DE60144494D1 - Chemisch-mechanisches polierstück mit wellenförmigen rillen - Google Patents
Chemisch-mechanisches polierstück mit wellenförmigen rillenInfo
- Publication number
- DE60144494D1 DE60144494D1 DE60144494T DE60144494T DE60144494D1 DE 60144494 D1 DE60144494 D1 DE 60144494D1 DE 60144494 T DE60144494 T DE 60144494T DE 60144494 T DE60144494 T DE 60144494T DE 60144494 D1 DE60144494 D1 DE 60144494D1
- Authority
- DE
- Germany
- Prior art keywords
- chemical mechanical
- roills
- wavy
- polishing
- mechanical polish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S451/00—Abrading
- Y10S451/921—Pad for lens shaping tool
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010049354A KR20030015567A (ko) | 2001-08-16 | 2001-08-16 | 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드 |
| PCT/KR2001/001464 WO2003017347A1 (en) | 2001-08-16 | 2001-08-29 | Chemical mechanical polishing pad having wave-shaped grooves |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE60144494D1 true DE60144494D1 (de) | 2011-06-01 |
Family
ID=19713250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60144494T Expired - Lifetime DE60144494D1 (de) | 2001-08-16 | 2001-08-29 | Chemisch-mechanisches polierstück mit wellenförmigen rillen |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6729950B2 (de) |
| EP (1) | EP1433197B1 (de) |
| JP (1) | JP2005500689A (de) |
| KR (1) | KR20030015567A (de) |
| CN (1) | CN1284210C (de) |
| AT (1) | ATE506695T1 (de) |
| DE (1) | DE60144494D1 (de) |
| TW (1) | TW504429B (de) |
| WO (1) | WO2003017347A1 (de) |
Families Citing this family (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7374644B2 (en) * | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7077721B2 (en) * | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US20050092621A1 (en) * | 2000-02-17 | 2005-05-05 | Yongqi Hu | Composite pad assembly for electrochemical mechanical processing (ECMP) |
| US6962524B2 (en) * | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7303462B2 (en) * | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
| US7125477B2 (en) * | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US7678245B2 (en) * | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
| US7066800B2 (en) * | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20040020789A1 (en) * | 2000-02-17 | 2004-02-05 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7303662B2 (en) * | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US7059948B2 (en) * | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
| US20080156657A1 (en) * | 2000-02-17 | 2008-07-03 | Butterfield Paul D | Conductive polishing article for electrochemical mechanical polishing |
| US6979248B2 (en) * | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7029365B2 (en) * | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
| US7670468B2 (en) * | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
| US6991528B2 (en) * | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
| US7137879B2 (en) * | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7344432B2 (en) * | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
| US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
| JP3843933B2 (ja) * | 2002-02-07 | 2006-11-08 | ソニー株式会社 | 研磨パッド、研磨装置および研磨方法 |
| US20050194681A1 (en) * | 2002-05-07 | 2005-09-08 | Yongqi Hu | Conductive pad with high abrasion |
| TWI250572B (en) * | 2002-06-03 | 2006-03-01 | Jsr Corp | Polishing pad and multi-layer polishing pad |
| US6942549B2 (en) * | 2003-10-29 | 2005-09-13 | International Business Machines Corporation | Two-sided chemical mechanical polishing pad for semiconductor processing |
| US7018274B2 (en) * | 2003-11-13 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Polishing pad having slurry utilization enhancing grooves |
| US7125318B2 (en) * | 2003-11-13 | 2006-10-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a groove arrangement for reducing slurry consumption |
| JP2005177897A (ja) * | 2003-12-17 | 2005-07-07 | Nec Electronics Corp | 研磨方法および研磨装置と半導体装置製造方法 |
| US20050178666A1 (en) * | 2004-01-13 | 2005-08-18 | Applied Materials, Inc. | Methods for fabrication of a polishing article |
| US6955587B2 (en) | 2004-01-30 | 2005-10-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Grooved polishing pad and method |
| US20060030156A1 (en) * | 2004-08-05 | 2006-02-09 | Applied Materials, Inc. | Abrasive conductive polishing article for electrochemical mechanical polishing |
| US7252582B2 (en) * | 2004-08-25 | 2007-08-07 | Jh Rhodes Company, Inc. | Optimized grooving structure for a CMP polishing pad |
| US7084064B2 (en) * | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
| WO2006039436A2 (en) * | 2004-10-01 | 2006-04-13 | Applied Materials, Inc. | Pad design for electrochemical mechanical polishing |
| US7520968B2 (en) * | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
| US7131895B2 (en) * | 2005-01-13 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having a radially alternating groove segment configuration |
| TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於ｃｍｐ之特製拋光墊及其製造方法及其用途 |
| US20060219663A1 (en) * | 2005-03-31 | 2006-10-05 | Applied Materials, Inc. | Metal CMP process on one or more polishing stations using slurries with oxidizers |
| US7427340B2 (en) * | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
| JP2007030157A (ja) * | 2005-06-20 | 2007-02-08 | Elpida Memory Inc | 研磨装置及び研磨方法 |
| KR100752181B1 (ko) * | 2005-10-05 | 2007-08-24 | 동부일렉트로닉스 주식회사 | 화학적 기계적 연마장치 |
| US7357703B2 (en) * | 2005-12-28 | 2008-04-15 | Jsr Corporation | Chemical mechanical polishing pad and chemical mechanical polishing method |
| US20080003935A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Polishing pad having surface texture |
| US20080220702A1 (en) * | 2006-07-03 | 2008-09-11 | Sang Fang Chemical Industry Co., Ltd. | Polishing pad having surface texture |
| US7267610B1 (en) * | 2006-08-30 | 2007-09-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having unevenly spaced grooves |
| US8002611B2 (en) * | 2006-12-27 | 2011-08-23 | Texas Instruments Incorporated | Chemical mechanical polishing pad having improved groove pattern |
| US20080293343A1 (en) * | 2007-05-22 | 2008-11-27 | Yuchun Wang | Pad with shallow cells for electrochemical mechanical processing |
| US9180570B2 (en) * | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| KR101004256B1 (ko) | 2008-03-20 | 2011-01-03 | 엠.씨.케이 (주) | 연마패드 및 그 제조방법 |
| TWI449597B (zh) * | 2008-07-09 | 2014-08-21 | Iv Technologies Co Ltd | 研磨墊及其製造方法 |
| TWI535527B (zh) * | 2009-07-20 | 2016-06-01 | 智勝科技股份有限公司 | 研磨方法、研磨墊與研磨系統 |
| KR101044281B1 (ko) * | 2009-07-30 | 2011-06-28 | 서강대학교산학협력단 | 기공이 형성된 ｃｍｐ 연마패드와 그의 제조방법 |
| CN103109355B (zh) * | 2010-09-15 | 2016-07-06 | 株式会社Lg化学 | 用于cmp的研磨垫 |
| EP2546105B1 (de) | 2011-07-14 | 2014-05-21 | LG Electronics Inc. | Haltevorrichtung für tragbare elektronische Vorrichtung |
| KR101295921B1 (ko) * | 2011-11-07 | 2013-08-13 | 주식회사 엘지실트론 | 연마패드의 표면처리방법 및 이를 이용한 웨이퍼의 연마방법 |
| CN103372812A (zh) * | 2013-07-12 | 2013-10-30 | 中国科学院上海光学精密机械研究所 | 大型环抛机抛光胶盘的开槽装置 |
| US9849562B2 (en) | 2015-12-28 | 2017-12-26 | Shine-File Llc | And manufacture of an abrasive polishing tool |
| CN105619202A (zh) * | 2016-02-26 | 2016-06-01 | 上海华力微电子有限公司 | 一种化学机械研磨装置及其化学机械研磨方法 |
| TWI595968B (zh) * | 2016-08-11 | 2017-08-21 | 宋建宏 | 研磨墊及其製造方法 |
| CN110842764A (zh) * | 2019-11-18 | 2020-02-28 | 张俊杰 | 一种用于超硬陶瓷球体部件研制的研磨盘装置 |
| CN113153380B (zh) * | 2021-05-18 | 2022-04-26 | 中铁第四勘察设计院集团有限公司 | 一种用于提高盾构隧道中管片接缝防水性能的方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109859U (ja) * | 1983-12-28 | 1985-07-25 | 株式会社 デイスコ | 半導体ウエ−ハ表面研削装置 |
| US5177908A (en) * | 1990-01-22 | 1993-01-12 | Micron Technology, Inc. | Polishing pad |
| US5329734A (en) * | 1993-04-30 | 1994-07-19 | Motorola, Inc. | Polishing pads used to chemical-mechanical polish a semiconductor substrate |
| JPH0752033A (ja) * | 1993-08-06 | 1995-02-28 | Sumitomo Metal Ind Ltd | 研磨装置 |
| US5650039A (en) * | 1994-03-02 | 1997-07-22 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved slurry distribution |
| JP3042593B2 (ja) * | 1995-10-25 | 2000-05-15 | 日本電気株式会社 | 研磨パッド |
| JP2865061B2 (ja) * | 1996-06-27 | 1999-03-08 | 日本電気株式会社 | 研磨パッドおよび研磨装置ならびに半導体装置の製造方法 |
| US5645469A (en) * | 1996-09-06 | 1997-07-08 | Advanced Micro Devices, Inc. | Polishing pad with radially extending tapered channels |
| US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| US6273806B1 (en) * | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| JPH11285962A (ja) * | 1998-04-06 | 1999-10-19 | Sony Corp | 研磨パッド、研磨装置および研磨方法 |
| JP3920465B2 (ja) * | 1998-08-04 | 2007-05-30 | 信越半導体株式会社 | 研磨方法および研磨装置 |
| GB2345255B (en) * | 1998-12-29 | 2000-12-27 | United Microelectronics Corp | Chemical-Mechanical Polishing Pad |
| US6220942B1 (en) * | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
| US6238271B1 (en) * | 1999-04-30 | 2001-05-29 | Speed Fam-Ipec Corp. | Methods and apparatus for improved polishing of workpieces |
| US6261168B1 (en) * | 1999-05-21 | 2001-07-17 | Lam Research Corporation | Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
| KR20010002470A (ko) * | 1999-06-15 | 2001-01-15 | 고석태 | 화학적 기계적 폴리싱 장치용 폴리싱 패드의 그루브 패턴 |
| JP2001071256A (ja) * | 1999-08-31 | 2001-03-21 | Shinozaki Seisakusho:Kk | 研磨パッドの溝形成方法及び装置並びに研磨パッド |
| KR100348525B1 (ko) * | 1999-10-09 | 2002-08-14 | 동성에이앤티 주식회사 | 다양한 표면 그루브패턴을 갖는 연마패드 |
| JP2001179611A (ja) * | 1999-12-24 | 2001-07-03 | Nec Corp | 化学的機械研磨装置 |
| US6241596B1 (en) * | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
| US6443815B1 (en) * | 2000-09-22 | 2002-09-03 | Lam Research Corporation | Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing |
| WO2003011520A1 (en) * | 2001-08-02 | 2003-02-13 | Skc Co., Ltd. | Method for fabricating chemical mechanical polishing pad using laser |
-
2001
- 2001-08-16 KR KR1020010049354A patent/KR20030015567A/ko active Search and Examination
- 2001-08-29 JP JP2003522156A patent/JP2005500689A/ja active Pending
- 2001-08-29 WO PCT/KR2001/001464 patent/WO2003017347A1/en active Application Filing
- 2001-08-29 US US10/129,386 patent/US6729950B2/en not_active Expired - Lifetime
- 2001-08-29 CN CNB018235417A patent/CN1284210C/zh not_active Expired - Lifetime
- 2001-08-29 EP EP01965710A patent/EP1433197B1/de not_active Expired - Lifetime
- 2001-08-29 DE DE60144494T patent/DE60144494D1/de not_active Expired - Lifetime
- 2001-08-29 AT AT01965710T patent/ATE506695T1/de not_active IP Right Cessation
- 2001-10-15 TW TW090125420A patent/TW504429B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1433197B1 (de) | 2011-04-20 |
| US6729950B2 (en) | 2004-05-04 |
| JP2005500689A (ja) | 2005-01-06 |
| KR20030015567A (ko) | 2003-02-25 |
| WO2003017347A1 (en) | 2003-02-27 |
| CN1284210C (zh) | 2006-11-08 |
| US20030034131A1 (en) | 2003-02-20 |
| TW504429B (en) | 2002-10-01 |
| EP1433197A4 (de) | 2008-04-09 |
| CN1543670A (zh) | 2004-11-03 |
| EP1433197A1 (de) | 2004-06-30 |
| ATE506695T1 (de) | 2011-05-15 |
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