DE69127402D1 - Elektrode für einen vertikalen Feldeffekttransistor und Verfahren zu deren Herstellung - Google Patents

Elektrode für einen vertikalen Feldeffekttransistor und Verfahren zu deren Herstellung

Info

Publication number
DE69127402D1
DE69127402D1 DE69127402T DE69127402T DE69127402D1 DE 69127402 D1 DE69127402 D1 DE 69127402D1 DE 69127402 T DE69127402 T DE 69127402T DE 69127402 T DE69127402 T DE 69127402T DE 69127402 D1 DE69127402 D1 DE 69127402D1
Authority
DE
Germany
Prior art keywords
area
semiconductor
making
conductive type
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69127402T
Other languages
English (en)
Other versions
DE69127402T2 (de
Inventor
Hayao Ohzu
Tetsunobu Kochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69127402D1 publication Critical patent/DE69127402D1/de
Application granted granted Critical
Publication of DE69127402T2 publication Critical patent/DE69127402T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H01L21/743—Making of internal connections, substrate contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0928—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising both N- and P- wells in the substrate, e.g. twin-tub
DE69127402T 1990-05-31 1991-05-29 Elektrode für einen vertikalen Feldeffekttransistor und Verfahren zu deren Herstellung Expired - Fee Related DE69127402T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13961890 1990-05-31
JP20814590 1990-08-08

Publications (2)

Publication Number Publication Date
DE69127402D1 true DE69127402D1 (de) 1997-10-02
DE69127402T2 DE69127402T2 (de) 1998-01-02

Family

ID=26472367

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69127402T Expired - Fee Related DE69127402T2 (de) 1990-05-31 1991-05-29 Elektrode für einen vertikalen Feldeffekttransistor und Verfahren zu deren Herstellung

Country Status (10)

Country Link
US (2) US5378914A (de)
EP (1) EP0459771B1 (de)
JP (1) JP3067263B2 (de)
CN (1) CN1052343C (de)
AT (1) ATE157482T1 (de)
DE (1) DE69127402T2 (de)
DK (1) DK0459771T3 (de)
ES (1) ES2104668T3 (de)
GR (1) GR3025139T3 (de)
MY (1) MY107475A (de)

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JPH11186194A (ja) * 1997-12-19 1999-07-09 Nec Corp 半導体装置の製造方法
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US6025225A (en) * 1998-01-22 2000-02-15 Micron Technology, Inc. Circuits with a trench capacitor having micro-roughened semiconductor surfaces and methods for forming the same
US6020239A (en) * 1998-01-28 2000-02-01 International Business Machines Corporation Pillar transistor incorporating a body contact
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JP4860821B2 (ja) * 1999-03-01 2012-01-25 ゼネラル セミコンダクター，インク． 半導体デバイス製造方法
US6500744B2 (en) 1999-09-02 2002-12-31 Micron Technology, Inc. Methods of forming DRAM assemblies, transistor devices, and openings in substrates
JP3899231B2 (ja) * 2000-12-18 2007-03-28 株式会社豊田中央研究所 半導体装置
US6551881B1 (en) * 2001-10-01 2003-04-22 Koninklijke Philips Electronics N.V. Self-aligned dual-oxide umosfet device and a method of fabricating same
DE10231966A1 (de) * 2002-07-15 2004-02-12 Infineon Technologies Ag Feldeffekttransistor, zugehörige Verwendung und zugehöriges Herstellungsverfahren
US6838723B2 (en) 2002-08-29 2005-01-04 Micron Technology, Inc. Merged MOS-bipolar capacitor memory cell
US7224024B2 (en) * 2002-08-29 2007-05-29 Micron Technology, Inc. Single transistor vertical memory gain cell
JP4028333B2 (ja) * 2002-09-02 2007-12-26 株式会社東芝 半導体装置
US6804142B2 (en) 2002-11-12 2004-10-12 Micron Technology, Inc. 6F2 3-transistor DRAM gain cell
US7838875B1 (en) 2003-01-22 2010-11-23 Tsang Dean Z Metal transistor device
US6747306B1 (en) 2003-02-04 2004-06-08 International Business Machines Corporation Vertical gate conductor with buried contact layer for increased contact landing area
US6956256B2 (en) * 2003-03-04 2005-10-18 Micron Technology Inc. Vertical gain cell
US6838332B1 (en) * 2003-08-15 2005-01-04 Freescale Semiconductor, Inc. Method for forming a semiconductor device having electrical contact from opposite sides
DE102006030631B4 (de) * 2006-07-03 2011-01-05 Infineon Technologies Austria Ag Halbleiterbauelementanordnung mit einem Leistungsbauelement und einem Logikbauelement
KR100949890B1 (ko) * 2007-12-11 2010-03-25 주식회사 하이닉스반도체 반도체 소자 및 그 제조 방법
KR100922557B1 (ko) * 2007-12-27 2009-10-21 주식회사 동부하이텍 Ｃｍｏｓ 트랜지스터 및 그 제조 방법
JP5493669B2 (ja) * 2009-10-07 2014-05-14 ソニー株式会社 固体撮像装置、撮像装置、および固体撮像装置の製造方法
CN102403256B (zh) * 2010-09-08 2014-02-26 上海华虹宏力半导体制造有限公司 赝埋层及制造方法、深孔接触及三极管
JP5075959B2 (ja) * 2010-09-14 2012-11-21 株式会社東芝 抵抗変化メモリ
US8704297B1 (en) * 2012-10-12 2014-04-22 Force Mos Technology Co., Ltd. Trench metal oxide semiconductor field effect transistor with multiple trenched source-body contacts for reducing gate charge
CN103137646A (zh) * 2013-03-15 2013-06-05 中国科学院微电子研究所 用于双极型阻变存储器交叉阵列集成方式的选通器件单元
US9397094B2 (en) 2014-09-25 2016-07-19 International Business Machines Corporation Semiconductor structure with an L-shaped bottom plate

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Also Published As

Publication number Publication date
US5378914A (en) 1995-01-03
US5583075A (en) 1996-12-10
CN1052343C (zh) 2000-05-10
ATE157482T1 (de) 1997-09-15
MY107475A (en) 1995-12-30
CN1057736A (zh) 1992-01-08
EP0459771B1 (de) 1997-08-27
EP0459771A2 (de) 1991-12-04
JP3067263B2 (ja) 2000-07-17
ES2104668T3 (es) 1997-10-16
DK0459771T3 (da) 1997-09-22
GR3025139T3 (en) 1998-02-27
JPH04226075A (ja) 1992-08-14
DE69127402T2 (de) 1998-01-02
EP0459771A3 (en) 1992-02-05

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee