DE69221627D1 - Verfahren zum herstellen von löthöckern und löthöcker so hergestellt. - Google Patents
Verfahren zum herstellen von löthöckern und löthöcker so hergestellt.Info
- Publication number
- DE69221627D1 DE69221627D1 DE69221627T DE69221627T DE69221627D1 DE 69221627 D1 DE69221627 D1 DE 69221627D1 DE 69221627 T DE69221627 T DE 69221627T DE 69221627 T DE69221627 T DE 69221627T DE 69221627 D1 DE69221627 D1 DE 69221627D1
- Authority
- DE
- Germany
- Prior art keywords
- solder
- bump
- under
- contact pad
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/036—Manufacturing methods by patterning a pre-deposited material
- H01L2224/0361—Physical or chemical etching
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/039—Methods of manufacturing bonding areas involving a specific sequence of method steps
- H01L2224/03912—Methods of manufacturing bonding areas involving a specific sequence of method steps the bump being used as a mask for patterning the bonding area
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/1147—Manufacturing methods using a lift-off mask
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/115—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
- H01L2224/11502—Pre-existing or pre-deposited material
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L2224/118—Post-treatment of the bump connector
- H01L2224/11848—Thermal treatments, e.g. annealing, controlled cooling
- H01L2224/11849—Reflowing
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L2224/119—Methods of manufacturing bump connectors involving a specific sequence of method steps
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
- H01L2224/13018—Shape in side view comprising protrusions or indentations
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1302—Disposition
- H01L2224/13023—Disposition the whole bump connector protruding from the surface
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01007—Nitrogen [N]
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/01022—Titanium [Ti]
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/759,450 US5162257A (en) | 1991-09-13 | 1991-09-13 | Solder bump fabrication method |
PCT/US1992/007722 WO1993006620A1 (en) | 1991-09-13 | 1992-09-11 | Solder bump fabrication method and solder bumps formed thereby |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69221627D1 true DE69221627D1 (de) | 1997-09-18 |
DE69221627T2 DE69221627T2 (de) | 1998-01-08 |
Family
ID=25055684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69221627T Expired - Fee Related DE69221627T2 (de) | 1991-09-13 | 1992-09-11 | Verfahren zum herstellen von löthöckern und löthöcker so hergestellt. |
Country Status (10)
Country | Link |
---|---|
US (2) | US5162257A (de) |
EP (1) | EP0603296B1 (de) |
JP (1) | JP2842692B2 (de) |
KR (1) | KR0186061B1 (de) |
AT (1) | ATE156935T1 (de) |
CA (1) | CA2116766C (de) |
DE (1) | DE69221627T2 (de) |
ES (1) | ES2106194T3 (de) |
TW (1) | TW200417B (de) |
WO (1) | WO1993006620A1 (de) |
Families Citing this family (95)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950001962A (ko) * | 1993-06-30 | 1995-01-04 | 김광호 | 반도체 칩 범프 |
US5366140A (en) * | 1993-09-30 | 1994-11-22 | Minnesota Mining And Manufacturing Company | Patterned array of uniform metal microbeads |
US5442852A (en) * | 1993-10-26 | 1995-08-22 | Pacific Microelectronics Corporation | Method of fabricating solder ball array |
US5396702A (en) * | 1993-12-15 | 1995-03-14 | At&T Corp. | Method for forming solder bumps on a substrate using an electrodeposition technique |
US5532550A (en) * | 1993-12-30 | 1996-07-02 | Adler; Robert | Organic based led display matrix |
US5665639A (en) * | 1994-02-23 | 1997-09-09 | Cypress Semiconductor Corp. | Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal |
US5470787A (en) * | 1994-05-02 | 1995-11-28 | Motorola, Inc. | Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same |
US5503286A (en) * | 1994-06-28 | 1996-04-02 | International Business Machines Corporation | Electroplated solder terminal |
US5539153A (en) * | 1994-08-08 | 1996-07-23 | Hewlett-Packard Company | Method of bumping substrates by contained paste deposition |
TW253856B (en) * | 1994-12-13 | 1995-08-11 | At & T Corp | Method of solder bonding, and article produced by the method |
AU6376796A (en) * | 1995-03-20 | 1996-10-16 | Mcnc | Solder bump fabrication methods and structure including a ti tanium barrier layer |
US6388203B1 (en) | 1995-04-04 | 2002-05-14 | Unitive International Limited | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby |
WO1996031905A1 (en) * | 1995-04-05 | 1996-10-10 | Mcnc | A solder bump structure for a microelectronic substrate |
US5620131A (en) * | 1995-06-15 | 1997-04-15 | Lucent Technologies Inc. | Method of solder bonding |
US5874782A (en) * | 1995-08-24 | 1999-02-23 | International Business Machines Corporation | Wafer with elevated contact structures |
KR100438256B1 (ko) * | 1995-12-18 | 2004-08-25 | 마츠시타 덴끼 산교 가부시키가이샤 | 반도체장치 및 그 제조방법 |
US5736456A (en) * | 1996-03-07 | 1998-04-07 | Micron Technology, Inc. | Method of forming conductive bumps on die for flip chip applications |
US5851911A (en) | 1996-03-07 | 1998-12-22 | Micron Technology, Inc. | Mask repattern process |
US5793116A (en) * | 1996-05-29 | 1998-08-11 | Mcnc | Microelectronic packaging using arched solder columns |
US5903058A (en) * | 1996-07-17 | 1999-05-11 | Micron Technology, Inc. | Conductive bumps on die for flip chip application |
JP3413020B2 (ja) * | 1996-07-17 | 2003-06-03 | 株式会社東芝 | 半導体装置の製造方法 |
US5902686A (en) * | 1996-11-21 | 1999-05-11 | Mcnc | Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures |
JP3553300B2 (ja) * | 1996-12-02 | 2004-08-11 | 富士通株式会社 | 半導体装置の製造方法及び半導体装置の実装方法 |
US6045030A (en) * | 1997-03-13 | 2000-04-04 | Raytheon Company | Sealing electronic packages containing bumped hybrids |
US6117299A (en) * | 1997-05-09 | 2000-09-12 | Mcnc | Methods of electroplating solder bumps of uniform height on integrated circuit substrates |
US5926731A (en) * | 1997-07-02 | 1999-07-20 | Delco Electronics Corp. | Method for controlling solder bump shape and stand-off height |
US5990472A (en) * | 1997-09-29 | 1999-11-23 | Mcnc | Microelectronic radiation detectors for detecting and emitting radiation signals |
US5962151A (en) * | 1997-12-05 | 1999-10-05 | Delco Electronics Corp. | Method for controlling solderability of a conductor and conductor formed thereby |
US5937320A (en) * | 1998-04-08 | 1999-08-10 | International Business Machines Corporation | Barrier layers for electroplated SnPb eutectic solder joints |
US6595408B1 (en) * | 1998-10-07 | 2003-07-22 | Micron Technology, Inc. | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
US6268275B1 (en) | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
US6139972A (en) * | 1998-10-26 | 2000-10-31 | Agilent Technologies Inc. | Solder paste containment device |
JP3667184B2 (ja) * | 1999-02-26 | 2005-07-06 | 住友ベークライト株式会社 | 半導体装置 |
JP3287328B2 (ja) * | 1999-03-09 | 2002-06-04 | 日本電気株式会社 | 半導体装置及び半導体装置の製造方法 |
US6649533B1 (en) * | 1999-05-05 | 2003-11-18 | Advanced Micro Devices, Inc. | Method and apparatus for forming an under bump metallurgy layer |
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-
1991
- 1991-09-13 US US07/759,450 patent/US5162257A/en not_active Expired - Lifetime
-
1992
- 1992-08-07 US US07/927,069 patent/US5293006A/en not_active Expired - Lifetime
- 1992-09-11 EP EP92919808A patent/EP0603296B1/de not_active Expired - Lifetime
- 1992-09-11 DE DE69221627T patent/DE69221627T2/de not_active Expired - Fee Related
- 1992-09-11 KR KR1019940700820A patent/KR0186061B1/ko not_active IP Right Cessation
- 1992-09-11 ES ES92919808T patent/ES2106194T3/es not_active Expired - Lifetime
- 1992-09-11 JP JP5506136A patent/JP2842692B2/ja not_active Expired - Fee Related
- 1992-09-11 WO PCT/US1992/007722 patent/WO1993006620A1/en active IP Right Grant
- 1992-09-11 CA CA002116766A patent/CA2116766C/en not_active Expired - Fee Related
- 1992-09-11 AT AT92919808T patent/ATE156935T1/de not_active IP Right Cessation
- 1992-10-01 TW TW081107808A patent/TW200417B/zh active
Also Published As
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---|---|
US5162257A (en) | 1992-11-10 |
KR0186061B1 (ko) | 1999-04-15 |
JP2842692B2 (ja) | 1999-01-06 |
DE69221627T2 (de) | 1998-01-08 |
EP0603296B1 (de) | 1997-08-13 |
ATE156935T1 (de) | 1997-08-15 |
EP0603296A1 (de) | 1994-06-29 |
KR940702644A (ko) | 1994-08-20 |
US5293006A (en) | 1994-03-08 |
CA2116766A1 (en) | 1993-04-01 |
JPH07502147A (ja) | 1995-03-02 |
TW200417B (de) | 1993-02-21 |
ES2106194T3 (es) | 1997-11-01 |
WO1993006620A1 (en) | 1993-04-01 |
CA2116766C (en) | 1999-02-16 |
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