 하이닉스반도체 반도체소자의 캐패시터 제조방법
US6693033B2 (en) 2000-02-10 2004-02-17 Motorola, Inc. Method of removing an amorphous oxide from a monocrystalline surface
US6392257B1 (en) 2000-02-10 2002-05-21 Motorola Inc. Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
US6528377B1 (en) 2000-02-10 2003-03-04 Motorola, Inc. Semiconductor substrate and method for preparing the same
KR100372018B1 (ko) * 2000-04-25 2003-02-14 주식회사 에버테크 반도체 메모리 소자의 캐패시터 및 그 제조 방법
JP2002170938A (ja) * 2000-04-28 2002-06-14 Sharp Corp 半導体装置およびその製造方法
US6558517B2 (en) * 2000-05-26 2003-05-06 Micron Technology, Inc. Physical vapor deposition methods
WO2002002842A2 (en) * 2000-06-29 2002-01-10 Applied Materials, Inc. Low temperature cvd bst deposition
US6477285B1 (en) 2000-06-30 2002-11-05 Motorola, Inc. Integrated circuits with optical signal propagation
US6410941B1 (en) 2000-06-30 2002-06-25 Motorola, Inc. Reconfigurable systems using hybrid integrated circuits with optical ports
US6427066B1 (en) 2000-06-30 2002-07-30 Motorola, Inc. Apparatus and method for effecting communications among a plurality of remote stations
US6501973B1 (en) 2000-06-30 2002-12-31 Motorola, Inc. Apparatus and method for measuring selected physical condition of an animate subject
US6432546B1 (en) * 2000-07-24 2002-08-13 Motorola, Inc. Microelectronic piezoelectric structure and method of forming the same
US6555946B1 (en) 2000-07-24 2003-04-29 Motorola, Inc. Acoustic wave device and process for forming the same
US6590236B1 (en) 2000-07-24 2003-07-08 Motorola, Inc. Semiconductor structure for use with high-frequency signals
US6482538B2 (en) 2000-07-24 2002-11-19 Motorola, Inc. Microelectronic piezoelectric structure and method of forming the same
US6493497B1 (en) 2000-09-26 2002-12-10 Motorola, Inc. Electro-optic structure and process for fabricating same
US6638838B1 (en) 2000-10-02 2003-10-28 Motorola, Inc. Semiconductor structure including a partially annealed layer and method of forming the same
US6583034B2 (en) 2000-11-22 2003-06-24 Motorola, Inc. Semiconductor structure including a compliant substrate having a graded monocrystalline layer and methods for fabricating the structure and semiconductor devices including the structure
US6559471B2 (en) 2000-12-08 2003-05-06 Motorola, Inc. Quantum well infrared photodetector and method for fabricating same
US6563118B2 (en) 2000-12-08 2003-05-13 Motorola, Inc. Pyroelectric device on a monocrystalline semiconductor substrate and process for fabricating same
US20020096683A1 (en) * 2001-01-19 2002-07-25 Motorola, Inc. Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
US6451664B1 (en) * 2001-01-30 2002-09-17 Infineon Technologies Ag Method of making a MIM capacitor with self-passivating plates
US6673646B2 (en) 2001-02-28 2004-01-06 Motorola, Inc. Growth of compound semiconductor structures on patterned oxide films and process for fabricating same
US7046719B2 (en) 2001-03-08 2006-05-16 Motorola, Inc. Soft handoff between cellular systems employing different encoding rates
KR20020079045A (ko) * 2001-04-12 2002-10-19 김상섭 누설전류 억제 구조의 메모리 소자
US6617266B2 (en) 2001-04-12 2003-09-09 Applied Materials, Inc. Barium strontium titanate annealing process
US6709989B2 (en) 2001-06-21 2004-03-23 Motorola, Inc. Method for fabricating a semiconductor structure including a metal oxide interface with silicon
US20030017266A1 (en) * 2001-07-13 2003-01-23 Cem Basceri Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers, including such layers having a varied concentration of barium and strontium within the layer
US6838122B2 (en) 2001-07-13 2005-01-04 Micron Technology, Inc. Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers
US6646293B2 (en) 2001-07-18 2003-11-11 Motorola, Inc. Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates
US6693298B2 (en) 2001-07-20 2004-02-17 Motorola, Inc. Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
US6472694B1 (en) 2001-07-23 2002-10-29 Motorola, Inc. Microprocessor structure having a compound semiconductor layer
US6667196B2 (en) 2001-07-25 2003-12-23 Motorola, Inc. Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
US6589856B2 (en) 2001-08-06 2003-07-08 Motorola, Inc. Method and apparatus for controlling anti-phase domains in semiconductor structures and devices
US6639249B2 (en) 2001-08-06 2003-10-28 Motorola, Inc. Structure and method for fabrication for a solid-state lighting device
US6462360B1 (en) 2001-08-06 2002-10-08 Motorola, Inc. Integrated gallium arsenide communications systems
US6917511B1 (en) * 2001-08-14 2005-07-12 Neophotonics Corporation Reactive deposition for the formation of chip capacitors
US6673667B2 (en) 2001-08-15 2004-01-06 Motorola, Inc. Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
US20030036217A1 (en) * 2001-08-16 2003-02-20 Motorola, Inc. Microcavity semiconductor laser coupled to a waveguide
US7011978B2 (en) * 2001-08-17 2006-03-14 Micron Technology, Inc. Methods of forming capacitor constructions comprising perovskite-type dielectric materials with different amount of crystallinity regions
US20030071327A1 (en) * 2001-10-17 2003-04-17 Motorola, Inc. Method and apparatus utilizing monocrystalline insulator
DE10246584B4 (de) * 2002-10-05 2005-05-19 Fachhochschule Kiel Substrat mit darauf befindlichem keramischen Film und dessen Verwendung
US20040070312A1 (en) * 2002-10-10 2004-04-15 Motorola, Inc. Integrated circuit and process for fabricating the same
US6965128B2 (en) * 2003-02-03 2005-11-15 Freescale Semiconductor, Inc. Structure and method for fabricating semiconductor microresonator devices
US6949442B2 (en) * 2003-05-05 2005-09-27 Infineon Technologies Ag Methods of forming MIM capacitors
IL157838A (en) * 2003-09-10 2013-05-30 Yaakov Amitai High-brightness optical device
US7112541B2 (en) 2004-05-06 2006-09-26 Applied Materials, Inc. In-situ oxide capping after CVD low k deposition
US7382013B2 (en) 2004-09-30 2008-06-03 Tdk Corporation Dielectric thin film, dielectric thin film device, and method of production thereof
US7273823B2 (en) 2005-06-03 2007-09-25 Applied Materials, Inc. Situ oxide cap layer development
US7795663B2 (en) * 2005-06-21 2010-09-14 E. I. Du Pont De Nemours And Company Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof
JP4956939B2 (ja) * 2005-08-31 2012-06-20 Tdk株式会社 誘電体膜及びその製造方法
US7582549B2 (en) * 2006-08-25 2009-09-01 Micron Technology, Inc. Atomic layer deposited barium strontium titanium oxide films
US8415227B2 (en) * 2011-08-29 2013-04-09 Intermolecular, Inc. High performance dielectric stack for DRAM capacitor
WO2014209323A1 (en) * 2013-06-27 2014-12-31 Empire Technology Development Llc Display integrated energy storage apparatus
US11329389B2 (en) * 2018-07-26 2022-05-10 Board Of Regents, The University Of Texas System Method for fabricating a hyperbolic metamaterial having a near-zero refractive index in the optical regime
CA3165628A1 (en) 2020-01-29 2021-08-05 Nikhil Kumar Low loss high efficiency photonic phase shifter
KR20220144410A (ko) 2020-03-03 2022-10-26 사이퀀텀, 코퍼레이션 광자 디바이스들을 위한 제작 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4863883A (en) * 1986-05-05 1989-09-05 Cabot Corporation Doped BaTiO3 based compositions
JP2649342B2 (ja) * 1986-12-04 1997-09-03 太陽誘電株式会社 電子部品用磁器の製造方法
US5453262A (en) * 1988-12-09 1995-09-26 Battelle Memorial Institute Continuous process for production of ceramic powders with controlled morphology
EP0430172B1 (de) * 1989-11-30 1994-05-18 Taiyo Yuden Co., Ltd. Festdielektrikum-Kondensator und Verfahren zur Herstellung
WO1991015023A1 (en) * 1990-03-28 1991-10-03 Taiyo Yuden Kabusikigaisha Ceramic capacitor and production thereof
JPH0779004B2 (ja) * 1990-10-31 1995-08-23 株式会社村田製作所 誘電体磁器組成物
US5232880A (en) * 1991-01-11 1993-08-03 Murata Manufacturing Co., Ltd. Method for production of nonreducible dielectric ceramic composition
JP2871135B2 (ja) * 1991-02-16 1999-03-17 株式会社村田製作所 非還元性誘電体磁器組成物の製造方法
TW242191B (de) * 1991-06-05 1995-03-01 Taiyo Yuden Kk
JP2879865B2 (ja) * 1992-01-16 1999-04-05 太陽誘電株式会社 誘電体磁器組成物の製造方法
US5401680A (en) * 1992-02-18 1995-03-28 National Semiconductor Corporation Method for forming a ceramic oxide capacitor having barrier layers
US5314651A (en) * 1992-05-29 1994-05-24 Texas Instruments Incorporated Fine-grain pyroelectric detector material and method
EP0571948B1 (de) * 1992-05-29 2000-02-09 Texas Instruments Incorporated Donatoren-dotierte Perovskite für Dünnfilm-Dielektrika
EP0581251A3 (de) * 1992-07-31 1995-02-08 Taiyo Yuden Kk Keramische Werkstoffe mit hoher dielektrischer Konstante und daraus hergestellte Kondensatoren.
JP3227859B2 (ja) * 1993-01-08 2001-11-12 株式会社村田製作所 非還元性誘電体磁器組成物
US5471364A (en) * 1993-03-31 1995-11-28 Texas Instruments Incorporated Electrode interface for high-dielectric-constant materials
JPH0773732A (ja) * 1993-06-23 1995-03-17 Sharp Corp 誘電体薄膜素子及びその製造方法
US5453908A (en) * 1994-09-30 1995-09-26 Texas Instruments Incorporated Barium strontium titanate (BST) thin films by holmium donor doping

Also Published As

Publication number Publication date
KR960012511A (ko) 1996-04-20
TW376562B (en) 1999-12-11
US5731220A (en) 1998-03-24
DE69513782T2 (de) 2000-06-29
JPH08198669A (ja) 1996-08-06
US5635741A (en) 1997-06-03
EP0709355A1 (de) 1996-05-01
EP0709355B1 (de) 1999-12-08

Similar Documents

Publication Publication Date Title
DE69513782D1 (de) Dielektrischer Dünnfilm aus Barium und/oder Strontium-Titanat mit Erbium und Herstellungsverfahren
DE69430501D1 (de) Dielektrische Dünnfilmanordnung und Herstellungsverfahren
KR970703049A (ko) 유전체 캐패시터 및 그 제조방법
DE69014027T2 (de) Dünnfilmkondensatoren und deren Herstellungsverfahren.
EP0513894A3 (en) Method of manufacturing a semiconductor device comprising a capacitor with a ferroelectric dielectric, and semiconductor device comprising such a capacitor
DE69017802D1 (de) Dünnfilmkondensator und dessen Herstellungsverfahren.
DE69215642T2 (de) Dielektrische Resonatorvorrichtung und deren Herstellungsverfahren
DE69434606D1 (de) Halbleiterbauelement mit Kondensator und dessen Herstellungsverfahren
DE69516045T2 (de) Keramischer Mehrschichtkondensator und Herstellungsverfahren
DE69327747D1 (de) Dielektrische Zusammensetzung, Mehrschichtleitersubstrat und keramischer Mehrschichtkondensator
DE69707356T2 (de) Kondensator mit dielektrischer Dünnschicht und Verfahren zur Herstellung
KR890015430A (ko) 캐패시터 및 그 제조방법
DE59400663D1 (de) Langzeitstabile Elektrode und daraus gebildeter Doppelschichtkondensator
DE69301939T2 (de) Elektrodenfolie für Elektrolytkondensator und Herstellungsverfahren
SG55315A1 (en) Method of manufacturing bi-layered ferroelectric thin film
DE69431971D1 (de) Dünnschichtkondensator und Herstellungsverfahren
DE69230156D1 (de) Herstellungsverfahren für Kondensator mit gestapelter Flossenstruktur und mit reduzierter Flossendicke
DE69226757T2 (de) Filmkondensator und Verfahren zur Herstellung
DE69215608D1 (de) Dünnschichttransistor und dessen Herstellungsmethode
KR900015198A (ko) 캐패시터 및 그의 제조방법
DE69506307D1 (de) Dielektrischer Oxid-Dünnfilm sowie dessen Herstellung
DE69607715T2 (de) Temperaturkoeffizientenkompensation der Dielektrizitätskonstante aus Barium-Strontium-Titanat
DE69009693T2 (de) Festdielektrikum-Kondensator und Verfahren zur Herstellung.
DE69009012T2 (de) Festdielektrikum-Kondensator und Verfahren zur Herstellung.
DE29604356U1 (de) Metallisierter dielektrischer Film und Kondensator daraus

Legal Events

Date Code Title Description
8364 No opposition during term of opposition