DE69226603T2 - Mit einer Antireflexionszusammensetzung überzogenes Substrat und Verfahren zur Behandlung eines solchen Substrats. - Google Patents

Mit einer Antireflexionszusammensetzung überzogenes Substrat und Verfahren zur Behandlung eines solchen Substrats.

Info

Publication number
DE69226603T2
DE69226603T2 DE69226603T DE69226603T DE69226603T2 DE 69226603 T2 DE69226603 T2 DE 69226603T2 DE 69226603 T DE69226603 T DE 69226603T DE 69226603 T DE69226603 T DE 69226603T DE 69226603 T2 DE69226603 T2 DE 69226603T2
Authority
DE
Germany
Prior art keywords
substrate
treating
reflective composition
coated
substrate coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69226603T
Other languages
English (en)
Other versions
DE69226603T3 (de
DE69226603D1 (de
Inventor
James W Thackeray
George W Orsula
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25157030&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69226603(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Application granted granted Critical
Publication of DE69226603D1 publication Critical patent/DE69226603D1/de
Publication of DE69226603T2 publication Critical patent/DE69226603T2/de
Publication of DE69226603T3 publication Critical patent/DE69226603T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
DE69226603T 1991-11-15 1992-10-22 Mit einer Antireflexionszusammensetzung überzogenes Substrat und Verfahren zur Behandlung eines solchen Substrats. Expired - Lifetime DE69226603T3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/792,482 US6165697A (en) 1991-11-15 1991-11-15 Antihalation compositions

Publications (3)

Publication Number Publication Date
DE69226603D1 DE69226603D1 (de) 1998-09-17
DE69226603T2 true DE69226603T2 (de) 1999-03-18
DE69226603T3 DE69226603T3 (de) 2001-09-06

Family

ID=25157030

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69226603T Expired - Lifetime DE69226603T3 (de) 1991-11-15 1992-10-22 Mit einer Antireflexionszusammensetzung überzogenes Substrat und Verfahren zur Behandlung eines solchen Substrats.
DE69232467T Expired - Lifetime DE69232467T3 (de) 1991-11-15 1992-10-22 Antireflexionszusammensetzungen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69232467T Expired - Lifetime DE69232467T3 (de) 1991-11-15 1992-10-22 Antireflexionszusammensetzungen

Country Status (4)

Country Link
US (5) US6165697A (de)
EP (2) EP0542008B2 (de)
JP (1) JP3050459B2 (de)
DE (2) DE69226603T3 (de)

Families Citing this family (132)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6528235B2 (en) * 1991-11-15 2003-03-04 Shipley Company, L.L.C. Antihalation compositions
US6773864B1 (en) 1991-11-15 2004-08-10 Shipley Company, L.L.C. Antihalation compositions
US6472128B2 (en) * 1996-04-30 2002-10-29 Shipley Company, L.L.C. Antihalation compositions
US6165697A (en) * 1991-11-15 2000-12-26 Shipley Company, L.L.C. Antihalation compositions
US20030128334A1 (en) * 1993-05-03 2003-07-10 O'donnell Francis E. Apparatus and method for customized laser correction of refractive error
US5576359A (en) * 1993-07-20 1996-11-19 Wako Pure Chemical Industries, Ltd. Deep ultraviolet absorbent composition
EP0675410B1 (de) * 1994-03-28 1999-08-04 Wako Pure Chemical Industries Ltd Resistzusammensetzung für tiefe Ultraviolettbelichtung
JP2953562B2 (ja) * 1994-07-18 1999-09-27 東京応化工業株式会社 リソグラフィー用下地材及びそれを用いた多層レジスト材料
DE69703094T2 (de) * 1996-03-07 2001-05-03 Clariant Finance Bvi Ltd Thermisches verarbeitungsverfahren von positiver photoresist-zusammensetzung
JP3436843B2 (ja) * 1996-04-25 2003-08-18 東京応化工業株式会社 リソグラフィー用下地材及びそれを用いたリソグラフィー用レジスト材料
US5886102A (en) * 1996-06-11 1999-03-23 Shipley Company, L.L.C. Antireflective coating compositions
JP2867964B2 (ja) * 1996-06-27 1999-03-10 日本電気株式会社 レジスト膜パターンの形成方法
US5652317A (en) * 1996-08-16 1997-07-29 Hoechst Celanese Corporation Antireflective coatings for photoresist compositions
US7147983B1 (en) 1996-10-07 2006-12-12 Shipley Company, L.L.C. Dyed photoresists and methods and articles of manufacture comprising same
US5948847A (en) * 1996-12-13 1999-09-07 Tokyo Ohka Kogyo Co., Ltd. Undercoating composition for photolithographic patterning
US5939236A (en) * 1997-02-07 1999-08-17 Shipley Company, L.L.C. Antireflective coating compositions comprising photoacid generators
JP3202649B2 (ja) * 1997-04-17 2001-08-27 日本電気株式会社 反射防止膜形成用材料およびこれを用いた半導体装置の製造方法
TW473653B (en) * 1997-05-27 2002-01-21 Clariant Japan Kk Composition for anti-reflective film or photo absorption film and compound used therein
US6054254A (en) * 1997-07-03 2000-04-25 Kabushiki Kaisha Toshiba Composition for underlying film and method of forming a pattern using the film
JP3473887B2 (ja) 1997-07-16 2003-12-08 東京応化工業株式会社 反射防止膜形成用組成物及びそれを用いたレジストパターンの形成方法
JPH1165125A (ja) * 1997-08-21 1999-03-05 Tokyo Ohka Kogyo Co Ltd パターン形成方法
CN1182440C (zh) * 1997-09-30 2004-12-29 西门子公司 用于深紫外线光刻的层状结构以及形成光刻层状结构的方法
US5919599A (en) * 1997-09-30 1999-07-06 Brewer Science, Inc. Thermosetting anti-reflective coatings at deep ultraviolet
JP4053631B2 (ja) * 1997-10-08 2008-02-27 Ａｚエレクトロニックマテリアルズ株式会社 反射防止膜又は光吸収膜用組成物及びこれに用いる重合体
US5976770A (en) 1998-01-15 1999-11-02 Shipley Company, L.L.C. Dyed photoresists and methods and articles of manufacture comprising same
US6190839B1 (en) * 1998-01-15 2001-02-20 Shipley Company, L.L.C. High conformality antireflective coating compositions
KR20010042973A (ko) 1998-04-29 2001-05-25 테리 브레우어 셀룰로식 결합제로부터 유도된 급속 에칭, 열경화성 반사방지 코팅
US6576408B2 (en) 1998-04-29 2003-06-10 Brewer Science, Inc. Thermosetting anti-reflective coatings comprising aryl urethanes of hydroxypropyl cellulose
US6383712B1 (en) * 1998-06-05 2002-05-07 International Business Machines Corporation Polymer-bound sensitizer
TW457403B (en) 1998-07-03 2001-10-01 Clariant Int Ltd Composition for forming a radiation absorbing coating containing blocked isocyanate compound and anti-reflective coating formed therefrom
EP1046958B1 (de) * 1998-07-10 2006-04-12 AZ Electronic Materials USA Corp. Benutzung einer zusammensetzung für eine antireflexunterschicht
US20020102483A1 (en) * 1998-09-15 2002-08-01 Timothy Adams Antireflective coating compositions
JP3852889B2 (ja) * 1998-09-24 2006-12-06 富士写真フイルム株式会社 フォトレジスト用反射防止膜材料組成物
US6114085A (en) * 1998-11-18 2000-09-05 Clariant Finance (Bvi) Limited Antireflective composition for a deep ultraviolet photoresist
US6544717B2 (en) 1999-01-28 2003-04-08 Tokyo Ohka Kogyo Co., Ltd. Undercoating composition for photolithographic resist
TW476865B (en) * 1999-01-28 2002-02-21 Tokyo Ohka Kogyo Co Ltd Undercoating composition for photolithographic resist
US6316165B1 (en) * 1999-03-08 2001-11-13 Shipley Company, L.L.C. Planarizing antireflective coating compositions
US6924339B2 (en) * 1999-03-12 2005-08-02 Arch Specialty Chemicals, Inc. Thermally cured underlayer for lithographic application
US6492092B1 (en) * 1999-03-12 2002-12-10 Arch Specialty Chemicals, Inc. Hydroxy-epoxide thermally cured undercoat for 193 NM lithography
US6610808B2 (en) 1999-03-12 2003-08-26 Arch Specialty Chemicals, Inc. Thermally cured underlayer for lithographic application
US6323287B1 (en) * 1999-03-12 2001-11-27 Arch Specialty Chemicals, Inc. Hydroxy-amino thermally cured undercoat for 193 NM lithography
KR100465864B1 (ko) * 1999-03-15 2005-01-24 주식회사 하이닉스반도체 유기 난반사방지 중합체 및 그의 제조방법
EP1048980B1 (de) 1999-04-28 2009-09-30 Qimonda AG Bottomresist
US6824879B2 (en) 1999-06-10 2004-11-30 Honeywell International Inc. Spin-on-glass anti-reflective coatings for photolithography
EP1190277B1 (de) 1999-06-10 2009-10-07 AlliedSignal Inc. Spin-on-glass antireflektionsbeschichtungen aufweisender halbleiter für photolithographie
US6890448B2 (en) * 1999-06-11 2005-05-10 Shipley Company, L.L.C. Antireflective hard mask compositions
KR100310252B1 (ko) * 1999-06-22 2001-11-14 박종섭 유기 반사방지 중합체 및 그의 제조방법
KR100492796B1 (ko) * 1999-07-30 2005-06-07 주식회사 하이닉스반도체 초미세 패턴의 형성 공정에서 사용되는 반사방지용 수지
US6461717B1 (en) 2000-04-24 2002-10-08 Shipley Company, L.L.C. Aperture fill
NL1015524C2 (nl) * 2000-06-26 2001-12-28 Otb Group Bv Werkwijze ter vervaardiging van een substraat om te worden toegepast in een stampervervaardigingsproces, alsmede substraat verkregen volgens een dergelijke werkwijze.
EP1172695A1 (de) * 2000-07-14 2002-01-16 Shipley Company LLC Sperrschicht
US6368400B1 (en) * 2000-07-17 2002-04-09 Honeywell International Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
TW556047B (en) 2000-07-31 2003-10-01 Shipley Co Llc Coated substrate, method for forming photoresist relief image, and antireflective composition
TW576949B (en) 2000-08-17 2004-02-21 Shipley Co Llc Antireflective coatings with increased etch rates
EP1197998A3 (de) * 2000-10-10 2005-12-21 Shipley Company LLC Antireflektiver Schaumstoff
US6444320B1 (en) 2001-01-08 2002-09-03 Brewer Science Thermosetting anti-reflective coatings for full-fill dual damascene process
TW576859B (en) * 2001-05-11 2004-02-21 Shipley Co Llc Antireflective coating compositions
KR100351458B1 (ko) * 2001-05-30 2002-09-05 주식회사 하이닉스반도체 유기 반사방지 중합체 및 그의 제조방법
KR20040075866A (ko) 2001-11-15 2004-08-30 허니웰 인터내셔날 인코포레이티드 포토리소그래피용 스핀-온 무반사 코팅
US6844131B2 (en) * 2002-01-09 2005-01-18 Clariant Finance (Bvi) Limited Positive-working photoimageable bottom antireflective coating
US20030215736A1 (en) * 2002-01-09 2003-11-20 Oberlander Joseph E. Negative-working photoimageable bottom antireflective coating
US7070914B2 (en) 2002-01-09 2006-07-04 Az Electronic Materials Usa Corp. Process for producing an image using a first minimum bottom antireflective coating composition
US7521168B2 (en) 2002-02-13 2009-04-21 Fujifilm Corporation Resist composition for electron beam, EUV or X-ray
KR20030068729A (ko) * 2002-02-16 2003-08-25 삼성전자주식회사 반사 방지용 광흡수막 형성 조성물 및 이를 이용한 반도체소자의 패턴 형성 방법
US8012670B2 (en) * 2002-04-11 2011-09-06 Rohm And Haas Electronic Materials Llc Photoresist systems
DE10227807A1 (de) * 2002-06-21 2004-01-22 Honeywell Specialty Chemicals Seelze Gmbh Silylalkylester von Anthracen- und Phenanthrencarbonsäuren
JP3852593B2 (ja) * 2002-07-17 2006-11-29 日産化学工業株式会社 反射防止膜形成組成物
JP3597523B2 (ja) * 2002-08-27 2004-12-08 東京応化工業株式会社 リソグラフィー用下地材
US7038328B2 (en) * 2002-10-15 2006-05-02 Brewer Science Inc. Anti-reflective compositions comprising triazine compounds
EP1422566A1 (de) * 2002-11-20 2004-05-26 Shipley Company, L.L.C. Mehrlagige Fotoresist-Systeme
JP2004206082A (ja) * 2002-11-20 2004-07-22 Rohm & Haas Electronic Materials Llc 多層フォトレジスト系
KR100504438B1 (ko) * 2002-11-25 2005-07-29 주식회사 하이닉스반도체 유기 반사방지막 중합체, 이의 제조 방법과 상기 중합체를포함하는 유기 반사 방지막 조성물
KR100832247B1 (ko) * 2002-11-27 2008-05-28 주식회사 동진쎄미켐 유기 난반사 방지막 조성물 및 이를 이용한 패턴 형성방법
US7160665B2 (en) * 2002-12-30 2007-01-09 International Business Machines Corporation Method for employing vertical acid transport for lithographic imaging applications
KR100512171B1 (ko) * 2003-01-24 2005-09-02 삼성전자주식회사 하층 레지스트용 조성물
US7029821B2 (en) * 2003-02-11 2006-04-18 Rohm And Haas Electronic Materials Llc Photoresist and organic antireflective coating compositions
JP4369203B2 (ja) 2003-03-24 2009-11-18 信越化学工業株式会社 反射防止膜材料、反射防止膜を有する基板及びパターン形成方法
JP4798938B2 (ja) * 2003-04-11 2011-10-19 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フォトレジストシステム
JP4105036B2 (ja) 2003-05-28 2008-06-18 信越化学工業株式会社 レジスト下層膜材料ならびにパターン形成方法
KR100882409B1 (ko) * 2003-06-03 2009-02-05 신에쓰 가가꾸 고교 가부시끼가이샤 반사 방지용 실리콘 수지, 반사 방지막 재료, 이것을 이용한 반사 방지막 및 패턴 형성 방법
US7202013B2 (en) * 2003-06-03 2007-04-10 Shin-Etsu Chemical Co., Ltd. Antireflective film material, and antireflective film and pattern formation method using the same
US7008476B2 (en) 2003-06-11 2006-03-07 Az Electronic Materials Usa Corp. Modified alginic acid of alginic acid derivatives and thermosetting anti-reflective compositions thereof
JP4069025B2 (ja) * 2003-06-18 2008-03-26 信越化学工業株式会社 レジスト下層膜材料ならびにパターン形成方法
WO2005041255A2 (en) 2003-08-04 2005-05-06 Honeywell International, Inc. Coating composition optimization for via fill and photolithography applications and methods of preparation thereof
US20050074688A1 (en) * 2003-10-03 2005-04-07 Toukhy Medhat A. Bottom antireflective coatings
US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
JP4769455B2 (ja) * 2003-12-30 2011-09-07 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． コーティング組成物
US20050215713A1 (en) * 2004-03-26 2005-09-29 Hessell Edward T Method of producing a crosslinked coating in the manufacture of integrated circuits
KR101168249B1 (ko) * 2004-05-14 2012-07-30 닛산 가가쿠 고교 가부시키 가이샤 비닐에테르 화합물을 포함하는 반사방지막 형성 조성물
US7427464B2 (en) 2004-06-22 2008-09-23 Shin-Etsu Chemical Co., Ltd. Patterning process and undercoat-forming material
JP4551704B2 (ja) 2004-07-08 2010-09-29 富士フイルム株式会社 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法
JP4621451B2 (ja) 2004-08-11 2011-01-26 富士フイルム株式会社 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法
EP1637927A1 (de) 2004-09-02 2006-03-22 Fuji Photo Film Co., Ltd. Positiv arbeitende Resistzusammensetzung und Verfahren zur Herstellung von Mustern unter Verwendung dieser Zusammensetzung
JP4439409B2 (ja) 2005-02-02 2010-03-24 富士フイルム株式会社 レジスト組成物及びそれを用いたパターン形成方法
EP1691238A3 (de) 2005-02-05 2009-01-21 Rohm and Haas Electronic Materials, L.L.C. Beschichtungszusammensetzungen zur Verwendung mit einem beschichteten Fotolack
KR100662542B1 (ko) * 2005-06-17 2006-12-28 제일모직주식회사 반사방지 하드마스크 조성물 및 이를 이용하여 기판 상에패턴화된 재료 형상을 형성시키는 방법
US8137895B2 (en) * 2005-08-09 2012-03-20 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for improving photoresist pattern adhesion
JP4580841B2 (ja) 2005-08-16 2010-11-17 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
EP1762895B1 (de) 2005-08-29 2016-02-24 Rohm and Haas Electronic Materials, L.L.C. Antireflex-Zusammensetzungen für Hartmasken
JP2007101715A (ja) 2005-09-30 2007-04-19 Fujifilm Corp パターン形成方法及びそれに用いるレジスト組成物
WO2007047379A2 (en) * 2005-10-12 2007-04-26 Sundance Enterprises Fluidized positioning and protection system
EP1829942B1 (de) 2006-02-28 2012-09-26 Rohm and Haas Electronic Materials, L.L.C. Beschichtungszusammensetzungen zur Verwendung mit einem beschichteten Fotolack
JP5145668B2 (ja) * 2006-08-11 2013-02-20 大日本印刷株式会社 パターン形成体、およびその製造方法
JP4905786B2 (ja) 2007-02-14 2012-03-28 富士フイルム株式会社 レジスト組成物及びそれを用いたパターン形成方法
US8642246B2 (en) 2007-02-26 2014-02-04 Honeywell International Inc. Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
US7592118B2 (en) 2007-03-27 2009-09-22 Fujifilm Corporation Positive resist composition and pattern forming method using the same
US8182975B2 (en) 2007-03-28 2012-05-22 Fujifilm Corporation Positive resist composition and pattern forming method using the same
JP4982228B2 (ja) 2007-03-30 2012-07-25 富士フイルム株式会社 ポジ型レジスト組成物及びこれを用いたパターン形成方法
JP5039622B2 (ja) 2007-03-30 2012-10-03 富士フイルム株式会社 ポジ型レジスト組成物及びこれを用いたパターン形成方法
JP5337398B2 (ja) 2007-04-06 2013-11-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． コーティング組成物
US7923196B2 (en) 2007-08-10 2011-04-12 Fujifilm Corporation Positive resist composition and pattern forming method using the same
JP4911469B2 (ja) 2007-09-28 2012-04-04 富士フイルム株式会社 レジスト組成物及びこれを用いたパターン形成方法
EP2071400A1 (de) 2007-11-12 2009-06-17 Rohm and Haas Electronic Materials LLC Beschichtungszusammensetzungen zur Verwendung mit einem beschichteten Fotolack
US7976894B1 (en) 2007-11-13 2011-07-12 Brewer Science Inc. Materials with thermally reversible curing mechanism
JP2009122325A (ja) 2007-11-14 2009-06-04 Fujifilm Corp トップコート組成物、それを用いたアルカリ現像液可溶性トップコート膜及びそれを用いたパターン形成方法
JP5101541B2 (ja) 2008-05-15 2012-12-19 信越化学工業株式会社 パターン形成方法
US7955782B2 (en) * 2008-09-22 2011-06-07 Honeywell International Inc. Bottom antireflective coatings exhibiting enhanced wet strip rates, bottom antireflective coating compositions for forming bottom antireflective coatings, and methods for fabricating the same
JP5112380B2 (ja) 2009-04-24 2013-01-09 信越化学工業株式会社 パターン形成方法
US9244352B2 (en) 2009-05-20 2016-01-26 Rohm And Haas Electronic Materials, Llc Coating compositions for use with an overcoated photoresist
US8501383B2 (en) 2009-05-20 2013-08-06 Rohm And Haas Electronic Materials Llc Coating compositions for use with an overcoated photoresist
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
EP2472328B1 (de) 2010-12-31 2013-06-19 Rohm and Haas Electronic Materials LLC Beschichtungszusammensetzungen zur Verwendung mit einem beschichteten Fotolack
EP2472329B1 (de) 2010-12-31 2013-06-05 Rohm and Haas Electronic Materials LLC Beschichtungszusammensetzungen zur Verwendung mit einem beschichteten Fotolack
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
JP5831388B2 (ja) * 2011-10-25 2015-12-09 信越化学工業株式会社 変性ノボラック型フェノール樹脂の製造方法
US9541834B2 (en) 2012-11-30 2017-01-10 Rohm And Haas Electronic Materials Llc Ionic thermal acid generators for low temperature applications
KR102255221B1 (ko) 2013-12-27 2021-05-24 롬엔드하스전자재료코리아유한회사 나노리소그래피용 유기 바닥 반사방지 코팅 조성물
KR102233875B1 (ko) 2013-12-30 2021-03-30 롬엔드하스전자재료코리아유한회사 광산 발생제를 포함하는 반사방지 코팅 조성물을 이용한 패턴 형성 방법
US11092894B2 (en) 2014-12-31 2021-08-17 Rohm And Haas Electronic Materials Korea Ltd. Method for forming pattern using anti-reflective coating composition comprising photoacid generator
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
JP2018062443A (ja) * 2016-10-13 2018-04-19 株式会社アルプスエンジニアリング 隔壁パターンを有するマスキング被膜の形成方法
US11269252B2 (en) 2019-07-22 2022-03-08 Rohm And Haas Electronic Materials Llc Method for forming pattern using antireflective coating composition including photoacid generator

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE278691C (de) *
GB574244A (en) * 1958-07-25 1945-12-28 Sparklets Ltd Improvements in or relating to means for producing a spray of atomised liquid
BE594235A (de) 1959-08-29
NL295625A (de) * 1962-07-26
DE1964961B2 (de) * 1969-12-24 1975-08-14 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zur Herstellung von Co polykondensaten
US4060656A (en) * 1973-04-02 1977-11-29 Teijin Limited Support for photosensitive resin
JPS5280022A (en) 1975-12-26 1977-07-05 Fuji Photo Film Co Ltd Light solubilizable composition
US4141733A (en) * 1977-10-25 1979-02-27 Eastman Kodak Company Development of light-sensitive quinone diazide compositions
US4299938A (en) * 1979-06-19 1981-11-10 Ciba-Geigy Corporation Photopolymerizable and thermally polymerizable compositions
US4341859A (en) * 1980-09-23 1982-07-27 General Electric Company Emulsion for making dry film resists
US4429034A (en) * 1980-09-23 1984-01-31 General Electric Company Dry film resists
DE3039209A1 (de) * 1980-10-17 1982-05-19 Basf Ag, 6700 Ludwigshafen Fotopolymere reliefformen und verfahren zu deren herstellung
DE3100175A1 (de) * 1981-01-07 1982-08-05 Basf Ag, 6700 Ludwigshafen Zur herstellung von druck- und reliefformen geeignete mehrschichten-elemente
US4413052A (en) * 1981-02-04 1983-11-01 Ciba-Geigy Corporation Photopolymerization process employing compounds containing acryloyl group and anthryl group
DE3107741A1 (de) * 1981-02-28 1982-09-16 Basf Ag, 6700 Ludwigshafen Zur herstellung von druck- und reliefformen geeignete mehrschichten-elemente sowie verfahren zu ihrer herstellung
US4370405A (en) 1981-03-30 1983-01-25 Hewlett-Packard Company Multilayer photoresist process utilizing an absorbant dye
US4362809A (en) * 1981-03-30 1982-12-07 Hewlett-Packard Company Multilayer photoresist process utilizing an absorbant dye
US4377631A (en) 1981-06-22 1983-03-22 Philip A. Hunt Chemical Corporation Positive novolak photoresist compositions
US4442197A (en) 1982-01-11 1984-04-10 General Electric Company Photocurable compositions
US4423138A (en) 1982-01-21 1983-12-27 Eastman Kodak Company Resist developer with ammonium or phosphonium compound and method of use to develop o-quinone diazide and novolac resist
US4439516A (en) 1982-03-15 1984-03-27 Shipley Company Inc. High temperature positive diazo photoresist processing using polyvinyl phenol
US4404357A (en) 1982-05-03 1983-09-13 Shipley Company Inc. High temperature naphthol novolak resin
US4424315A (en) 1982-09-20 1984-01-03 Shipley Company Inc. Naphthol novolak resin blend
US4822718A (en) * 1982-09-30 1989-04-18 Brewer Science, Inc. Light absorbing coating
US4910122A (en) * 1982-09-30 1990-03-20 Brewer Science, Inc. Anti-reflective coating
ATE37242T1 (de) 1984-02-10 1988-09-15 Ciba Geigy Ag Verfahren zur herstellung einer schutzschicht oder einer reliefabbildung.
JPS60220931A (ja) * 1984-03-06 1985-11-05 Tokyo Ohka Kogyo Co Ltd 感光性樹脂用下地材料
US4487889A (en) * 1984-04-25 1984-12-11 Scm Corporation Aqueous glycoluril thermosetting coating
DE3584316D1 (de) 1984-06-01 1991-11-14 Rohm & Haas Lichtempfindliche beschichtungszusammensetzung, aus diesem hergestellte thermisch stabile beschichtungen und verfahren zur herstellung von thermisch stabilen polymerbildern.
DD278691A3 (de) * 1985-02-04 1990-05-16 Univ Schiller Jena Verfahren zur herstellung von uv-absorbierenden optischen materialien
US4885232A (en) * 1985-03-11 1989-12-05 Hoechst Celanese Corporation High temperature post exposure baking treatment for positive photoresist compositions
US4609614A (en) † 1985-06-24 1986-09-02 Rca Corporation Process of using absorptive layer in optical lithography with overlying photoresist layer to form relief pattern on substrate
US4603101A (en) 1985-09-27 1986-07-29 General Electric Company Photoresist compositions containing t-substituted organomethyl vinylaryl ether materials
CA1307695C (en) 1986-01-13 1992-09-22 Wayne Edmund Feely Photosensitive compounds and thermally stable and aqueous developablenegative images
US4719166A (en) * 1986-07-29 1988-01-12 Eastman Kodak Company Positive-working photoresist elements containing anti-reflective butadienyl dyes which are thermally stable at temperatures of at least 200° C.
JPS6381820A (ja) * 1986-09-25 1988-04-12 Toshiba Corp レジストパタ−ン形成方法
US4863827A (en) * 1986-10-20 1989-09-05 American Hoechst Corporation Postive working multi-level photoresist
US4764561A (en) * 1987-06-12 1988-08-16 Nalco Chemical Company Melamine-formaldehyde/styrene-acrylate paint detackification composition
US5139918A (en) * 1988-03-02 1992-08-18 Hewlett-Packard Company Photoresist system and photoetching process employing an I-line peak light source
US4860062A (en) * 1988-05-20 1989-08-22 Shipley Company Inc. Device and method for measuring reflective notch control in photoresists
US4921778A (en) * 1988-07-29 1990-05-01 Shipley Company Inc. Photoresist pattern fabrication employing chemically amplified metalized material
DE68928548T2 (de) 1988-09-28 1998-04-23 Brewer Science Inc Multifunktionelle photolithographische zusammensetzungen
US4981530A (en) * 1988-11-28 1991-01-01 International Business Machines Corporation Planarizing ladder-type silsesquioxane polymer insulation layer
US5128232A (en) 1989-05-22 1992-07-07 Shiply Company Inc. Photoresist composition with copolymer binder having a major proportion of phenolic units and a minor proportion of non-aromatic cyclic alcoholic units
US5019481A (en) * 1989-09-25 1991-05-28 International Business Machines Corporation Aqueous base developable negative resist compositions
EP0423446B1 (de) 1989-10-17 1998-03-04 Shipley Company Inc. Fotoresist für nahes U.V.
US5089374A (en) * 1990-08-20 1992-02-18 Eastman Kodak Company Novel bis-onium salts and the use thereof as photoinitiators
US5100503A (en) * 1990-09-14 1992-03-31 Ncr Corporation Silica-based anti-reflective planarizing layer
US5219788A (en) 1991-02-25 1993-06-15 Ibm Corporation Bilayer metallization cap for photolithography
US5206116A (en) * 1991-03-04 1993-04-27 Shipley Company Inc. Light-sensitive composition for use as a soldermask and process
US6165697A (en) * 1991-11-15 2000-12-26 Shipley Company, L.L.C. Antihalation compositions
US6528235B2 (en) * 1991-11-15 2003-03-04 Shipley Company, L.L.C. Antihalation compositions
US6773864B1 (en) * 1991-11-15 2004-08-10 Shipley Company, L.L.C. Antihalation compositions
US6472128B2 (en) * 1996-04-30 2002-10-29 Shipley Company, L.L.C. Antihalation compositions
US5693691A (en) * 1995-08-21 1997-12-02 Brewer Science, Inc. Thermosetting anti-reflective coatings compositions
US5939236A (en) * 1997-02-07 1999-08-17 Shipley Company, L.L.C. Antireflective coating compositions comprising photoacid generators
US6190839B1 (en) * 1998-01-15 2001-02-20 Shipley Company, L.L.C. High conformality antireflective coating compositions
US20020102483A1 (en) * 1998-09-15 2002-08-01 Timothy Adams Antireflective coating compositions
US6316165B1 (en) * 1999-03-08 2001-11-13 Shipley Company, L.L.C. Planarizing antireflective coating compositions
KR100395904B1 (ko) * 1999-04-23 2003-08-27 주식회사 하이닉스반도체 유기 반사방지 중합체 및 그의 제조방법
US6890448B2 (en) * 1999-06-11 2005-05-10 Shipley Company, L.L.C. Antireflective hard mask compositions
TW556047B (en) * 2000-07-31 2003-10-01 Shipley Co Llc Coated substrate, method for forming photoresist relief image, and antireflective composition
TW576859B (en) * 2001-05-11 2004-02-21 Shipley Co Llc Antireflective coating compositions

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US7776508B2 (en) 2010-08-17
US5851738A (en) 1998-12-22
EP0542008B1 (de) 1998-08-12
EP0542008A1 (de) 1993-05-19
EP0542008B2 (de) 2001-02-28
EP0763781A3 (de) 1997-07-16
US6165697A (en) 2000-12-26
EP0763781A2 (de) 1997-03-19
DE69232467T2 (de) 2002-10-17
JP3050459B2 (ja) 2000-06-12
JPH06118631A (ja) 1994-04-28
DE69232467T3 (de) 2008-09-18
US5851730A (en) 1998-12-22
US20080248426A1 (en) 2008-10-09
EP0763781B2 (de) 2008-03-12
US6451503B1 (en) 2002-09-17
DE69232467D1 (de) 2002-04-11
EP0763781B1 (de) 2002-03-06
DE69226603T3 (de) 2001-09-06
DE69226603D1 (de) 1998-09-17

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