DE60141659D1 - Elektromagnetisch gekoppelte Verbindungssystemarchitektur - Google Patents

Elektromagnetisch gekoppelte Verbindungssystemarchitektur

Info

Publication number
DE60141659D1
DE60141659D1 DE60141659T DE60141659T DE60141659D1 DE 60141659 D1 DE60141659 D1 DE 60141659D1 DE 60141659 T DE60141659 T DE 60141659T DE 60141659 T DE60141659 T DE 60141659T DE 60141659 D1 DE60141659 D1 DE 60141659D1
Authority
DE
Germany
Prior art keywords
system architecture
connection system
electromagnetically coupled
coupled connection
electromagnetically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60141659T
Other languages
English (en)
Inventor
Charles A Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Application granted granted Critical
Publication of DE60141659D1 publication Critical patent/DE60141659D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive loop type
    • H04B5/22—
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H04B5/24—
    • H04B5/48—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE60141659T 2001-05-08 2001-11-13 Elektromagnetisch gekoppelte Verbindungssystemarchitektur Expired - Lifetime DE60141659D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/851,566 US6882239B2 (en) 2001-05-08 2001-05-08 Electromagnetically coupled interconnect system

Publications (1)

Publication Number Publication Date
DE60141659D1 true DE60141659D1 (de) 2010-05-06

Family

ID=25311070

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60128730T Expired - Lifetime DE60128730T2 (de) 2001-05-08 2001-11-13 Elektromagnetisch-gekoppelte verbindungssystemarchitektur
DE60141659T Expired - Lifetime DE60141659D1 (de) 2001-05-08 2001-11-13 Elektromagnetisch gekoppelte Verbindungssystemarchitektur

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60128730T Expired - Lifetime DE60128730T2 (de) 2001-05-08 2001-11-13 Elektromagnetisch-gekoppelte verbindungssystemarchitektur

Country Status (9)

Country Link
US (3) US6882239B2 (de)
EP (2) EP1388070B1 (de)
JP (2) JP4256168B2 (de)
KR (2) KR101069295B1 (de)
CN (1) CN1333354C (de)
AU (1) AU2002236576A1 (de)
DE (2) DE60128730T2 (de)
TW (1) TW543234B (de)
WO (1) WO2002091616A2 (de)

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EP1388070A2 (de) 2004-02-11
US20100045407A1 (en) 2010-02-25
JP2009124714A (ja) 2009-06-04
US20020186106A1 (en) 2002-12-12
CN1333354C (zh) 2007-08-22
EP1388070B1 (de) 2007-05-30
JP4256168B2 (ja) 2009-04-22
US6882239B2 (en) 2005-04-19
KR20080036147A (ko) 2008-04-24
KR20040012802A (ko) 2004-02-11
DE60128730D1 (de) 2007-07-12
KR101005247B1 (ko) 2011-01-04
WO2002091616A2 (en) 2002-11-14
US7612630B2 (en) 2009-11-03
KR101069295B1 (ko) 2011-10-05
EP1830280B1 (de) 2010-03-24
AU2002236576A1 (en) 2002-11-18
WO2002091616A3 (en) 2003-03-27
JP2005513824A (ja) 2005-05-12
US20050156755A1 (en) 2005-07-21
US7889022B2 (en) 2011-02-15
CN1620652A (zh) 2005-05-25
TW543234B (en) 2003-07-21
DE60128730T2 (de) 2008-01-24

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