DE69208638D1 - Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten - Google Patents

Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten

Info

Publication number
DE69208638D1
DE69208638D1 DE69208638T DE69208638T DE69208638D1 DE 69208638 D1 DE69208638 D1 DE 69208638D1 DE 69208638 T DE69208638 T DE 69208638T DE 69208638 T DE69208638 T DE 69208638T DE 69208638 D1 DE69208638 D1 DE 69208638D1
Authority
DE
Germany
Prior art keywords
heat dissipation
electronic components
improved heat
performance electronic
module layout
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69208638T
Other languages
English (en)
Other versions
DE69208638T2 (de
Inventor
Kaveh Azar
Richard Edward Caron
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69208638D1 publication Critical patent/DE69208638D1/de
Application granted granted Critical
Publication of DE69208638T2 publication Critical patent/DE69208638T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE69208638T 1991-12-16 1992-11-20 Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten Expired - Fee Related DE69208638T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/807,688 US5294831A (en) 1991-12-16 1991-12-16 Circuit pack layout with improved dissipation of heat produced by high power electronic components

Publications (2)

Publication Number Publication Date
DE69208638D1 true DE69208638D1 (de) 1996-04-04
DE69208638T2 DE69208638T2 (de) 1996-09-19

Family

ID=25196955

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69208638T Expired - Fee Related DE69208638T2 (de) 1991-12-16 1992-11-20 Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten

Country Status (4)

Country Link
US (1) US5294831A (de)
EP (1) EP0551726B1 (de)
KR (1) KR930015998A (de)
DE (1) DE69208638T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6705388B1 (en) 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
US6253834B1 (en) * 1998-10-28 2001-07-03 Hewlett-Packard Company Apparatus to enhance cooling of electronic device
US6330153B1 (en) 1999-01-14 2001-12-11 Nokia Telecommunications Oy Method and system for efficiently removing heat generated from an electronic device
US7028753B2 (en) * 2000-09-20 2006-04-18 Hewlett-Packard Development Company, L.P. Apparatus to enhance cooling of electronic device
US6456515B1 (en) 2000-11-27 2002-09-24 Briggs & Stratton Corporation Three-phase H-bridge assembly and method of assembling the same
DE10102621B4 (de) * 2001-01-20 2006-05-24 Conti Temic Microelectronic Gmbh Leistungsmodul
JP3513116B2 (ja) * 2001-03-22 2004-03-31 株式会社東芝 情報処理装置
WO2002089206A1 (en) * 2001-04-23 2002-11-07 Showa Denko K.K. Heat sink
DE10204200A1 (de) * 2002-02-01 2003-08-21 Conti Temic Microelectronic Leistungsmodul
CA2372399C (en) * 2002-02-19 2010-10-26 Long Manufacturing Ltd. Low profile finned heat exchanger
US7019971B2 (en) * 2003-09-30 2006-03-28 Intel Corporation Thermal management systems for micro-components
US7269005B2 (en) * 2003-11-21 2007-09-11 Intel Corporation Pumped loop cooling with remote heat exchanger and display cooling
US20050141195A1 (en) * 2003-12-31 2005-06-30 Himanshu Pokharna Folded fin microchannel heat exchanger
US20060154393A1 (en) * 2005-01-11 2006-07-13 Doan Trung T Systems and methods for removing operating heat from a light emitting diode
US20060157234A1 (en) * 2005-01-14 2006-07-20 Honeywell International Inc. Microchannel heat exchanger fabricated by wire electro-discharge machining
TWI253154B (en) * 2005-05-06 2006-04-11 Neobulb Technologies Inc Integrated circuit packaging and method of making the same
US7505884B2 (en) * 2006-04-07 2009-03-17 Delphi Technologies, Inc. Method for automatic generation of finite element mesh from IC layout data
US20080024997A1 (en) * 2006-07-28 2008-01-31 Apple Computer, Inc. Staggered memory layout for improved cooling in reduced height enclosure
TW200814264A (en) * 2006-09-07 2008-03-16 Univ Nat Central Heat sink structure for sub package substrate
US8238098B1 (en) * 2007-12-10 2012-08-07 Rivas Victor A Nano machined materials using femtosecond pulse laser technologies to enhanced thermal and optical properties for increased surface area to enhanced heat dissipation and emissivity and electromagnetic radiation
US8604923B1 (en) 2008-07-16 2013-12-10 Victor Rivas Alvarez Telemetric health monitoring devices and system
WO2011094293A1 (en) * 2010-01-27 2011-08-04 Fusion Uv Systems, Inc. Micro-channel-cooled high heat load light emitting device
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US11604035B2 (en) * 2013-09-29 2023-03-14 Huawei Technologies Co., Ltd. Support plateheat dissipation apparatus
US10014238B2 (en) * 2016-07-19 2018-07-03 Ge Energy Power Conversion Technology Ltd Method, system, and electronic assembly for thermal management
US10952352B2 (en) * 2017-10-27 2021-03-16 Micron Technology, Inc. Assemblies including heat dispersing elements and related systems and methods
JP7021013B2 (ja) * 2018-06-25 2022-02-16 トヨタ自動車株式会社 冷却器
CN114527847A (zh) * 2022-02-11 2022-05-24 北京微焓科技有限公司 散热装置的设计方法、散热装置及散热装置的制造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3961666A (en) * 1972-11-24 1976-06-08 Sony Corporation Heat dispersion device for use in an electronic apparatus
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
US4620216A (en) * 1983-04-29 1986-10-28 International Business Machines Corporation Unitary slotted heat sink for semiconductor packages
DE3573137D1 (en) * 1984-10-03 1989-10-26 Sumitomo Electric Industries Material for a semiconductor device and process for its manufacture
DE3528291A1 (de) * 1985-08-07 1987-02-19 Kernforschungsz Karlsruhe Anordnung zur kuehlung elektronischer bauelemente
US4823869A (en) * 1986-06-19 1989-04-25 International Business Machines Corporation Heat sink
US4922378A (en) * 1986-08-01 1990-05-01 Texas Instruments Incorporated Baseboard for orthogonal chip mount
US5031072A (en) * 1986-08-01 1991-07-09 Texas Instruments Incorporated Baseboard for orthogonal chip mount
US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
US4879891A (en) * 1987-04-27 1989-11-14 Thermalloy Incorporated Method of manufacturing heat sink apparatus
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component
JP2507561B2 (ja) * 1988-10-19 1996-06-12 株式会社日立製作所 半導体の冷却装置
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
US5166775A (en) * 1990-01-16 1992-11-24 Cray Research, Inc. Air manifold for cooling electronic devices
US4987478A (en) * 1990-02-20 1991-01-22 Unisys Corporation Micro individual integrated circuit package
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US5003429A (en) * 1990-07-09 1991-03-26 International Business Machines Corporation Electronic assembly with enhanced heat sinking

Also Published As

Publication number Publication date
EP0551726A1 (de) 1993-07-21
US5294831A (en) 1994-03-15
KR930015998A (ko) 1993-07-24
DE69208638T2 (de) 1996-09-19
EP0551726B1 (de) 1996-02-28

Similar Documents

Publication Publication Date Title
DE69208638D1 (de) Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten
DE69425796D1 (de) Elektronische Schaltungsanordnung mit verbesserter Hitzeableitung
DE69321375D1 (de) Elektronisches Gerät mit verschiedenen Stromquellen
DE69109624T2 (de) Herstellungsverfahren einer elektronischen Karte mit Wärmeabführung.
DE69313789T2 (de) Elektro-optischer Baustein mit linear angeordneten Komponenten
DE3887801D1 (de) Mit einer Wärmeabfuhrvorrichtung versehene gedruckte Schaltung.
DE68920923D1 (de) Elektronische Packung mit verbesserter Wärmesenke.
DE69132714D1 (de) Elektronische Schaltung mit Kühlungsmitteln
DE69129888D1 (de) Wärmesenke für elektronische Schaltung
DE69326284D1 (de) Halbleiteranordnung mit anschlusswählender Schaltung
DE69416107D1 (de) Integrierte Schaltungsgehäuse mit flach abgeschlossenem Kühlkörper
DE69223715T2 (de) Integrierte Schaltung mit reduzierten elektromagnetischen Ausstrahlungen
DE69514053D1 (de) Leiterplatte mit bimetallischer Wärmesenke
DE69303645T2 (de) Modul mit gedruckter Schaltung
DE69112389T2 (de) Elektronischer Packungsmodul.
DE69405504D1 (de) Kühlgerät mit elektronischer Kühlung
DE3482156D1 (de) Einteilige waermesenke fuer einen elektronischen anordnungsmodul.
DE3581632D1 (de) Integrierte halbleiter-schaltungsvorrichtung mit mehrschichtverdrahtung.
DE9309973U1 (de) Leiterplatte mit lichtemittierenden Bauelementen
DE69111295D1 (de) Kühlung von Schränken mit elektronischen Geräten.
DE59408442D1 (de) Elektronisches Schaltungsmodul
KR920020012U (ko) 전자부품용 냉각기
KR900014005U (ko) 회로 소자용 방열판(Heat Sink)
KR930001782U (ko) 회로부품 방열장치
KR930001780U (ko) 집적회로용 방열판

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee