DE60105375D1 - Herstellungsverfahren einer elektronischen Packungsanordnung - Google Patents

Herstellungsverfahren einer elektronischen Packungsanordnung

Info

Publication number
DE60105375D1
DE60105375D1 DE60105375T DE60105375T DE60105375D1 DE 60105375 D1 DE60105375 D1 DE 60105375D1 DE 60105375 T DE60105375 T DE 60105375T DE 60105375 T DE60105375 T DE 60105375T DE 60105375 D1 DE60105375 D1 DE 60105375D1
Authority
DE
Germany
Prior art keywords
manufacturing process
electronic packaging
packaging arrangement
arrangement
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60105375T
Other languages
English (en)
Other versions
DE60105375T2 (de
Inventor
Giovanni Frezza
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Application granted granted Critical
Publication of DE60105375D1 publication Critical patent/DE60105375D1/de
Publication of DE60105375T2 publication Critical patent/DE60105375T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
DE60105375T 2000-11-30 2001-11-29 Herstellungsverfahren einer elektronischen Packungsanordnung Expired - Lifetime DE60105375T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00830796 2000-11-30
EP00830796A EP1211721A1 (de) 2000-11-30 2000-11-30 Verbesserte elektronische Packungsanordnung und Herstellungsverfahren dafür

Publications (2)

Publication Number Publication Date
DE60105375D1 true DE60105375D1 (de) 2004-10-14
DE60105375T2 DE60105375T2 (de) 2005-09-22

Family

ID=8175575

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60105375T Expired - Lifetime DE60105375T2 (de) 2000-11-30 2001-11-29 Herstellungsverfahren einer elektronischen Packungsanordnung

Country Status (3)

Country Link
US (1) US20020070464A1 (de)
EP (1) EP1211721A1 (de)
DE (1) DE60105375T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900508B2 (en) 2002-04-16 2005-05-31 Stmicroelectronics, Inc. Embedded flat film molding
DE10327694A1 (de) 2003-06-20 2005-01-05 Robert Bosch Gmbh Optische Sensoranordnung und entsprechendes Herstellungsverfahren
US7199438B2 (en) * 2003-09-23 2007-04-03 Advanced Semiconductor Engineering, Inc. Overmolded optical package
GB0412435D0 (en) * 2004-06-04 2004-07-07 Melexis Nv Packaged intergrated circuit devices
DE102004027512A1 (de) * 2004-06-04 2005-12-22 Robert Bosch Gmbh Spektroskopischer Gassensor, insbesondere zum Nachweis mindestens einer Gaskomponente in der Umluft, und Verfahren zur Herstellung eines derartigen spektroskopischen Gassensors
DE102004031316B3 (de) 2004-06-29 2005-12-29 Robert Bosch Gmbh Gassensor-Modul zur spektroskopischen Messung einer Gaskonzentration
US7897920B2 (en) * 2005-09-21 2011-03-01 Analog Devices, Inc. Radiation sensor device and method
DE102007038515A1 (de) * 2006-11-09 2008-05-15 Robert Bosch Gmbh Vorrichtung zur Passivierung eines Bauelements und Verfahren zur Herstellung der Vorrichtung
ITMI20072099A1 (it) * 2007-10-30 2009-04-30 St Microelectronics Srl Metodo di fabbricazione di un dispositivo elettronico comprendente dispositivi mems incapsulati per stampaggio
EP2224218B1 (de) * 2009-02-25 2018-11-28 Sensirion Automotive Solutions AG Sensor in einer geformten Verpackung und Herstellungsverfahren dafür
JP5759943B2 (ja) * 2012-06-15 2015-08-05 日立オートモティブシステムズ株式会社 熱式流量計
US9677950B2 (en) 2013-03-14 2017-06-13 Robert Bosch Gmbh Portable device with temperature sensing
IT201700055921A1 (it) 2017-05-23 2018-11-23 St Microelectronics Srl Dispositivo a semiconduttore, circuito e procedimento corrispondenti

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105262A (en) * 1988-09-19 1992-04-14 Ford Motor Company Thick film circuit housing assembly design
KR960009089B1 (ko) * 1993-03-04 1996-07-10 문정환 패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지
KR970005706B1 (ko) * 1994-01-24 1997-04-19 금성일렉트론 주식회사 고체촬상소자 및 그 제조방법
NL1003315C2 (nl) * 1996-06-11 1997-12-17 Europ Semiconductor Assembly E Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling.
US6069027A (en) * 1997-05-21 2000-05-30 Lsi Logic Corporation Fixture for lid-attachment for encapsulated packages
FR2782388B1 (fr) * 1998-08-11 2000-11-03 Trixell Sas Detecteur de rayonnement a l'etat solide a duree de vie accrue
US6331452B1 (en) * 1999-04-12 2001-12-18 Verdicom, Inc. Method of fabricating integrated circuit package with opening allowing access to die

Also Published As

Publication number Publication date
DE60105375T2 (de) 2005-09-22
EP1211721A1 (de) 2002-06-05
US20020070464A1 (en) 2002-06-13

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Legal Events

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