DE60140624D1 - Herstellung von halbleitervorrichtungen mit luftspalten für zwischenverbindungs-strukturen mit ultra-niedrigen kapazitäten - Google Patents
Herstellung von halbleitervorrichtungen mit luftspalten für zwischenverbindungs-strukturen mit ultra-niedrigen kapazitätenInfo
- Publication number
- DE60140624D1 DE60140624D1 DE60140624T DE60140624T DE60140624D1 DE 60140624 D1 DE60140624 D1 DE 60140624D1 DE 60140624 T DE60140624 T DE 60140624T DE 60140624 T DE60140624 T DE 60140624T DE 60140624 D1 DE60140624 D1 DE 60140624D1
- Authority
- DE
- Germany
- Prior art keywords
- ultra
- preparation
- semiconductor devices
- low capacity
- intermediate structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/7682—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing the dielectric comprising air gaps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22958900P | 2000-08-31 | 2000-08-31 | |
| US22966000P | 2000-08-31 | 2000-08-31 | |
| US22965800P | 2000-08-31 | 2000-08-31 | |
| PCT/US2001/027224 WO2002019420A2 (en) | 2000-08-31 | 2001-08-31 | Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnection structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE60140624D1 true DE60140624D1 (de) | 2010-01-07 |
Family
ID=27397975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60140624T Expired - Lifetime DE60140624D1 (de) | 2000-08-31 | 2001-08-31 | Herstellung von halbleitervorrichtungen mit luftspalten für zwischenverbindungs-strukturen mit ultra-niedrigen kapazitäten |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6610593B2 (de) |
| EP (1) | EP1352421B1 (de) |
| AU (1) | AU2001288616A1 (de) |
| DE (1) | DE60140624D1 (de) |
| MY (1) | MY128644A (de) |
| TW (1) | TWI226103B (de) |
| WO (1) | WO2002019420A2 (de) |
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| TW401376B (en) | 1997-07-15 | 2000-08-11 | Asahi Chemical Ind | An alkoxysilane/organic polymer composition for use in producing an insulating thin film and uses thereof |
| US5953627A (en) | 1997-11-06 | 1999-09-14 | International Business Machines Corporation | Process for manufacture of integrated circuit device |
| AU756688B2 (en) | 1998-06-05 | 2003-01-23 | Georgia Tech Research Corporation | Porous insulating compounds and method for making same |
| US6071180A (en) * | 1999-01-19 | 2000-06-06 | Ernst Thielenhaus Gmbh & Co. Kg | Method of surface grinding a flange surface of a wheel hub for an automotive vehicle |
| US6071805A (en) | 1999-01-25 | 2000-06-06 | Chartered Semiconductor Manufacturing, Ltd. | Air gap formation for high speed IC processing |
| US6815329B2 (en) * | 2000-02-08 | 2004-11-09 | International Business Machines Corporation | Multilayer interconnect structure containing air gaps and method for making |
-
2001
- 2001-08-30 TW TW090121428A patent/TWI226103B/zh not_active IP Right Cessation
- 2001-08-30 MY MYPI20014099A patent/MY128644A/en unknown
- 2001-08-31 AU AU2001288616A patent/AU2001288616A1/en not_active Abandoned
- 2001-08-31 US US09/945,305 patent/US6610593B2/en not_active Expired - Lifetime
- 2001-08-31 DE DE60140624T patent/DE60140624D1/de not_active Expired - Lifetime
- 2001-08-31 WO PCT/US2001/027224 patent/WO2002019420A2/en active Application Filing
- 2001-08-31 EP EP01968364A patent/EP1352421B1/de not_active Expired - Lifetime
-
2003
- 2003-08-25 US US10/647,813 patent/US6888249B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1352421A2 (de) | 2003-10-15 |
| TWI226103B (en) | 2005-01-01 |
| WO2002019420A3 (en) | 2003-05-15 |
| EP1352421B1 (de) | 2009-11-25 |
| WO2002019420A2 (en) | 2002-03-07 |
| US20020081787A1 (en) | 2002-06-27 |
| AU2001288616A1 (en) | 2002-03-13 |
| US6610593B2 (en) | 2003-08-26 |
| US20040038513A1 (en) | 2004-02-26 |
| MY128644A (en) | 2007-02-28 |
| US6888249B2 (en) | 2005-05-03 |
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| 8364 | No opposition during term of opposition |