DE69411740T2 - Elektrisch leitfähige Klebstoff-Zusammensetzungen - Google Patents

Elektrisch leitfähige Klebstoff-Zusammensetzungen

Info

Publication number
DE69411740T2
DE69411740T2 DE69411740T DE69411740T DE69411740T2 DE 69411740 T2 DE69411740 T2 DE 69411740T2 DE 69411740 T DE69411740 T DE 69411740T DE 69411740 T DE69411740 T DE 69411740T DE 69411740 T2 DE69411740 T2 DE 69411740T2
Authority
DE
Germany
Prior art keywords
electrically conductive
conductive adhesive
adhesive compositions
compositions
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69411740T
Other languages
English (en)
Other versions
DE69411740D1 (de
Inventor
Michael Kropp
Wayne Mahoney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of DE69411740D1 publication Critical patent/DE69411740D1/de
Application granted granted Critical
Publication of DE69411740T2 publication Critical patent/DE69411740T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
DE69411740T 1993-06-16 1994-05-02 Elektrisch leitfähige Klebstoff-Zusammensetzungen Expired - Fee Related DE69411740T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/078,740 US5362421A (en) 1993-06-16 1993-06-16 Electrically conductive adhesive compositions
PCT/US1994/004828 WO1994029397A1 (en) 1993-06-16 1994-05-02 Electrically conductive adhesive compositions

Publications (2)

Publication Number Publication Date
DE69411740D1 DE69411740D1 (de) 1998-08-20
DE69411740T2 true DE69411740T2 (de) 1999-04-08

Family

ID=22145943

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69411740T Expired - Fee Related DE69411740T2 (de) 1993-06-16 1994-05-02 Elektrisch leitfähige Klebstoff-Zusammensetzungen

Country Status (9)

Country Link
US (1) US5362421A (de)
EP (1) EP0703951B1 (de)
JP (1) JP3652698B2 (de)
KR (1) KR100336188B1 (de)
CN (1) CN1056399C (de)
CA (1) CA2162882C (de)
DE (1) DE69411740T2 (de)
SG (1) SG46676A1 (de)
WO (1) WO1994029397A1 (de)

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US5626948A (en) * 1996-01-03 1997-05-06 Ferber Technologies L.L.C. Electrical system having a multilayer conductive composition
US5734523A (en) * 1996-07-24 1998-03-31 Pemstar, Inc. Conductive film connectors for use on head assemblies in drives
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US6309502B1 (en) 1997-08-19 2001-10-30 3M Innovative Properties Company Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
US5968674A (en) * 1997-10-14 1999-10-19 Xerox Corporation Conductive polymer coatings and processes thereof
US6030423A (en) * 1998-02-12 2000-02-29 Micron Technology, Inc. Thin profile battery bonding method and method of conductively interconnecting electronic components
US6139777A (en) * 1998-05-08 2000-10-31 Matsushita Electric Industrial Co., Ltd. Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
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US6482868B1 (en) 1998-12-31 2002-11-19 3M Innovative Properties Company Accelerators useful for energy polymerizable compositions
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US6635689B1 (en) * 2000-06-26 2003-10-21 3M Innovative Properties Company Accelerators for cationic polymerization catalyzed by iron-based catalysts
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
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US6695623B2 (en) * 2001-05-31 2004-02-24 International Business Machines Corporation Enhanced electrical/mechanical connection for electronic devices
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US20050256230A1 (en) * 2002-04-01 2005-11-17 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
JP4201519B2 (ja) * 2002-04-01 2008-12-24 スリーエム イノベイティブ プロパティズ カンパニー カチオン重合性接着剤組成物及び異方導電性接着剤組成物
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JP4538797B2 (ja) * 2002-10-30 2010-09-08 チバ ホールディング インコーポレーテッド 酸化触媒としての金属錯体化合物の使用
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US20050250929A1 (en) * 2004-05-10 2005-11-10 3M Innovative Properties Company Ferrocenium-derived catalyst for cationically polymerizable monomers
US7078095B2 (en) * 2004-07-07 2006-07-18 Xerox Corporation Adhesive film exhibiting anisotropic electrical conductivity
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US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions
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EP2044163B1 (de) * 2006-07-24 2012-04-25 3M Innovative Properties Company Elektrisch leitende haftklebstoffe
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CN101816026A (zh) * 2007-10-22 2010-08-25 夏普株式会社 显示装置及其制造方法
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EP2487215B1 (de) * 2011-02-11 2013-07-24 Henkel AG & Co. KGaA Elektrisch leitfähige Haftmittel mit mindestens einem Metallvorläufer
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JP5392333B2 (ja) * 2011-09-28 2014-01-22 日立化成株式会社 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
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JP5662366B2 (ja) * 2012-03-21 2015-01-28 デクセリアルズ株式会社 接着剤
CN103000253B (zh) * 2012-11-10 2015-05-20 江苏瑞德新能源科技有限公司 一种潜伏固化型导电浆料及用其在基板上形成电极的方法
CN103709954A (zh) * 2013-12-24 2014-04-09 上海金大塑胶有限公司 一种热熔胶型不干胶材料的制备方法
DE102015212058A1 (de) * 2015-06-29 2016-12-29 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
KR20190129829A (ko) * 2017-03-30 2019-11-20 하리마카세이 가부시기가이샤 도전성 페이스트
CN108165198B (zh) * 2018-01-30 2019-07-12 东莞市恒尔朗实业有限公司 一种高导电的环氧树脂胶粘剂及其制备方法
CN110724486A (zh) * 2019-09-20 2020-01-24 北京蓝海黑石科技有限公司 一种可回收型led封装导电胶组合物及其制备方法
CN111117539B (zh) * 2019-12-16 2021-07-09 苏州瑞力博新材科技有限公司 一种高粘接力、低接触电阻导电胶及其制备的异质结叠瓦太阳能组件
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Also Published As

Publication number Publication date
KR960703159A (ko) 1996-06-19
JP3652698B2 (ja) 2005-05-25
JPH08511570A (ja) 1996-12-03
CN1128040A (zh) 1996-07-31
DE69411740D1 (de) 1998-08-20
KR100336188B1 (ko) 2002-10-11
EP0703951B1 (de) 1998-07-15
CA2162882A1 (en) 1994-12-22
US5362421A (en) 1994-11-08
CA2162882C (en) 2005-07-26
CN1056399C (zh) 2000-09-13
SG46676A1 (en) 1998-02-20
EP0703951A1 (de) 1996-04-03
WO1994029397A1 (en) 1994-12-22

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