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Publication numberDE69208638 D1
Publication typeGrant
Application numberDE1992608638
Publication date4 Apr 1996
Filing date20 Nov 1992
Priority date16 Dec 1991
Also published asDE69208638T2, EP0551726A1, EP0551726B1, US5294831
Publication number1992608638, 92608638, DE 69208638 D1, DE 69208638D1, DE-D1-69208638, DE1992608638, DE69208638 D1, DE69208638D1, DE92608638
InventorsKaveh Azar, Richard Edward Caron
ApplicantAt & T Corp
Export CitationBiBTeX, EndNote, RefMan
Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten Module layout with improved dissipation of heat produced by high-power electronic components translated from German
DE 69208638 D1
Abstract  available in
Description  available in
Claims  available in
International ClassificationF28F3/02, H01L23/367, H05K7/20
Cooperative ClassificationH01L2924/3011, F28F3/02, H01L2924/0002, H01L23/367
European ClassificationH01L23/367, F28F3/02
Legal Events
27 Mar 19978364No opposition during term of opposition
11 Sep 20088339Ceased/non-payment of the annual fee