DE69310626D1 - Anordnung der Heizelemente eines Thermo-Druckkopfes und Herstellungsverfahren - Google Patents
Anordnung der Heizelemente eines Thermo-Druckkopfes und HerstellungsverfahrenInfo
- Publication number
- DE69310626D1 DE69310626D1 DE69310626T DE69310626T DE69310626D1 DE 69310626 D1 DE69310626 D1 DE 69310626D1 DE 69310626 T DE69310626 T DE 69310626T DE 69310626 T DE69310626 T DE 69310626T DE 69310626 D1 DE69310626 D1 DE 69310626D1
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- manufacturing process
- heating elements
- thermal printhead
- printhead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/34—Structure of thermal heads comprising semiconductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/925,355 US5414245A (en) | 1992-08-03 | 1992-08-03 | Thermal-ink heater array using rectifying material |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69310626D1 true DE69310626D1 (de) | 1997-06-19 |
DE69310626T2 DE69310626T2 (de) | 1997-09-11 |
Family
ID=25451612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69310626T Expired - Lifetime DE69310626T2 (de) | 1992-08-03 | 1993-08-02 | Anordnung der Heizelemente eines Thermo-Druckkopfes und Herstellungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (2) | US5414245A (de) |
EP (1) | EP0582453B1 (de) |
JP (1) | JPH07290706A (de) |
DE (1) | DE69310626T2 (de) |
Families Citing this family (66)
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JPH08276614A (ja) * | 1994-11-08 | 1996-10-22 | Agfa Gevaert Nv | 特殊印刷ヘツドを有する直接静電式印刷装置 |
JPH08264269A (ja) * | 1995-03-28 | 1996-10-11 | Rohm Co Ltd | シート材に対する加熱体 |
US6048734A (en) | 1995-09-15 | 2000-04-11 | The Regents Of The University Of Michigan | Thermal microvalves in a fluid flow method |
US5815180A (en) * | 1997-03-17 | 1998-09-29 | Hewlett-Packard Company | Thermal inkjet printhead warming circuit |
US6120135A (en) * | 1997-07-03 | 2000-09-19 | Lexmark International, Inc. | Printhead having heating element conductors arranged in spaced apart planes and including heating elements having a substantially constant cross-sectional area in the direction of current flow |
US6030071A (en) * | 1997-07-03 | 2000-02-29 | Lexmark International, Inc. | Printhead having heating element conductors arranged in a matrix |
EP0968825B1 (de) * | 1998-06-30 | 2005-09-14 | Canon Kabushiki Kaisha | Zeilendruckkopf für Tintenstrahldrucker |
US6093910A (en) * | 1998-10-30 | 2000-07-25 | Tachi-S Engineering, Usa Inc. | Electric seat heater |
US6222166B1 (en) * | 1999-08-09 | 2001-04-24 | Watlow Electric Manufacturing Co. | Aluminum substrate thick film heater |
US6427597B1 (en) | 2000-01-27 | 2002-08-06 | Patrice M. Aurenty | Method of controlling image resolution on a substrate |
US6314216B1 (en) * | 2000-01-28 | 2001-11-06 | Hewlett-Packard Company | Resistor array with position dependent heat dissipation |
US6412919B1 (en) | 2000-09-05 | 2002-07-02 | Hewlett-Packard Company | Transistor drop ejectors in ink-jet print heads |
US6403403B1 (en) * | 2000-09-12 | 2002-06-11 | The Aerospace Corporation | Diode isolated thin film fuel cell array addressing method |
US6692700B2 (en) | 2001-02-14 | 2004-02-17 | Handylab, Inc. | Heat-reduction methods and systems related to microfluidic devices |
AUPR399001A0 (en) * | 2001-03-27 | 2001-04-26 | Silverbrook Research Pty. Ltd. | An apparatus and method(ART104) |
US6852287B2 (en) | 2001-09-12 | 2005-02-08 | Handylab, Inc. | Microfluidic devices having a reduced number of input and output connections |
US7829025B2 (en) | 2001-03-28 | 2010-11-09 | Venture Lending & Leasing Iv, Inc. | Systems and methods for thermal actuation of microfluidic devices |
US7323140B2 (en) | 2001-03-28 | 2008-01-29 | Handylab, Inc. | Moving microdroplets in a microfluidic device |
US8895311B1 (en) | 2001-03-28 | 2014-11-25 | Handylab, Inc. | Methods and systems for control of general purpose microfluidic devices |
US7010391B2 (en) | 2001-03-28 | 2006-03-07 | Handylab, Inc. | Methods and systems for control of microfluidic devices |
JP4837192B2 (ja) * | 2001-06-26 | 2011-12-14 | ローム株式会社 | 加熱ヒータおよびその加熱ヒータを備えた定着装置 |
US6755509B2 (en) * | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
EP2402089A1 (de) | 2003-07-31 | 2012-01-04 | Handylab, Inc. | Verarbeitung partikelhaltiger Proben |
US6946718B2 (en) * | 2004-01-05 | 2005-09-20 | Hewlett-Packard Development Company, L.P. | Integrated fuse for multilayered structure |
WO2005108620A2 (en) | 2004-05-03 | 2005-11-17 | Handylab, Inc. | Processing polynucleotide-containing samples |
US8852862B2 (en) | 2004-05-03 | 2014-10-07 | Handylab, Inc. | Method for processing polynucleotide-containing samples |
GB0500111D0 (en) * | 2005-01-06 | 2005-02-09 | Koninkl Philips Electronics Nv | Inkjet print head |
US20070079911A1 (en) * | 2005-10-12 | 2007-04-12 | Browne Alan L | Method for erasing stored data and restoring data |
JP5415253B2 (ja) | 2006-03-24 | 2014-02-12 | ハンディラブ・インコーポレーテッド | 微小流体サンプルを処理するための一体化システム及びその使用方法 |
US7998708B2 (en) | 2006-03-24 | 2011-08-16 | Handylab, Inc. | Microfluidic system for amplifying and detecting polynucleotides in parallel |
US11806718B2 (en) | 2006-03-24 | 2023-11-07 | Handylab, Inc. | Fluorescence detector for microfluidic diagnostic system |
US10900066B2 (en) | 2006-03-24 | 2021-01-26 | Handylab, Inc. | Microfluidic system for amplifying and detecting polynucleotides in parallel |
WO2008060604A2 (en) | 2006-11-14 | 2008-05-22 | Handylab, Inc. | Microfluidic system for amplifying and detecting polynucleotides in parallel |
WO2008061165A2 (en) | 2006-11-14 | 2008-05-22 | Handylab, Inc. | Microfluidic cartridge and method of making same |
US20090136385A1 (en) | 2007-07-13 | 2009-05-28 | Handylab, Inc. | Reagent Tube |
USD621060S1 (en) | 2008-07-14 | 2010-08-03 | Handylab, Inc. | Microfluidic cartridge |
US9186677B2 (en) | 2007-07-13 | 2015-11-17 | Handylab, Inc. | Integrated apparatus for performing nucleic acid extraction and diagnostic testing on multiple biological samples |
US8133671B2 (en) | 2007-07-13 | 2012-03-13 | Handylab, Inc. | Integrated apparatus for performing nucleic acid extraction and diagnostic testing on multiple biological samples |
US8105783B2 (en) | 2007-07-13 | 2012-01-31 | Handylab, Inc. | Microfluidic cartridge |
US9618139B2 (en) | 2007-07-13 | 2017-04-11 | Handylab, Inc. | Integrated heater and magnetic separator |
CA2693654C (en) | 2007-07-13 | 2018-02-13 | Handylab, Inc. | Polynucleotide capture materials, and methods of using same |
US8287820B2 (en) | 2007-07-13 | 2012-10-16 | Handylab, Inc. | Automated pipetting apparatus having a combined liquid pump and pipette head system |
US8182763B2 (en) | 2007-07-13 | 2012-05-22 | Handylab, Inc. | Rack for sample tubes and reagent holders |
WO2009096940A1 (en) * | 2008-01-28 | 2009-08-06 | Hewlett-Packard Development Company, L.P. | Common base lateral bipolar junction transistor circuit for an inkjet print head |
USD618820S1 (en) | 2008-07-11 | 2010-06-29 | Handylab, Inc. | Reagent holder |
USD787087S1 (en) | 2008-07-14 | 2017-05-16 | Handylab, Inc. | Housing |
US8907718B2 (en) * | 2009-03-04 | 2014-12-09 | Sensortechnics GmbH | Passive resistive-heater addressing network |
US8637794B2 (en) * | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
KR101841378B1 (ko) * | 2009-12-15 | 2018-03-22 | 램 리써치 코포레이션 | Cd 균일성을 향상시키기 위한 기판 온도의 조절 |
US8791392B2 (en) | 2010-10-22 | 2014-07-29 | Lam Research Corporation | Methods of fault detection for multiplexed heater array |
US8546732B2 (en) | 2010-11-10 | 2013-10-01 | Lam Research Corporation | Heating plate with planar heater zones for semiconductor processing |
CA3082652A1 (en) | 2011-04-15 | 2012-10-18 | Becton, Dickinson And Company | Scanning real-time microfluidic thermocycler and methods for synchronized thermocycling and scanning optical detection |
US9307578B2 (en) | 2011-08-17 | 2016-04-05 | Lam Research Corporation | System and method for monitoring temperatures of and controlling multiplexed heater array |
US10388493B2 (en) | 2011-09-16 | 2019-08-20 | Lam Research Corporation | Component of a substrate support assembly producing localized magnetic fields |
US8624168B2 (en) | 2011-09-20 | 2014-01-07 | Lam Research Corporation | Heating plate with diode planar heater zones for semiconductor processing |
US8461674B2 (en) | 2011-09-21 | 2013-06-11 | Lam Research Corporation | Thermal plate with planar thermal zones for semiconductor processing |
DK2761305T3 (da) | 2011-09-30 | 2017-11-20 | Becton Dickinson Co | Forenet reagensstrimmel |
USD692162S1 (en) | 2011-09-30 | 2013-10-22 | Becton, Dickinson And Company | Single piece reagent holder |
EP2773892B1 (de) | 2011-11-04 | 2020-10-07 | Handylab, Inc. | Vorrichtung zur vorbereitung von polynukleotidproben |
RU2658773C2 (ru) | 2012-02-03 | 2018-06-22 | Бектон, Дикинсон Энд Компани | Система и способ выполнения автоматизированных тестов над множеством биологических проб |
US9324589B2 (en) * | 2012-02-28 | 2016-04-26 | Lam Research Corporation | Multiplexed heater array using AC drive for semiconductor processing |
US8809747B2 (en) | 2012-04-13 | 2014-08-19 | Lam Research Corporation | Current peak spreading schemes for multiplexed heated array |
US10049948B2 (en) | 2012-11-30 | 2018-08-14 | Lam Research Corporation | Power switching system for ESC with array of thermal control elements |
FR3052291B1 (fr) | 2016-06-03 | 2018-11-23 | Stmicroelectronics (Rousset) Sas | Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. |
US10761041B2 (en) * | 2017-11-21 | 2020-09-01 | Watlow Electric Manufacturing Company | Multi-parallel sensor array system |
JP7411431B2 (ja) * | 2020-01-31 | 2024-01-11 | 新光電気工業株式会社 | 静電チャック、基板固定装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3515850A (en) * | 1967-10-02 | 1970-06-02 | Ncr Co | Thermal printing head with diffused printing elements |
JPS4942707B1 (de) * | 1970-09-16 | 1974-11-16 | ||
US3769562A (en) * | 1972-02-07 | 1973-10-30 | Texas Instruments Inc | Double isolation for electronic devices |
US3931492A (en) * | 1972-06-19 | 1976-01-06 | Nippon Telegraph And Telephone Public Corporation | Thermal print head |
US3736406A (en) * | 1972-06-21 | 1973-05-29 | Rca Corp | Thermographic print head and method of making same |
US3815144A (en) * | 1972-09-14 | 1974-06-04 | H Aiken | Thermal recorder having an analogue to digital converter |
US3852563A (en) * | 1974-02-01 | 1974-12-03 | Hewlett Packard Co | Thermal printing head |
GB1585214A (en) * | 1976-05-31 | 1981-02-25 | Matsushita Electric Ind Co Ltd | Thermal head apparatus |
JPS53114072A (en) * | 1977-03-17 | 1978-10-05 | Oki Electric Ind Co Ltd | Multilayer circuit |
US4099046A (en) * | 1977-04-11 | 1978-07-04 | Northern Telecom Limited | Thermal printing device |
US4213030A (en) * | 1977-07-21 | 1980-07-15 | Kyoto Ceramic Kabushiki Kaisha | Silicon-semiconductor-type thermal head |
JPS5953875B2 (ja) * | 1978-06-14 | 1984-12-27 | 株式会社東芝 | 感熱記録ヘツド |
US4232212A (en) * | 1978-10-03 | 1980-11-04 | Northern Telecom Limited | Thermal printers |
JPS55124674A (en) * | 1979-03-22 | 1980-09-25 | Fuji Xerox Co Ltd | Driver for thermosensitive recording head |
JPS56109068A (en) * | 1980-02-04 | 1981-08-29 | Nippon Telegr & Teleph Corp <Ntt> | Recorder for multitone |
US4401881A (en) * | 1980-03-21 | 1983-08-30 | Tokyo Shibaura Denki Kabushiki Kaisha | Two-dimensional thermal head |
US4754141A (en) * | 1985-08-22 | 1988-06-28 | High Technology Sensors, Inc. | Modulated infrared source |
US4695853A (en) * | 1986-12-12 | 1987-09-22 | Hewlett-Packard Company | Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture |
US5081474A (en) * | 1988-07-04 | 1992-01-14 | Canon Kabushiki Kaisha | Recording head having multi-layer matrix wiring |
US5175565A (en) * | 1988-07-26 | 1992-12-29 | Canon Kabushiki Kaisha | Ink jet substrate including plural temperature sensors and heaters |
US4999650A (en) * | 1989-12-18 | 1991-03-12 | Eastman Kodak Company | Bubble jet print head having improved multiplex actuation construction |
-
1992
- 1992-08-03 US US07/925,355 patent/US5414245A/en not_active Expired - Lifetime
-
1993
- 1993-08-02 EP EP93306107A patent/EP0582453B1/de not_active Expired - Lifetime
- 1993-08-02 DE DE69310626T patent/DE69310626T2/de not_active Expired - Lifetime
- 1993-08-02 JP JP5190988A patent/JPH07290706A/ja active Pending
-
1995
- 1995-01-10 US US08/370,947 patent/US5609910A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0582453A2 (de) | 1994-02-09 |
JPH07290706A (ja) | 1995-11-07 |
DE69310626T2 (de) | 1997-09-11 |
EP0582453A3 (en) | 1994-07-13 |
EP0582453B1 (de) | 1997-05-14 |
US5609910A (en) | 1997-03-11 |
US5414245A (en) | 1995-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE), |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE |