DE69128861T2 - Vakuumsbehandlungsvorrichtung und Reinigungsverfahren dafür - Google Patents
Vakuumsbehandlungsvorrichtung und Reinigungsverfahren dafürInfo
- Publication number
- DE69128861T2 DE69128861T2 DE69128861T DE69128861T DE69128861T2 DE 69128861 T2 DE69128861 T2 DE 69128861T2 DE 69128861 T DE69128861 T DE 69128861T DE 69128861 T DE69128861 T DE 69128861T DE 69128861 T2 DE69128861 T2 DE 69128861T2
- Authority
- DE
- Germany
- Prior art keywords
- treatment device
- cleaning method
- method therefor
- vacuum treatment
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/35—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads providing current or voltage to the thermal head
- B41J2/355—Control circuits for heating-element selection
- B41J2/36—Print density control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/35—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads providing current or voltage to the thermal head
- B41J2/355—Control circuits for heating-element selection
- B41J2/36—Print density control
- B41J2/365—Print density control by compensation for variation in temperature
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP225321/90 | 1990-08-29 | ||
JP2225321A JP2644912B2 (ja) | 1990-08-29 | 1990-08-29 | 真空処理装置及びその運転方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
DE69128861D1 DE69128861D1 (de) | 1998-03-12 |
DE69128861T2 true DE69128861T2 (de) | 1998-10-08 |
DE69128861T3 DE69128861T3 (de) | 2004-05-19 |
Family
ID=16827524
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69133535T Expired - Lifetime DE69133535T2 (de) | 1990-08-29 | 1991-08-19 | Arbeitsverfahren für Vakuumbehandlungsvorrichtung |
DE69133564T Expired - Lifetime DE69133564T2 (de) | 1990-08-29 | 1991-08-19 | Vakuumbehandlungsvorrichtung und Arbeitsverfahren dafür |
DE69133254T Expired - Fee Related DE69133254T2 (de) | 1990-08-29 | 1991-08-19 | Arbeitsverfahren für Vakuumbehandlungsvorrichtung |
DE69133567T Expired - Lifetime DE69133567T2 (de) | 1990-08-29 | 1991-08-19 | Vakuumbehandlungsvorrichtung und Arbeitsverfahren dafür |
DE69128861T Expired - Fee Related DE69128861T3 (de) | 1990-08-29 | 1991-08-19 | Vakuumsbehandlungsvorrichtung und Reinigungsverfahren dafür |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69133535T Expired - Lifetime DE69133535T2 (de) | 1990-08-29 | 1991-08-19 | Arbeitsverfahren für Vakuumbehandlungsvorrichtung |
DE69133564T Expired - Lifetime DE69133564T2 (de) | 1990-08-29 | 1991-08-19 | Vakuumbehandlungsvorrichtung und Arbeitsverfahren dafür |
DE69133254T Expired - Fee Related DE69133254T2 (de) | 1990-08-29 | 1991-08-19 | Arbeitsverfahren für Vakuumbehandlungsvorrichtung |
DE69133567T Expired - Lifetime DE69133567T2 (de) | 1990-08-29 | 1991-08-19 | Vakuumbehandlungsvorrichtung und Arbeitsverfahren dafür |
Country Status (5)
Country | Link |
---|---|
US (47) | US5314509A (de) |
EP (5) | EP0856875B1 (de) |
JP (1) | JP2644912B2 (de) |
KR (1) | KR0184682B1 (de) |
DE (5) | DE69133535T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012100929A1 (de) * | 2012-02-06 | 2013-08-08 | Roth & Rau Ag | Substratbearbeitungsanlage |
Families Citing this family (153)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
US5685684A (en) * | 1990-11-26 | 1997-11-11 | Hitachi, Ltd. | Vacuum processing system |
US5630434A (en) * | 1991-11-05 | 1997-05-20 | Gray; Donald J. | Filter regeneration system |
US5240507A (en) * | 1991-11-05 | 1993-08-31 | Gray Donald J | Cleaning method and system |
US5702535A (en) * | 1991-11-05 | 1997-12-30 | Gebhard-Gray Associates | Dry cleaning and degreasing system |
US5534072A (en) * | 1992-06-24 | 1996-07-09 | Anelva Corporation | Integrated module multi-chamber CVD processing system and its method for processing subtrates |
US5746008A (en) * | 1992-07-29 | 1998-05-05 | Shinko Electric Co., Ltd. | Electronic substrate processing system using portable closed containers |
DE69333576T2 (de) * | 1992-08-14 | 2005-08-25 | Hamamatsu Photonics K.K., Hamamatsu | Verfahren und Vorrichtung zur Erzeugung von gasförmigen Ionen unter Verwendung von Röntgenstrahlen |
JP3239320B2 (ja) * | 1992-12-14 | 2001-12-17 | 株式会社荏原製作所 | 基板搬送システム |
JPH0712458A (ja) * | 1993-06-23 | 1995-01-17 | Murata Mfg Co Ltd | 部品乾燥機 |
US6090706A (en) * | 1993-06-28 | 2000-07-18 | Applied Materials, Inc. | Preconditioning process for treating deposition chamber prior to deposition of tungsten silicide coating on active substrates therein |
JP3158264B2 (ja) * | 1993-08-11 | 2001-04-23 | 東京エレクトロン株式会社 | ガス処理装置 |
US5565034A (en) * | 1993-10-29 | 1996-10-15 | Tokyo Electron Limited | Apparatus for processing substrates having a film formed on a surface of the substrate |
JP2900788B2 (ja) * | 1994-03-22 | 1999-06-02 | 信越半導体株式会社 | 枚葉式ウェーハ処理装置 |
US6712577B2 (en) * | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
JPH0817894A (ja) * | 1994-06-27 | 1996-01-19 | Dainippon Screen Mfg Co Ltd | 基板表面処理装置 |
FR2733036B1 (fr) * | 1995-04-14 | 1997-07-04 | Unir | Dispositif de protection anti-contamination rapprochee |
US6363164B1 (en) | 1996-05-13 | 2002-03-26 | Cummins-Allison Corp. | Automated document processing system using full image scanning |
US6283130B1 (en) | 1995-05-30 | 2001-09-04 | Anelva Corporation | Plasma cleaning method and placement area protector used in the method |
JPH0936198A (ja) * | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
US6672819B1 (en) | 1995-07-19 | 2004-01-06 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
KR100310249B1 (ko) * | 1995-08-05 | 2001-12-17 | 엔도 마코토 | 기판처리장치 |
US6481956B1 (en) * | 1995-10-27 | 2002-11-19 | Brooks Automation Inc. | Method of transferring substrates with two different substrate holding end effectors |
WO1997034742A1 (fr) * | 1996-03-18 | 1997-09-25 | Komatsu Ltd. | Dispositif de commande d'un systeme de transport de pieces |
US5779799A (en) * | 1996-06-21 | 1998-07-14 | Micron Technology, Inc. | Substrate coating apparatus |
JPH1022358A (ja) * | 1996-06-28 | 1998-01-23 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US5713138A (en) * | 1996-08-23 | 1998-02-03 | Research, Incorporated | Coating dryer system |
US6714832B1 (en) | 1996-09-11 | 2004-03-30 | Hitachi, Ltd. | Operating method of vacuum processing system and vacuum processing system |
KR100234060B1 (ko) * | 1996-12-04 | 1999-12-15 | 구자홍 | 음극선관용 스프링 구조 |
US6009890A (en) * | 1997-01-21 | 2000-01-04 | Tokyo Electron Limited | Substrate transporting and processing system |
IT1290911B1 (it) * | 1997-02-03 | 1998-12-14 | Siv Soc Italiana Vetro | Procedimento e dispositivo per l'alimentazione di impianti da vuoto atti al deposito di rivestimenti superficiali su substrati. |
US6138695A (en) * | 1997-03-07 | 2000-10-31 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
US5922136A (en) * | 1997-03-28 | 1999-07-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP cleaner apparatus and method |
US6059507A (en) * | 1997-04-21 | 2000-05-09 | Brooks Automation, Inc. | Substrate processing apparatus with small batch load lock |
JP3850952B2 (ja) * | 1997-05-15 | 2006-11-29 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
JP3850951B2 (ja) * | 1997-05-15 | 2006-11-29 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
JP3737604B2 (ja) * | 1997-06-03 | 2006-01-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US5882413A (en) * | 1997-07-11 | 1999-03-16 | Brooks Automation, Inc. | Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer |
US6139245A (en) * | 1997-07-11 | 2000-10-31 | Brooks Automation Inc. | Robot arm relocation system |
KR19990010200A (ko) * | 1997-07-15 | 1999-02-05 | 윤종용 | 감압식 건조 장치를 이용하는 반도체장치 건조방법 |
US6034000A (en) * | 1997-07-28 | 2000-03-07 | Applied Materials, Inc. | Multiple loadlock system |
US5974689A (en) * | 1997-09-23 | 1999-11-02 | Gary W. Farrell | Chemical drying and cleaning system |
DE19756830A1 (de) * | 1997-12-19 | 1999-07-01 | Wacker Chemie Gmbh | Vakuumtechnisches Trocknen von Halbleiterbruch |
US6026589A (en) * | 1998-02-02 | 2000-02-22 | Silicon Valley Group, Thermal Systems Llc | Wafer carrier and semiconductor apparatus for processing a semiconductor substrate |
KR20010041031A (ko) * | 1998-04-02 | 2001-05-15 | 오노 시게오 | 기판처리장치와 그 방법 및 노광장치와 그 방법 |
KR100265287B1 (ko) * | 1998-04-21 | 2000-10-02 | 윤종용 | 반도체소자 제조용 식각설비의 멀티챔버 시스템 |
US6079927A (en) * | 1998-04-22 | 2000-06-27 | Varian Semiconductor Equipment Associates, Inc. | Automated wafer buffer for use with wafer processing equipment |
US6246473B1 (en) | 1998-04-23 | 2001-06-12 | Sandia Corporation | Method and apparatus for monitoring plasma processing operations |
NL1009171C2 (nl) * | 1998-05-14 | 1999-12-10 | Asm Int | Waferrek voorzien van een gasverdeelinrichting. |
KR20010043705A (ko) * | 1998-05-18 | 2001-05-25 | 조셉 제이. 스위니 | 워크 스테이션간에 웨이퍼당 이송을 위한 웨이퍼 버퍼스테이션과 방법 |
US6151796A (en) * | 1998-06-04 | 2000-11-28 | Kem-Tec Japan Co., Ltd. | Substrate drying device, drying method and substrate dried by the same |
US6217272B1 (en) * | 1998-10-01 | 2001-04-17 | Applied Science And Technology, Inc. | In-line sputter deposition system |
JP2000306978A (ja) * | 1999-02-15 | 2000-11-02 | Kokusai Electric Co Ltd | 基板処理装置、基板搬送装置、および基板処理方法 |
JP3959200B2 (ja) * | 1999-03-19 | 2007-08-15 | 株式会社東芝 | 半導体装置の製造装置 |
US6251195B1 (en) | 1999-07-12 | 2001-06-26 | Fsi International, Inc. | Method for transferring a microelectronic device to and from a processing chamber |
DE60025891T2 (de) * | 1999-08-24 | 2006-07-20 | Nishikawa Rubber Co., Ltd. | Halterlose Dichtung |
JP2001093791A (ja) * | 1999-09-20 | 2001-04-06 | Hitachi Ltd | 真空処理装置の運転方法及びウエハの処理方法 |
JP2001127044A (ja) | 1999-10-29 | 2001-05-11 | Hitachi Ltd | 真空処理装置および真空処理システム |
US6364592B1 (en) * | 1999-12-01 | 2002-04-02 | Brooks Automation, Inc. | Small footprint carrier front end loader |
US6949143B1 (en) * | 1999-12-15 | 2005-09-27 | Applied Materials, Inc. | Dual substrate loadlock process equipment |
JP2001308003A (ja) * | 2000-02-15 | 2001-11-02 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
US6698991B1 (en) * | 2000-03-02 | 2004-03-02 | Applied Materials, Inc. | Fabrication system with extensible equipment sets |
JP2002043229A (ja) * | 2000-07-25 | 2002-02-08 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
US6530733B2 (en) | 2000-07-27 | 2003-03-11 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012100929A1 (de) * | 2012-02-06 | 2013-08-08 | Roth & Rau Ag | Substratbearbeitungsanlage |
US10199250B2 (en) | 2012-02-06 | 2019-02-05 | Meyer Burger (Germany) Gmbh | Substrate processing device |
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