DE69231290D1 - Halbleitervorrichtung und Verfahren zu ihrer Herstellung - Google Patents

Halbleitervorrichtung und Verfahren zu ihrer Herstellung

Info

Publication number
DE69231290D1
DE69231290D1 DE69231290T DE69231290T DE69231290D1 DE 69231290 D1 DE69231290 D1 DE 69231290D1 DE 69231290 T DE69231290 T DE 69231290T DE 69231290 T DE69231290 T DE 69231290T DE 69231290 D1 DE69231290 D1 DE 69231290D1
Authority
DE
Germany
Prior art keywords
manufacture
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69231290T
Other languages
English (en)
Inventor
Mitsutaka Sato
Junichi Kasai
Masanori Yoshimoto
Kouichi Takeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyushu Fujitsu Electronics Ltd
Fujitsu Ltd
Original Assignee
Kyushu Fujitsu Electronics Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3347283A external-priority patent/JPH05183099A/ja
Application filed by Kyushu Fujitsu Electronics Ltd, Fujitsu Ltd filed Critical Kyushu Fujitsu Electronics Ltd
Application granted granted Critical
Publication of DE69231290D1 publication Critical patent/DE69231290D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
DE69231290T 1991-12-27 1992-12-23 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Expired - Lifetime DE69231290D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3347283A JPH05183099A (ja) 1991-12-27 1991-12-27 半導体装置及びその製造方法
JP9452492 1992-04-14

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EP (2) EP0987758A3 (de)
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KR960009108B1 (en) 1996-07-10
EP0550013B1 (de) 2000-07-26
EP0550013A2 (de) 1993-07-07
EP0987758A3 (de) 2000-05-24
EP0987758A2 (de) 2000-03-22
US5637915A (en) 1997-06-10
EP0550013A3 (de) 1993-07-28
US5409866A (en) 1995-04-25

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