Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberDE69208638 T2
Publication typeGrant
Application numberDE1992608638
Publication date19 Sep 1996
Filing date20 Nov 1992
Priority date16 Dec 1991
Also published asDE69208638D1, EP0551726A1, EP0551726B1, US5294831
Publication number1992608638, 92608638, DE 69208638 T2, DE 69208638T2, DE-T2-69208638, DE1992608638, DE69208638 T2, DE69208638T2, DE92608638
InventorsKaveh Azar, Richard Edward Caron
ApplicantAt & T Corp
Export CitationBiBTeX, EndNote, RefMan
External Links: DPMA, Espacenet
Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten Module layout with improved dissipation of heat produced by high-power electronic components translated from German
DE 69208638 T2
Abstract  available in
Description  available in
Claims  available in
International ClassificationF28F3/02, H01L23/367, H05K7/20
Cooperative ClassificationF28F3/02, H01L23/367, H01L2924/0002, H01L2924/3011
European ClassificationH01L23/367, F28F3/02