DE60109499D1 - Verfahren und vorrichtung zum zurückhalten einer federtastspitze - Google Patents

Verfahren und vorrichtung zum zurückhalten einer federtastspitze

Info

Publication number
DE60109499D1
DE60109499D1 DE60109499T DE60109499T DE60109499D1 DE 60109499 D1 DE60109499 D1 DE 60109499D1 DE 60109499 T DE60109499 T DE 60109499T DE 60109499 T DE60109499 T DE 60109499T DE 60109499 D1 DE60109499 D1 DE 60109499D1
Authority
DE
Germany
Prior art keywords
probe
spring
housing
ground
grounding element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60109499T
Other languages
English (en)
Other versions
DE60109499T2 (de
Inventor
Steven Feldman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of DE60109499D1 publication Critical patent/DE60109499D1/de
Publication of DE60109499T2 publication Critical patent/DE60109499T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
DE60109499T 2001-03-13 2001-12-11 Verfahren und vorrichtung zum zurückhalten einer federtastspitze Expired - Lifetime DE60109499T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/804,782 US6447328B1 (en) 2001-03-13 2001-03-13 Method and apparatus for retaining a spring probe
US804782 2001-03-13
PCT/US2001/047640 WO2002073220A2 (en) 2001-03-13 2001-12-11 Method and apparatus for retaining a spring probe

Publications (2)

Publication Number Publication Date
DE60109499D1 true DE60109499D1 (de) 2005-04-21
DE60109499T2 DE60109499T2 (de) 2006-04-13

Family

ID=25189817

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60109499T Expired - Lifetime DE60109499T2 (de) 2001-03-13 2001-12-11 Verfahren und vorrichtung zum zurückhalten einer federtastspitze

Country Status (8)

Country Link
US (1) US6447328B1 (de)
EP (1) EP1368666B1 (de)
JP (1) JP4106273B2 (de)
KR (1) KR100831787B1 (de)
CN (1) CN1288449C (de)
AT (1) ATE291234T1 (de)
DE (1) DE60109499T2 (de)
WO (1) WO2002073220A2 (de)

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US6551126B1 (en) * 2001-03-13 2003-04-22 3M Innovative Properties Company High bandwidth probe assembly
US6902416B2 (en) 2002-08-29 2005-06-07 3M Innovative Properties Company High density probe device
US6696850B1 (en) * 2002-10-02 2004-02-24 Interconnect Devices, Inc. Contact probe with off-centered back-drilled aperture
US6824427B1 (en) * 2003-05-13 2004-11-30 3M Innovative Properties Company Coaxial probe interconnection system
US7015708B2 (en) * 2003-07-11 2006-03-21 Gore Enterprise Holdings, Inc. Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts
JP4053962B2 (ja) * 2003-10-15 2008-02-27 株式会社東芝 半導体装置
WO2006007440A1 (en) * 2004-06-16 2006-01-19 Rika Denshi America, Inc. Electrical test probes, methods of making, and methods of using
KR100600482B1 (ko) * 2004-06-22 2006-07-13 삼성전자주식회사 반도체 패키지 측정용 프로브
JP4757531B2 (ja) 2005-04-28 2011-08-24 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
US7298153B2 (en) * 2005-05-25 2007-11-20 Interconnect Devices, Inc. Eccentric offset Kelvin probe
US7740508B2 (en) * 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
US20100194419A1 (en) * 2009-02-05 2010-08-05 Chan Edward K Multi-contact probe assembly
US7850489B1 (en) 2009-08-10 2010-12-14 3M Innovative Properties Company Electrical connector system
US7997933B2 (en) 2009-08-10 2011-08-16 3M Innovative Properties Company Electrical connector system
US7927144B2 (en) * 2009-08-10 2011-04-19 3M Innovative Properties Company Electrical connector with interlocking plates
US7909646B2 (en) * 2009-08-10 2011-03-22 3M Innovative Properties Company Electrical carrier assembly and system of electrical carrier assemblies
US8905795B2 (en) 2011-10-12 2014-12-09 Apple Inc. Spring-loaded contacts
USRE46958E1 (en) 2011-10-24 2018-07-17 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
USRE47459E1 (en) 2011-10-24 2019-06-25 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
US8926342B2 (en) 2011-10-24 2015-01-06 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
US20130330983A1 (en) * 2012-06-10 2013-12-12 Apple Inc. Spring-loaded contacts having sloped backside with retention guide
KR101403048B1 (ko) * 2012-06-26 2014-06-09 주식회사 오킨스전자 고주파 특성을 갖는 반도체 디바이스 테스트소켓
TWI555987B (zh) * 2014-01-28 2016-11-01 Spring sleeve type probe and its manufacturing method
CN104280678B (zh) * 2014-10-30 2018-11-27 通富微电子股份有限公司 半导体测试治具
CN106645809A (zh) * 2016-10-14 2017-05-10 厦门大学 一种双重包覆壳层隔绝针尖的制备方法
US10705118B2 (en) * 2017-03-23 2020-07-07 Ford Global Technologies, Llc Power module testing apparatus
CN108663553B (zh) * 2017-03-29 2022-01-25 上海中船电气有限公司 一种接触式半导体材料测试头
JP7346026B2 (ja) * 2018-12-26 2023-09-19 株式会社日本マイクロニクス 電気的接続装置
WO2021215334A1 (ja) * 2020-04-22 2021-10-28 株式会社村田製作所 検査用コネクタ及び検査用ユニット
US11942722B2 (en) 2020-09-25 2024-03-26 Apple Inc. Magnetic circuit for magnetic connector
US11437747B2 (en) 2020-09-25 2022-09-06 Apple Inc. Spring-loaded contacts having capsule intermediate object
US11293976B1 (en) * 2020-09-25 2022-04-05 Essai, Inc. Integrated circuit device test tooling with dual angle cavities
KR102503437B1 (ko) * 2021-04-26 2023-02-24 주식회사 에이플러스알에프 인쇄회로기판 테스트용 커넥터

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BE847127A (fr) * 1975-10-17 1977-01-31 Appareil de connexion de controle electrique,
US4593243A (en) 1984-08-29 1986-06-03 Magnavox Government And Industrial Electronics Company Coplanar and stripline probe card apparatus
GB2166913A (en) * 1984-11-13 1986-05-14 Tektronix Inc Impedance matched test probe
US4712062A (en) 1984-12-20 1987-12-08 Hughes Aircraft Company Ground shield apparatus for giga-hertz test jig
US4724180A (en) 1985-08-05 1988-02-09 Teradyne, Inc. Electrically shielded connectors
US4783624A (en) * 1986-04-14 1988-11-08 Interconnect Devices, Inc. Contact probe devices and method
US4827211A (en) 1987-01-30 1989-05-02 Cascade Microtech, Inc. Wafer probe
EP0283545B1 (de) * 1987-03-27 1991-10-16 Ibm Deutschland Gmbh Kontaktsonden-Anordnung zur elektrischen Verbindung einer Prüfeinrichtung mit den kreisförmigen Anschlussflächen eines Prüflings
US4931726A (en) * 1987-06-22 1990-06-05 Hitachi, Ltd. Apparatus for testing semiconductor device
JPH0178029U (de) * 1987-11-13 1989-05-25
US4965514A (en) 1989-06-05 1990-10-23 Tektronix, Inc. Apparatus for probing a microwave circuit
US5144228A (en) 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
JPH0529407A (ja) * 1991-07-19 1993-02-05 Fujitsu Ltd 回路基板試験装置
US5308250A (en) 1992-10-30 1994-05-03 Hewlett-Packard Company Pressure contact for connecting a coaxial shield to a microstrip ground plane
US5477159A (en) 1992-10-30 1995-12-19 Hewlett-Packard Company Integrated circuit probe fixture with detachable high frequency probe carrier
KR0138618B1 (ko) 1993-08-04 1998-06-15 이노우에 아끼라 프로브카드, 프로브카드용 동축 프로브빔 및 그 제조방법
US5416429A (en) 1994-05-23 1995-05-16 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuits
JPH07325108A (ja) * 1994-05-31 1995-12-12 Kyocera Corp 電子部品の測定装置
US5486770A (en) 1994-06-27 1996-01-23 Motorola, Inc. High frequency wafer probe apparatus and method
JP3483961B2 (ja) * 1994-10-31 2004-01-06 株式会社アドバンテスト 高周波用コネクタ
US5625299A (en) 1995-02-03 1997-04-29 Uhling; Thomas F. Multiple lead analog voltage probe with high signal integrity over a wide band width
US5641315A (en) * 1995-11-16 1997-06-24 Everett Charles Technologies, Inc. Telescoping spring probe
US5917330A (en) 1996-01-17 1999-06-29 Miley; David M. Probe ring having electrical components affixed thereto and related apparatus and processes
US5936415A (en) 1996-12-20 1999-08-10 Xilinx, Inc. Method and apparatus for a pin-configurable integrated circuit tester board
EP0915342B1 (de) * 1997-11-05 2004-03-03 Feinmetall GmbH Prüfkopf für Mikrostrukturen mit Schnittstelle
TW438980B (en) * 1998-03-24 2001-06-07 Teradyne Inc High performance probe interface for automatic test equipment
US6160412A (en) * 1998-11-05 2000-12-12 Wentworth Laboratories, Inc. Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US6196866B1 (en) * 1999-04-30 2001-03-06 International Business Machines Corporation Vertical probe housing
JP2001004659A (ja) * 1999-06-17 2001-01-12 Yokowo Co Ltd 測定用同軸型プローブ

Also Published As

Publication number Publication date
CN1288449C (zh) 2006-12-06
ATE291234T1 (de) 2005-04-15
US6447328B1 (en) 2002-09-10
WO2002073220A2 (en) 2002-09-19
CN1555489A (zh) 2004-12-15
DE60109499T2 (de) 2006-04-13
WO2002073220A3 (en) 2003-04-03
JP2004530870A (ja) 2004-10-07
EP1368666A2 (de) 2003-12-10
JP4106273B2 (ja) 2008-06-25
US20020132514A1 (en) 2002-09-19
KR20030081513A (ko) 2003-10-17
KR100831787B1 (ko) 2008-05-28
EP1368666B1 (de) 2005-03-16

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Legal Events

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8364 No opposition during term of opposition