DE69430765D1 - Eingebettetes Substrat für integrierte Schaltungsmodule - Google Patents

Eingebettetes Substrat für integrierte Schaltungsmodule

Info

Publication number
DE69430765D1
DE69430765D1 DE69430765T DE69430765T DE69430765D1 DE 69430765 D1 DE69430765 D1 DE 69430765D1 DE 69430765 T DE69430765 T DE 69430765T DE 69430765 T DE69430765 T DE 69430765T DE 69430765 D1 DE69430765 D1 DE 69430765D1
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit modules
embedded substrate
embedded
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69430765T
Other languages
English (en)
Other versions
DE69430765T2 (de
Inventor
Raymond Albert Fillion
Robert John Wojnarowski
Michael Gdula
Herbert Stanley Cole
Eric Joseph Wildi
Wolfgang Daum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lockheed Martin Corp
Original Assignee
Lockheed Corp
Lockheed Martin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lockheed Corp, Lockheed Martin Corp filed Critical Lockheed Corp
Publication of DE69430765D1 publication Critical patent/DE69430765D1/de
Application granted granted Critical
Publication of DE69430765T2 publication Critical patent/DE69430765T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
DE1994630765 1993-02-08 1994-02-08 Eingebettetes Substrat für integrierte Schaltungsmodule Expired - Lifetime DE69430765T2 (de)

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US1448193A 1993-02-08 1993-02-08
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US5353498A (en) 1994-10-11
JP3802936B2 (ja) 2006-08-02
US5497033A (en) 1996-03-05
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JPH077134A (ja) 1995-01-10

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