DE602005027785D1 - Verfahren zur Häusung einer mikromechanischen Anzeigevorrichtung - Google Patents

Verfahren zur Häusung einer mikromechanischen Anzeigevorrichtung

Info

Publication number
DE602005027785D1
DE602005027785D1 DE602005027785T DE602005027785T DE602005027785D1 DE 602005027785 D1 DE602005027785 D1 DE 602005027785D1 DE 602005027785 T DE602005027785 T DE 602005027785T DE 602005027785 T DE602005027785 T DE 602005027785T DE 602005027785 D1 DE602005027785 D1 DE 602005027785D1
Authority
DE
Germany
Prior art keywords
packaging
display device
backplane
transparent substrate
interferometric modulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005027785T
Other languages
English (en)
Inventor
William J Cummings
Brian J Gally
Lauren Palmateer
Philip D Floyd
Clarence Chui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm MEMS Technologies Inc
Original Assignee
Qualcomm MEMS Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm MEMS Technologies Inc filed Critical Qualcomm MEMS Technologies Inc
Publication of DE602005027785D1 publication Critical patent/DE602005027785D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/045—Optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
DE602005027785T 2004-09-27 2005-09-14 Verfahren zur Häusung einer mikromechanischen Anzeigevorrichtung Active DE602005027785D1 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US61337704P 2004-09-27 2004-09-27
US61348404P 2004-09-27 2004-09-27
US61346704P 2004-09-27 2004-09-27
US61332004P 2004-09-27 2004-09-27
US61395604P 2004-09-27 2004-09-27
US61356304P 2004-09-27 2004-09-27
US11/150,496 US8124434B2 (en) 2004-09-27 2005-06-10 Method and system for packaging a display

Publications (1)

Publication Number Publication Date
DE602005027785D1 true DE602005027785D1 (de) 2011-06-16

Family

ID=35207614

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005027785T Active DE602005027785D1 (de) 2004-09-27 2005-09-14 Verfahren zur Häusung einer mikromechanischen Anzeigevorrichtung

Country Status (11)

Country Link
US (2) US8124434B2 (de)
EP (1) EP1640320B1 (de)
JP (2) JP4535386B2 (de)
KR (2) KR101239270B1 (de)
AT (1) ATE508094T1 (de)
AU (1) AU2005203700A1 (de)
CA (1) CA2518805A1 (de)
DE (1) DE602005027785D1 (de)
MX (1) MXPA05010085A (de)
SG (1) SG155970A1 (de)
TW (1) TWI370102B (de)

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US7561334B2 (en) * 2005-12-20 2009-07-14 Qualcomm Mems Technologies, Inc. Method and apparatus for reducing back-glass deflection in an interferometric modulator display device
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US20100020382A1 (en) * 2008-07-22 2010-01-28 Qualcomm Mems Technologies, Inc. Spacer for mems device
US8410690B2 (en) * 2009-02-13 2013-04-02 Qualcomm Mems Technologies, Inc. Display device with desiccant
US8379392B2 (en) * 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
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CN102744317A (zh) * 2012-07-06 2012-10-24 邓洋阳 液晶显示器框架生产方法
US20140028686A1 (en) * 2012-07-27 2014-01-30 Qualcomm Mems Technologies, Inc. Display system with thin film encapsulated inverted imod
JP6260080B2 (ja) 2013-01-07 2018-01-17 セイコーエプソン株式会社 波長可変干渉フィルター、波長可変干渉フィルターの製造方法、光学モジュール、及び電子機器
KR101446414B1 (ko) * 2013-02-20 2014-10-02 희성전자 주식회사 디스플레이 장치 제조 방법
JP6070404B2 (ja) * 2013-05-14 2017-02-01 富士通株式会社 Ｍｅｍｓデバイス及びｍｅｍｓデバイスの製造方法
US8760797B1 (en) 2013-06-13 2014-06-24 Seagate Technology Llc Contamination control for a disc drive
US20160299332A1 (en) * 2015-04-09 2016-10-13 Qualcomm Mems Technologies, Inc. Pre-release encapsulation of electromechanical system devices
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US20060076637A1 (en) 2006-04-13
US20120127556A1 (en) 2012-05-24
KR20060092895A (ko) 2006-08-23
EP1640320A2 (de) 2006-03-29
CA2518805A1 (en) 2006-03-27
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TW200626483A (en) 2006-08-01
JP2006099095A (ja) 2006-04-13
ATE508094T1 (de) 2011-05-15
JP4535386B2 (ja) 2010-09-01
EP1640320A3 (de) 2007-02-28
KR20120117716A (ko) 2012-10-24
MXPA05010085A (es) 2006-05-17
TWI370102B (en) 2012-08-11
US8124434B2 (en) 2012-02-28
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JP2010176140A (ja) 2010-08-12
KR101239270B1 (ko) 2013-03-07

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