DE69426082D1 - Kontroll einrichtung für stiftgitter - Google Patents

Kontroll einrichtung für stiftgitter

Info

Publication number
DE69426082D1
DE69426082D1 DE69426082T DE69426082T DE69426082D1 DE 69426082 D1 DE69426082 D1 DE 69426082D1 DE 69426082 T DE69426082 T DE 69426082T DE 69426082 T DE69426082 T DE 69426082T DE 69426082 D1 DE69426082 D1 DE 69426082D1
Authority
DE
Germany
Prior art keywords
control device
pin grid
grid
pin
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69426082T
Other languages
English (en)
Other versions
DE69426082T2 (de
Inventor
L Jackson
C Boman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Scanning Inc
Original Assignee
General Scanning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Scanning Inc filed Critical General Scanning Inc
Publication of DE69426082D1 publication Critical patent/DE69426082D1/de
Application granted granted Critical
Publication of DE69426082T2 publication Critical patent/DE69426082T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
DE69426082T 1993-10-19 1994-07-22 Kontroll einrichtung für stiftgitter Expired - Fee Related DE69426082T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/138,776 US5652658A (en) 1993-10-19 1993-10-19 Grid array inspection system and method
PCT/US1994/008385 WO1995011519A1 (en) 1993-10-19 1994-07-22 Grid array inspection system and method

Publications (2)

Publication Number Publication Date
DE69426082D1 true DE69426082D1 (de) 2000-11-09
DE69426082T2 DE69426082T2 (de) 2001-06-07

Family

ID=22483590

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69426082T Expired - Fee Related DE69426082T2 (de) 1993-10-19 1994-07-22 Kontroll einrichtung für stiftgitter

Country Status (5)

Country Link
US (2) US5652658A (de)
EP (1) EP0724773B1 (de)
JP (1) JP3005294B2 (de)
DE (1) DE69426082T2 (de)
WO (1) WO1995011519A1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3158966B2 (ja) * 1995-06-19 2001-04-23 松下電器産業株式会社 バンプ付電子部品の製造装置および製造方法
US6517004B2 (en) * 1995-12-18 2003-02-11 Metrologic Instruments, Inc. Automated system for identifying and dimensioning packages transported through a laser scanning tunnel using laser scanning beam indexing techniques
US5978502A (en) 1996-04-01 1999-11-02 Cognex Corporation Machine vision methods for determining characteristics of three-dimensional objects
DE69632635T2 (de) * 1996-12-31 2005-05-25 Datalogic S.P.A., Lippo Di Calderara Di Reno Verfahren und Apparat zur Volumenmessung eines Gegenstandes
DE69629482T2 (de) * 1996-12-31 2004-06-17 Datalogic S.P.A., Lippo Di Calderara Di Reno Verfahren und Apparat zur Volumenmessung eines Gegenstandes mittels eines Laserabtasters
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US6118893A (en) * 1997-07-16 2000-09-12 Cognex Corporation Analysis of an image of a pattern of discrete objects
US6130959A (en) * 1997-07-16 2000-10-10 Cognex Corporation Analyzing an image of an arrangement of discrete objects
US6151406A (en) 1997-10-09 2000-11-21 Cognex Corporation Method and apparatus for locating ball grid array packages from two-dimensional image data
US6915006B2 (en) * 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6067376A (en) * 1998-01-16 2000-05-23 Cognex Corporation Classifying pixels of an image
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
US6915007B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6055328A (en) * 1998-01-16 2000-04-25 Cognex Corporation Analyzing an acquired arrangement of object locations
US6633663B1 (en) 1998-05-05 2003-10-14 International Business Machines Corporation Method and system for determining component dimensional information
US6301549B1 (en) 1998-06-26 2001-10-09 Lucent Technologies, Inc. Three dimensional object boundary and motion determination device and method of operation thereof
US6518997B1 (en) 1998-08-05 2003-02-11 National Semiconductor Corporation Grid array inspection system and method
ATE322665T1 (de) * 1999-07-13 2006-04-15 Beaty Elwin M Verfahren und apparat für die dreidimensionale inspektion von elektronischen komponenten
US7034272B1 (en) * 1999-10-05 2006-04-25 Electro Scientific Industries, Inc. Method and apparatus for evaluating integrated circuit packages having three dimensional features
US6525331B1 (en) 1999-12-01 2003-02-25 Nanyang Technological University Ball grid array (BGA) package on-line non-contact inspection method and system
IL133696A (en) * 1999-12-23 2006-04-10 Orbotech Ltd Cam reference inspection of multi-color and contour images
EP1220596A1 (de) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente
US6665066B2 (en) * 2001-04-27 2003-12-16 National Instruments Corporation Machine vision system and method for analyzing illumination lines in an image to determine characteristics of an object being inspected
AU2003264916A1 (en) * 2003-09-05 2005-03-29 Semiconductor Technologies And Instruments Pte Ltd. Ball grid array inspection system and method
US7315383B1 (en) * 2004-07-09 2008-01-01 Mohsen Abdollahi Scanning 3D measurement technique using structured lighting and high-speed CMOS imager
US8111904B2 (en) 2005-10-07 2012-02-07 Cognex Technology And Investment Corp. Methods and apparatus for practical 3D vision system
US8162584B2 (en) 2006-08-23 2012-04-24 Cognex Corporation Method and apparatus for semiconductor wafer alignment
KR101251372B1 (ko) * 2008-10-13 2013-04-05 주식회사 고영테크놀러지 3차원형상 측정방법
US8611636B1 (en) 2009-01-05 2013-12-17 Cognex Corporation High speed method of aligning components having a plurality of non-uniformly spaced features
CN103026216B (zh) 2010-06-08 2016-09-07 Dcg系统有限公司 三维热点定位
TWI460422B (zh) * 2010-10-22 2014-11-11 Dcg Systems Inc 從裝置一側作鎖相熱雷射激發並從另一側取得鎖相熱發散影像
US9488469B1 (en) 2013-04-22 2016-11-08 Cognex Corporation System and method for high-accuracy measurement of object surface displacement using a laser displacement sensor
CN110680371B (zh) * 2019-10-21 2021-03-19 华中科技大学 一种基于结构光和ct的人体内外结构成像方法和装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4240750A (en) * 1978-10-02 1980-12-23 Hurd William A Automatic circuit board tester
US4373804A (en) * 1979-04-30 1983-02-15 Diffracto Ltd. Method and apparatus for electro-optically determining the dimension, location and attitude of objects
US4743771A (en) * 1985-06-17 1988-05-10 View Engineering, Inc. Z-axis height measurement system
US4706168A (en) * 1985-11-15 1987-11-10 View Engineering, Inc. Systems and methods for illuminating objects for vision systems
US4872052A (en) * 1986-12-03 1989-10-03 View Engineering, Inc. Semiconductor device inspection system
US5024529A (en) * 1988-01-29 1991-06-18 Synthetic Vision Systems, Inc. Method and system for high-speed, high-resolution, 3-D imaging of an object at a vision station
US5028799A (en) * 1988-08-01 1991-07-02 Robotic Vision System, Inc. Method and apparatus for three dimensional object surface determination using co-planar data from multiple sensors
US4891529A (en) * 1988-08-22 1990-01-02 View Engineering, Inc. System and method for analyzing dimensions of can tops during manufacture
JPH0794972B2 (ja) * 1989-12-13 1995-10-11 松下電器産業株式会社 半田の外観検査方法
US5192983A (en) * 1989-12-19 1993-03-09 Matsushita Electric Industrial Co., Ltd. Apparatus for and method of checking external appearance of soldering state
US5058178A (en) * 1989-12-21 1991-10-15 At&T Bell Laboratories Method and apparatus for inspection of specular, three-dimensional features
JP2890578B2 (ja) * 1989-12-25 1999-05-17 ソニー株式会社 Ｉｃリード検査装置とｉｃリード検査方法

Also Published As

Publication number Publication date
JP3005294B2 (ja) 2000-01-31
EP0724773B1 (de) 2000-10-04
US5652658A (en) 1997-07-29
JPH09505886A (ja) 1997-06-10
WO1995011519A1 (en) 1995-04-27
EP0724773A1 (de) 1996-08-07
DE69426082T2 (de) 2001-06-07
US5812268A (en) 1998-09-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee