DE60209964T8 - Vergussmasse für eine Leuchtdiode - Google Patents

Vergussmasse für eine Leuchtdiode Download PDF

Info

Publication number
DE60209964T8
DE60209964T8 DE60209964T DE60209964T DE60209964T8 DE 60209964 T8 DE60209964 T8 DE 60209964T8 DE 60209964 T DE60209964 T DE 60209964T DE 60209964 T DE60209964 T DE 60209964T DE 60209964 T8 DE60209964 T8 DE 60209964T8
Authority
DE
Germany
Prior art keywords
light emitting
emitting diode
potting compound
potting
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE60209964T
Other languages
English (en)
Other versions
DE60209964T2 (de
DE60209964D1 (de
Inventor
Takemasa Toyoda Gosei Co. Ltd. Nishikasugai-gun YASUKAWA
Yasuji Toyoda Gosei Co. Ltd. Nishikasugai-gun OZAKI
Kenichi Toyoda Gosei Co. Ltd. Nishikasugai-gun WATANABE
Akira Nagoya-shi Mabuchi
Satoshi Niiza-shi Honda
Tsutomu Iruma-gun Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Toyoda Gosei Co Ltd
Original Assignee
Sanken Electric Co Ltd
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd, Toyoda Gosei Co Ltd filed Critical Sanken Electric Co Ltd
Publication of DE60209964D1 publication Critical patent/DE60209964D1/de
Publication of DE60209964T2 publication Critical patent/DE60209964T2/de
Application granted granted Critical
Publication of DE60209964T8 publication Critical patent/DE60209964T8/de
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
DE60209964T 2001-06-15 2002-06-14 Vergussmasse für eine Leuchtdiode Active DE60209964T8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001182544A JP2002374007A (ja) 2001-06-15 2001-06-15 発光装置
JP2001182544 2001-06-15

Publications (3)

Publication Number Publication Date
DE60209964D1 DE60209964D1 (de) 2006-05-11
DE60209964T2 DE60209964T2 (de) 2006-11-30
DE60209964T8 true DE60209964T8 (de) 2007-03-29

Family

ID=19022633

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60209964T Active DE60209964T8 (de) 2001-06-15 2002-06-14 Vergussmasse für eine Leuchtdiode

Country Status (5)

Country Link
US (1) US6680490B2 (de)
EP (1) EP1267423B1 (de)
JP (1) JP2002374007A (de)
DE (1) DE60209964T8 (de)
TW (1) TW544957B (de)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004056088A (ja) * 2002-05-31 2004-02-19 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体発光素子
JP2004055855A (ja) * 2002-07-19 2004-02-19 Toyoda Gosei Co Ltd 通信装置
US20040137656A1 (en) * 2003-01-15 2004-07-15 Gurbir Singh Low thermal resistance light emitting diode package and a method of making the same
JP4721625B2 (ja) * 2003-01-29 2011-07-13 旭化成ケミカルズ株式会社 発光ダイオード
DE10307800A1 (de) * 2003-02-24 2004-09-02 Vishay Semiconductor Gmbh Halbleiterbauteil
TWI275189B (en) 2003-12-30 2007-03-01 Osram Opto Semiconductors Gmbh Radiation-emitting and/or radiation-receiving semiconductor component and method for producing such component
DE10361801A1 (de) * 2003-12-30 2005-08-04 Osram Opto Semiconductors Gmbh Strahlungsemittierendes und/oder strahlungsempfangendes Halbleiterbauelement und Verfahren zu dessen Herstellung
JP4516337B2 (ja) * 2004-03-25 2010-08-04 シチズン電子株式会社 半導体発光装置
JP4754850B2 (ja) 2004-03-26 2011-08-24 パナソニック株式会社 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法
US7355284B2 (en) * 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
US7201497B2 (en) * 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
US20060131709A1 (en) * 2004-12-21 2006-06-22 Caron Michael R Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9793247B2 (en) * 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
JP4698234B2 (ja) * 2005-01-21 2011-06-08 スタンレー電気株式会社 表面実装型半導体素子
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
DE102005038698A1 (de) 2005-07-08 2007-01-18 Tridonic Optoelectronics Gmbh Optoelektronische Bauelemente mit Haftvermittler
US8426879B2 (en) 2005-09-30 2013-04-23 Nichia Corporation Light emitting device and backlight unit using the same
KR20080106402A (ko) 2006-01-05 2008-12-05 일루미텍스, 인크. Ｌｅｄ로부터 광을 유도하기 위한 개별 광학 디바이스
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) * 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US7763478B2 (en) * 2006-08-21 2010-07-27 Cree, Inc. Methods of forming semiconductor light emitting device packages by liquid injection molding
EP2070123A2 (de) * 2006-10-02 2009-06-17 Illumitex, Inc. Led-system und -verfahren
US20090275266A1 (en) * 2006-10-02 2009-11-05 Illumitex, Inc. Optical device polishing
JP5380774B2 (ja) * 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
US9711703B2 (en) * 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
CN101388161A (zh) * 2007-09-14 2009-03-18 科锐香港有限公司 Led表面安装装置和并入有此装置的led显示器
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8866169B2 (en) * 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
EP2240968A1 (de) * 2008-02-08 2010-10-20 Illumitex, Inc. System und verfahren zur bildung einer emitterschicht
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
US9425172B2 (en) * 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
TW201034256A (en) * 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
JP2010171379A (ja) * 2008-12-25 2010-08-05 Seiko Instruments Inc 発光デバイス
KR20100080423A (ko) 2008-12-30 2010-07-08 삼성엘이디 주식회사 발광소자 패키지 및 그 제조방법
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8415692B2 (en) * 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) * 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US8449128B2 (en) * 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
DE102009055786A1 (de) * 2009-11-25 2011-05-26 Osram Opto Semiconductors Gmbh Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses
DE102009058421A1 (de) 2009-12-16 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
US9468070B2 (en) 2010-02-16 2016-10-11 Cree Inc. Color control of light emitting devices and applications thereof
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US8691890B2 (en) 2010-10-22 2014-04-08 Panasonic Corporation Unsaturated polyester resin composition for use in LED reflector, and LED reflector and LED luminaire using said composition
KR101830614B1 (ko) * 2011-01-28 2018-02-21 주식회사 쿠라레 반사판용 폴리아미드 조성물, 반사판, 상기 반사판을 구비한 발광 장치, 및 상기 발광 장치를 구비한 조명 장치 및 화상 표시 장치
CN102760816A (zh) * 2011-04-26 2012-10-31 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
CN102881800A (zh) * 2011-07-15 2013-01-16 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
KR101817807B1 (ko) * 2011-09-20 2018-01-11 엘지이노텍 주식회사 발광소자 패키지 및 이를 포함하는 조명시스템
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
JP5865038B2 (ja) 2011-11-30 2016-02-17 日東電工株式会社 素子接続用基板、その製造方法および発光ダイオード装置
JP5938912B2 (ja) * 2012-01-13 2016-06-22 日亜化学工業株式会社 発光装置及び照明装置
DE102015111492B4 (de) * 2015-07-15 2023-02-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelemente und Verfahren zur Herstellung von Bauelementen

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111343A (ja) * 1993-10-13 1995-04-25 Matsushita Electron Corp 光電装置
JPH07183580A (ja) * 1993-12-24 1995-07-21 Rohm Co Ltd 電子部品
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
US6242280B1 (en) * 1999-06-30 2001-06-05 Agilent Technologies, Inc. Method of interconnecting an electronic device
WO2001059851A1 (en) * 2000-02-09 2001-08-16 Nippon Leiz Corporation Light source
US6407411B1 (en) * 2000-04-13 2002-06-18 General Electric Company Led lead frame assembly
JP2002190622A (ja) * 2000-12-22 2002-07-05 Sanken Electric Co Ltd 発光ダイオード用透光性蛍光カバー
JP2002261333A (ja) * 2001-03-05 2002-09-13 Toyoda Gosei Co Ltd 発光装置
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置

Also Published As

Publication number Publication date
US6680490B2 (en) 2004-01-20
DE60209964T2 (de) 2006-11-30
EP1267423B1 (de) 2006-03-22
JP2002374007A (ja) 2002-12-26
DE60209964D1 (de) 2006-05-11
EP1267423A2 (de) 2002-12-18
US20030006421A1 (en) 2003-01-09
EP1267423A3 (de) 2004-06-23
TW544957B (en) 2003-08-01

Similar Documents

Publication Publication Date Title
DE60209964T8 (de) Vergussmasse für eine Leuchtdiode
DE60229607D1 (de) Organische Leuchtdiode
DE60234661D1 (de) Reflektive lichtemittierende Diode
DE60318611D1 (de) Lichtemittierende Diode
EP1548849A4 (de) Leuchtdiode
DE60219171D1 (de) Led-anzeigeleuchte
HK1097594A1 (en) Light emitting diode based measurement systems
DE102004004319B8 (de) Steuervorrichtung für eine Licht emittierende Diode
SG114514A1 (en) Organic light emitting diode (oled)
EP1643566A4 (de) Prozess zur herstellung eines weisses licht emittierenden leuchtdiodenelements
DE60223443D1 (de) Organische lichtemittierende Diode mit hohem Kontrastverhältnis
DE60121416D1 (de) Diodenlasermodul
FR2896029B1 (fr) Module d'eclairage comportant des diodes electroluminescentes.
ATE278185T1 (de) Diodenlichtquelle für eine zeilenkamera
DE60311422D1 (de) Halbleiterlaserdiodenvorrichtung
NO20041523L (no) Lysemitterende halvlederelement
DE60127085D1 (de) Organische Leuchtdiode
TW547774U (en) Light emitting diode
DE60314997D1 (de) Verstimmte dfb-laserdiode
DE29901093U1 (de) Fotoabtastelement-Leuchtdiode für SMD
EP1320900A4 (de) VERBESSERTE GaN-LEUCHTDIODE
SG99394A1 (en) Group 3-5 compound semiconductor and light emitting diode
GB0128520D0 (en) Organic light emitting diode
EP1626447A4 (de) Licht emittierende diode mit gleichmässiger allseitiger lichtausbreitung
FR2831723B1 (fr) Laser a semi-conducteurs

Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: YASUKAWA, TAKEMASA, TOYODA GOSEI CO. LTD., NISHIKA

Inventor name: YOKOTA, TSUTOMU, IRUMA-GUN, SAITAMA, JP

Inventor name: HONDA, SATOSHI, NIIZA-SHI, SAITAMA, JP

Inventor name: MABUCHI, AKIRA, NAGOYA-SHI, AICHI 453-0860, JP

Inventor name: WATANABE, KENICHI, TOYODA GOSEI CO. LTD., NISHIKAS

Inventor name: OZAKI, YASUJI, TOYODA GOSEI CO. LTD., NISHIKASUGAI

8364 No opposition during term of opposition